KR101522787B1 - A printed circuit board comprising embeded electronic component within - Google Patents

Abstract

The present invention relates to a printed circuit board with an embedded electronic component. The printed circuit board with embedded electronic component according to the present invention includes a core on which a cavity is formed, the electronic component which is inserted into the cavity, an insulation layer which is stacked on the upper and lower sides of the core and is bonded to the outer circumference of the electronic component with a mixed coupling agent with a functional group which functions in an organic material and an inorganic material, and a circuit pattern which is formed on the insulation layer.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a printed circuit board (PCB)

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001]

As electronic devices such as mobile phones are becoming thinner and thinner, the size of the substrate is limited, and the multifunctionality of electronic devices is required, and mounting of electronic components for implementing more functions in a limited area of the substrate is required.

However, as the size of the substrate is limited, it is not possible to sufficiently secure the mounting area of the electronic component, so that a technique of inserting electronic components such as an active element such as an IC and a semiconductor chip and a passive element into the substrate is required. In recent years, a technique for embedding an active element and a passive element in the same layer, or stacking them and being embedded in a substrate has been developed.

Conventionally, a method of manufacturing a component-embedded printed circuit board includes a step of forming a cavity in a core of a substrate, and inserting various elements and an electronic component such as an IC and a semiconductor chip in the cavity. Thereafter, a resin material such as a prepreg is coated on the inside of the cavity and the core on which the electronic parts are inserted to fix the electronic parts and to form an insulating layer, a via hole or a through hole is formed in the insulating layer, So that the electronic component can be electrically connected to the outside of the substrate by the circuit formation.

At this time, a circuit pattern formed by plating is formed in the via hole or the through hole and the upper part thereof, and used as an electrical connecting means with the electronic parts built in the substrate, and the insulating layer is sequentially laminated on the upper and lower surfaces of the substrate, A built-in multilayer printed circuit board can be manufactured.

In such a conventional built-in printed circuit board, heat is applied to the laminate at a high temperature while the soldering and the reflow process are repeated each time the manufacturing process is progressed, and warping of the substrate may occur every time the laminate is heated to a high temperature. Since the electronic component embedded in the substrate is made of a material having a different coefficient of thermal expansion (CTE) from that of the insulating layer bonded to the outside of the substrate, the substrate is repeatedly warped during the heating process and stress is concentrated at the interface with the insulating layer As the process progresses, peeling or lifting of the bonded interface may occur due to thermal shock.

Korean Patent Publication No. 2012-0071938

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a component-embedded printed circuit board with improved mechanical characteristics and reliability between an electronic component embedded in a printed circuit board and an insulating layer which is buried in an upper portion thereof.

The above object of the present invention can be achieved by a method of manufacturing a semiconductor device, An electronic component inserted into the cavity; An insulating layer which is laminated on the upper and lower portions of the core and which is joined to an outer circumferential surface of the electronic component by a coupling agent having a functional group acting on the organic material and the inorganic material respectively; And a circuit pattern provided on the insulating layer.

The electronic component may be an MLCC including external electrodes provided on both sides and a body provided between the external electrodes.

The coupling agent mixed in the insulating layer may be composed of at least two functional groups and may be composed of the following formula.

The

(XO) _n -Ti- (OY) _4-n

Where X is an alkyl group, Y is an ograno-functional groups, and n is a natural number containing 1, 2, 3.

delete

The insulating layer may be a prepreg (PPG) composed of a thermosetting resin composition in which an inorganic filler is mixed, and 0.1 to 3.0 mass% of organotitanates based on the mass of the inorganic filler mixed with the thermosetting resin composition Lt; / RTI >

The insulating layer may further include a via for electrically connecting the circuit pattern and the external electrode, and a circuit layer of a predetermined pattern electrically connected to the upper and lower surfaces of the core through the through hole may be formed.

The insulating layer may be filled in a space between the cavity and the electronic component so as to surround the entire outer peripheral surface of the electronic component.

As described above, in the component-embedded printed circuit board according to the present invention, the coupling agent of organic titanates is mixed with the insulating layer that encloses the electronic components built in the core, It is possible to improve the bonding and adhesion performance between the insulating layer and the surface of the electronic component. By improving the bonding performance between the insulating layer and the electronic component, the insulating layer prevents peeling and lifting on the electronic component, An effect of improving the yield of the printed circuit board product can be exhibited.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view of a component-embedded printed circuit board according to an embodiment of the present invention; Fig.
2 is a process diagram showing a manufacturing process of an embodiment of a component-embedded printed circuit board according to the present invention.
3 is a schematic view of an apparatus for evaluating the adhesion between an electronic component and an insulating layer (prepreg) applied to a component-embedded printed circuit board according to the present invention.
4 is a schematic view of a bending evaluation test of a component-embedded printed circuit board according to the present invention;
Fig. 5 is a comparison photograph of a normal product in which the electronic component and the insulating layer are not peeled off, a defective product in which the electronic component and the insulating layer are peeled off as a result of the bending test of the component built-in printed circuit board.

The matters relating to the operation and effect including the technical structure of the above-described object of the component built-in printed circuit board and the method for manufacturing the same according to the present invention will be clearly understood by the following detailed description of the preferred embodiment of the present invention with reference to the drawings .

Component printed circuit board

1 is a sectional view of a component-embedded printed circuit board according to the present invention.

The printed circuit board 100 according to the present invention includes an electronic component 200 embedded in a core 110 having a cavity 111 formed therein, The insulating layer 120 may be formed of a thermosetting resin composition in which organotitanates are mixed.

Although the component-embedded printed circuit board 100 is shown in which the electronic components 200 embedded in the core 110 are embedded in one place, the present invention is not limited thereto and is embedded in the printed circuit boards of the unit units at regular intervals And one or more electronic components 200 may be incorporated depending on the type of the built-in component.

The cavity 111 may be formed in the form of a through hole in the core 110 positioned at the center of the component-embedded printed circuit board 100 and the cavity 111 may be formed through laser processing or drilling using CNC have. At this time, it is preferable that the cavity 111 is formed to be equal to or larger than the width of the electronic component 200 to be inserted therein.

The circuit layers 112 may be formed in a predetermined pattern on the upper and lower surfaces of the core 110. Each of the circuit layers 112 may include a via hole or through hole 113 penetrating the core 110 As shown in FIG.

Meanwhile, the electronic component 200 is inserted into the cavity 111 of the core 110. The electronic component 200 may include active elements such as an IC, a semiconductor chip, and a CPU, in addition to passive elements such as MLCC and LTCC. . At this time, it is preferable that the height of the electronic component is made equal to the height of the core.

Here, the electronic component 200 includes a main body 201 on which internal electrodes are formed, an external electrode 202 on the both sides of the main body 201, And external electrodes 202 on both sides may be physically and electrically connected to external circuits, respectively.

The insulating layer 120 may be laminated on the upper and lower portions of the core 110 in which the electronic component 200 is embedded. The insulating layer 120 may be formed by laminating and curing an insulating material such as a prepreg (PPG). The insulating layer 120 is pressed on the upper and lower portions of the electronic component 200 and directly contacts the outer peripheral surface of the electronic component 200. The insulating layer 120 is bonded to the outer peripheral surface of the electronic component 200, Can be combined.

In addition, the insulating layer 120 may be formed of a thermosetting resin composition including an inorganic filler such as silica. At this time, organotitanates may be added to the insulating layer, and 0.1 to 3.0 mass% of the inorganic filler contained in the insulating layer 120 may be mixed. The organotitanates can be mixed evenly with stirring with the inorganic filler during preparation of the prepreg of the insulating layer 120 before application.

The organotitanates are coupling agents for improving the adhesion between inorganic and organic materials and can be used for the purpose of improving adhesion between various types of powders and resins constituting the insulating layer.

In addition, organotitanates have two functional groups (-OY) capable of bonding with organic materials and a functional group (XO-) capable of bonding with inorganic materials to improve adhesion between organic and inorganic materials by the following formula .

Where X is an alkyl group, Y is an ograno-functional groups, and n is a natural number containing 1, 2, 3.

On the other hand, among the alkyl groups, n-propyl, iso-propyl, n-butyl, etc., and ograno-functional groups are carboxyl groups. Ester, phosphate, pyrophosphato, sulfonate and the like. In addition, various kinds of functional groups for bonding polar or non-polar thermoplastic polymers and thermosetting polymers may be used. Can be used.

As a result of the coupling function by the functional groups of the organic titanates mixed in the insulating layer 120, the mutual adhesion between the electronic component 200 and the insulating layer 120 is strengthened, It is possible to prevent the insulating layer from being peeled off from the surface of the electronic component 200 even if repeated bending and thermal shocks are applied to the insulating layer.

delete

If the organic titanates mixed in the insulating layer 120 is less than 0.1 mass% of the inorganic filler mass in the insulating layer, the bonding strength between the electronic component 200 and the insulating layer 120 can not be sufficient If it exceeds 3.0 mass%, the effect of increasing the bonding force at the bonding interface between the electronic component 200 and the insulating layer 120 may be deteriorated. At this time, if the organotitanates are 3.0% by mass or more, the organotitanates are aggregated in the insulating layer and the adhesive force with the electronic component 200 is lowered. In this case, It may be difficult to remove the alcohol by-products generated by the reaction with the ceramic component constituting the MLCC.

The insulating layer 120 is stacked on the upper and lower surfaces of the core 110 including the electronic component 200. The insulating layer 120 partially flows into the interface between the electronic component 200 and the core 110, The insulating layer 120 may be formed on the outer circumferential surface of the insulating layer 120 so as to surround the insulating layer 120.

A plurality of vias 121 may be formed in the insulating layer 120. The vias 121 may be formed by laser machining or CNC drilling as in the case of the cavity 111 formed in the core 110. After the vias 121 are processed, A circuit pattern 130 may be formed by forming a plating layer on the upper surface and etching the plating layer to electrically connect with the electronic component 200.

The component-embedded printed circuit board 100 having the above-described structure is mounted on the surface of the electronic component 200 built in the core 110 and the insulating layer 120 stacked on the top and the bottom of the core 110, The coupling performance of the mixed organic titanates in the layer 120 can be enhanced.

Of the manufacturing method of the built-in printed circuit board In one embodiment

A manufacturing method of the component-embedded printed circuit board of the present invention having the above-described structure will be described with reference to the following drawings.

2 is a process diagram showing a manufacturing process of an embodiment of a component-embedded printed circuit board according to the present invention.

First, as shown in FIG. 2A, a cavity 111 having a through-hole shape is formed in a core 110 made of an insulating material. The cavity 111 may be formed by laser processing or drilling. The cavity 111 may have a predetermined size, and may be formed to be equal to or larger than the width of the electronic component 200 inserted therein.

In addition, the carrier C may be attached to the lower surface of the core 110. The carrier C is a member for fixing the position of the electronic component 200 when the electronic component is inserted into the cavity 111 formed by the through hole so that the electronic component 200 is not separated from the cavity 111 , An adhesive member may be applied to the upper surface of the electronic component 200 so that the electronic component 200 can be temporarily fixed.

Next, the electronic component 200 is inserted into the cavity 111 of the core 110 to be positioned on the carrier C as shown in FIG. 2B. It is preferable that the electronic component 200 has the same height as the thickness of the core 110. When the height of the electronic component 200 is higher, 110 must be thicker.

After the electronic component 200 is inserted into the cavity 111 of the core 110, upper and lower insulating layers 120a and 120b are formed on the upper and lower portions of the core 110, respectively, as shown in FIGS. The lower insulating layer 120b can be stacked. First, the upper insulating layer 120a may be laminated on the upper portion of the core 110. The upper insulating layer 120a may be formed by laminating an insulating material and may be cured by heating and pressing the insulating material. At this time, when the insulating material is heated and pressed, a part of the insulating material flows into the space between the cavity 111 of the core 110 and the electronic part 200 and hardened, so that the electronic part 200 can be fixed. A separate adhesive may be injected between the electronic component 200 and the side wall of the cavity 111 before the upper insulating layer 120a is formed to fix the electronic component 200. [

When the lamination of the upper insulating layer 120a is completed, the carrier C attached to the lower surface of the core 110 is removed. 2d, the core 110 is turned over to laminate the lower insulating layer 120b on the opposite side of the core 110 on which the upper insulating layer 120a is formed in the same manner as the upper insulating layer 120a, And is cured by compression to complete the formation of the insulating layers 120a and 120b as shown in FIG. 3D.

The upper and lower insulating layers 120a and 120b may be formed of prepregs such as PPG or the like mixed with a certain amount of an inorganic filler such as silica and organic titanates before the upper and lower insulating layers 120a and 120b are laminated. ) Material.

The upper and lower insulating layers 120a and 120b may be formed by mixing an inorganic filler with 0.1 to 3.0 mass% of organoianates relative to the mass of the inorganic filler in the thermosetting resin composition before lamination to the core 110, The prepreg can be produced by stirring. Here, the pre-mixture in which the organic titanates are mixed is a coupling which improves the adhesion between the organic material and the inorganic material by acting on the ceramic material of the insulating layer, which is an organic material, and the inorganic material, Can act as zero.

Finally, as shown in FIG. 2E, a via hole 121 is formed on the upper and lower insulating layers 120b, a plating layer is formed on the inside of the via hole 121 and on the insulating layers 120a and 120b, The printed circuit board is completed by forming the circuit pattern 130 of the printed circuit board.

Evaluating the bonding strength of electronic parts on printed circuit board

Through the above-described manufacturing process, the reliability of the electronic component bonding of the built-in printed circuit board fabricated as shown in FIG. 1 was tested according to a standard standard. As a result, it was found that organotitanates were not included in the insulating layer It can be seen that the adhesion between the insulating layer and the electronic component is enhanced and the bonding reliability is improved when the printed circuit board is formed by including organotitanates in the insulating layer rather than the printed circuit board.

Evaluation of adhesion between electronic parts and insulating layer

First, a prepreg (PPG) used as a typical material of the insulating layer 120 closely adhered to the electronic component 200 embedded in the component-embedded printed circuit board according to the present invention is bonded to an outer circumferential surface of an MLCC (electronic component) After the prepreg was cured to make the insulating layer and the MLCC closely contact, shear stress was applied according to JESD22-B117 standard specifications.

At this time, the prepreg (PPG) constituting the insulating layer 120 is formed by mixing an inorganic filler with a thermosetting resin such as resin or epoxy, and organotitanates of 0.1 to 3.0 mass% Lt; / RTI > mixed composition.

When the MLCC is bonded to a prepreg not mixed with organotitanates through an evaluation device as shown in FIG. 3 according to this specification, the shear strength in a state where the shear stress is applied to one side and the bonding site is separated Strength) was 1293 kgf on average, and the shear strength in the state where MLCC was bonded to prepreg mixed with organotitanates was estimated to be about 4460%, which was 1860 kgf on average.

3 is a schematic diagram showing an evaluation apparatus for evaluating shear stress according to the standard of JESD22-B117.

Evaluation of bonding reliability of electronic parts embedded in printed circuit board

The reliability evaluation of the bonding between the electronic component and the insulating layer built in the board in the component built-in printed circuit board manufactured through the manufacturing method of the present invention is completed by completing the manufacture of the printed circuit board and completing the JESD22-B113 standard specification And evaluated by a bending test. The evaluation of the bending of the printed circuit board was performed by applying a pressure to four points through a commercial bending evaluation tester, pressing it to a depth of 2 mm to generate bending, and repeating the bending of 20000 bands once per second at a frequency of 1 Hz. Respectively.

As a result of the evaluation according to this standard, it has been found that in a printed circuit board composed of a printed circuit board composed of an insulating layer 120 containing organic titanates and an insulating layer not containing organic titanates, ) And the delamination of the insulating layer were confirmed by an ultrasonic microscope. Fig. 5 is a photograph of a comparison between a normal product in which the electronic component and the insulating layer are not peeled off, a defective product in which the electronic component and the insulating layer are peeled off as a result of the bending test of the component-embedded printed circuit board, As shown in the photograph, the peeling position of the electronic component was confirmed to be black, which confirmed that the peeling between the electronic component and the insulating layer actually occurred through a cross-sectional analysis of the printed circuit board.

In addition, as shown in Table 1, a printed circuit board to which organic titanates are applied to an insulating layer and a printed circuit board to which an organic titanate is not contained in an insulating layer, Bonding reliability is greatly improved compared to the case where a printed circuit board is manufactured by including organotitanates in a printed circuit board without organotitanates in the insulating layer, It can be confirmed that the bonding reliability is improved when the organic titanate (organotianates) is 0.1 to 3.0 mass% based on the inorganic mixed filler nitrogen.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. However, it should be understood that such substitutions, changes, and the like fall within the scope of the following claims.

110. Core
111. Cavity
112. Circuit layer
120.120a Insulating layer
121. A via hole
130. Circuit pattern
200. Electronic parts

Claims (11)

A core formed with a cavity;
An electronic component inserted into the cavity;
A coupling agent of an organic titanate having a functional group acting on an organic material and an inorganic material, respectively, and an inorganic filler are laminated on the top and bottom of the core, and 0.1 to 0.3 mass% of the organic titanate is mixed with the inorganic filler An insulating layer bonded to an outer circumferential surface of the electronic component; And
A circuit pattern provided on the insulating layer;
A printed circuit board with a built-in component.
The method according to claim 1,
Wherein the electronic component includes MLCCs including external electrodes provided on both sides and a main body provided between the external electrodes.
The method according to claim 1,
Wherein the coupling agent mixed in the insulating layer is an organic titanate having at least two functional groups and having the following formula.
The

Where X is an alkyl group, Y is an ograno-functional groups, and n is a natural number containing 1, 2, 3.
delete The method of claim 3,
Wherein the alkyl group is any one of n-propyl, iso-propyl, and n-butyl.
The method of claim 3,
Wherein the organic functional groups are any one of carboxyl, ester, phosphato, pyrophosphato, and sulfonato. 2. The printed circuit board of claim 1, wherein the organic functional groups are selected from the group consisting of carboxyl, ester, phosphato, pyrophosphato and sulfonato.
delete The method according to claim 1,
Wherein the insulating layer is made of a prepreg (PPG) of a thermosetting resin composition mixed with an inorganic filler.
The method according to claim 1,
And a via for electrically connecting the circuit pattern and the external electrode of the electronic component to the inside of the insulating layer.
The method according to claim 1,
Wherein the insulating layer is filled in a space between the cavity and the electronic component to surround the entire outer peripheral surface of the electronic component.
3. The method of claim 2,
Wherein a circuit layer of a predetermined pattern electrically connected to the upper and lower surfaces of the core through the through holes is formed.

Images