KR101508892B1 - 첩부 장치 및 첩부 방법 - Google Patents

첩부 장치 및 첩부 방법 Download PDF

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Publication number
KR101508892B1
KR101508892B1 KR20147034704A KR20147034704A KR101508892B1 KR 101508892 B1 KR101508892 B1 KR 101508892B1 KR 20147034704 A KR20147034704 A KR 20147034704A KR 20147034704 A KR20147034704 A KR 20147034704A KR 101508892 B1 KR101508892 B1 KR 101508892B1
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KR
South Korea
Prior art keywords
laminate
plate member
supporting
support
plate
Prior art date
Application number
KR20147034704A
Other languages
English (en)
Korean (ko)
Other versions
KR20150005715A (ko
Inventor
준이치 가츠라가와
요시히로 이나오
시게루 가토
Original Assignee
도오꾜오까고오교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도오꾜오까고오교 가부시끼가이샤 filed Critical 도오꾜오까고오교 가부시끼가이샤
Publication of KR20150005715A publication Critical patent/KR20150005715A/ko
Application granted granted Critical
Publication of KR101508892B1 publication Critical patent/KR101508892B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/32—Discharging presses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/56—Compression moulding under special conditions, e.g. vacuum
    • B29C2043/561—Compression moulding under special conditions, e.g. vacuum under vacuum conditions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/20—Making multilayered or multicoloured articles
    • B29C43/203—Making multilayered articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/04—Time
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/08—Dimensions, e.g. volume
    • B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/12—Pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Press Drives And Press Lines (AREA)
KR20147034704A 2012-05-11 2013-04-26 첩부 장치 및 첩부 방법 KR101508892B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012110098A JP5639617B2 (ja) 2012-05-11 2012-05-11 貼付装置および貼付方法
JPJP-P-2012-110098 2012-05-11
PCT/JP2013/062408 WO2013168611A1 (ja) 2012-05-11 2013-04-26 貼付装置および貼付方法

Publications (2)

Publication Number Publication Date
KR20150005715A KR20150005715A (ko) 2015-01-14
KR101508892B1 true KR101508892B1 (ko) 2015-04-07

Family

ID=49550656

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20147034704A KR101508892B1 (ko) 2012-05-11 2013-04-26 첩부 장치 및 첩부 방법

Country Status (4)

Country Link
JP (1) JP5639617B2 (ja)
KR (1) KR101508892B1 (ja)
TW (1) TWI499508B (ja)
WO (1) WO2013168611A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6291275B2 (ja) * 2014-02-13 2018-03-14 東京応化工業株式会社 貼付方法
JP6836003B1 (ja) * 2020-08-27 2021-02-24 信越エンジニアリング株式会社 ワーク分離装置及びワーク分離方法
CN114966145A (zh) * 2021-02-25 2022-08-30 上海为彪汽配制造有限公司 接触式ict测试针床及其测试方法
CN115195264B (zh) * 2022-08-01 2024-01-19 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 叠压工作台及叠压机

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050053008A (ko) * 2003-12-01 2005-06-07 도쿄 오카 고교 가부시키가이샤 첩부장치 및 첩부방법
KR20070059994A (ko) * 2005-12-06 2007-06-12 도쿄 오카 고교 가부시키가이샤 서포트 플레이트의 첩합수단과 첩합장치, 및 서포트플레이트의 첩합방법
KR20100058913A (ko) * 2008-11-25 2010-06-04 세메스 주식회사 기판처리방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003241157A (ja) * 2002-02-21 2003-08-27 Shibaura Mechatronics Corp 基板貼り合わせ装置、基板貼り合わせ方法、及び液晶表示パネルの製造装置、並びに製造方法
JP4751612B2 (ja) * 2004-12-28 2011-08-17 芝浦メカトロニクス株式会社 基板貼り合わせ装置及び基板貼り合わせ方法
JP4480660B2 (ja) * 2005-10-27 2010-06-16 Ｎｅｃエンジニアリング株式会社 基板貼り合わせ装置
JP4671841B2 (ja) * 2005-11-09 2011-04-20 パナソニック株式会社 対象物間の脱ガス方法および脱ガス装置
TWM317916U (en) * 2006-11-13 2007-09-01 Cheng Uei Prec Ind Co Ltd An organ of quickly mold change
JP2010010207A (ja) * 2008-06-24 2010-01-14 Tokyo Ohka Kogyo Co Ltd 剥離装置および剥離方法
JP5210060B2 (ja) * 2008-07-02 2013-06-12 東京応化工業株式会社 剥離装置および剥離方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050053008A (ko) * 2003-12-01 2005-06-07 도쿄 오카 고교 가부시키가이샤 첩부장치 및 첩부방법
KR20070059994A (ko) * 2005-12-06 2007-06-12 도쿄 오카 고교 가부시키가이샤 서포트 플레이트의 첩합수단과 첩합장치, 및 서포트플레이트의 첩합방법
KR20100058913A (ko) * 2008-11-25 2010-06-04 세메스 주식회사 기판처리방법

Also Published As

Publication number Publication date
TW201404596A (zh) 2014-02-01
JP5639617B2 (ja) 2014-12-10
KR20150005715A (ko) 2015-01-14
TWI499508B (zh) 2015-09-11
WO2013168611A1 (ja) 2013-11-14
JP2013239499A (ja) 2013-11-28

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