KR101508892B1 - Adhering apparatus and adhering method - Google Patents

Abstract

The patch device (1) comprises a pair of upper and lower plate members (2) sandwiching a laminate formed by laminating a substrate, an adhesive layer, and a support for supporting the substrate in this order, and the upper plate member Preventing member 27 for preventing the laminate to be attached to the upper plate member 2b is formed at a portion of the upper plate member 2b which is in contact with the laminate member.

Description

[0001] ADHERING APPARATUS AND ADHERING METHOD [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding apparatus and a bonding method in which a substrate and a supporting member are pasted via an adhesive layer by applying a pressing force.

Patent Document 1 discloses a bonding technique for bonding a substrate and a support through an adhesive layer. For example, Patent Document 1 discloses a bonding technique for bonding a substrate and a support to each other by using a heat- A combination set of a laminated material including an inorganic substrate and an auxiliary material for a lamination processing is provided and a low pressure load of at least 0.05 MPa is further applied for 10 seconds or more A pressing method of an inorganic substrate is disclosed.

Japanese Unexamined Patent Publication No. 2002-192394 (published on July 10, 2002)

However, as a result of the investigation by the present inventors, it has been found that, in the case of using the conventional press-forming method as described in Patent Document 1 for attaching a substrate such as a wafer substrate and a support for supporting the substrate via an adhesive layer, It was found that the following problems occurred. That is, when the substrate and the support are sandwiched and pressed between the plate members by using a press machine having a pair of upper and lower plate members, when the plate member and the support or the substrate are in close contact with each other and the planarity of the plate member and the support is high, And the support body may be attached to the upper plate member in some cases. In such a case, it is difficult to remove the substrate and the support from the press machine.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide a bonding apparatus in which a plate and a pair of upper and lower plate members are pasted with an adhesive layer interposed therebetween, It is a principal object of the present invention to provide a technique for preventing sticking to a member.

In order to solve the above problems, a bonding apparatus according to the present invention is a bonding apparatus according to the present invention, in which a substrate, an adhesive layer, and a support for supporting the substrate are laminated in this order, And a pair of upper and lower plate members sandwiching the laminate body therebetween, wherein a portion of the upper plate member which is in contact with the laminate body is provided with a laminate adherend to the plate member Is formed on the surface of the substrate.

In addition, a bonding method according to the present invention is a bonding method in which a substrate, an adhesive layer, and a supporting body for supporting the substrate are stacked in this order to apply pressure to the substrate and the supporting body, As a method, there are a bonding step in which a laminated body is sandwiched and pressed by a pair of upper and lower plate members, and a separating step in which the pair of plate members are separated from each other after the attaching step. In the separating step, The prevention member formed on the plate member in contact with the laminate prevents the laminate from being attached to the plate member on the upper side.

According to the present invention, it is possible to prevent the laminate from adhering to the upper plate member.

1 is a front view showing a schematic configuration of a patch device according to an embodiment of the present invention.
2 is a partially enlarged view showing a schematic configuration of a prevention part according to an embodiment of the present invention.

A bonding apparatus according to the present invention is a bonding apparatus in which a substrate, an adhesive layer, and a support for supporting the substrate are stacked in this order to apply pressure to the substrate and the support via an adhesive layer And a pair of upper and lower plate members sandwiching the laminated body therebetween, and a preventive portion for preventing the laminated body from being attached to the plate member is formed at a portion of the upper plate member in contact with the laminated body to be.

[Laminate]

The laminate to be a target of the application is formed by laminating a substrate, an adhesive layer containing, for example, a thermoplastic resin, and a support plate (support) for supporting the substrate in this order. That is, the laminate can be obtained by forming an adhesive layer by applying an adhesive to one of the substrate and the support plate, or by sticking (adhering) an adhesive tape formed by applying an adhesive, In this order. Then, the laminate is stacked and formed in advance, and then placed (set) (set) at a predetermined position of the attaching device by, for example, a transfer device such as a robot arm. It is more preferable that the laminate is temporarily fixed so that the relative positions of the substrate and the support plate do not deviate from each other in a state where the laminate is formed in advance. Alternatively, the laminated body may be placed (set) at a predetermined position of the attaching device by, for example, stacking a substrate and a support plate on a plate member of the attaching device by a conveying device such as a robot arm.

On the other hand, a forming method and a forming apparatus for forming a laminate, that is, a method of forming an adhesive layer, an adhesive layer forming apparatus, a superposing method of a substrate and a support plate, and a superimposing apparatus are not particularly limited, and various methods and devices . In the present invention, the laminate may be formed by laminating a substrate, an adhesive layer, and a support plate in this order at the time when pressure is applied by a pouch device.

The substrate is provided in processes such as thinning, transportation, and mounting in a state in which the substrate is supported by the support plate (pasted). The substrate is not limited to a wafer substrate, and may be any substrate such as a ceramic substrate, a thin film substrate, or a flexible substrate which needs to be supported by a support plate, for example.

The support plate is a support for supporting the substrate, and is attached to the substrate via an adhesive layer. Therefore, it is preferable that the support plate has a strength required to prevent breakage or deformation of the substrate during the processes such as thinning, transportation and mounting of the substrate, and it is preferable that the support plate is lighter. From the viewpoints described above, it is more preferable that the support plate is made of glass, silicon, acrylic resin, ceramic, or the like.

The adhesive constituting the adhesive layer may contain, for example, a thermoplastic resin that improves thermal fluidity by heating as an adhesive material. Examples of the thermoplastic resin include an acrylic resin, a styrene resin, a maleimide resin, a hydrocarbon resin, and an elastomer.

The method of forming the adhesive layer, that is, the coating method of applying the adhesive to the substrate or the support plate, or the forming method of forming the adhesive tape by applying the adhesive to the substrate is not particularly limited. As the method of applying the adhesive, For example, a spin coating method, a dipping method, a roller blade method, a doctor blade method, a spray method, and a coating method using a slit nozzle.

The thickness of the adhesive layer may be suitably set according to the type of the substrate and the support plate to which the adhesive is applied, the treatment to be performed on the substrate after the application, etc. It is preferably within the range of 10 to 150 mu m, More preferable.

When the support plate is peeled from the substrate, a solvent may be supplied to the adhesive layer to dissolve the adhesive layer. Thereby, the substrate and the support plate can be separated from each other. At this time, if a through hole is formed in the thickness direction of the support plate, the solvent can be easily supplied to the adhesive layer through the through hole.

Further, a layer other than the adhesive layer may be additionally formed between the substrate and the support plate as long as the adhesive is not interfered with. For example, a separation layer may be formed between the support plate and the adhesive layer, which is altered by irradiating light. Since the separation layer is formed, the substrate and the support plate can be easily separated by irradiating light after the processes such as thinning, transportation and mounting of the substrate.

[Attachment]

The attaching device according to the present embodiment will be described below with reference to Fig. 1, the attaching device 1 according to the present embodiment includes a pair of plate members 2 that sandwich a laminate (not shown), a support member 2 that supports the plate member 2, (3). The attaching device 1 can be sealed at the time of attaching, and is housed in a chamber (not shown) that can make the inside of the container a reduced-pressure environment by using a suction device or the like.

The plate member 2 is composed of a lower plate member 2a and an upper plate member 2b which have an outer appearance on a disk and are arranged in the vertical direction.

The lower plate member 2a has a mounting plate 12 on which the laminate is placed with the substrate side down, for example, as a portion in contact with the laminate, And a middle plate 13 formed between the mounting plate 12 and the support plate 14. The support plate 14 is fixed to the base plate 31 and the support plate 14, The mount plate 12 and the intermediate plate 13 are made of ceramics such as alumina. Between the mounting plate 12 and the intermediate plate 13, heating of the laminated body at 50 to 300 占 폚 at the time of pressing by heating the lower plate member 2a, for example, heating of a surface heater or a ribbon heater A device (not shown) is inserted. That is, the lower plate member 2a has a built-in heating device. The support plate 14 is made of metal such as stainless steel, or ceramics or stone. The intermediate plate 13 has a function as an insulator for preventing a short circuit between the heating device and the support plate 14. [ When the support plate 14 is formed of metal, the lower plate member 2a can be easily fixed to the lower support member 3a. Further, the wrist plate 12, the intermediate plate 13, and the support plate 14 are fixed to each other by a plurality of bolts and nuts.

The surface of the wrist plate 12 is formed so that the flatness of the non-pressing surface is 1.0 m or less. Here, the plan view is a numerical value showing the degree of the unevenness with respect to the plane, and the term "planarity of 1.0 μm or less" means that the unevenness of the surface of the mounting plate 12 (and the pressing plate 22 described later) Mu m or less. In addition, the placement plate 12 has a thickness of, for example, 35 mm or more (thickness in the up-and-down direction) so as to reduce the amount of bending at the time of pressing. Since the wrist plate 12 is formed of ceramics, it is possible to easily process the surface of the wrist plate 12 so that the flatness of the surface becomes 1.0 μm or less. Since the coefficient of thermal expansion of the ceramics is smaller than that of metal, it is preferable to reduce the curvature and deformation of the surface of the mounting plate 12 and the surface of the pressing plate 22 during pressing under heating, The flatness (horizontal property) of each surface can be maintained.

The lower plate member 2a is further provided with a thermometer 16 such as a thermocouple for measuring the temperature of the surface of the placing plate 12, And a plurality of carrying pins (17) for lifting the stacked body at the time of carrying the stacked body in order to facilitate the carrying operation by the carrying apparatus.

The upper plate member 2b is fixed to the center support member 41 of the upper support member 3b of the strut member 3 by a pressing plate 22 for pressing the support plate, And an intermediate plate 23 formed between the pressing plate 22 and the support plate 24. The pressing plate 22 and the intermediate plate 23 are made of ceramics such as alumina. Between the pressing plate 22 and the intermediate plate 23, the upper plate member 2b is heated to heat the laminate at 50 to 300 占 폚, for example, by heating the surface heater or the ribbon heater A device (not shown) is inserted. That is, the upper plate member 2b incorporates a heating device. The support plate 24 is formed of a metal such as stainless steel or a ceramic or a stone. The intermediate plate 23 has a function as an insulator for preventing a short circuit between the heating device and the support plate 24. When the support plate 24 is made of metal, the upper plate member 2b can be easily fixed to the upper support member 3b. The pressing plate 22, the intermediate plate 23, and the support plate 24 are fixed to each other by a plurality of bolts and nuts.

The surface of the pressure plate 22 is formed such that the flatness of the pressure plate 22 is 1.0 μm or less. The pressing plate 22 has a thickness of, for example, 35 mm or more (thickness in the up-and-down direction) so as to reduce the amount of deflection at the time of pressing. Since the pressing plate 22 is formed of ceramics, it is possible to easily process the surface of the pressing plate 22 so that the flatness of the surface thereof becomes 1.0 占 퐉 or less.

The upper plate member 2b is further provided with a thermometer 16 such as a thermocouple for measuring the temperature of the surface of the pressing plate 22, (Preventing portions) 27 for preventing the laminate to be attached to the upper plate member 2b at the contacting portion.

The preventive member 27 is a member for preventing the laminate to be attached to the upper plate member 2b when the lower plate member 2a and the upper plate member 2b are separated after pressing the laminate .

When the laminated body is pressed by the plate member 2, the surface of the pressing plate 22 of the upper plate member 2b and the laminated body are brought into close contact with each other, In the case where the surface and the surface of the laminate have a high flatness, the laminate sometimes sticks to the upper plate member 2b. Particularly, when the flatness of the pressing plate 22 at the time of non-pressing is 1.0 占 퐉 or less, the laminate tends to adhere to the surface of the pressing plate 22.

On the other hand, the preventing member 27 presses the laminate in the direction away from the upper plate member 2b. By combining the pressing force and the self weight of the laminate, it is possible to smoothly prevent the laminate from sticking to the upper plate member 2b.

That is, in one embodiment, the preventing member 27 is formed of a metal such as stainless steel, and as shown in Figs. 2A and 2B, a pin (pushing member) 27a, And a spring 27b elastically supporting the pin 27a so as to protrude from the surface of the pressing plate 22. [

2 (a), the elastic force of the spring 27b pushes the pin 27a into the concave portion 28 in the pressing plate 22 when the laminate is being pressed, The pin 27a is adjusted so as to protrude from the surface of the pressing plate 22 when the pressing of the laminate is released as shown in Fig. Thereby, when the lower plate member 2a and the upper plate member 2b are separated after pressing the laminate, a force can be applied to the laminate in a direction away from the upper plate member 2b. By combining this force and the self weight of the laminate, it is possible to prevent the laminate from attaching to the upper plate member 2b. The strength of the spring 27b may be suitably set in accordance with the size, weight, and the like of the laminate.

It is more preferable that the tip A of the pin 27a on the side in contact with the laminate is rounded so as not to scratch the laminate. The number of the restraining members 27 ... is not particularly limited, but it is preferable that the number of the restraining members 27 ... be arranged so as to stably press the laminate. In one example, three points are formed on the pressing plate 22 .

In another embodiment, the pressing plate 22 is provided with a delivery portion (preventing portion) 29 for delivering the gas from the pressing plate 22 toward the laminate in place of or in addition to the preventing members 27 ..., May be formed.

It is possible to smoothly prevent the laminate from sticking to the upper plate member 2b by pushing the laminate downward by delivering the gas from the pressing plate 22 toward the laminate.

On the other hand, the gas sent out by the sending unit 29 is not particularly limited, and for example, a gas such as nitrogen can be used. In addition, the dispensing section 29 may dispense the gas so that the laminate is not attached to the pressing plate 22, and the flow rate of the dispensed gas is not particularly limited. A plurality of feeding portions 29 may be formed on the pressing plate 22.

The conveying pin 17 is a member for lifting the stacked body at the time of conveyance of the stacked body in order to facilitate the conveying operation by the conveying apparatus before and after the pushing operation. The carrying pin 17 is made of metal such as stainless steel having a rounded tip and is movably provided inside the placing plate 12. [ The conveying pin 17 is accommodated in the accommodating plate 12 while the laminate is being pressed by the control unit. When the pressing of the laminate is released, the conveying pin 17 is moved from the surface of the accommodating plate 12 So that the operation is controlled. Thus, the carrying pin 17 lifts the stacked body from the surface of the mount plate 12 at the time of carrying the stacked body without scratching the substrate, thereby facilitating the carrying operation by the carrying apparatus.

The strut member 3 is constituted by a lower support member 3a which is arranged in the vertical direction and supports the lower plate member 2a and an upper support member 3b which supports the upper plate member 2b have. The lower support member 3a and the upper support member 3b are made of metal such as stainless steel or ceramics or stone.

The lower support member 3a includes a central support member 31 fixed to the base 30 and supporting at least a central portion of the lower plate member 2a and a central support member 31 fixed to the base 30, And a plurality of peripheral supporting members 32 ... which support the other. The lower support member 3a fixes the lower plate member 2a so that the surface of the placement plate 12 is horizontal. The diameter of the center support member 31 may be as long as it is necessary to support the lower plate member 2a at the time of pressing. It is preferable that the diameter of the center support member 31 is smaller so as not to radiate the heat of the lower plate member 2a . The number of the peripheral support members 32 ... of the lower support member 3a is set to 3 to 5 mm in order to prevent the heat of the lower plate member 2a from being discharged and to support the entire lower plate member 2a in a balanced manner, More preferably within the range of 10 to 10, more preferably 6 or 8. The plurality of peripheral support members 32 are arranged at equal intervals so as to support the entire lower plate member 2a in a balanced manner, that is, to keep the surface of the placement plate 12 horizontal. The diameter of the peripheral support member 32 may be sufficient to reduce the amount of bending of the lower plate member 2a at the time of pressing. In order to prevent heat from being transmitted through the lower plate member 2a, desirable.

The upper support member 3b is connected to a pressurizing device (not shown) that applies (applies a load to) pressurizing the laminate and includes a central support member 41 (not shown) for supporting at least a central portion of the upper plate member 2b ). The upper support member 3b fixes the upper plate member 2b so that the surface of the pressure plate 22 is horizontal. The diameter of the center support member 41 may have a strength required to support the upper plate member 2b at the time of pressing. The center support member 41 is movable in the vertical direction by being driven by the pressurizing device. Therefore, the upper support member 3b supports the upper plate member 2b so as to freely move to apply pressure to the laminate.

The peripheral support member 32 is composed of a cylindrical portion 32a and a support portion 32b accommodated in the cylindrical portion 32a. The support portion 32b can freely expand and contract in the moving direction of the upper plate member 2b, that is, in the up-and-down direction, by entering and exiting the flat portion 32a. Specifically, the support portion 32b has its distal end fixed to the support plate 14 and presses the lower plate member 2a against the pressing force of the upper plate member 2b to press the lower plate member 2a For example, in a unit of 0.1 [micro] m so as to reduce the amount of deflection of the semiconductor wafer W.

The support portion 32b is formed so that the flatness of the surface of the mounting plate 12 is, for example, 1.0 m or less, that is, the curvature or deformation of the surface of the mounting plate 12 is corrected, (Flatness) of the light-shielding film. For example, the expansion and contraction operation is performed manually using a tool or the like, so that the curvature or deformation of the surface of the placement plate 12 can be corrected, and the flatness of the surface of the placement plate 12 can be maintained. The configuration and method for correcting the curvature and deformation of the surface of the placement plate 12 at the time of non-pressing are not particularly limited, and various configurations and methods can be used as long as the planarity of the surface of the placement plate 12 can be maintained Can be adopted.

The expansion and contraction of the support portion 32b by manual operation can be performed based on various criteria. For example, a micrometer may be arranged on the lower side of the wrist plate 12, and the supporting portion 32b may be stretched and contracted to correct the bending or deformation of the wrist plate 12 based on the measured value of the micrometer. The pressure distribution measuring instrument (sensor sheet) may be pressed against the plate member 2, and the supporting portion 32b may be stretched and contracted so that the pressure distribution is not deflected, based on the measurement result of the pressure distribution measuring instrument. It is also possible to measure the flatness of the laminated body after actually pressing the laminated body formed by bonding the support plate to the substrate by the plate member 2 and then measuring the flatness of the laminated body, The support portion 32b may be stretched and expanded so as to improve the flatness of the support portion 32b.

In addition, in one modification, the attaching device 1 includes a detecting portion (not shown) for detecting the amount of deflection of the plate member 2 that is generated when pressure is applied to the laminate, and a detecting portion (Not shown) for stretching and shrinking the peripheral supporting members 32 ... so as to make it possible.

Specifically, the detecting unit is provided with a plurality of image pickup elements such as CCD or COMS, for example, and picks up the plate member 2, that is, the mount plate 12 and the pushing plate 22, And can be configured to be able to detect. By using an image pickup element such as CCD or COMS, the detection limit of the detection section can be set to 1.0 mu m. The amount of deflection can be detected with reference to the center of the placement plate 12 or the center of the pressing plate 22. The detection unit may include a plurality of sensors such as a pressure sensor built in the plate member 2 instead of a plurality of image pickup devices, Or by measuring the pressure distribution, the amount of deflection can be detected.

The control unit controls the peripheral portion of the mounting plate 12 and the peripheral portion of the pressing plate 22 on the basis of the center portion of the mounting plate 12 or the center portion of the pressing plate 22 based on the detection result The retracting operation of the support portion 32b of the peripheral support member 32 can be pulse-controlled at a high gear ratio such that the bending amount is 1.0 占 퐉 or less, that is, the bending amount is, for example, below the detection limit by the detecting portion. In other words, according to the present modification, the detecting unit and the control unit perform feedback control of the amount of warping of the periphery of the mounting plate 12 and the peripheral portion of the pressing plate 22 at the time of pressing the laminate, It is possible to uniformly adhere the substrate and the support to each other via the adhesive layer. On the other hand, the control of the expansion and contraction of the support portion 32b is not limited to the pulse control described above. For example, motor control may be performed by a method other than pulse control, or feedback control may be performed by arranging load cells.

The control unit may also be configured to control the extending and retracting operation of the support portion 32b of the peripheral support member 32 even when the pressure is not applied. In other words, the support portion 32b always compensates for the curvature or deformation of the surface of the mounting plate 12 and the surface of the pressing plate 22 so that the surface of the mounting plate 12 and the surface of the pressing plate 22, The stretching operation may be controlled by the control unit so as to maintain the flatness (horizontal property) of the surface. The control unit may be configured to release the pulse control of the expansion and contraction operation of the support portion 32b so that the expansion and contraction of the support portion 32b can be performed manually, for example, by using a tool or the like .

In another modified example, the upper support member 3b may be provided with peripheral support members similarly to the lower support member 3a. In other words, a plurality of peripheral supporting members may be formed on the central supporting member 41 to support other than the central portion of the upper plate member 2b.

The number of the peripheral supporting members of the upper support member 3b is preferably 3 to 10 mm in order to prevent the heat of the upper plate member 2b from being discharged and to support (press) the entire upper plate member 2b in a balanced manner. , And more preferably 6 or 8. The plurality of peripheral supporting members are arranged at equal intervals to balance (press) the entire upper plate member 2b, that is, to keep the surface of the pressing plate 22 horizontal. The diameter of these peripheral supporting members may be sufficient to reduce the amount of bending of the upper plate member 2b at the time of pressing, but it is preferable that the diameter of the peripheral supporting members is smaller so as not to radiate the heat of the upper plate member 2b .

In addition, like the peripheral supporting member 32, the peripheral supporting member may be composed of a cylindrical portion and a supporting portion accommodated in the cylindrical portion. The support portion can freely expand and contract in the moving direction of the upper plate member 2b, that is, in the up-and-down direction, by entering and exiting the flat portion. Specifically, the support portion abuts against the support plate 24 (is fixed as necessary), and its bending amount of the upper plate member 2b is reduced by resisting the pressing force of the upper plate member 2b So that it can freely expand and contract in units of 0.1 탆, for example. The support portion is manually expanded and contracted using, for example, a tool or the like to correct the curvature or deformation of the surface of the pressing plate 22, thereby maintaining the flatness of the surface of the pressing plate 22 concerned.

On the other hand, the constitution and the method for correcting the curvature and deformation of the surface of the pressing plate 22 at the time of non-pressing are not particularly limited, and various configurations and methods can be employed as long as the flatness of the surface of the pressing plate 22 can be maintained Can be adopted. For example, as in the above modification, the attaching device 1 is provided with a detecting unit and a control unit, and the control unit includes, in addition to the supporting unit 32b of the peripheral supporting member 32, It is also possible to control the expansion and contraction operation of the support portion of

In the above description, the configuration in which the lower plate member 2a is fixed and the upper plate member 2b is driven in the vertical direction by the pressurizing device via the upper support member 3b has been described as an example. However, The upper plate member 2b may be fixed and the lower plate member 2a may be vertically driven by the pressing device via the lower support member 3a or may be configured such that the lower plate member 2a 2a and the upper plate member 2b may be driven in the vertical direction.

[Attachment method]

Next, a method of attaching the laminate using the attachment device 1 having the above configuration will be described.

First, for example, a substrate, an adhesive layer, and a support plate are laminated in this order on the center of the placement plate 12 of the lower plate member 2a of the attachment device 1 housed in the chamber, and the substrate and the support plate are not misaligned The temporarily fixed laminate is conveyed using a conveying device such as a robot arm, and placed on the substrate side (conveying step). At this time, the inside of the chamber is in a reduced-pressure environment. The pair of plate members 2 are heated to 50 to 300 占 폚 in advance by a heating device.

Next, by lowering the upper plate member 2b of the pliing apparatus 1, the pressing plate 22 is brought into contact with the support plate and further lowered, thereby pressing and heating the laminate body (the attaching step and heating fair). That is, the substrate, the adhesive layer, and the support plate are pressed and heated under a reduced pressure environment. For example, in the case where the diameter of the substrate is 300 mm, the pushing force is preferably such that a load of 1 to 6 t is applied to the entire substrate.

Here, it is preferable that the adhesive layer is heated until the temperature is equal to or higher than the glass transition point (Tg) of the thermoplastic resin as the adhesive material. By heating the adhesive layer to a temperature equal to or higher than the glass transition point of the thermoplastic resin, the thermal fluidity of the adhesive layer is improved and easily deformed. The heating condition of the substrate by the heating apparatus is different depending on the material of the adhesive layer, that is, the thermoplastic resin as the adhesive material, but the heating temperature is preferably 50 to 300 占 폚 and the heating time, that is, the pressing time is 0.5 to 6 minutes More preferably 0.5 to 3 minutes. By pressing the substrate and the support plate while pressing them, the adhesive layer maintains thermal fluidity and is easily deformed and spread uniformly according to the pressing force. Therefore, it is possible to uniformly attach the substrate and the support plate, and there is no possibility of bad attachment.

Since the attaching apparatus 1 according to the present invention performs the attaching step and the heating step at the same time, it is possible to shorten the time for attaching the substrate and the support to each other, as compared with the case where the steps are separately performed. Since the chamber is in a reduced pressure environment, air bubbles are not mixed between the adhesive layer and the substrate and the support plate, so that it is possible to adhere preferably.

Thereafter, the top plate member 2b and the bottom plate member 2a are separated from each other by moving the upper plate member 2b upward (the spacing step). The pin 27a of the preventing member 27 housed in the concave portion 28 protrudes from the surface of the pressing plate 22 during the attaching process. As a result, the pin 27a presses the laminate in the direction away from the upper plate member 2b, thereby preventing the laminate from sticking to the pressing plate 22.

As described above, the pressing plate 22 may be provided with a feeder 29 for feeding gas from the pressing plate 22 toward the laminate in place of or in addition to the preventing member 27 . In this case, in the separation process, the delivery portion 29 sends out the gas toward the laminate, thereby preventing the laminate from sticking to the pressure plate 22.

As described above, in the pasting apparatus 1 according to the present invention, it is possible to prevent the laminate from sticking to the upper plate member 2b in the spacing step. Therefore, after the spacing step, In the state shown in Fig.

Finally, the laminate is taken out of the pouch device 1 (carrying-out step) by using a carrying device such as a robot arm. As described above, in the pasting apparatus 1 according to the present invention, the stacked body is placed on the placing plate 12 after the spacing process. Therefore, by carrying the transport pin 17 from the surface of the mount plate 12 and lifting the stack from the surface of the mount plate 12, the transport operation by the transport device can be easily performed.

The present invention is not limited to the above-described embodiments, but various modifications can be made within the scope of the claims, and embodiments obtained by suitably combining the disclosed technical means are also included in the technical scope of the present invention. All of the documents described in this specification are also incorporated by reference.

Industrial availability

The pasting apparatus according to the present invention can be widely used, for example, in a manufacturing process of a micronized semiconductor device.

1:
2: plate member
2a: Lower plate member
2b: upper plate member
3: Strut member
3a: Lower support member
3b: upper support member
12: wrist plate (a portion in contact with the laminate)
14: Support plate (a portion in contact with the strut member)
17: Return pin
22: pressing plate (a portion in contact with the laminate)
24: a support plate (a portion in contact with the strut member)
27: prevention member (prevention member)
27a: pin (pushing member)
27b: spring
28:
29: sending part (preventing part)
31:
32: peripheral supporting member
41:

Claims (10)

A pasting apparatus for pasting the substrate and a support through an adhesive layer by applying pressure to a laminate formed by laminating a substrate, an adhesive layer, and a support for supporting the substrate in this order,
And a pair of upper and lower plate members sandwiching the laminated body therebetween,
A preventing portion for preventing the laminate to be attached to the plate member is formed at a portion in contact with the laminate in the upper plate member,
The preventing section includes a pressing member for pressing the laminate in a direction away from the upper plate member,
Wherein a depression for receiving the pressing member is formed at a portion of the upper plate member in contact with the laminate body and the pressing member is resiliently elastic so as to press the laminate member in a direction away from the upper plate member Wherein the supporting member is supported by the supporting member. The method according to claim 1,
Wherein a tip end of the pushing member which is in contact with the stacked body is rounded. The method according to claim 1,
Wherein the preventing portion includes a delivery portion for delivering gas from a portion in contact with the laminate in the upper plate member toward the laminate. The method according to claim 1,
Wherein the plate member has a flat surface at a portion contacting the laminate at an unpressurized pressure of 1.0 m or less. 5. The method according to any one of claims 1 to 4,
And a strut member for supporting the plate member,
Wherein the strut member comprises a central support member for supporting at least a central portion of the plate member and a plurality of peripheral support members formed on the central support member and supporting a portion other than the central portion of the plate member, At least one of the plate members is supported so as to freely move to apply pressure to the laminate body and the peripheral support member can freely expand and contract in the moving direction of the plate member,
A detecting unit for detecting a deflection amount of the plate member which is generated when the stacked body is pressurized,
Further comprising a control unit for expanding and contracting the peripheral supporting member such that the amount of deflection detected by the detecting unit is canceled. A pasting apparatus for pasting the substrate and a support through an adhesive layer by applying pressure to a laminate formed by laminating a substrate, an adhesive layer, and a support for supporting the substrate in this order,
And a pair of upper and lower plate members sandwiching the laminated body therebetween,
A preventing portion for preventing the laminate to be attached to the plate member is formed at a portion in contact with the laminate in the upper plate member,
And a strut member for supporting the plate member,
Wherein the strut member comprises a central support member for supporting at least a central portion of the plate member and a plurality of peripheral support members formed on the central support member and supporting a portion other than the central portion of the plate member, At least one of the plate members is supported so as to freely move to apply pressure to the laminate body and the peripheral support member can freely expand and contract in the moving direction of the plate member,
A detecting unit for detecting a deflection amount of the plate member which is generated when the stacked body is pressurized,
Further comprising a control unit for expanding and contracting the peripheral supporting member such that the amount of deflection detected by the detecting unit is canceled. A bonding method in which a substrate and an adhesive layer are laminated in this order on a substrate, an adhesive layer, and a support for supporting the substrate,
An attaching step in which the laminate is sandwiched and pressed by a pair of upper and lower plate members,
And a separating step of separating the pair of plate members from each other after the attaching step,
In the separating step, the preventing portion formed on the upper plate member in contact with the laminate prevents the laminate from being attached to the upper plate member,
In the spacing step, the laminated body is pressed in a direction away from the upper plate member by the pressing member provided in the prevention unit,
Wherein a depression for receiving the pressing member is formed at a portion of the upper plate member which is in contact with the laminate body and the pressing member is elastically elastic so as to press the laminate member in a direction away from the upper plate member Wherein the supporting member is supported by the supporting member. A bonding method in which a substrate and an adhesive layer are laminated in this order on a substrate, an adhesive layer, and a support for supporting the substrate,
An attaching step in which the laminate is sandwiched and pressed by a pair of upper and lower plate members,
And a separating step of separating the pair of plate members from each other after the attaching step,
In the separating step, the preventing portion formed on the upper plate member in contact with the laminate prevents the laminate from being attached to the upper plate member,
Wherein the strut member for supporting the plate member comprises a central support member for supporting at least a central portion of the plate member and a plurality of peripheral support members for supporting the central portion of the plate member other than the central portion, Wherein the member supports at least one of the pair of plate members so as to freely move in order to apply pressure to the laminate and the peripheral supporting member is freely stretched and contracted in the moving direction of the plate member,
The amount of deflection of the plate member which is generated when pressure is applied to the laminate is detected,
And the peripheral supporting member is stretched and contracted so that the detected bending amount is canceled. 9. The method according to claim 7 or 8,
Wherein in the interleaving step, the prevention portion sends gas from a portion of the upper plate member in contact with the laminate toward the laminate. delete

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