TWI763696B - pasting device - Google Patents

pasting device

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Publication number
TWI763696B
TWI763696B TW106126869A TW106126869A TWI763696B TW I763696 B TWI763696 B TW I763696B TW 106126869 A TW106126869 A TW 106126869A TW 106126869 A TW106126869 A TW 106126869A TW I763696 B TWI763696 B TW I763696B
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Taiwan
Prior art keywords
support
plate member
pressing
substrate
decompression chamber
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TW106126869A
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Chinese (zh)
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TW201820522A (en
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中村彰彦
戶崎均
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日商東京應化工業股份有限公司
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Publication of TW201820522A publication Critical patent/TW201820522A/en
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Publication of TWI763696B publication Critical patent/TWI763696B/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

本發明的課題為提供一種新穎的黏貼裝置,可均勻黏貼矩形的支承體與基板。   其解決手段為黏貼裝置(100)具備:板構件(1)、支承構件(10)、伺服馬達(13)及負載感測器(15),支承構件(10)分別是從下側板構件的平面部(11a)的背面側分別將佔據支承下側板構件的平面部(11a)全面的區域等分割成矩形相似形的N2 個(N為2以上的整數)之分割支承區域(12)所構成的各分割支承區域(12)。The subject of the present invention is to provide a novel sticking device capable of sticking a rectangular support body and a substrate uniformly. The solution is that the sticking device (100) is provided with: a plate member (1), a support member (10), a servo motor (13) and a load sensor (15), and the support member (10) is respectively a plane from the lower side plate member The rear side of the portion (11a) is formed by equally dividing the area occupying the entire surface of the plane portion (11a) supporting the lower side plate member into N 2 (N is an integer of 2 or more) divided support areas (12) of a rectangular similar shape. Each of the divided support regions (12).

Description

黏貼裝置pasting device

本發明是關於黏貼裝置。 The present invention relates to a sticking device.

伴隨行動電話、數位AV機器及IC卡等的高功能化,藉著使所搭載半導體元件(電子零元件)小型化及薄板化,提高半導體元件在半導體封裝(半導體裝置)內之集成化的要求。 With the increase in functions of mobile phones, digital AV equipment, and IC cards, the demand for integration of semiconductor elements in semiconductor packages (semiconductor devices) has increased by reducing the size and thickness of mounted semiconductor elements (electronic components). .

在此,包括半導體元件的半導體封裝有WLP(Wafer Level Package)等已為人知。WLP及PLP(Panel Level Package)等的半導體封裝有將位於裸晶片的端部的端子再配置於晶片區內的扇入型WLP(Fan-in Wafer Level Package)等的扇入型技術與端子再配置於晶片區外的扇外型WLP(Fan-out Wafer Level Package)等的扇外型技術為人所知。尤其是扇外型技術是應用於在面板上配置半導體元件封裝化的扇外型PLP(Fan-out Panel Level Package),為實現半導體封裝的集成化、薄型化及小型化,目光集中在如該等的扇外型技術。 Here, as a semiconductor package including a semiconductor element, WLP (Wafer Level Package) or the like is known. In semiconductor packages such as WLP and PLP (Panel Level Package), there are fan-in technology such as fan-in type WLP (Fan-in Wafer Level Package) in which the terminals located at the ends of the bare die are relocated in the die area, and terminal reassembly. Fan-out technology such as fan-out Wafer Level Package (WLP), which is arranged outside the wafer area, is known. In particular, the fan-out panel technology is applied to the fan-out panel level PLP (Fan-out Panel Level Package) in which semiconductor components are packaged on the panel. and other fan-shaped technology.

專利文獻1中,記載一種黏貼裝置,透過接著層黏貼基板與支承體,製造依此上述基板與上述接著層與 上述支承體順序層疊所成的層疊體用的黏貼裝置,其特徵為:具備夾入上述層疊體的一對板構件,及支承上述板構件的支承構件,支承至少一方之上述板構件的上述支承構件是在該板構件上成等間隔鄰接的複數的點狀,或線狀地定位。 Patent Document 1 describes a sticking device that sticks a substrate and a support through an adhesive layer, and manufactures the above-mentioned substrate, the above-mentioned adhesive layer, and the like. A sticking device for a laminated body in which the above-mentioned support bodies are sequentially laminated, comprising a pair of plate members sandwiching the above-mentioned laminated body, and a support member for supporting the above-mentioned plate members, and the above-mentioned support for supporting at least one of the above-mentioned plate members The members are positioned on the plate member in a plurality of dots that are adjacent to each other at equal intervals, or are positioned linearly.

[先前技術文獻] [Prior Art Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本特開2014-220389號公報(2014年11月20日公開) [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-220389 (published on November 20, 2014)

專利文獻1記載的黏貼裝置在可將圓形的基板與基板黏貼成均勻厚度之矩形的基板與支承體黏貼成均勻的厚度上困難。又,半導體封裝的方法高度化,可將矩形的基板與支承體黏貼成均勻厚度的新穎的黏貼裝置極有用。 The sticking apparatus described in Patent Document 1 has difficulty in sticking a circular board and a rectangular board with a uniform thickness and a support with a uniform thickness. In addition, the method of semiconductor packaging is highly advanced, and a novel bonding apparatus capable of bonding a rectangular substrate and a support to a uniform thickness is extremely useful.

本發明是鑒於上述的問題點所研創而成,其目的為提供可均勻黏貼矩形的支承體與基板的黏貼裝置。 The present invention has been developed in view of the above-mentioned problems, and an object of the present invention is to provide a sticking device capable of sticking a rectangular support body and a substrate uniformly.

為解決上述的課題,本發明的黏貼裝置,係 黏貼基板,及支承上述基板的支承體的黏貼裝置,其特徵為,具備:夾入上述基板與上述支承體的一對板構件;支承上述一對板構件之中的一方板構件的複數支承構件;朝上述一方板構件推壓上述一對板構件之中的另一方板構件的推壓部;及在上述推壓部與上述另一方板構件之間,檢測上述推壓部施加於上述另一方板構件之推壓力的推壓力檢測部,上述一對板構件分別具有矩形的平面部,上述複數支承構件是分別配置從上述一方板構件的平面部的背面側分別支承將佔據上述一方板構件的平面部全面的區域等分割成上述矩形相似形的N2個(在此,N為2以上的整數)之分割支承區域所構成的該等各分割支承區域。 In order to solve the above-mentioned problems, the sticking apparatus of the present invention is a sticking apparatus for sticking a substrate and a support for supporting the substrate, characterized by comprising: a pair of plate members sandwiching the substrate and the support; and supporting the one A plurality of support members for one of the plate members; a pressing portion for pressing the other of the pair of plate members toward the one plate member; and between the pressing portion and the other plate member and a pressing force detecting portion for detecting the pressing force applied by the pressing portion to the other plate member, the pair of plate members each has a rectangular flat surface portion, and the plurality of support members are respectively arranged from the flat surface of the one plate member. The back side of the part supports each of the divided support areas formed by dividing the area occupying the entire surface of the plane part of the above-mentioned one plate member into N 2 (here, N is an integer of 2 or more) of the above-mentioned rectangular-like shape. Divide the support area.

根據本發明,實現提供一種可均勻黏貼矩形的支承體與基板之新穎黏貼裝置的效果。 According to the present invention, the effect of providing a novel sticking device capable of sticking a rectangular support body and a substrate uniformly is achieved.

1:板構件 1: Plate member

1a:下側板構件(板構件) 1a: Lower side plate member (plate member)

1b:上側板構件(板構件) 1b: Upper side plate member (plate member)

10:支承構件 10: Supporting members

11:平面部 11: Flat part

11a:下側板構件的平面部(平面部) 11a: Flat portion (flat portion) of lower side plate member

11b:上側板構件的平面部(平面部) 11b: Flat portion (flat portion) of upper side plate member

12:分割支承區域 12: Divide the support area

13、13’:伺服馬達 13, 13': Servo motor

14、14’:推壓軸 14, 14': push the shaft

14a、14’a:上部推壓軸(推壓軸) 14a, 14'a: Upper push shaft (push shaft)

14b、14’b:下部推壓軸(推壓軸) 14b, 14'b: Lower push shaft (push shaft)

15、15’:負載感測器 15, 15': load sensor

16:保持部 16: Keeping Department

16a:間隔片(保持部) 16a: Spacer (holding part)

16b:筒狀部(保持部) 16b: cylindrical part (holding part)

16c:軸部(保持部) 16c: Shaft part (holding part)

17:連結軸 17: connecting shaft

18:位置感測器(位置檢測部) 18: Position sensor (position detection part)

18a:磁鐵(位置檢測部) 18a: Magnet (position detection part)

18b、18c:感測頭 18b, 18c: Sensor head

19:分割推壓區域 19: Divide the push area

20:推壓力特定部 20: Push force specific part

21:控制部 21: Control Department

30:被處理基板(基板) 30: Substrate to be processed (substrate)

35:密封基板(基板) 35: Sealing the substrate (substrate)

40:支承面板(支承體) 40: Support panel (support body)

41:面板(支承體) 41: Panel (support body)

50:減壓室 50: Decompression Chamber

100、101、102:黏貼裝置 100, 101, 102: Paste device

第1圖表示本發明一實施形態(第一實施形態)之黏貼裝置100的概略構成的圖。 FIG. 1 is a diagram showing a schematic configuration of a sticking apparatus 100 according to an embodiment (first embodiment) of the present invention.

第2圖是說明本發明一實施形態(第一實施形態)之黏貼裝置100的負載感測器15及支承構件10的配置的圖。 FIG. 2 is a diagram illustrating the arrangement of the load cell 15 and the support member 10 of the sticking device 100 according to one embodiment (first embodiment) of the present invention.

第3圖是說明本發明一實施形態(第一實施形態)之黏貼裝置100的下側板構件1a、保持部16、連結軸17、位置 感測器18及減壓室50的配置的圖。 Fig. 3 illustrates the lower plate member 1a, the holding portion 16, the connecting shaft 17, and the position of the sticking device 100 according to an embodiment (first embodiment) of the present invention A diagram showing the arrangement of the sensor 18 and the decompression chamber 50 .

第4圖是針對本發明一實施形態(第一實施形態)之黏貼裝置100的動作說明的圖。 FIG. 4 is a diagram for explaining the operation of the sticking apparatus 100 according to an embodiment (first embodiment) of the present invention.

第5圖是針對本發明一實施形態(第一實施形態)之黏貼裝置100的動作說明的圖。 FIG. 5 is a diagram for explaining the operation of the sticking apparatus 100 according to one embodiment (first embodiment) of the present invention.

第6圖是針對本發明一實施形態(第一實施形態)之黏貼裝置100的動作說明的圖。 FIG. 6 is a diagram for explaining the operation of the sticking apparatus 100 according to one embodiment (first embodiment) of the present invention.

第7圖是針對本發明一實施形態(第一實施形態)之黏貼裝置100的動作說明的圖。 FIG. 7 is a diagram for explaining the operation of the sticking apparatus 100 according to one embodiment (first embodiment) of the present invention.

第8圖是針對本發明一實施形態(第一實施形態)之黏貼裝置100的動作說明的圖。 FIG. 8 is a diagram for explaining the operation of the sticking apparatus 100 according to an embodiment (first embodiment) of the present invention.

第9圖是針對本發明一實施形態(第一實施形態)之黏貼裝置100的動作說明的圖。 FIG. 9 is a diagram for explaining the operation of the sticking apparatus 100 according to one embodiment (first embodiment) of the present invention.

第10圖是針對本發明一實施形態(第一實施形態)之黏貼裝置100的動作說明的圖。 Fig. 10 is a diagram for explaining the operation of the sticking apparatus 100 according to an embodiment (first embodiment) of the present invention.

第11圖是針對本發明一實施形態(第一實施形態)之黏貼裝置100的動作說明的圖。 FIG. 11 is a diagram for explaining the operation of the sticking apparatus 100 according to one embodiment (first embodiment) of the present invention.

第12圖表示本發明其他實施形態(第二實施形態)之黏貼裝置101的概略構成的圖。 Fig. 12 is a diagram showing a schematic configuration of a sticking apparatus 101 according to another embodiment (second embodiment) of the present invention.

第13圖是說明本發明其他實施形態(第二實施形態)之黏貼裝置101的負載感測器15’及支承構件10的配置的圖。 Fig. 13 is a diagram for explaining the arrangement of the load cell 15' and the support member 10 of the sticking device 101 according to another embodiment (second embodiment) of the present invention.

第14圖表示本發明另一其他實施形態(第三實施形態)之黏貼裝置102的概略構成的圖。 FIG. 14 is a diagram showing a schematic configuration of a sticking apparatus 102 according to another embodiment (third embodiment) of the present invention.

第15圖是說明本發明的各實施形態之黏貼裝置黏貼的 被處理基板30及支承面板40的概略的圖。 Fig. 15 is a diagram illustrating the sticking of the sticking apparatus according to the embodiments of the present invention A schematic diagram of the substrate to be processed 30 and the support panel 40 .

<黏貼裝置100> <Paste Device 100>

使用第1圖~第3圖,針對本發明一實施形態(第一實施形態)之黏貼裝置100詳細說明。 The sticking apparatus 100 according to one embodiment (first embodiment) of the present invention will be described in detail with reference to FIGS. 1 to 3 .

第1圖是本實施形態之黏貼裝置100的概略構成的圖。第2圖是說明本實施形態之黏貼裝置100的負載感測器15的配置(第2圖的(a)),及支承構件10的配置(第2圖的(b))的圖。 FIG. 1 is a diagram showing a schematic configuration of a sticking apparatus 100 according to the present embodiment. FIG. 2 is a diagram illustrating the arrangement of the load cells 15 ( FIG. 2( a )) and the arrangement of the support member 10 ( FIG. 2( b )) of the bonding apparatus 100 of the present embodiment.

第3圖是說明本發明一實施形態之黏貼裝置100的下側板構件1a、保持部16、位置感測器18及減壓室50的配置的圖。 FIG. 3 is a diagram illustrating the arrangement of the lower plate member 1 a , the holding portion 16 , the position sensor 18 , and the decompression chamber 50 of the sticking device 100 according to the embodiment of the present invention.

如第1圖表示,本實施形態的黏貼裝置100具備一對板構件1,一對板構件1具備下側板構件1a與上側板構件1b。在此,從下側板構件1a的背面側藉著複數支承構件10支承下側板構件1a的被處理基板30,及將佔據支承著支承面板40的平面部11a全面的區域等分割所構成的各該分割支承區域12。 As shown in FIG. 1, the bonding apparatus 100 of the present embodiment includes a pair of plate members 1, and the pair of plate members 1 includes a lower plate member 1a and an upper plate member 1b. Here, the substrates 30 to be processed that support the lower plate member 1 a from the back side of the lower plate member 1 a via the plurality of support members 10 , and each of the substrates 30 that occupy the entire surface of the plane portion 11 a supporting the support panel 40 is divided into equal parts. The support region 12 is divided.

藉此,黏貼裝置100在以上側板構件1b施加推壓力時,可藉下側板構件1a均勻地阻止該推壓力。在此,下側板構件1a的平面部11a及上側板構件1b的平面部11b為矩形。因此,黏貼裝置100可相對於矩形的被處理基板30 及矩形的支承面板40之包括矩形角部的全面均勻地施加推壓力。藉此,黏貼裝置100可形成具備均一厚度的矩形的層疊體。亦即,黏貼裝置100是典型地在形成面板型的層疊體進行基板加工之PLP(Panel Level Package)技術中可適當黏貼基板與支承體的裝置。 Thereby, when the sticking device 100 exerts a pressing force on the upper side plate member 1b, the pressing force can be uniformly blocked by the lower side plate member 1a. Here, the flat surface portion 11a of the lower plate member 1a and the flat surface portion 11b of the upper plate member 1b are rectangular. Therefore, the sticking device 100 can be relative to the rectangular processed substrate 30 And the entire surface of the rectangular support panel 40 including the rectangular corners is uniformly applied with a pressing force. Thereby, the sticking apparatus 100 can form a rectangular laminated body having a uniform thickness. That is, the sticking apparatus 100 is an apparatus that can appropriately stick a substrate and a support body in a PLP (Panel Level Package) technique for forming a panel-type laminate and performing a substrate processing typically.

以下,針對黏貼裝置100具備的板構件1、支承構件10、伺服馬達13、負載感測器15、保持部16及位置感測器18進一步詳細說明。 Hereinafter, the plate member 1 , the support member 10 , the servo motor 13 , the load sensor 15 , the holding portion 16 , and the position sensor 18 included in the sticking device 100 will be described in further detail.

[板構件1] [Plate member 1]

如第1圖表示,板構件1是用於黏貼被處理基板30及支承面板(支承體)40的構件。板構件1分別是以配設在上下方向的下側板構件(一方的板構件)1a及上側板構件(另一方的板構件)1b所構成。又,板構件1分別是在下側板構件1a的平面部11a與上側板構件1b的平面部11b之間,夾入地黏貼被處理基板30及支承面板40,形成層疊體60(第11圖)。 As shown in FIG. 1 , the plate member 1 is a member for attaching the substrate to be processed 30 and the support panel (support body) 40 . The plate members 1 are constituted by a lower-side plate member (one plate member) 1a and an upper-side plate member (the other plate member) 1b arranged in the up-down direction, respectively. In the plate member 1, the substrate to be processed 30 and the support panel 40 are sandwiched between the flat surface portion 11a of the lower plate member 1a and the flat surface portion 11b of the upper plate member 1b to form a laminate 60 (FIG. 11).

[下側板構件1a] [Lower side plate member 1a]

下側板構件1a是載放被處理基板30及支承面板40之一側的板構件,被複數支承構件10所支承。下側板構件1a是具備載放板2、下側中間板3、下側支承板4的構成。 The lower plate member 1 a is a plate member on which the substrate to be processed 30 and the support panel 40 are placed, and is supported by the plurality of support members 10 . The lower-side plate member 1 a has a configuration including a placing plate 2 , a lower-side intermediate plate 3 , and a lower-side support plate 4 .

下側板構件1a的平面部11a是以黏貼之物件的被處理基板30及支承面板40的相似形為佳,具有與被處理基板30及支承面板40相同的面積,或具有比被處理基板30 及支承面板40大的面積。更具體而言,平面部11a的面積比被處理基板30及支承面板40的面積大時,被處理基板30及支承面板40的周邊端部是比平面部11a的周邊端部更配置在內側,複數支承構件10的全部是以配置在被處理基板30及支承面板40的內周圍部更佳。 Preferably, the flat portion 11a of the lower plate member 1a is similar in shape to the substrate to be processed 30 and the support panel 40 of the object to be pasted, and has the same area as the substrate to be processed 30 and the support panel 40, or has a larger area than the substrate to be processed 30 and the support panel 40. And the support panel 40 has a large area. More specifically, when the area of the flat surface portion 11a is larger than the areas of the substrate to be processed 30 and the support panel 40, the peripheral end portions of the substrate to be processed 30 and the support panel 40 are arranged on the inner side of the peripheral end portion of the flat surface portion 11a, It is more preferable that all of the plurality of support members 10 are arranged on the inner periphery of the substrate to be processed 30 and the support panel 40 .

如第2圖的(b)表示,佔據平面部11a的全部的區域是將該區域等分割成16個分割支承區域12所構成,分割支承區域12分別為平面部11a之形狀的相似形。並且,第2圖的(b)中,以一點虛線區分平面部11a的面內的各個區域為分割支承區域12,僅對其中之一的一個分割支承區域12賦予符號,針對其他的分割支承區域12省略號。又如第2圖的(b)表示,在分割支承區域12內以虛線記載支承構件10,僅對其中之一的一個支承構件10賦予符號,針對其他的支承構件10省略號。 As shown in FIG. 2(b), the entire area occupying the flat portion 11a is formed by equally dividing the area into 16 divided support regions 12, each of which is a similar shape to the shape of the flat portion 11a. Further, in FIG. 2(b), each area within the plane of the flat surface portion 11a is identified by a dotted line as the divided support area 12, only one of the divided support areas 12 is given a symbol, and the other divided support areas are assigned symbols. 12 ellipsis. As shown in FIG. 2( b ), the support members 10 are described by dotted lines in the divided support regions 12 , and only one of the support members 10 is given a symbol, and the other support members 10 are abbreviated.

黏貼裝置100是藉複數支承構件10,從形成下側板構件1a之平面部11a的相似形所等分割的16個分割支承區域12的各個背面側支承下側板構件。 The bonding apparatus 100 supports the lower plate member from the back side of each of the 16 divided support regions 12 equally divided by the similar shape forming the flat surface portion 11a of the lower plate member 1a by means of the plurality of support members 10 .

如上述,在分割支承區域12的各個背面側配置複數支承構件10,可藉此在配置於平面部11a的矩形的被處理基板30及也包括矩形的支承面板40之角部的周緣部份的全面,配置支承構件10。藉此,可將上側板構件1b所施加的推壓力,在矩形的平面部11a中均勻地阻止。因此,黏貼裝置100可適當黏貼使得矩形的被處理基板30及矩形的支承面板40成為均勻的厚度。 As described above, by arranging the plurality of support members 10 on the respective rear sides of the divided support regions 12, the rectangular substrate 30 to be processed and the peripheral portion including the corners of the rectangular support panel 40 arranged on the flat surface 11a can thereby be formed. Overall, the support member 10 is arranged. Thereby, the pressing force applied by the upper plate member 1b can be uniformly stopped in the rectangular flat portion 11a. Therefore, the sticking device 100 can stick properly so that the rectangular substrate to be processed 30 and the rectangular support panel 40 have uniform thickness.

再者,黏貼裝置100中,分割支承區域12的數量為16個,但是佔據上側板構件的平面部的全面之區域的相似形的分割推壓區域的數量不限於16個,即42個。分割支承區域12的數量只要是在N2個的分割推壓區域等分割佔據平面部全面的區域的構成即可。在此,N雖可對應下側板構件1a的大小適當設計,但N為2以上的整數時,可將施加於板構件的推壓力均等地分割阻止。並且,例如在黏貼510mm×510mm~550mm×550mm的面積的被處理基板30及支承面板40的場合,雖不加以限定,但N是以2~8的整數為佳,4~8的範圍的整數更佳。 In addition, in the sticking device 100, the number of the divided support areas 12 is 16, but the number of similar divided pressing areas occupying the entire area of the flat portion of the upper plate member is not limited to 16 , that is, 42. The number of the divided support regions 12 may be any configuration as long as the regions occupying the entire surface of the plane portion are divided into N 2 divided pressing regions. Here, although N can be appropriately designed according to the size of the lower plate member 1a, when N is an integer of 2 or more, the pressing force applied to the plate member can be equally divided and prevented. In addition, for example, in the case of bonding the substrate to be processed 30 and the support panel 40 with an area of 510 mm×510 mm to 550 mm×550 mm, although not limited, N is preferably an integer of 2 to 8, and an integer in the range of 4 to 8 is preferable. better.

[支承構件10] [Support member 10]

如第1圖及第2圖的(b)表示,複數支承構件10是從下側板構件的平面部11a個別地分別支撐該等支承區域12。支承構件10是配置使支承構件10的剖面的中心點與該等分割支承區域12的中心點在與平面部11a平行的X-Y平面上形成一致為佳。又,支承構件10以使其剖面的形狀成圓形為佳。又,支承構件10的直徑雖不加以限定,但以推壓時具有支承下側板構件1a所需的強度,下側板構件1a不致散熱程度之細的為佳,例如以40mm~80mm為佳,以50mm~70mm更佳,並以60mm最佳。 As shown in Fig. 1 and Fig. 2(b), the plurality of support members 10 individually support the support regions 12 from the flat surface portion 11a of the lower plate member. The support member 10 is preferably arranged so that the center point of the cross section of the support member 10 and the center point of the divided support regions 12 are aligned on the X-Y plane parallel to the plane portion 11a. Moreover, it is preferable that the cross-sectional shape of the support member 10 is circular. In addition, although the diameter of the support member 10 is not limited, it is preferable to have the strength required to support the lower side plate member 1a during pressing, and the lower side plate member 1a is not too thin to dissipate heat, for example, 40mm~80mm, and 50mm~70mm is better, and 60mm is the best.

又,支承構件10是例如以不鏽鋼等的金述所形成。複數支承構件10是固定在減壓室50的底部,從下側板構件1a的平面部11a的背面側,根據分割支承區域12, 個別地支承下側板構件1a。並且,支承構件10也可分別藉墊片(調整構件,未圖示)適當調整高度來維持以上側板構件1b施加推壓力時的平面部11a的平面度。 In addition, the support member 10 is formed of metal such as stainless steel, for example. The plurality of support members 10 are fixed to the bottom of the decompression chamber 50, and the support regions 12 are divided from the back side of the flat surface portion 11a of the lower plate member 1a. The lower side plate members 1a are individually supported. In addition, each of the support members 10 may be appropriately adjusted in height by spacers (adjustment members, not shown) to maintain the flatness of the plane portion 11a when the upper side plate member 1b applies a pressing force.

(下側板構件1a的其他的構成) (Other configuration of the lower plate member 1a)

此外,下側板構件1a是與被處理基板30或支承面板40接觸的部位,例如以支承面板40側為上載放層疊被處理基板30與支承面板40的層疊體的載放板2;支承構件10所支承之部位的下側支承板4;及設置於載放板2與下側支承板4間的下側中間板3所構成。又,下側板構件1a具備支承被處理基板30或支承面板40的複數支承銷5。 In addition, the lower plate member 1 a is a portion that contacts the substrate to be processed 30 or the support panel 40 , for example, the support panel 40 side is placed as an upper plate 2 on which a laminate of the substrate to be processed 30 and the support panel 40 is placed; the support member 10 The lower side support plate 4 of the supported part; In addition, the lower plate member 1a includes a plurality of support pins 5 that support the substrate to be processed 30 or the support panel 40 .

載放板2及下側中間板3是以氧化鋁等的陶瓷形成。又,在載放板2及下側中間板3之間,夾入藉著加熱下側板構件1a在推壓時將層疊體加熱用的面加熱器或筒形加熱器等的加熱裝置(未圖示)。亦即,下側板構件1a內置加熱裝置。以加熱裝置加熱下側板構件的平面部11a。藉此,例如可頭尾良好地接著被處理基板30或支承面板40或重疊後的被處理基板30及支承面板40。因此,例如透過接著層黏貼被處理基板30與支承面板40時,可適當將該接著層加熱。加熱裝置是例如可對應接著層所含的熱塑性樹脂或硬化性樹脂,適當調整加熱條件。 The placement plate 2 and the lower intermediate plate 3 are formed of ceramics such as alumina. Further, between the placing plate 2 and the lower intermediate plate 3, a heating device (not shown in the figure) such as a surface heater or a cartridge heater for heating the laminated body during pressing is sandwiched by heating the lower plate member 1a. Show). That is, the lower side plate member 1a has a built-in heating device. The flat portion 11a of the lower side plate member is heated with a heating device. Thereby, for example, the substrate to be processed 30 or the support panel 40 or the substrate to be processed 30 and the support panel 40 after being superimposed can be satisfactorily attached to each other. Therefore, for example, when the substrate to be processed 30 and the support panel 40 are pasted through the adhesive layer, the adhesive layer can be appropriately heated. The heating device can appropriately adjust heating conditions according to the thermoplastic resin or curable resin contained in the adhesive layer, for example.

下側支承板4是以不鏽鋼等的金屬、陶瓷或石頭等形成。因此,下側中間板3具有防止加熱裝置與下側支承板4短路的作為絕緣體的功能。又,下側支承板4是以 金屬形成,因此下側板構件1a對支承構件10的固定變得容易。並且,載放板2、下側中間板3及下側支承板4是以複數的螺栓及螺帽彼此固定。因此,在以金屬形成下側支承板4的場合,藉螺栓及螺帽的固定容易。 The lower support plate 4 is formed of metal such as stainless steel, ceramics, stone, or the like. Therefore, the lower intermediate plate 3 has a function as an insulator for preventing the short circuit between the heating device and the lower support plate 4 . In addition, the lower support plate 4 is Since it is formed of metal, it becomes easy to fix the lower plate member 1a to the support member 10 . In addition, the placement plate 2, the lower intermediate plate 3, and the lower support plate 4 are fixed to each other with a plurality of bolts and nuts. Therefore, when the lower support plate 4 is formed of metal, fixing by bolts and nuts is easy.

載放板2形成其表面,即平面部11a在非推壓時的平面度為1.0μm以下。在此,平面度是表示相對於平面之凹度程度的數值,「平面度1.0μm以下」是指非推壓時的載放板2(及後述的推壓板6)表面的凹凸為±1.0μm以下。並且,載放板2例如具有35mm以上的厚度(上下方向的厚度)可降低推壓時的彎曲量。載放板2是以陶瓷形成,因此使其表面的平面部成為1.0μm以下而可容易加工。又,陶瓷與金屬比較,由於熱膨脹率小在加熱狀態下的推壓時之平面部11a的表面及推壓板6的表面(即,後述的平面部11b)的彎曲或扭曲等的產生困難。因此,可維持下側板構件1a的平面部11a及上側板構件1b的平面部11b的平面性(水準性)。下側板構件1a也可進一步具備測量平面部11a的溫度之例如熱電偶等構成的溫度計(未圖示)。 The surface of the placement plate 2, that is, the flatness of the flat portion 11a when not pressed is 1.0 μm or less. Here, flatness is a numerical value indicating the degree of concavity with respect to a flat surface, and “flatness of 1.0 μm or less” means that the unevenness on the surface of the placement plate 2 (and the pressing plate 6 described later) during non-pressing is ±1.0 μm the following. In addition, the placing plate 2 has a thickness (the thickness in the vertical direction) of, for example, 35 mm or more, so that the amount of bending at the time of pressing can be reduced. Since the placement plate 2 is formed of ceramics, the flat portion of the surface thereof is 1.0 μm or less, and thus it can be easily processed. In addition, since ceramics have a smaller thermal expansion coefficient than metals, warping or twisting of the surface of the flat portion 11a and the surface of the pressing plate 6 (that is, the flat portion 11b described later) during pressing in a heated state is difficult to occur. Therefore, the flatness (levelness) of the flat portion 11a of the lower plate member 1a and the flat portion 11b of the upper plate member 1b can be maintained. The lower plate member 1a may further include a thermometer (not shown) including, for example, a thermocouple, which measures the temperature of the flat portion 11a.

(支承銷5) (Support pin 5)

如第3圖的(a)表示,複數支承銷5是設置在下側板構件1a的銷,在支承被處理基板30或支承面板40的狀態下,藉驅動手段(未圖示)相對於平面部11a上下移動。藉此,複數支承銷5從其底面支承被處理基板30或支承面板40而上下移動。並且,在板構件1中,夾入被處理基板30及支承面 板40推壓時,將支承銷5收納於下側板構件1a的內部。 As shown in Fig. 3(a), the plurality of support pins 5 are pins provided on the lower plate member 1a, and in a state of supporting the substrate 30 to be processed or the support panel 40, are driven relative to the flat surface portion 11a by a driving means (not shown). Moving up and down. Thereby, the plurality of support pins 5 support the substrate to be processed 30 or the support panel 40 from the bottom surface thereof and move up and down. In addition, in the plate member 1, the substrate to be processed 30 and the supporting surface are sandwiched When the plate 40 is pressed, the support pin 5 is accommodated inside the lower plate member 1a.

黏貼裝置100中,6個支承銷5是配置在下側板構件1a的平面部11a的面內區分分割支承區域12的線量(一點虛線)的交點上。 In the bonding apparatus 100, the six support pins 5 are arranged at the intersections of the lines (dotted lines) dividing the support regions 12 in the plane of the flat portion 11a of the lower plate member 1a.

支承銷5的材料雖不加以限定,但可以是熱傳導性佳的鋁及不鏽鋼(SUS)等,也可以具耐磨性的樹脂,例如聚醯亞胺樹脂等構成。聚醯亞胺樹脂可舉例有Vespel(商標登記)等。 Although the material of the support pin 5 is not limited, it may be made of aluminum, stainless steel (SUS), etc. with good thermal conductivity, or a resin with wear resistance, such as polyimide resin. As a polyimide resin, Vespel (trademark registration) etc. are mentioned.

[上側板構件1b] [Upper side plate member 1b]

黏貼裝置100藉著將上側板構件1b朝下側板構件1a移動,推壓以夾入被處理基板30及支承面板40。藉此,黏貼被處理基板30及支承面板40形成層疊體60。並且,上側板構件1b的平面部11b的大小是與下側板構件1a的平面部11a的大小相同。 The bonding apparatus 100 pushes and sandwiches the substrate to be processed 30 and the support panel 40 by moving the upper plate member 1b toward the lower plate member 1a. Thereby, the to-be-processed board|substrate 30 and the support panel 40 are adhere|attached, and the laminated body 60 is formed. In addition, the size of the plane portion 11b of the upper plate member 1b is the same as the size of the plane portion 11a of the lower plate member 1a.

上側板構件1b是由推壓板6、上側中間板7及上側支承板8構成。上側板構件1b是將施加於上側支承板8的力透過上側中間板7傳遞至推壓板6,藉此對被處理基板30及支承面板40施加推壓力。又,在推壓板6與上側中間板7之間夾入加熱裝置(未圖示)。加熱裝置可使用與上述的加熱裝置相同的裝置,加熱於上側板構件的平面部11b的溫度也是以和上述相同的溫度為佳。 The upper-side plate member 1 b is constituted by a pressing plate 6 , an upper-side intermediate plate 7 , and an upper-side support plate 8 . The upper plate member 1 b transmits the force applied to the upper support plate 8 to the pressing plate 6 through the upper intermediate plate 7 , thereby applying a pressing force to the substrate to be processed 30 and the support panel 40 . Furthermore, a heating device (not shown) is sandwiched between the pressing plate 6 and the upper intermediate plate 7 . As the heating device, the same device as the above-mentioned heating device can be used, and the temperature for heating the flat surface portion 11b of the upper plate member is preferably the same as the above-described temperature.

推壓板6及上側中間板7是以氧化鋁等的陶瓷形成,上側支承板8是以不鏽鋼等的金屬、陶瓷及石頭等 形成。因此,上側中間板7具有防止加熱裝置與上側支承板8短路的作為絕緣體的功能。又,上側支承板8是以金屬形成,因此上側板構件1b對下部推壓軸(推壓軸)14b的固定變得容易。並且,推壓板6、上側中間板7及上側支承板8是以複數的螺栓及螺帽彼此固定。因此,在以金屬形成上側支承板8的場合,藉螺栓及螺帽的固定容易。 The pressing plate 6 and the upper intermediate plate 7 are made of ceramics such as alumina, and the upper support plate 8 is made of metals such as stainless steel, ceramics, stones, etc. form. Therefore, the upper intermediate plate 7 has a function as an insulator for preventing the short circuit between the heating device and the upper support plate 8 . Moreover, since the upper support plate 8 is formed of metal, it becomes easy to fix the upper plate member 1b to the lower pressing shaft (pressing shaft) 14b. In addition, the pressing plate 6, the upper intermediate plate 7, and the upper support plate 8 are fixed to each other with a plurality of bolts and nuts. Therefore, when the upper support plate 8 is formed of metal, fixing by bolts and nuts is easy.

推壓板6的平面部,即平面部11b在非推壓時的平面度為1.0μm以下。並且,推壓板6例如具有35mm以上的厚度(上下方向的厚度)可降低推壓時的彎曲量。推壓板6是以陶瓷形成,因此使平面部11b的平面度成為1.0μm以下可容易加工。 The flatness of the flat portion of the pressing plate 6, that is, the flatness of the flat portion 11b when not pressed is 1.0 μm or less. In addition, the pressing plate 6 has a thickness (the thickness in the vertical direction) of, for example, 35 mm or more, so that the amount of bending at the time of pressing can be reduced. Since the pressing plate 6 is formed of ceramics, the flatness of the flat portion 11b can be easily processed by setting the flatness of the flat portion 11b to be 1.0 μm or less.

上側板構件1b進一步具備測量平面部11b的溫度之例如熱電偶等構成的溫度計(未圖示),並在與推壓板6的層疊體接觸的部位具備推壓銷9。 The upper plate member 1b is further provided with a thermometer (not shown) composed of, for example, a thermocouple for measuring the temperature of the flat portion 11b, and a pressing pin 9 at a portion contacting the laminated body of the pressing plate 6 .

(推壓銷9) (push pin 9)

推壓銷9是將先前搬運至減壓室50內的被處理基板30或支承面板40向Z方向朝下側推壓的銷。本實施形態中,推壓銷9在推壓板6設有6個,推壓銷9的前端部是與支承銷5的各前端部相對地配置。並且,第1圖是圖示6個推壓銷9之中的一部份,其他的省略。 The pressing pin 9 is a pin for pressing the substrate to be processed 30 or the support panel 40 that has been transported into the decompression chamber 50 downward in the Z direction. In the present embodiment, six pressing pins 9 are provided on the pressing plate 6 , and the front end portions of the pressing pins 9 are arranged to face each front end portion of the support pins 5 . In addition, Fig. 1 shows a part of the six pressing pins 9, and the others are omitted.

推壓銷9分別是藉推壓軸14,在Z方向可同時上下移動,在抵接於被處理基板30或支承面板40的上面時,藉著彈簧(彈推構件)9a,將被處理基板30或支承面板 40朝Z方向向下側彈推。如上述,配置支承銷5與推壓銷9,彈推被處理基板30或支承面板40,可藉此適當推壓被處理基板30或支承面板40的平面部之內周圍部份的一部份。並且,推壓銷9在板構件1藉著夾入被處理基板30及支承面板40而施加推壓力時,被收納於上側板構件1b的內部。 The pressing pins 9 can move up and down simultaneously in the Z direction by the pressing shafts 14, respectively. When the pressing pins 9 are in contact with the upper surface of the substrate to be processed 30 or the support panel 40, the substrate to be processed 30 is moved by a spring (pushing member) 9a. or support panel 40 Bounce downwards in the Z direction. As described above, by arranging the support pins 5 and the push pins 9 to push the target substrate 30 or the support panel 40 , a part of the surrounding portion within the flat surface of the target substrate 30 or the support panel 40 can be appropriately pressed. . In addition, the pressing pins 9 are accommodated in the inside of the upper plate member 1 b when the plate member 1 applies a pressing force by sandwiching the substrate to be processed 30 and the support panel 40 .

推壓銷9朝著Z方向不向下側移動,為此將位在不與保持於保持部16之被處理基板30或支承面板40的位置,在本說明書中,稱推壓銷9位於「待機位置」(第8圖)。相對於此,上側板構件1b向下方移動,其結果,將可藉著彈簧9a彈推保持在保持部16的被處理基板30或支承面板40的位置,在本說明書中,稱推壓銷9位於「推壓位置」(第9圖)。 The push pins 9 do not move downward in the Z direction, and for this reason, they are located at positions not related to the substrate to be processed 30 or the support panel 40 held by the holding portion 16. In this specification, the push pins 9 are referred to as being located at " Standby position" (Fig. 8). On the other hand, the upper plate member 1b moves downward, and as a result, the position of the substrate to be processed 30 or the support panel 40 held by the holding portion 16 is pushed and held by the spring 9a. In this specification, the position is called the pressing pin 9 in the "push position" (Fig. 9).

[伺服馬達13] [Servo motor 13]

伺服馬達13是藉著朝Z方向向下側移動上側板構件1b,對配置於上側板構件1b及下側板構件1a之間的被處理基板30或支承面板40施加推壓力的馬達。再者,如第1圖表示,在黏貼裝置100中,伺服馬達13是配置在減壓室50的外部,固定於固定框71。又,減壓室50是固定於台座部72。亦即,黏貼裝置100中,伺服馬達13與減壓室50並非一體而是個別固定。在此,假如將伺服馬達13固定於減壓室50的場合,從伺服馬達13朝被處理基板30或支承面板40施加推壓力時,對減壓室50產生負載,會有產生扭曲之 虞。相對於此,個別固定伺服馬達13與減壓室50,可防止負載施加於減壓室。例如,將伺服馬達13固定於固定框71,將減壓室50固定於台座部72,可分別對固定框71及台座部72施加負載,對減壓室不會造成負擔。 The servo motor 13 is a motor that applies a pressing force to the substrate to be processed 30 or the support panel 40 disposed between the upper plate member 1b and the lower plate member 1a by moving the upper plate member 1b downward in the Z direction. Furthermore, as shown in FIG. 1 , in the sticking apparatus 100 , the servo motor 13 is arranged outside the decompression chamber 50 and is fixed to the fixing frame 71 . In addition, the decompression chamber 50 is fixed to the pedestal portion 72 . That is, in the sticking device 100, the servo motor 13 and the decompression chamber 50 are not integrally but fixed separately. Here, if the servo motor 13 is fixed to the decompression chamber 50, when a pressing force is applied from the servo motor 13 to the substrate to be processed 30 or the support panel 40, a load is applied to the decompression chamber 50, which may cause distortion. Yu. On the other hand, by fixing the servo motor 13 and the decompression chamber 50 individually, a load can be prevented from being applied to the decompression chamber. For example, by fixing the servo motor 13 to the fixing frame 71 and fixing the decompression chamber 50 to the pedestal portion 72, loads can be applied to the fixing frame 71 and the pedestal portion 72, respectively, without burdening the decompression chamber.

伺服馬達13是透過具備上部推壓軸14a及下部推壓軸14b的推壓軸14,對配置在減壓室50的內部的上側板構件1b施加推壓力。更具體而言,推壓軸14是在上部推壓軸14a及下部推壓軸14b之間,設有負載感測器15,將透過負載感測器15施加的力透過插入減壓室50的下部推壓軸14b傳達至上側板構件1b。亦即,黏貼裝置100是將負載感測器15設置在減壓室50的外部。 The servo motor 13 applies a pressing force to the upper plate member 1b disposed inside the decompression chamber 50 through the pressing shaft 14 including the upper pressing shaft 14a and the lower pressing shaft 14b. More specifically, the pressing shaft 14 is provided with a load cell 15 between the upper pressing shaft 14a and the lower pressing shaft 14b, and transmits the force applied by the load cell 15 through the lower pressing shaft inserted into the decompression chamber 50 14b is communicated to the upper side plate member 1b. That is, in the pasting device 100 , the load cell 15 is provided outside the decompression chamber 50 .

[負載感測器15] [Load Sensor 15]

又,負載感測器((loadcell;負載轉換器)推壓力檢測部)15是檢測伺服馬達13透過上側板構件1b,施加於被處理基板30及支承面板40的推壓力,在減壓室50的外部中,設置在上部推壓軸14a及下部推壓軸14b之間。負載感測器15是藉著伺服馬達13,檢測施加於上側板構件1b的負載後轉換成電訊號。 In addition, the load cell (load cell; load converter) pressing force detection unit) 15 detects the pressing force applied by the servo motor 13 to the substrate to be processed 30 and the support panel 40 through the upper plate member 1 b, and is detected in the decompression chamber 50 It is provided between the upper pressing shaft 14a and the lower pressing shaft 14b in the outside of the . The load sensor 15 detects the load applied to the upper plate member 1b by the servo motor 13 and converts it into an electrical signal.

黏貼裝置100是使用壓縮型的負載感測器作為推壓力檢測部。作為壓縮型的負載感測器,例如可舉例梁型、柱型、S型及膜片型等的負載感測器。 The sticking device 100 uses a compression-type load cell as a pressing force detection unit. As a compression-type load sensor, for example, beam-type, column-type, S-type, and diaphragm-type load cells can be exemplified.

又,如第2圖的(a)表示,黏貼裝置100中,負載感測器15配置有一個,從上側板構件1b的平面部11b的 背面側,檢測以該平面部11b的中心點為中心施加的推壓力。藉此,根據負載感測器15檢測後之推壓力的大小,伺服馬達13調整施加於上側板構件1b的推壓力。因此,可適當調整用於貼合被處理基板30及支承面板40的推壓力。 In addition, as shown in FIG. 2(a), in the bonding apparatus 100, one load cell 15 is arranged, and the load cell 15 is disposed from the surface of the flat surface portion 11b of the upper side plate member 1b. On the back side, the pressing force applied around the center point of the flat portion 11b is detected. As a result, the servo motor 13 adjusts the pressing force applied to the upper plate member 1b according to the magnitude of the pressing force detected by the load sensor 15 . Therefore, the pressing force for bonding the substrate to be processed 30 and the support panel 40 can be appropriately adjusted.

[保持部16] [holding part 16]

保持部16是將搬入減壓室50的被處理基板30或支承面板40預先保持在下側板構件1a與上側板構件1b之間的構件。保持部16具備間隔片16a、筒狀部16b及軸部16c(第3圖的(b)及(c))。 The holding portion 16 is a member that holds the substrate to be processed 30 or the support panel 40 carried into the decompression chamber 50 between the lower plate member 1 a and the upper plate member 1 b in advance. The holding part 16 is provided with the spacer piece 16a, the cylindrical part 16b, and the shaft part 16c ((b) and (c) of FIG. 3).

如第3圖的(b)表示,間隔片16a是支承搬入至減壓室50的被處理基板30或支承面板40的底面側之周緣部份的一部份。對間隔片16a的材質尤其不加以限定,例如可以將不鏽鋼(SUS)倒角,使用以聚四氟乙烯等為樹脂塗層的材質。 As shown in FIG. 3( b ), the spacer 16 a is a part of the peripheral edge portion on the bottom surface side of the substrate 30 to be processed or the support panel 40 that is carried into the decompression chamber 50 . The material of the spacer 16a is not particularly limited. For example, stainless steel (SUS) can be chamfered, and a material coated with a resin such as polytetrafluoroethylene can be used.

將軸部16c插穿於連通減壓室50的外部與內部的筒狀部16b,使該軸部16c在筒狀部16b的內側滑動地相對於X方向平行移動。並且,藉軸部16c與筒狀部16b形成的減壓室50的間隙也可以例如具備油封、金屬熔封等習知的手段,密閉使空氣不致從外部連入減壓室50。 The shaft portion 16c is inserted into the cylindrical portion 16b that communicates the outside and the inside of the decompression chamber 50, and the shaft portion 16c is slid inside the cylindrical portion 16b to move in parallel with respect to the X direction. In addition, the clearance of the decompression chamber 50 formed by the shaft portion 16c and the cylindrical portion 16b may be sealed by conventional means such as oil seal and metal sealing so as to prevent air from entering the decompression chamber 50 from the outside.

如第3圖的(a)表示,黏貼裝置100具備四個保持部16。又,黏貼裝置100具備兩個連結軸17,四個保持部16分別在減壓室50的外部,以兩個為一組地以連結軸17連結。藉連結軸17連結後的2組的保持部16分別在減壓室 50的內部夾著下側板構件1a,並使各保持部16的間隔片16a彼此相對地配置。黏貼裝置100在以驅動部(未圖示)使兩個連結軸17彼此接近地移動時,相對於X方向平行移動,以使得分別連結在連結軸17的兩個保持部16的端部接近彼此相對配置的間隔片16a的端部。藉此,如第3圖的(b)及(c)表示,四個保持部16分別可從其底面,藉間隔片16a支承地移動矩形的被處理基板30或支承面板40的周緣部份。 As shown in FIG. 3( a ), the sticking device 100 includes four holding parts 16 . In addition, the sticking device 100 includes two connecting shafts 17 , and the four holding parts 16 are respectively connected to the outside of the decompression chamber 50 by the connecting shafts 17 as a set of two. The two sets of holding parts 16 connected by the connecting shaft 17 are in the decompression chambers, respectively. The lower plate member 1a is sandwiched inside 50, and the spacers 16a of the respective holding portions 16 are arranged to face each other. The sticking device 100 moves parallel to the X direction so that the ends of the two holding parts 16 respectively connected to the connecting shafts 17 come close to each other when the two connecting shafts 17 are moved close to each other by the driving part (not shown). The ends of the spacers 16a arranged opposite to each other. Thereby, as shown in (b) and (c) of FIG. 3, the four holding portions 16 can move the peripheral portion of the rectangular substrate 30 or the support panel 40 while being supported by the spacers 16a from the bottom surfaces thereof.

被處理基板30或支承面板40在被運到保持部16的上部為止,四個間隔片16a分別在不與被處理基板30或支承面板40皆不重疊的位置移動。本說明書中,此一狀態時,稱間隔片16a是位在「脫離位置」。在被處理基板30或支承面板40被運入保持部16更上方之後,使得四個間隔片16a分別回到與被處理基板30或支承面板40重疊的位置,以可藉保持部16支承被處理基板30或支承面板40。本說明書中,此一狀態時,稱間隔片16a是位在「插入位置」。並且,第3圖的(a)是表示間隔片16a位於「脫離位置」的狀態,第3圖的(b)及(c)是表示間隔片16a位於「插入位置」的狀態。 Until the substrate to be processed 30 or the support panel 40 is transported to the upper part of the holding unit 16 , the four spacers 16 a move at positions that do not overlap with the substrate to be processed 30 or the support panel 40 , respectively. In this specification, in this state, the spacer 16a is said to be in the "disengaged position". After the substrate to be processed 30 or the support panel 40 is carried into the upper part of the holding part 16 , the four spacers 16 a are respectively returned to the positions overlapping the substrate to be processed 30 or the support panel 40 , so that the substrate to be processed can be supported by the holding part 16 . Substrate 30 or support panel 40 . In this specification, in this state, the spacer 16a is referred to as the "insertion position". In addition, Fig. 3(a) shows the state in which the spacer 16a is in the "disengagement position", and Fig. 3(b) and (c) show the state in which the spacer 16a is in the "insertion position".

支承保持部16的被處理基板30或支承面板40的間隔片16a與被處理基板30或支承面板40重疊的寬度d3為非限定地,可以從被處理基板30或支承面板40的周緣跨內側1~5mm程度獲得。適當為5mm。又,間隔片16a的橫寬d4雖可為5mm,但不限於此。 The width d 3 of the spacer 16 a supporting the substrate to be processed 30 or the support panel 40 of the holding unit 16 overlapping the substrate to be processed 30 or the support panel 40 is not limited, and may span the inner side from the peripheral edge of the substrate to be processed 30 or the support panel 40 1~5mm degree is obtained. Appropriately, it is 5mm. In addition, although the lateral width d4 of the spacer 16a may be 5 mm, it is not limited to this.

[位置感測器18] [Position Sensor 18]

位置感測器(位置檢測器)18是設置在減壓室50的外部,從減壓室50的外部的保持部16的位置檢測減壓室50之內部的保持部16的端部,即間隔片16a的位置的磁感測器。 The position sensor (position detector) 18 is provided outside the decompression chamber 50, and detects the end of the holding portion 16 inside the decompression chamber 50 from the position of the holding portion 16 outside the decompression chamber 50, that is, the interval Magnetic sensor for the position of sheet 16a.

如第3圖的(b)表示,位置感測器18具備:設置在固定於連結軸17的軸部的磁鐵18a,及配置在該磁鐵18a的移動方向的前後,檢測該磁鐵18a的位移的兩個感測頭18b及18c。在此,磁鐵18a是設置在固定於連結軸17的軸部的端部,感測頭18b及18c是設置在插穿該軸部的缸筒。磁鐵18a在連結軸17沿著X方向移動時,與兩個間隔片16a同時,在缸筒內部等距離移動。此時,兩個感測頭18b及18c是根據從磁鐵18a發出的磁變化,檢測磁鐵18a的位置。藉此,與磁鐵18a同時可特定等距離移動的兩個間隔片16a的位置。因此,可一邊維持著減壓室50的減壓環境,並與減壓室50的操作獨立,可確認保持部16的端部的位置。又,驅動連結軸17的驅動部(未圖示)例如為空氣驅動部的場合,藉著根據起因於空氣壓力的變化產生之該驅動部的移動距離的變化的誤動作,間隔片16a可適當保持被處理基板30或支承面板40防止損傷。 As shown in (b) of FIG. 3 , the position sensor 18 includes a magnet 18a provided on the shaft portion fixed to the connecting shaft 17, and a magnet 18a disposed before and after the moving direction of the magnet 18a to detect the displacement of the magnet 18a. Two sensor heads 18b and 18c. Here, the magnet 18a is provided at the end portion of the shaft portion fixed to the connecting shaft 17, and the sensor heads 18b and 18c are provided at the cylinder tube inserted through the shaft portion. When the connecting shaft 17 moves in the X direction, the magnet 18a moves equidistantly inside the cylinder simultaneously with the two spacers 16a. At this time, the two sensor heads 18b and 18c detect the position of the magnet 18a based on the magnetic change emitted from the magnet 18a. Thereby, the position of the two spacer pieces 16a which can be moved equidistantly at the same time as the magnet 18a can be specified. Therefore, the decompression environment of the decompression chamber 50 can be maintained, and the position of the end portion of the holding portion 16 can be confirmed independently of the operation of the decompression chamber 50 . In addition, when the driving part (not shown) that drives the coupling shaft 17 is, for example, an air driving part, the spacer 16a can be properly held by malfunction according to the change in the moving distance of the driving part caused by the change in the air pressure. The substrate 30 to be processed or the support panel 40 is prevented from being damaged.

並且,本實施型態的黏貼裝置100雖採用磁感測器,但檢測部不限於磁感測器。具體而言,只要是藉超音波或雷射等檢測物件物的位移的位置測量感測器,可使 用任意的感測器。 In addition, although the sticking device 100 of the present embodiment uses a magnetic sensor, the detection unit is not limited to the magnetic sensor. Specifically, as long as it is a position measurement sensor that detects the displacement of an object by means of ultrasonic waves or lasers, the Use any sensor.

位置測量感測器除了磁感測器之外,例如,可舉例超音波感測器、渦流感測器、雷射感測器及接觸式感測器等。 In addition to the magnetic sensor, the position measurement sensor includes, for example, an ultrasonic sensor, an eddy current sensor, a laser sensor, and a touch sensor.

[減壓室50] [decompression chamber 50]

減壓室50是在可減壓的環境下,黏貼被處理基板30或支承面板40的空間,將黏貼裝置100的板構件1及支承構件10收納於其內部。又,在減壓室50設有習知的減壓手段(未圖示),可藉該減壓手段控制減壓室50內的內部壓力。 The decompression chamber 50 is a space in which the substrate to be processed 30 or the support panel 40 is attached in a decompressible environment, and the plate member 1 and the support member 10 of the attaching apparatus 100 are accommodated therein. In addition, a conventional decompression means (not shown) is provided in the decompression chamber 50, and the internal pressure in the decompression chamber 50 can be controlled by the decompression means.

並在減壓室50設有搬入被處理基板30及支承面板40,並搬出黏貼後之層疊體60用的可開合的收送窗口(未圖示)。再者,被處理基板30與支承面板40的搬入,及層疊體60的搬出是可藉機械手臂等習知的搬運裝置或人手進行。 The decompression chamber 50 is provided with an openable and closable receiving window (not shown) for carrying in the substrate 30 to be processed and the support panel 40 and carrying out the laminated body 60 after sticking. In addition, the carrying-in of the substrate 30 to be processed and the support panel 40, and the carrying-out of the laminated body 60 can be performed by a conventional conveying device such as a robot arm or by a human hand.

減壓室50為可減壓的構成,因此在減壓氛圍下透過接著層黏貼被處理基板30與支承面板40,藉此在被處理基板30及支承面板40之間,可適當防止在接著層產生氣泡,可適當防止該氣泡導致黏貼不良。又,例如,可適當防止在接著層與被處理基板30之間產生孔隙。 The decompression chamber 50 has a structure that can be decompressed. Therefore, the substrate to be processed 30 and the support panel 40 are pasted through the adhesive layer in a decompressed atmosphere, so that between the substrate to be processed 30 and the support panel 40, the adhesive layer can be properly prevented. The generation of air bubbles can appropriately prevent the air bubbles from causing poor adhesion. Also, for example, generation of voids between the adhesive layer and the substrate to be processed 30 can be appropriately prevented.

[黏貼裝置100的動作] [Operation of the pasting device 100]

接著,針對本實施形態的黏貼裝置100之黏貼被處理基板30與支承面板40用的概略的動作說明。 Next, the schematic operation|movement for sticking the to-be-processed board|substrate 30 and the support panel 40 of the sticking apparatus 100 of this embodiment is demonstrated.

第4~11圖是針對本實施形態的黏貼裝置100的動作,藉減壓室50之內部的狀態說明的圖。並且,為說明的方便起見,對於伺服馬達13、上部推壓軸14a及負載感測器15,省略其圖示。 FIGS. 4 to 11 are diagrams for explaining the operation of the sticking device 100 of the present embodiment using the state of the inside of the decompression chamber 50 . In addition, for the convenience of description, illustration of the servo motor 13, the upper pressing shaft 14a, and the load cell 15 is omitted.

(1.朝減壓室50之支承面板40的搬入) (1. Carrying in to the support panel 40 of the decompression chamber 50 )

首先,透過減壓室50的收受視窗(未圖示),搬入支承面板40。藉支承銷5支承搬入後的支承面板40(參閱第4圖)。並且,在此階段,預先使保持部16成為脫離位置。 First, the support panel 40 is carried in through the receiving window (not shown) of the decompression chamber 50 . The loaded support panel 40 is supported by the support pins 5 (see FIG. 4 ). In addition, at this stage, the holding portion 16 is set to the disengaged position in advance.

(2.朝間隔片16a之支承面板40的收送) (2. Delivery to the support panel 40 of the spacer 16a)

接著,藉著將支承銷5朝Z方向的移動,使載放於支承銷5的支承面板40位在比保持部16更上側,移動至不與推壓銷9接觸的位置為止(參閱第5圖)。並且,使間隔片16a在插入位置移動之後,支承銷5在Z方向的下側移動。藉此,不改變支承面板40的水準方向的位置以間隔片16a支承著(參閱第6圖)。 Next, by moving the support pin 5 in the Z direction, the support panel 40 placed on the support pin 5 is positioned above the holding portion 16 and moved to a position where it does not come into contact with the push pin 9 (see Section 5 picture). And after the spacer piece 16a is moved to an insertion position, the support pin 5 is moved to the lower side of a Z direction. Thereby, the position which does not change the horizontal direction of the support panel 40 is supported by the spacer piece 16a (refer FIG. 6).

(3.朝減壓室50之被處理基板30的搬入) (3. Carrying-in of the substrate 30 to be processed into the decompression chamber 50 )

接著,與支承面板40的場合同樣,在此狀態下,透過減壓室50的收送視窗,搬入被處理基板30(參閱第7圖)。隨後,關閉收送視窗之後,開始減壓室50的減壓。減壓室50的減壓條件適當為在10Pa以下。 Next, as in the case of the support panel 40 , in this state, the substrate to be processed 30 is carried in through the receiving window of the decompression chamber 50 (see FIG. 7 ). Then, after closing the sending and receiving window, the decompression of the decompression chamber 50 is started. The decompression condition of the decompression chamber 50 is suitably 10 Pa or less.

(4.被處理基板30的加熱) (4. Heating of the substrate 30 to be processed)

接著,使支承銷5在Z方向的下側移動,藉此將被處理基板30載放於下側板構件1a加熱。藉此,將形成在被處理基板30的上面的接著層加熱(參閱第8圖)。 Next, the substrate 30 to be processed is placed on the lower plate member 1 a and heated by moving the support pins 5 to the lower side in the Z direction. Thereby, the adhesive layer formed on the upper surface of the substrate to be processed 30 is heated (see FIG. 8).

(5.暫固定) (5. Temporarily fixed)

接著,將加熱後的上側板構件1b下降至Z方向的下側,藉此與支承面板40的上面接觸。伴隨上側板構件1b與支承面板40的上面接觸,推壓銷9從待機位置移動至推壓位置,使間隔片16a所支承的支承面板40施加藉彈簧9a朝著Z方向的下側彈推的力。接著,將載放在支承銷5的被處理基板30,藉著該支承銷5在Z方向的上側移動。藉此,使形成在被處理基板30的上面的接著層移動至間隔片16a所支承的支承面板40的底面附近(參閱第9圖)。隨後,將間隔片16a移動至脫離位置,藉著推壓銷9的彈簧9a所施加的力,而被支承銷5及推壓銷9夾入,推壓被處理基板30與支承面板40(參閱第10圖)。藉此,將被處理基板30與支承面板40重疊、暫固定。 Next, the heated upper-side plate member 1b is lowered to the lower side in the Z direction, and thereby comes into contact with the upper surface of the support panel 40 . As the upper plate member 1b comes into contact with the upper surface of the support panel 40, the push pin 9 moves from the standby position to the push position, so that the support panel 40 supported by the spacer 16a is biased toward the lower side in the Z direction by the spring 9a. force. Next, the substrate to be processed 30 placed on the support pins 5 is moved to the upper side in the Z direction by the support pins 5 . Thereby, the adhesive layer formed on the upper surface of the substrate to be processed 30 is moved to the vicinity of the bottom surface of the support panel 40 supported by the spacer 16a (see FIG. 9). Then, the spacer 16a is moved to the disengaged position, and is sandwiched by the support pins 5 and the push pins 9 by the force of the springs 9a of the push pins 9, and pushes the substrate to be processed 30 and the support panel 40 (refer to Figure 10). Thereby, the substrate 30 to be processed and the support panel 40 are overlapped and temporarily fixed.

(6.被處理基板30與支承面板40的黏貼) (6. Adhesion of the substrate 30 to be processed and the support panel 40 )

接著,以相同速度使支承銷5與上側板構件1b下降。藉此,在加熱後的上側板構件1b與加熱後的下側板構件1a之間,夾入並推壓被處理基板30與支承面板40,藉此黏貼被處理基板30與支承面板40(參閱第11圖)。 Next, the support pin 5 and the upper side plate member 1b are lowered at the same speed. Thereby, between the heated upper plate member 1b and the heated lower plate member 1a, the substrate to be processed 30 and the support panel 40 are sandwiched and pressed, whereby the substrate to be processed 30 and the support panel 40 are adhered (refer to the 11 Figures).

[層疊體60] [Laminated body 60]

針對第15圖表示的本實施形態的黏貼裝置100之黏貼物件的被處理基板30、支承面板40及層疊體60的概略說明。並且,層疊體60是黏貼被處理基板30與支承面板40所成的層疊體。 A schematic description of the substrate to be processed 30 , the support panel 40 , and the laminated body 60 to which the sticking device 100 of the present embodiment shown in FIG. 15 sticks objects. In addition, the laminated body 60 is a laminated body formed by bonding the substrate to be processed 30 and the support panel 40 .

(被處理基板30) (Substrate 30 to be processed)

本實施形態中,被處理基板30具備在藉密封材33密封元件32的密封體的一方的平面部中,形成有將位於元件32之端部的端子配置在晶片區外用的再配線層31的密封基板(基板)35,該密封基板35是透過接著層43及分離層42,支承於面板(支承體)41的基板。在與再配線層31的支承面板40接觸的面形成有接著層43。並且,形成於再配線層31的接著層43是可採用元件32及密封材33與分離層42之間的接著層43相同的構件等,被處理基板30的面板(支撐體)41、分離層42可採用與後述的支承面板40具備的構件等相同的構件等。 In the present embodiment, the substrate 30 to be processed is provided with a rewiring layer 31 for arranging a terminal located at an end of the element 32 outside the wafer area in one flat portion of the sealing body that seals the element 32 by the sealing material 33 . The sealing substrate (substrate) 35 is a substrate supported by the panel (support) 41 through the adhesive layer 43 and the separation layer 42 . An adhesive layer 43 is formed on the surface of the rewiring layer 31 in contact with the support panel 40 . In addition, the bonding layer 43 formed on the rewiring layer 31 may be the same member as the bonding layer 43 between the element 32 and the sealing material 33 and the separation layer 42. The panel (support) 41 of the substrate to be processed 30, the separation layer, etc. can be used. 42 can employ the same members and the like as those included in the support panel 40 to be described later.

被處理基板30是藉黏貼裝置100,黏貼於支承面板40,形成層疊體60之後,從被處理基板30的面板41側,朝向被處理基板30側的分離層42照射光。藉此,使該分離層42變質,將被處理基板30側的面板41從層疊體60分離。隨後,在支承於支承面板40之密封基板35的未設置再配線層31的面中,進行安裝另外元件(未圖示)等的加工。 After the substrate 30 to be processed is bonded to the support panel 40 by the bonding apparatus 100 to form the laminate 60, light is irradiated from the side of the panel 41 of the substrate to be processed 30 toward the separation layer 42 of the substrate to be processed 30. Thereby, the quality of the separation layer 42 is changed, and the panel 41 on the side of the substrate to be processed 30 is separated from the laminated body 60 . Then, on the surface of the sealing substrate 35 supported by the support panel 40 on which the rewiring layer 31 is not provided, a process of mounting another component (not shown) or the like is performed.

元件32為半導體元件或其他的元件,具有單層或複數層的構造。並且,元件32為半導體元件的場合,藉切割密封基板35所獲得的電子零元件成為半導體裝置。 The element 32 is a semiconductor element or other element, and has a structure of a single layer or a plurality of layers. In addition, when the element 32 is a semiconductor element, the electronic component obtained by dicing the sealing substrate 35 becomes a semiconductor device.

作為密封材33,例如可使用環氧系的樹脂、矽系的樹脂等。一實施形態中,密封材33並非設置於各元件32,而是一體地密封安裝於接著層43的複數元件32的全部。 As the sealing material 33 , for example, epoxy-based resin, silicon-based resin, or the like can be used. In one embodiment, the sealing material 33 is not provided on each element 32 , but integrally seals all of the plurality of elements 32 attached to the adhesive layer 43 .

再配線層31也稱為RDL(Redistribution Layer),構成與元件32連接的配線的薄膜的配線體,具有單層或複數層的構造。一實施形態中,再配線層31雖是在介質(例如,氧化矽(SiOX)、光敏性環氧基等的光敏性樹脂等),藉介質(例如,鋁、銅、鈦、鎳、金等的金屬等)形成有配線的構成,但不為此所限定。 The redistribution layer 31 is also called an RDL (Redistribution Layer), and is a thin-film wiring body that constitutes wiring connected to the element 32 and has a single-layer or plural-layer structure. In one embodiment, the rewiring layer 31 is made of a dielectric (eg, silicon oxide (SiO x ), a photosensitive resin such as a photosensitive epoxy group, etc.), and a dielectric (eg, aluminum, copper, titanium, nickel, gold, etc.) (such as metals, etc.) have a structure in which wiring is formed, but is not limited to this.

再者,第15圖表示的被處理基板30中,在與再配線層31的支承面板40接觸的面設有接著層43,但另外的實施形態中,接著層43也可以設置在與支承面板40上之分離層42的被處理基板30接觸的面。 Furthermore, in the substrate to be processed 30 shown in FIG. 15, the adhesive layer 43 is provided on the surface in contact with the support panel 40 of the rewiring layer 31, but in another embodiment, the adhesive layer 43 may be provided on the support panel. The surface of the separation layer 42 on the 40 that is in contact with the substrate to be processed 30 .

又,黏貼裝置100也可以將未被面板41所支承的密封基板35黏貼於支承面板40來取代被處理基板30。又,被處理基板30不限於藉面板41支承密封基板35所成的基板,也可以是矽晶圓基板、陶瓷基板、薄膜基板、撓性基板等任意的基板。 In addition, the sticking apparatus 100 may stick the sealing substrate 35 not supported by the panel 41 to the support panel 40 instead of the substrate to be processed 30 . Further, the substrate to be processed 30 is not limited to a substrate in which the sealing substrate 35 is supported by the panel 41, and may be any substrate such as a silicon wafer substrate, a ceramic substrate, a thin film substrate, and a flexible substrate.

(支承面板40) (Support panel 40)

支承面板40是支承被處理基板30的支承體,形成有面板(支承體)41與在該面板41上的分離層42。支承面板40是透過該分離層42,黏貼於被處理基板30的密封基板35。 The support panel 40 is a support body that supports the substrate to be processed 30 , and a panel (support body) 41 and a separation layer 42 on the panel 41 are formed. The support panel 40 is a sealing substrate 35 attached to the substrate to be processed 30 through the separation layer 42 .

面板41在基板的薄化、搬運、安裝等的過程時,為防止基板的破損或變形具有所需的強度即可,以進一步輕量為佳。從以上的觀點,面板41是以玻璃、矽、丙烯酸系樹脂、陶瓷等構成為佳,並以玻璃構成為更佳。 The panel 41 only needs to have the required strength to prevent breakage or deformation of the substrate during the process of thinning, conveying, and mounting of the substrate, and it is preferable to further reduce the weight. From the above viewpoints, the panel 41 is preferably made of glass, silicon, acrylic resin, ceramics, or the like, and more preferably made of glass.

分離層42是藉吸收透過面板41所照射的光而變質的層。分離層42雖是以僅具有吸收光的構造的材料所形成的為佳,但是在不損及分離層之本質特性的範圍,也可添加不具有吸收光之構造的材料,形成分離層42。 The separation layer 42 is a layer changed in quality by absorbing the light irradiated through the panel 41 . Although the separation layer 42 is preferably formed of a material having only a light-absorbing structure, a material that does not have a light-absorbing structure may be added to form the separation layer 42 within the range that does not impair the essential characteristics of the separation layer.

一實施形態中,分離層42也可由氟碳化合物構成。分離層42是藉氟碳化合物所構成,藉著吸收光而變質,其結果,會喪失接受光的照射之前的強度或接著性。因此,施加些微的外力(例如,抬起支承面板40等),會破壞分離層42,可容易使面板41與密封基板35分離。構成分離層42的氟碳化合物可以藉電漿CVD(化學氣相沉積)法適當成膜。 In one embodiment, the separation layer 42 may be formed of a fluorocarbon compound. The separation layer 42 is made of a fluorocarbon compound, and is degraded by absorbing light, and as a result, loses strength or adhesiveness before being irradiated with light. Therefore, applying a slight external force (for example, lifting the support panel 40 , etc.) will destroy the separation layer 42 , and the panel 41 and the sealing substrate 35 can be easily separated. The fluorocarbon compound constituting the separation layer 42 can be appropriately formed into a film by a plasma CVD (chemical vapor deposition) method.

又,在其他的實施形態中,例如,分離層42也可以使用將具有光吸收性的構造包含於其重複的單位的聚合物;具有無機物、紅外線吸收性的構造的化合物;及反應性聚倍半矽氧烷等所形成。並且,分離層42的光的吸收率是以80%以上為佳。 Further, in other embodiments, for example, the separation layer 42 may use a polymer having a light-absorbing structure in its repeating unit; a compound having an inorganic substance or an infrared-absorbing structure; and a reactive polyplex. Formed by semi-siloxane, etc. In addition, the light absorption rate of the separation layer 42 is preferably 80% or more.

分離層42的厚度為下限值是以0.05μm以上為 佳,並以0.3μm以上更佳。又,分離層42的厚度為上限值是以50μm以下為佳,並以1μm以下更佳。分離層42的厚度納入0.05μm~50μm的範圍時,藉短時間的光的照射及低能量的光的照射,可以在分離層42產生預定的變質。又,分離層42的厚度從生產性的觀點尤其以納入1μm以下的範圍為最佳。 The lower limit of the thickness of the separation layer 42 is 0.05 μm or more preferably, and more preferably 0.3 μm or more. In addition, the upper limit of the thickness of the separation layer 42 is preferably 50 μm or less, and more preferably 1 μm or less. When the thickness of the separation layer 42 falls within the range of 0.05 μm to 50 μm, a predetermined change in the separation layer 42 can be caused by irradiation of light for a short time and light of low energy. In addition, the thickness of the separation layer 42 is preferably within the range of 1 μm or less from the viewpoint of productivity.

接著層43為接著被處理基板30之密封基板35與支承面板40的層,藉著在基板及面板的至少其中一方塗抹接著劑所形成。構成接著層的接著劑,例如可包括以藉著加熱使熱流動性提升的熱塑性樹脂作為接著材料,也可以包括藉著熱或光硬化的硬化性樹脂。熱塑性樹脂是例如可舉例有丙烯酸系樹脂、苯乙烯系樹脂、馬來醯亞胺系樹脂、烴系樹脂、熱塑性彈性體及聚碸系樹脂等。又,硬化性樹脂是例如丙烯酸樹脂、環氧樹脂,或者,上述熱塑性樹脂是例如可舉例含丙烯酸單體等的硬化性單體的樹脂組成物等。 The next layer 43 is a layer to be followed by the sealing substrate 35 and the support panel 40 of the substrate 30 to be processed, and is formed by applying an adhesive to at least one of the substrate and the panel. The adhesive constituting the adhesive layer may include, for example, a thermoplastic resin whose thermal fluidity is improved by heating as an adhesive material, or may include a curable resin that is cured by heat or light. As a thermoplastic resin, an acrylic resin, a styrene-type resin, a maleimide-type resin, a hydrocarbon-type resin, a thermoplastic elastomer, a polysilicon-type resin, etc. are mentioned, for example. Moreover, the curable resin is, for example, an acrylic resin, an epoxy resin, or the above-mentioned thermoplastic resin is, for example, a resin composition containing a curable monomer such as an acrylic monomer, and the like.

對於接著物的形成方法,即在基板或面板塗抹接著劑的塗抹方法,或者在基材塗抹接著劑形成接著帶的形成方法,尤其不加以限定,但是接著劑的塗抹方法例如可舉例有藉旋轉塗抹法、浸漬法、滾刀法、噴淋法、狹縫噴嘴法的塗抹法等。 The method of forming the adhesive, that is, the method of applying the adhesive to the substrate or the panel, or the method of applying the adhesive to the substrate to form the adhesive tape, is not particularly limited, but the method of applying the adhesive can be, for example, by rotating The coating method, the dipping method, the hob method, the spray method, the smearing method of the slit nozzle method, etc.

接著層的厚度只要對應成為黏貼對象的基板及面板的種類、對黏貼後的基板施加的處理等適當設定即可,但以10~150μm的範圍內為佳,並以15~100μm的範圍 內更佳。 The thickness of the adhesive layer may be appropriately set according to the types of substrates and panels to be pasted, the treatment applied to the substrates after pasting, and the like, but is preferably in the range of 10 to 150 μm, and preferably in the range of 15 to 100 μm Better inside.

[層疊體的變形例] [Variation of the laminated body]

黏貼裝置100藉黏貼基板與支承體形成的層疊體不限於上述的實施形態。黏貼裝置100形成的層疊體只要可黏貼密封基板35與面板41即可,也可具備接著層及分離層的其中之一。 The laminated body formed by the bonding apparatus 100 by bonding the substrate and the support is not limited to the above-described embodiment. The laminated body formed by the sticking apparatus 100 only needs to be capable of sticking the sealing substrate 35 and the panel 41 , and may include one of an adhesive layer and a separation layer.

例如,一變形例的層疊體也可以是透過吸收光變質的分離層將密封基板(基板)與藉光穿透的材料形成的面板(支承體)層疊所構成的層疊體。亦即,如層疊體60,在分離層42與密封基板35之間也可不具備接著層43。作為如此之形成層疊體用的分離層,可舉例具有接著性的分離層,該分離層例如可舉例如硬化型樹脂,或熱塑性樹脂並使用具備光吸收性的樹脂形成的分離層,及在具有接著性的樹脂配合吸收光的材料所構成的分離層等。在使用硬化型樹脂或熱塑性樹脂並具備光吸收性的樹脂所形成的分離層,例如可舉例使用聚醯亞胺樹脂形成的分離層。並且,在具有接著性的樹脂配合吸收光的材料所構成的分離層,例如可舉例在丙烯酸系紫外線硬化型樹脂配合碳黑等所構成的分離層,及在黏著性樹脂配合玻璃燈泡的紅外線吸收材料等所構成的分離層等。並且,該等分離層不論接著性的有無,皆是在吸收光而變質之分離層的範疇。 For example, the laminate of a modified example may be a laminate formed by laminating a sealing substrate (substrate) and a panel (support) formed of a material through which light penetrates through a separation layer that absorbs light and degrades. That is, like the laminated body 60 , the adhesive layer 43 may not be provided between the separation layer 42 and the sealing substrate 35 . As the separation layer for forming the laminate in this way, a separation layer having adhesiveness can be exemplified. For example, the separation layer includes a separation layer formed of a curable resin, a thermoplastic resin and a resin having light absorption properties, and a separation layer having a light-absorbing property. The adhesive resin is blended with a separation layer or the like made of a material that absorbs light. As the separation layer formed using a curable resin or a thermoplastic resin and a light-absorbing resin, for example, a separation layer formed using a polyimide resin can be exemplified. In addition, the separation layer composed of an adhesive resin mixed with a light-absorbing material includes, for example, a separation layer composed of an acrylic UV-curable resin mixed with carbon black, and an adhesive resin mixed with a glass bulb for infrared absorption. A separation layer composed of materials, etc. In addition, regardless of the presence or absence of adhesiveness, these separation layers are all in the category of separation layers that absorb light and change in quality.

又,另外其他的變形例的層疊體是例如透過接著層將密封基板(基板)及藉光穿透的材料形成的面板(支 承體)層疊所構成的層疊體,該接著層是具有施加機械力可剝離程度之接著力的接著層。可形成如此之層疊體的接著劑例如可舉例感壓性接著劑(黏著劑)及可剝離性接著劑等。在感壓性接著劑,例如可舉例習知的感壓性接著劑。可剝離性接著劑,例如也可以在熱塑性樹脂、光硬化性樹脂或熱硬化性樹脂等,配合蠟或矽等的脫模劑來調整接著力的接著劑。並且,也可以包含熱硬化性樹脂或光硬化性樹脂等,使該等的樹脂硬化藉此發現如可剝離性的硬化型的接著劑。又,如此之可剝離的接著劑可以是包含以蜜蠟或蠟等接著力低的熱塑性樹脂為主成份所成的接著劑。 In addition, the laminated body of another modification example is, for example, a panel (support) formed of a material through which a sealing substrate (substrate) and light transmits through an adhesive layer. A laminate formed by lamination of a carrier), and the adhesive layer is an adhesive layer having an adhesive force to the extent that it can be peeled off by applying a mechanical force. As an adhesive which can form such a laminated body, a pressure-sensitive adhesive (adhesive), a peelable adhesive, etc. are mentioned, for example. Examples of the pressure-sensitive adhesive include conventional pressure-sensitive adhesives. As the peelable adhesive, for example, a thermoplastic resin, a photocurable resin, a thermosetting resin, or the like may be mixed with a release agent such as wax or silicon to adjust the adhesive force. In addition, a thermosetting resin, a photocurable resin, or the like may be contained, and a hardening adhesive such as releasability may be found by curing these resins. Moreover, such a peelable adhesive may be an adhesive mainly composed of a thermoplastic resin having a low adhesive force such as beeswax or wax.

<黏貼裝置101> <Paste Device 101>

本發明的黏貼裝置不限於上述的實施形態(第一實施形態)。如第12圖及第13圖表示,例如,一實施形態(第二實施形態)的黏貼裝置101具備四個負載感測器15’,伺服馬達13是透過一個上部推壓軸14’a,朝該等四個負載感測器15’施加推壓力,負載感測器15’分別是透過下部推壓軸14’b朝上側板構件1b施加推壓力的構成。 The sticking device of the present invention is not limited to the above-described embodiment (first embodiment). As shown in FIGS. 12 and 13, for example, the sticking device 101 of one embodiment (the second embodiment) includes four load cells 15', and the servo motor 13 pushes the shaft 14'a through an upper pressing shaft 14'a toward the When the pressing force is applied to the four load cells 15', the load cells 15' are configured to apply the pressing force to the upper plate member 1b through the lower pressing shaft 14'b, respectively.

第12圖是表示第二實施形態之黏貼裝置101的概略構成的圖,第13圖的(a)是說明第二實施形態之黏貼裝置101的負載感測器15’的配置的圖,第13圖的(b)是說明支承構件10的配置的圖。並且,針對與第一實施形態相同的符號的構件是指相同的構件,省略其說明。又,第12圖及第13圖是僅針對四個負載感測器15’的一個賦予符號,針 對以相同形狀所圖示的其他負載感測器15’則省略符號。同樣地,針對將平面部11b以兩點虛線等分割的分割推壓區域,也僅針對一個分割推壓區域19賦予符號,針對其他的分割推壓區域19則省略符號。 FIG. 12 is a diagram showing a schematic configuration of the sticking device 101 according to the second embodiment, and (a) of FIG. 13 is a view explaining the arrangement of the load cells 15 ′ of the sticking device 101 according to the second embodiment. (b) of the figure is a figure explaining the arrangement|positioning of the support member 10. FIG. In addition, the members with the same reference numerals as those in the first embodiment refer to the same members, and the description thereof will be omitted. In addition, FIGS. 12 and 13 are symbols only for one of the four load sensors 15', and the Symbols are omitted for other load cells 15' shown in the same shape. Similarly, with respect to the divided pressing regions equally divided by the two-dotted dashed line, only one divided pressing region 19 is given a reference numeral, and the other divided pressing regions 19 are not referenced.

如第13圖的(a)表示,黏貼裝置101分別配置有四個負載感測器15’,推壓以兩點虛線所區分的四個分割推壓區域19的各個中心點。四個負載感測器15’分別是透過下部推壓軸14’b,配置有上側板構件1b。藉此,可在將平面部11b等分割為四個的分割推壓區域19分別檢測伺服馬達13施加於上側板構件1b之平面部11b的推壓力。因此,可藉一個負載感測器15,與檢測施加於上側板構件1b之平面部11b的推壓力的場合不同,可適當檢測出施加於上側板構件1b之平面部11b的推壓力的差,即推壓力的偏差。藉此,可減小在將平面部11b等分割為四個的分割推壓區域19分別所檢測之推壓力的差,可藉一個負載感測器獲得比檢測施加於板構件1的推壓力的場合更為均勻之推壓力的分佈。 As shown in (a) of FIG. 13, the sticking device 101 is provided with four load cells 15', respectively, and presses the respective center points of the four divided pressing regions 19 divided by the two-dotted dotted line. The four load cells 15' pass through the lower pressing shafts 14'b, respectively, and are provided with the upper plate member 1b. As a result, the pressing force applied by the servo motor 13 to the flat surface portion 11b of the upper plate member 1b can be detected in the divided pressing regions 19 in which the flat surface portion 11b is divided into four equal parts. Therefore, the difference in the pressing force applied to the flat surface portion 11b of the upper plate member 1b can be appropriately detected by a single load sensor 15, which is different from the case of detecting the pressing force applied to the flat surface portion 11b of the upper plate member 1b, That is, the deviation of the pushing force. Thereby, the difference between the pressing forces detected in the divided pressing regions 19 that divide the flat portion 11b into four parts can be reduced, and a load cell can obtain a higher pressure than the detection of the pressing force applied to the plate member 1 by one load sensor. The distribution of the pushing force is more uniform in the occasion.

並且,黏貼裝置101也可以將成為標準取樣的被處理基板30及支承面板40,或調整用工件(成為標準取樣的被加工板)配置在下側板構件1a及上側板構件1b之間,以伺服馬達13施加推壓力,藉此特定各負載感測器15’檢測之推壓力的差,隨後,調整使得該推壓力的差變小。 In addition, the sticking device 101 may arrange the substrate to be processed 30 and the support panel 40 for standard sampling, or the workpiece for adjustment (the to-be-processed plate for standard sampling) between the lower plate member 1a and the upper plate member 1b, and the servo motor may 13. By applying the pushing force, the difference of the pushing force detected by each load sensor 15' is specified, and then, it is adjusted so that the difference in the pushing force becomes smaller.

將四個負載感測器15’分別檢測的推壓力變小 的方法中,例如可舉例將墊片(調整構件,未圖示)插入負載感測器15’與下部推壓軸14’b的間隙,調整推壓力的差的方法。 Reduce the thrust force detected by the four load sensors 15' In this method, for example, a spacer (adjustment member, not shown) is inserted into the gap between the load sensor 15' and the lower pressing shaft 14'b to adjust the difference in the pressing force.

再者,如第13圖的(b)表示,黏貼裝置101與黏貼裝置100的場合同樣,具備分別由其背面側支承各分割支承區域12的支承構件10,可均勻地阻止施加於下側板構件1a的平面部11a的推壓力。藉此,黏貼裝置101在下側板構件1a的平面部11a可均勻地阻止從上側板構件1b的平面部11b均勻分布施加的推壓力。因此,可以均勻的厚度適當黏貼被處理基板30及支承面板40。 Furthermore, as shown in FIG. 13(b), the sticking device 101 is provided with the support member 10 that supports each of the divided support regions 12 from the back side, as in the case of the sticking device 100, so that the application to the lower side plate member can be prevented uniformly. The pressing force of the flat part 11a of 1a. Thereby, the sticking device 101 can evenly prevent the pressing force applied from the flat surface 11b of the upper plate member 1b from being uniformly distributed on the flat surface 11a of the lower plate member 1a. Therefore, the substrate 30 to be processed and the support panel 40 can be properly bonded with a uniform thickness.

並且,黏貼裝置101中,分割推壓區域19的數量雖為4個,但占據上側板構件的平面部全面的區域之相似形的分割推壓區域的數量不限於4個,即22個。分割推壓區域19的數量只要是在M2個的分割推壓區域等分割佔據平面部全面的區域的構成即可。在此,M雖可對應上側板構件1b的大小適當設計,但M只要是2以上的整數,即可適當檢測施加於板構件之推壓力的分佈。又,M為2以上的整數,且較規定分割支承區域12之數量的N小的整數時,可適當檢測出施加於板構件全面之推壓力的偏差,M是以2~8的整數為佳,並以4~8的範圍的整數更佳。 In addition, in the sticking device 101, although the number of divided pressing regions 19 is four, the number of similar divided pressing regions occupying the entire area of the flat surface of the upper plate member is not limited to four, that is, 22 . The number of the divided pressing regions 19 may be a configuration in which an area occupying the entire surface of the plane portion is divided into M 2 divided pressing regions or the like. Here, although M can be appropriately designed according to the size of the upper plate member 1b, as long as M is an integer of 2 or more, the distribution of the pressing force applied to the plate member can be appropriately detected. In addition, when M is an integer of 2 or more and is smaller than N, which specifies the number of divided support regions 12, the deviation of the pressing force applied to the entire surface of the plate member can be appropriately detected, and M is preferably an integer of 2 to 8. , and preferably an integer in the range of 4 to 8.

<黏貼裝置102> <Paste Device 102>

本發明的黏貼裝置不限於上述的實施形態(第一實施形態及第二實施形態)。如第14圖表示,例如,一實施形 態(第三實施形態)的黏貼裝置102具備四個伺服馬達13’取代第二實施形態的一個伺服馬達13,並具備推壓力特定部20及控制部21的構成。 The sticking apparatus of the present invention is not limited to the above-described embodiments (first embodiment and second embodiment). As shown in Fig. 14, for example, an embodiment The sticking apparatus 102 of the second embodiment (third embodiment) includes four servo motors 13' instead of one servo motor 13 of the second embodiment, and includes a pressing force specifying unit 20 and a control unit 21.

藉此,黏貼裝置102根據在四個負載感測器15’分別所檢測的推壓力,四個伺服馬達13’可個別調整施加於板構件1的推壓力。藉此,例如可適應被處理基板30及支承面板40的個體差或種類的變化地適當調整施加於板構件1的推壓力。 Thereby, the four servo motors 13' can individually adjust the pressing force applied to the plate member 1 according to the pressing force detected by the four load sensors 15', respectively, by the sticking device 102. Thereby, the pressing force applied to the plate member 1 can be appropriately adjusted, for example, in accordance with individual differences or changes in the types of the substrates 30 to be processed and the support panels 40 .

以下,使用第14圖,針對本實施形態的黏貼裝置102具有的複數伺服馬達13’、推壓力特定部20及控制部21進一步詳細說明。 Hereinafter, the plurality of servo motors 13', the pressing force specifying unit 20, and the control unit 21 included in the sticking device 102 of the present embodiment will be described in further detail with reference to Fig. 14 .

第14圖是表示本實施形態之黏貼裝置102的概略構成的圖。並且,針對與第一實施形態相同的符號的構件是指相同的構件,省略其說明。又,第14圖中,以相同形狀所圖示的構件是與賦予其中之一的符號的構件相同構成的構件。 FIG. 14 is a diagram showing a schematic configuration of the sticking apparatus 102 of the present embodiment. In addition, the members with the same reference numerals as those in the first embodiment refer to the same members, and the description thereof will be omitted. In addition, in FIG. 14, the member shown in the figure with the same shape has the same structure as the member which attached the code|symbol to one of them.

黏貼裝置102具備四個伺服馬達13’,朝四個負載感測器15’分別施加推壓力(第14圖及第13圖的(a))。亦即,相對於一個負載感測器15’具備一個伺服馬達13’。藉此,可藉四個伺服馬達13’個別調整施加於板構件1的推壓力。 The sticking device 102 includes four servo motors 13', and applies a pressing force to each of the four load cells 15' (Fig. 14 and (a) of Fig. 13). That is, one servo motor 13' is provided for one load sensor 15'. Thereby, the pressing force applied to the plate member 1 can be individually adjusted by the four servo motors 13'.

推壓力特定部20是特定四個負載感測器15’分別檢測之推壓力的差。如第14圖表示,推壓力特定部20是藉有線或無線連接於各負載感測器15’,取得以負載感測 器15’分別測量之推壓力的值的數據。控制部21是根據推壓力特定部20取得的負載感測器15’之分別推壓力的值,控制伺服馬達13’。 The pushing force specifying unit 20 specifies the difference between the pushing forces detected by the four load cells 15'. As shown in FIG. 14, the pressing force specifying portion 20 is connected to each load sensor 15' by wire or wireless, and is obtained by load sensing The data of the value of the pushing force measured by the device 15' respectively. The control unit 21 controls the servo motor 13' based on the values of the respective pressing forces of the load cells 15' acquired by the pressing force specifying unit 20.

更具體而言,黏貼裝置102是首先,控制部21分別控制四個伺服馬達13’,使上側板構件1b朝著Z方向向下側移動。接著,控制部21分別控制四個伺服馬達13’,將預定的推壓力施加於重疊後的被處理基板30及支承面板40。在此,推壓力特定部20接收負載感測器15’分別檢測之推壓力的值作為數據。接著,推壓力特定部20使用獲得之推壓力的數據,例如進行合計處理等,算出四個伺服馬達13’分別應施加於各分割推壓區域19之推壓力的修正值,以減小四個伺服馬達13’分別施加於各分割推壓區域19之推壓力的差。隨後,控制部21根據推壓力特定部20算出之推壓力的修正值,控制四個伺服馬達13’分別施加於上側板構件1b的推壓力。藉此,即使施加於各上側板構件的平面部11b,即分割推壓區域19的推壓力產生差的場合,仍可減少該等差。其結果,可以將被處理基板30與支承面板40黏貼成均勻的厚度。並且,控制部21將施加於各分割推壓區域19之推壓力的差調整為預定的範圍內之後,經過預定的時間時,分別控制四個伺服馬達13’使上側板構件1b朝著Z方向向上側移動。藉此,可以從被處理基板30與支承面板40形成層疊體60。 More specifically, in the pasting device 102, first, the control unit 21 controls the four servo motors 13' to move the upper plate member 1b downward in the Z direction. Next, the control unit 21 controls each of the four servo motors 13' to apply a predetermined pressing force to the stacked substrates 30 and the support panel 40 to be processed. Here, the pushing force specifying unit 20 receives, as data, the values of the pushing force detected by the load cells 15', respectively. Next, the pressing force specifying unit 20 uses the obtained data on the pressing force, for example, performs an aggregation process, etc., and calculates the correction value of the pressing force to be applied to each of the divided pressing regions 19 by the four servo motors 13 ′, so as to reduce by four The servo motors 13 ′ are applied to the difference of the pressing force of the respective divided pressing regions 19 . Then, the control unit 21 controls the pressing forces applied to the upper plate member 1b by the four servomotors 13' based on the correction value of the pressing force calculated by the pressing force specifying unit 20. Thereby, even if there is a difference in the pressing force applied to the flat surface portion 11b of each upper plate member, that is, the divided pressing region 19, the difference can be reduced. As a result, the to-be-processed substrate 30 and the support panel 40 can be bonded to a uniform thickness. Then, after the control unit 21 adjusts the difference in the pressing force applied to the respective divided pressing regions 19 within a predetermined range, when a predetermined time elapses, the four servo motors 13' are respectively controlled so that the upper plate member 1b faces the Z direction. Move to the side. Thereby, the laminated body 60 can be formed from the substrate to be processed 30 and the support panel 40 .

本發明不限於上述的各實施形態,可在請求項表示的範圍進行種種的變更,針對可適當組合獲得不同 實施形態揭示之技術手段的實施形態也包含於本發明的技術範圍內。 The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims, and different Embodiments of the technical means disclosed in the embodiments are also included in the technical scope of the present invention.

[產業上的可利用性] [Industrial Availability]

本發明在半導體裝置的製造中可適當地利用。 The present invention can be suitably used in the manufacture of semiconductor devices.

1‧‧‧板構件 1‧‧‧Board member

1a‧‧‧下側板構件 1a‧‧‧Lower side plate member

1b‧‧‧上側板構件 1b‧‧‧upper side plate member

2‧‧‧載放板 2‧‧‧Place board

3‧‧‧下側中間板 3‧‧‧Lower middle plate

4‧‧‧下側支承板 4‧‧‧Lower side support plate

5‧‧‧支承銷 5‧‧‧Support pin

6‧‧‧推壓板 6‧‧‧Push plate

7‧‧‧上側中間板 7‧‧‧Top middle plate

8‧‧‧上側支承板 8‧‧‧Upper support plate

9‧‧‧推壓銷 9‧‧‧Push pin

9a‧‧‧彈簧 9a‧‧‧Spring

10‧‧‧支承構件 10‧‧‧Support member

11a‧‧‧下側板構件的平面部 11a‧‧‧Flat portion of lower side plate member

11b‧‧‧上側板構件的平面部 11b‧‧‧Flat part of upper side plate member

13‧‧‧推壓部 13‧‧‧Pushing part

14‧‧‧推壓軸 14‧‧‧Push shaft

14a‧‧‧上部推壓軸 14a‧‧‧Upper push shaft

14b‧‧‧下部推壓軸 14b‧‧‧Lower push shaft

15‧‧‧推壓力檢測部 15‧‧‧Push force detection part

16‧‧‧保持部 16‧‧‧Maintenance Department

16a‧‧‧間隔片 16a‧‧‧Spacer

16b‧‧‧筒狀部 16b‧‧‧cylindrical part

16c‧‧‧軸部 16c‧‧‧Shaft

17‧‧‧連結軸 17‧‧‧Connecting shaft

50‧‧‧減壓室 50‧‧‧Decompression Chamber

71‧‧‧固定框 71‧‧‧Fixed frame

72‧‧‧台座部 72‧‧‧Pedestal

100‧‧‧黏貼裝置 100‧‧‧Paste Device

Claims (8)

一種黏貼裝置,係黏貼基板,及支承上述基板的支承體的黏貼裝置,其特徵為,具備:夾入上述基板與上述支承體的一對板構件;支承上述一對板構件之中的一方板構件的複數支承構件;朝上述一方板構件推壓上述一對板構件之中的另一方板構件的推壓部;及在上述推壓部與上述另一方板構件之間,檢測上述推壓部施加於上述另一方板構件之推壓力的推壓力檢測部,上述一對板構件分別具有矩形的平面部,上述複數支承構件是分別配置從上述一方板構件的平面部的背面側分別支承將佔據上述一方板構件的平面部全面的區域等分割成上述矩形相似形的N2個(在此,N為2以上的整數)之分割支承區域所構成的該等各分割支承區域,上述複數支承構件是分別固定使得該支承構件的剖面的中心點與上述分割支承區域的中心點在與上述一方的板構件的平面部平行的X-Y平面上形成一致。 A bonding apparatus for bonding a substrate and a support for supporting the substrate, comprising: a pair of plate members sandwiching the substrate and the support; and supporting one of the pair of plate members A plurality of supporting members for members; a pressing portion for pressing the other plate member of the pair of plate members toward the one plate member; and detecting the pressing portion between the pressing portion and the other plate member The pressing force detecting portion for the pressing force applied to the other plate member, the pair of plate members each has a rectangular flat surface portion, and the plurality of support members are respectively arranged to support from the back side of the flat surface portion of the one plate member and occupy the space. Each of the divided support regions constituted by N 2 (here, N is an integer greater than or equal to 2) divided support regions of the above-mentioned rectangular analogous shape is divided equally over the entire area of the plane portion of the one plate member, the plurality of support members Each is fixed so that the center point of the cross section of the support member and the center point of the divided support region are aligned on the XY plane parallel to the plane portion of the one plate member. 如請求項1記載的黏貼裝置,其中,上述推壓力檢測部是由複數推壓力檢測部所構成,該等複數支承構件是分別配置檢測施加於將佔據上述 另一方板構件的平面部全面的區域等分割成上述矩形相似形的M2個(在此,M為2以上的整數)之分割推壓區域所構成的該等各分割推壓區域的推壓力。 The sticking device according to claim 1, wherein the pressing force detecting portion is constituted by a plurality of pressing force detecting portions, and the plurality of supporting members are respectively arranged to detect an area that will occupy the entire surface of the plane portion of the other plate member. The pressing force of each of these divided pressing regions constituted by M 2 (here, M is an integer of 2 or more) divided pressing regions equally divided into the above-mentioned rectangular-like shape. 如請求項2記載的黏貼裝置,其中,上述推壓部是由複數推壓部所構成,該等複數推壓部是分別配置各別推壓上述各複數推壓力檢測部,具備:推壓力特定部,特定上述推壓力檢測部所分別檢測之推壓力的差,及控制部,控制上述複數推壓部分別施加於上述另一方板構件的推壓力以減小上述推壓力特定部特定之推壓力的差。 The sticking device according to claim 2, wherein the pressing portion is composed of a plurality of pressing portions, and the plurality of pressing portions are respectively arranged to press the respective plurality of pressing force detecting portions, and comprising: a pressing force specifying A part for specifying the difference between the pushing forces detected by the pushing force detecting parts respectively; and a control part for controlling the pushing forces respectively applied by the plurality of pushing parts to the other plate member so as to reduce the pushing force specified by the pushing force specifying part poor. 如請求項2記載的黏貼裝置,其中,N是比M大的整數。 The sticking device according to claim 2, wherein N is an integer larger than M. 如請求項3記載的黏貼裝置,其中,N是比M大的整數。 The sticking device according to claim 3, wherein N is an integer larger than M. 如請求項2~5任一項記載的黏貼裝置,其中,N是4,M是2。 The sticking device according to any one of claims 2 to 5, wherein N is 4 and M is 2. 一種黏貼裝置,其特徵為,進一步具備: 減壓室,儲置請求項1~6中任一項記載的黏貼裝置;保持部,將從上述減壓室的外部插入至內部,搬入該減壓室的上述基板或上述支承體保持在上述一對板構件之間;驅動部,設置在上述減壓室的外部,使上述保持部相對於上述一對板構件的至少一方的平面部平行移動;及位置檢測部,設置在上述減壓室的外部,從上述減壓室的外部的上述保持部的位置檢測上述減壓室之內部的上述保持部的端部的位置。 A sticking device, characterized by further comprising: A decompression chamber for storing the sticking device according to any one of Claims 1 to 6; a holding part for inserting from the outside of the decompression chamber into the interior, and holding the substrate or the support carried into the decompression chamber in the decompression chamber between a pair of plate members; a driving part provided outside the decompression chamber for parallelly moving the holding part with respect to at least one plane part of the pair of plate members; and a position detection part provided in the decompression chamber The position of the end of the holding portion inside the decompression chamber is detected from the position of the holding portion outside the decompression chamber. 如請求項7記載的黏貼裝置,其中,上述推壓部是與上述減壓室分別固定,透過從上述減壓室的外部插入至內部的推壓軸,朝上述另一方的板構件施加推壓力。 The sticking device according to claim 7, wherein the pressing portion is separately fixed to the decompression chamber, and applies a pressing force to the other plate member through a pressing shaft inserted from the outside to the inside of the decompression chamber.
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JPH11163090A (en) * 1997-12-02 1999-06-18 Mecs Corp Thin work transfer robot
WO2009060890A1 (en) * 2007-11-09 2009-05-14 Ulvac, Inc. Bonding substrate manufacturing apparatus and bonding substrate manufacturing method
JP2014003246A (en) * 2012-06-20 2014-01-09 Tokyo Ohka Kogyo Co Ltd Bonding apparatus
WO2014157082A1 (en) * 2013-03-29 2014-10-02 東京応化工業株式会社 Attachment method

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