TWI763696B - pasting device - Google Patents

Abstract

The subject of the present invention is to provide a novel sticking device capable of sticking a rectangular support body and a substrate uniformly. The solution is that the sticking device (100) is provided with: a plate member (1), a support member (10), a servo motor (13) and a load sensor (15), and the support member (10) is respectively a plane from the lower side plate member The rear side of the portion (11a) is formed by equally dividing the area occupying the entire surface of the plane portion (11a) supporting the lower side plate member into N ² (N is an integer of 2 or more) divided support areas (12) of a rectangular similar shape. Each of the divided support regions (12).

Description

pasting device

The present invention relates to a sticking device.

With the increase in functions of mobile phones, digital AV equipment, and IC cards, the demand for integration of semiconductor elements in semiconductor packages (semiconductor devices) has increased by reducing the size and thickness of mounted semiconductor elements (electronic components). .

Here, as a semiconductor package including a semiconductor element, WLP (Wafer Level Package) or the like is known. In semiconductor packages such as WLP and PLP (Panel Level Package), there are fan-in technology such as fan-in type WLP (Fan-in Wafer Level Package) in which the terminals located at the ends of the bare die are relocated in the die area, and terminal reassembly. Fan-out technology such as fan-out Wafer Level Package (WLP), which is arranged outside the wafer area, is known. In particular, the fan-out panel technology is applied to the fan-out panel level PLP (Fan-out Panel Level Package) in which semiconductor components are packaged on the panel. and other fan-shaped technology.

Patent Document 1 describes a sticking device that sticks a substrate and a support through an adhesive layer, and manufactures the above-mentioned substrate, the above-mentioned adhesive layer, and the like. A sticking device for a laminated body in which the above-mentioned support bodies are sequentially laminated, comprising a pair of plate members sandwiching the above-mentioned laminated body, and a support member for supporting the above-mentioned plate members, and the above-mentioned support for supporting at least one of the above-mentioned plate members The members are positioned on the plate member in a plurality of dots that are adjacent to each other at equal intervals, or are positioned linearly.

[Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Application Laid-Open No. 2014-220389 (published on November 20, 2014)

The sticking apparatus described in Patent Document 1 has difficulty in sticking a circular board and a rectangular board with a uniform thickness and a support with a uniform thickness. In addition, the method of semiconductor packaging is highly advanced, and a novel bonding apparatus capable of bonding a rectangular substrate and a support to a uniform thickness is extremely useful.

The present invention has been developed in view of the above-mentioned problems, and an object of the present invention is to provide a sticking device capable of sticking a rectangular support body and a substrate uniformly.

In order to solve the above-mentioned problems, the sticking apparatus of the present invention is a sticking apparatus for sticking a substrate and a support for supporting the substrate, characterized by comprising: a pair of plate members sandwiching the substrate and the support; and supporting the one A plurality of support members for one of the plate members; a pressing portion for pressing the other of the pair of plate members toward the one plate member; and between the pressing portion and the other plate member and a pressing force detecting portion for detecting the pressing force applied by the pressing portion to the other plate member, the pair of plate members each has a rectangular flat surface portion, and the plurality of support members are respectively arranged from the flat surface of the one plate member. The back side of the part supports each of the divided support areas formed by dividing the area occupying the entire surface of the plane part of the above-mentioned one plate member into N ² (here, N is an integer of 2 or more) of the above-mentioned rectangular-like shape. Divide the support area.

According to the present invention, the effect of providing a novel sticking device capable of sticking a rectangular support body and a substrate uniformly is achieved.

1: Plate member

1a: Lower side plate member (plate member)

1b: Upper side plate member (plate member)

10: Supporting members

11: Flat part

11a: Flat portion (flat portion) of lower side plate member

11b: Flat portion (flat portion) of upper side plate member

12: Divide the support area

13, 13': Servo motor

14, 14': push the shaft

14a, 14'a: Upper push shaft (push shaft)

14b, 14'b: Lower push shaft (push shaft)

15, 15': load sensor

16: Keeping Department

16a: Spacer (holding part)

16b: cylindrical part (holding part)

16c: Shaft part (holding part)

17: connecting shaft

18: Position sensor (position detection part)

18a: Magnet (position detection part)

18b, 18c: Sensor head

19: Divide the push area

20: Push force specific part

21: Control Department

30: Substrate to be processed (substrate)

35: Sealing the substrate (substrate)

40: Support panel (support body)

41: Panel (support body)

50: Decompression Chamber

100, 101, 102: Paste device

FIG. 1 is a diagram showing a schematic configuration of a sticking apparatus 100 according to an embodiment (first embodiment) of the present invention.

FIG. 2 is a diagram illustrating the arrangement of the load cell 15 and the support member 10 of the sticking device 100 according to one embodiment (first embodiment) of the present invention.

Fig. 3 illustrates the lower plate member 1a, the holding portion 16, the connecting shaft 17, and the position of the sticking device 100 according to an embodiment (first embodiment) of the present invention A diagram showing the arrangement of the sensor 18 and the decompression chamber 50 .

FIG. 4 is a diagram for explaining the operation of the sticking apparatus 100 according to an embodiment (first embodiment) of the present invention.

FIG. 5 is a diagram for explaining the operation of the sticking apparatus 100 according to one embodiment (first embodiment) of the present invention.

FIG. 6 is a diagram for explaining the operation of the sticking apparatus 100 according to one embodiment (first embodiment) of the present invention.

FIG. 7 is a diagram for explaining the operation of the sticking apparatus 100 according to one embodiment (first embodiment) of the present invention.

FIG. 8 is a diagram for explaining the operation of the sticking apparatus 100 according to an embodiment (first embodiment) of the present invention.

FIG. 9 is a diagram for explaining the operation of the sticking apparatus 100 according to one embodiment (first embodiment) of the present invention.

Fig. 10 is a diagram for explaining the operation of the sticking apparatus 100 according to an embodiment (first embodiment) of the present invention.

FIG. 11 is a diagram for explaining the operation of the sticking apparatus 100 according to one embodiment (first embodiment) of the present invention.

Fig. 12 is a diagram showing a schematic configuration of a sticking apparatus 101 according to another embodiment (second embodiment) of the present invention.

Fig. 13 is a diagram for explaining the arrangement of the load cell 15' and the support member 10 of the sticking device 101 according to another embodiment (second embodiment) of the present invention.

FIG. 14 is a diagram showing a schematic configuration of a sticking apparatus 102 according to another embodiment (third embodiment) of the present invention.

Fig. 15 is a diagram illustrating the sticking of the sticking apparatus according to the embodiments of the present invention A schematic diagram of the substrate to be processed 30 and the support panel 40 .

<Paste Device 100>

The sticking apparatus 100 according to one embodiment (first embodiment) of the present invention will be described in detail with reference to FIGS. 1 to 3 .

FIG. 1 is a diagram showing a schematic configuration of a sticking apparatus 100 according to the present embodiment. FIG. 2 is a diagram illustrating the arrangement of the load cells 15 ( FIG. 2( a )) and the arrangement of the support member 10 ( FIG. 2( b )) of the bonding apparatus 100 of the present embodiment.

FIG. 3 is a diagram illustrating the arrangement of the lower plate member 1 a , the holding portion 16 , the position sensor 18 , and the decompression chamber 50 of the sticking device 100 according to the embodiment of the present invention.

As shown in FIG. 1, the bonding apparatus 100 of the present embodiment includes a pair of plate members 1, and the pair of plate members 1 includes a lower plate member 1a and an upper plate member 1b. Here, the substrates 30 to be processed that support the lower plate member 1 a from the back side of the lower plate member 1 a via the plurality of support members 10 , and each of the substrates 30 that occupy the entire surface of the plane portion 11 a supporting the support panel 40 is divided into equal parts. The support region 12 is divided.

Thereby, when the sticking device 100 exerts a pressing force on the upper side plate member 1b, the pressing force can be uniformly blocked by the lower side plate member 1a. Here, the flat surface portion 11a of the lower plate member 1a and the flat surface portion 11b of the upper plate member 1b are rectangular. Therefore, the sticking device 100 can be relative to the rectangular processed substrate 30 And the entire surface of the rectangular support panel 40 including the rectangular corners is uniformly applied with a pressing force. Thereby, the sticking apparatus 100 can form a rectangular laminated body having a uniform thickness. That is, the sticking apparatus 100 is an apparatus that can appropriately stick a substrate and a support body in a PLP (Panel Level Package) technique for forming a panel-type laminate and performing a substrate processing typically.

Hereinafter, the plate member 1 , the support member 10 , the servo motor 13 , the load sensor 15 , the holding portion 16 , and the position sensor 18 included in the sticking device 100 will be described in further detail.

[Plate member 1]

As shown in FIG. 1 , the plate member 1 is a member for attaching the substrate to be processed 30 and the support panel (support body) 40 . The plate members 1 are constituted by a lower-side plate member (one plate member) 1a and an upper-side plate member (the other plate member) 1b arranged in the up-down direction, respectively. In the plate member 1, the substrate to be processed 30 and the support panel 40 are sandwiched between the flat surface portion 11a of the lower plate member 1a and the flat surface portion 11b of the upper plate member 1b to form a laminate 60 (FIG. 11).

[Lower side plate member 1a]

The lower plate member 1 a is a plate member on which the substrate to be processed 30 and the support panel 40 are placed, and is supported by the plurality of support members 10 . The lower-side plate member 1 a has a configuration including a placing plate 2 , a lower-side intermediate plate 3 , and a lower-side support plate 4 .

Preferably, the flat portion 11a of the lower plate member 1a is similar in shape to the substrate to be processed 30 and the support panel 40 of the object to be pasted, and has the same area as the substrate to be processed 30 and the support panel 40, or has a larger area than the substrate to be processed 30 and the support panel 40. And the support panel 40 has a large area. More specifically, when the area of the flat surface portion 11a is larger than the areas of the substrate to be processed 30 and the support panel 40, the peripheral end portions of the substrate to be processed 30 and the support panel 40 are arranged on the inner side of the peripheral end portion of the flat surface portion 11a, It is more preferable that all of the plurality of support members 10 are arranged on the inner periphery of the substrate to be processed 30 and the support panel 40 .

As shown in FIG. 2(b), the entire area occupying the flat portion 11a is formed by equally dividing the area into 16 divided support regions 12, each of which is a similar shape to the shape of the flat portion 11a. Further, in FIG. 2(b), each area within the plane of the flat surface portion 11a is identified by a dotted line as the divided support area 12, only one of the divided support areas 12 is given a symbol, and the other divided support areas are assigned symbols. 12 ellipsis. As shown in FIG. 2( b ), the support members 10 are described by dotted lines in the divided support regions 12 , and only one of the support members 10 is given a symbol, and the other support members 10 are abbreviated.

The bonding apparatus 100 supports the lower plate member from the back side of each of the 16 divided support regions 12 equally divided by the similar shape forming the flat surface portion 11a of the lower plate member 1a by means of the plurality of support members 10 .

As described above, by arranging the plurality of support members 10 on the respective rear sides of the divided support regions 12, the rectangular substrate 30 to be processed and the peripheral portion including the corners of the rectangular support panel 40 arranged on the flat surface 11a can thereby be formed. Overall, the support member 10 is arranged. Thereby, the pressing force applied by the upper plate member 1b can be uniformly stopped in the rectangular flat portion 11a. Therefore, the sticking device 100 can stick properly so that the rectangular substrate to be processed 30 and the rectangular support panel 40 have uniform thickness.

In addition, in the sticking device 100, the number of the divided support areas 12 is 16, but the number of similar divided pressing areas occupying the entire area of the flat portion of the upper plate member is not limited to ¹⁶ , that is, 42. The number of the divided support regions 12 may be any configuration as long as the regions occupying the entire surface of the plane portion are divided into N ² divided pressing regions. Here, although N can be appropriately designed according to the size of the lower plate member 1a, when N is an integer of 2 or more, the pressing force applied to the plate member can be equally divided and prevented. In addition, for example, in the case of bonding the substrate to be processed 30 and the support panel 40 with an area of 510 mm×510 mm to 550 mm×550 mm, although not limited, N is preferably an integer of 2 to 8, and an integer in the range of 4 to 8 is preferable. better.

[Support member 10]

As shown in Fig. 1 and Fig. 2(b), the plurality of support members 10 individually support the support regions 12 from the flat surface portion 11a of the lower plate member. The support member 10 is preferably arranged so that the center point of the cross section of the support member 10 and the center point of the divided support regions 12 are aligned on the X-Y plane parallel to the plane portion 11a. Moreover, it is preferable that the cross-sectional shape of the support member 10 is circular. In addition, although the diameter of the support member 10 is not limited, it is preferable to have the strength required to support the lower side plate member 1a during pressing, and the lower side plate member 1a is not too thin to dissipate heat, for example, 40mm~80mm, and 50mm~70mm is better, and 60mm is the best.

In addition, the support member 10 is formed of metal such as stainless steel, for example. The plurality of support members 10 are fixed to the bottom of the decompression chamber 50, and the support regions 12 are divided from the back side of the flat surface portion 11a of the lower plate member 1a. The lower side plate members 1a are individually supported. In addition, each of the support members 10 may be appropriately adjusted in height by spacers (adjustment members, not shown) to maintain the flatness of the plane portion 11a when the upper side plate member 1b applies a pressing force.

(Other configuration of the lower plate member 1a)

In addition, the lower plate member 1 a is a portion that contacts the substrate to be processed 30 or the support panel 40 , for example, the support panel 40 side is placed as an upper plate 2 on which a laminate of the substrate to be processed 30 and the support panel 40 is placed; the support member 10 The lower side support plate 4 of the supported part; In addition, the lower plate member 1a includes a plurality of support pins 5 that support the substrate to be processed 30 or the support panel 40 .

The placement plate 2 and the lower intermediate plate 3 are formed of ceramics such as alumina. Further, between the placing plate 2 and the lower intermediate plate 3, a heating device (not shown in the figure) such as a surface heater or a cartridge heater for heating the laminated body during pressing is sandwiched by heating the lower plate member 1a. Show). That is, the lower side plate member 1a has a built-in heating device. The flat portion 11a of the lower side plate member is heated with a heating device. Thereby, for example, the substrate to be processed 30 or the support panel 40 or the substrate to be processed 30 and the support panel 40 after being superimposed can be satisfactorily attached to each other. Therefore, for example, when the substrate to be processed 30 and the support panel 40 are pasted through the adhesive layer, the adhesive layer can be appropriately heated. The heating device can appropriately adjust heating conditions according to the thermoplastic resin or curable resin contained in the adhesive layer, for example.

The lower support plate 4 is formed of metal such as stainless steel, ceramics, stone, or the like. Therefore, the lower intermediate plate 3 has a function as an insulator for preventing the short circuit between the heating device and the lower support plate 4 . In addition, the lower support plate 4 is Since it is formed of metal, it becomes easy to fix the lower plate member 1a to the support member 10 . In addition, the placement plate 2, the lower intermediate plate 3, and the lower support plate 4 are fixed to each other with a plurality of bolts and nuts. Therefore, when the lower support plate 4 is formed of metal, fixing by bolts and nuts is easy.

The surface of the placement plate 2, that is, the flatness of the flat portion 11a when not pressed is 1.0 μm or less. Here, flatness is a numerical value indicating the degree of concavity with respect to a flat surface, and “flatness of 1.0 μm or less” means that the unevenness on the surface of the placement plate 2 (and the pressing plate 6 described later) during non-pressing is ±1.0 μm the following. In addition, the placing plate 2 has a thickness (the thickness in the vertical direction) of, for example, 35 mm or more, so that the amount of bending at the time of pressing can be reduced. Since the placement plate 2 is formed of ceramics, the flat portion of the surface thereof is 1.0 μm or less, and thus it can be easily processed. In addition, since ceramics have a smaller thermal expansion coefficient than metals, warping or twisting of the surface of the flat portion 11a and the surface of the pressing plate 6 (that is, the flat portion 11b described later) during pressing in a heated state is difficult to occur. Therefore, the flatness (levelness) of the flat portion 11a of the lower plate member 1a and the flat portion 11b of the upper plate member 1b can be maintained. The lower plate member 1a may further include a thermometer (not shown) including, for example, a thermocouple, which measures the temperature of the flat portion 11a.

(Support pin 5)

As shown in Fig. 3(a), the plurality of support pins 5 are pins provided on the lower plate member 1a, and in a state of supporting the substrate 30 to be processed or the support panel 40, are driven relative to the flat surface portion 11a by a driving means (not shown). Moving up and down. Thereby, the plurality of support pins 5 support the substrate to be processed 30 or the support panel 40 from the bottom surface thereof and move up and down. In addition, in the plate member 1, the substrate to be processed 30 and the supporting surface are sandwiched When the plate 40 is pressed, the support pin 5 is accommodated inside the lower plate member 1a.

In the bonding apparatus 100, the six support pins 5 are arranged at the intersections of the lines (dotted lines) dividing the support regions 12 in the plane of the flat portion 11a of the lower plate member 1a.

Although the material of the support pin 5 is not limited, it may be made of aluminum, stainless steel (SUS), etc. with good thermal conductivity, or a resin with wear resistance, such as polyimide resin. As a polyimide resin, Vespel (trademark registration) etc. are mentioned.

[Upper side plate member 1b]

The bonding apparatus 100 pushes and sandwiches the substrate to be processed 30 and the support panel 40 by moving the upper plate member 1b toward the lower plate member 1a. Thereby, the to-be-processed board|substrate 30 and the support panel 40 are adhere|attached, and the laminated body 60 is formed. In addition, the size of the plane portion 11b of the upper plate member 1b is the same as the size of the plane portion 11a of the lower plate member 1a.

The upper-side plate member 1 b is constituted by a pressing plate 6 , an upper-side intermediate plate 7 , and an upper-side support plate 8 . The upper plate member 1 b transmits the force applied to the upper support plate 8 to the pressing plate 6 through the upper intermediate plate 7 , thereby applying a pressing force to the substrate to be processed 30 and the support panel 40 . Furthermore, a heating device (not shown) is sandwiched between the pressing plate 6 and the upper intermediate plate 7 . As the heating device, the same device as the above-mentioned heating device can be used, and the temperature for heating the flat surface portion 11b of the upper plate member is preferably the same as the above-described temperature.

The pressing plate 6 and the upper intermediate plate 7 are made of ceramics such as alumina, and the upper support plate 8 is made of metals such as stainless steel, ceramics, stones, etc. form. Therefore, the upper intermediate plate 7 has a function as an insulator for preventing the short circuit between the heating device and the upper support plate 8 . Moreover, since the upper support plate 8 is formed of metal, it becomes easy to fix the upper plate member 1b to the lower pressing shaft (pressing shaft) 14b. In addition, the pressing plate 6, the upper intermediate plate 7, and the upper support plate 8 are fixed to each other with a plurality of bolts and nuts. Therefore, when the upper support plate 8 is formed of metal, fixing by bolts and nuts is easy.

The flatness of the flat portion of the pressing plate 6, that is, the flatness of the flat portion 11b when not pressed is 1.0 μm or less. In addition, the pressing plate 6 has a thickness (the thickness in the vertical direction) of, for example, 35 mm or more, so that the amount of bending at the time of pressing can be reduced. Since the pressing plate 6 is formed of ceramics, the flatness of the flat portion 11b can be easily processed by setting the flatness of the flat portion 11b to be 1.0 μm or less.

The upper plate member 1b is further provided with a thermometer (not shown) composed of, for example, a thermocouple for measuring the temperature of the flat portion 11b, and a pressing pin 9 at a portion contacting the laminated body of the pressing plate 6 .

(push pin 9)

The pressing pin 9 is a pin for pressing the substrate to be processed 30 or the support panel 40 that has been transported into the decompression chamber 50 downward in the Z direction. In the present embodiment, six pressing pins 9 are provided on the pressing plate 6 , and the front end portions of the pressing pins 9 are arranged to face each front end portion of the support pins 5 . In addition, Fig. 1 shows a part of the six pressing pins 9, and the others are omitted.

The pressing pins 9 can move up and down simultaneously in the Z direction by the pressing shafts 14, respectively. When the pressing pins 9 are in contact with the upper surface of the substrate to be processed 30 or the support panel 40, the substrate to be processed 30 is moved by a spring (pushing member) 9a. or support panel 40 Bounce downwards in the Z direction. As described above, by arranging the support pins 5 and the push pins 9 to push the target substrate 30 or the support panel 40 , a part of the surrounding portion within the flat surface of the target substrate 30 or the support panel 40 can be appropriately pressed. . In addition, the pressing pins 9 are accommodated in the inside of the upper plate member 1 b when the plate member 1 applies a pressing force by sandwiching the substrate to be processed 30 and the support panel 40 .

The push pins 9 do not move downward in the Z direction, and for this reason, they are located at positions not related to the substrate to be processed 30 or the support panel 40 held by the holding portion 16. In this specification, the push pins 9 are referred to as being located at " Standby position" (Fig. 8). On the other hand, the upper plate member 1b moves downward, and as a result, the position of the substrate to be processed 30 or the support panel 40 held by the holding portion 16 is pushed and held by the spring 9a. In this specification, the position is called the pressing pin 9 in the "push position" (Fig. 9).

[Servo motor 13]

The servo motor 13 is a motor that applies a pressing force to the substrate to be processed 30 or the support panel 40 disposed between the upper plate member 1b and the lower plate member 1a by moving the upper plate member 1b downward in the Z direction. Furthermore, as shown in FIG. 1 , in the sticking apparatus 100 , the servo motor 13 is arranged outside the decompression chamber 50 and is fixed to the fixing frame 71 . In addition, the decompression chamber 50 is fixed to the pedestal portion 72 . That is, in the sticking device 100, the servo motor 13 and the decompression chamber 50 are not integrally but fixed separately. Here, if the servo motor 13 is fixed to the decompression chamber 50, when a pressing force is applied from the servo motor 13 to the substrate to be processed 30 or the support panel 40, a load is applied to the decompression chamber 50, which may cause distortion. Yu. On the other hand, by fixing the servo motor 13 and the decompression chamber 50 individually, a load can be prevented from being applied to the decompression chamber. For example, by fixing the servo motor 13 to the fixing frame 71 and fixing the decompression chamber 50 to the pedestal portion 72, loads can be applied to the fixing frame 71 and the pedestal portion 72, respectively, without burdening the decompression chamber.

The servo motor 13 applies a pressing force to the upper plate member 1b disposed inside the decompression chamber 50 through the pressing shaft 14 including the upper pressing shaft 14a and the lower pressing shaft 14b. More specifically, the pressing shaft 14 is provided with a load cell 15 between the upper pressing shaft 14a and the lower pressing shaft 14b, and transmits the force applied by the load cell 15 through the lower pressing shaft inserted into the decompression chamber 50 14b is communicated to the upper side plate member 1b. That is, in the pasting device 100 , the load cell 15 is provided outside the decompression chamber 50 .

[Load Sensor 15]

In addition, the load cell (load cell; load converter) pressing force detection unit) 15 detects the pressing force applied by the servo motor 13 to the substrate to be processed 30 and the support panel 40 through the upper plate member 1 b, and is detected in the decompression chamber 50 It is provided between the upper pressing shaft 14a and the lower pressing shaft 14b in the outside of the . The load sensor 15 detects the load applied to the upper plate member 1b by the servo motor 13 and converts it into an electrical signal.

The sticking device 100 uses a compression-type load cell as a pressing force detection unit. As a compression-type load sensor, for example, beam-type, column-type, S-type, and diaphragm-type load cells can be exemplified.

In addition, as shown in FIG. 2(a), in the bonding apparatus 100, one load cell 15 is arranged, and the load cell 15 is disposed from the surface of the flat surface portion 11b of the upper side plate member 1b. On the back side, the pressing force applied around the center point of the flat portion 11b is detected. As a result, the servo motor 13 adjusts the pressing force applied to the upper plate member 1b according to the magnitude of the pressing force detected by the load sensor 15 . Therefore, the pressing force for bonding the substrate to be processed 30 and the support panel 40 can be appropriately adjusted.

[holding part 16]

The holding portion 16 is a member that holds the substrate to be processed 30 or the support panel 40 carried into the decompression chamber 50 between the lower plate member 1 a and the upper plate member 1 b in advance. The holding part 16 is provided with the spacer piece 16a, the cylindrical part 16b, and the shaft part 16c ((b) and (c) of FIG. 3).

As shown in FIG. 3( b ), the spacer 16 a is a part of the peripheral edge portion on the bottom surface side of the substrate 30 to be processed or the support panel 40 that is carried into the decompression chamber 50 . The material of the spacer 16a is not particularly limited. For example, stainless steel (SUS) can be chamfered, and a material coated with a resin such as polytetrafluoroethylene can be used.

The shaft portion 16c is inserted into the cylindrical portion 16b that communicates the outside and the inside of the decompression chamber 50, and the shaft portion 16c is slid inside the cylindrical portion 16b to move in parallel with respect to the X direction. In addition, the clearance of the decompression chamber 50 formed by the shaft portion 16c and the cylindrical portion 16b may be sealed by conventional means such as oil seal and metal sealing so as to prevent air from entering the decompression chamber 50 from the outside.

As shown in FIG. 3( a ), the sticking device 100 includes four holding parts 16 . In addition, the sticking device 100 includes two connecting shafts 17 , and the four holding parts 16 are respectively connected to the outside of the decompression chamber 50 by the connecting shafts 17 as a set of two. The two sets of holding parts 16 connected by the connecting shaft 17 are in the decompression chambers, respectively. The lower plate member 1a is sandwiched inside 50, and the spacers 16a of the respective holding portions 16 are arranged to face each other. The sticking device 100 moves parallel to the X direction so that the ends of the two holding parts 16 respectively connected to the connecting shafts 17 come close to each other when the two connecting shafts 17 are moved close to each other by the driving part (not shown). The ends of the spacers 16a arranged opposite to each other. Thereby, as shown in (b) and (c) of FIG. 3, the four holding portions 16 can move the peripheral portion of the rectangular substrate 30 or the support panel 40 while being supported by the spacers 16a from the bottom surfaces thereof.

Until the substrate to be processed 30 or the support panel 40 is transported to the upper part of the holding unit 16 , the four spacers 16 a move at positions that do not overlap with the substrate to be processed 30 or the support panel 40 , respectively. In this specification, in this state, the spacer 16a is said to be in the "disengaged position". After the substrate to be processed 30 or the support panel 40 is carried into the upper part of the holding part 16 , the four spacers 16 a are respectively returned to the positions overlapping the substrate to be processed 30 or the support panel 40 , so that the substrate to be processed can be supported by the holding part 16 . Substrate 30 or support panel 40 . In this specification, in this state, the spacer 16a is referred to as the "insertion position". In addition, Fig. 3(a) shows the state in which the spacer 16a is in the "disengagement position", and Fig. 3(b) and (c) show the state in which the spacer 16a is in the "insertion position".

The width d ₃ of the spacer 16 a supporting the substrate to be processed 30 or the support panel 40 of the holding unit 16 overlapping the substrate to be processed 30 or the support panel 40 is not limited, and may span the inner side from the peripheral edge of the substrate to be processed 30 or the support panel 40 1~5mm degree is obtained. Appropriately, it is 5mm. In addition, although the lateral width _d4 of the spacer 16a may be 5 mm, it is not limited to this.

[Position Sensor 18]

The position sensor (position detector) 18 is provided outside the decompression chamber 50, and detects the end of the holding portion 16 inside the decompression chamber 50 from the position of the holding portion 16 outside the decompression chamber 50, that is, the interval Magnetic sensor for the position of sheet 16a.

As shown in (b) of FIG. 3 , the position sensor 18 includes a magnet 18a provided on the shaft portion fixed to the connecting shaft 17, and a magnet 18a disposed before and after the moving direction of the magnet 18a to detect the displacement of the magnet 18a. Two sensor heads 18b and 18c. Here, the magnet 18a is provided at the end portion of the shaft portion fixed to the connecting shaft 17, and the sensor heads 18b and 18c are provided at the cylinder tube inserted through the shaft portion. When the connecting shaft 17 moves in the X direction, the magnet 18a moves equidistantly inside the cylinder simultaneously with the two spacers 16a. At this time, the two sensor heads 18b and 18c detect the position of the magnet 18a based on the magnetic change emitted from the magnet 18a. Thereby, the position of the two spacer pieces 16a which can be moved equidistantly at the same time as the magnet 18a can be specified. Therefore, the decompression environment of the decompression chamber 50 can be maintained, and the position of the end portion of the holding portion 16 can be confirmed independently of the operation of the decompression chamber 50 . In addition, when the driving part (not shown) that drives the coupling shaft 17 is, for example, an air driving part, the spacer 16a can be properly held by malfunction according to the change in the moving distance of the driving part caused by the change in the air pressure. The substrate 30 to be processed or the support panel 40 is prevented from being damaged.

In addition, although the sticking device 100 of the present embodiment uses a magnetic sensor, the detection unit is not limited to the magnetic sensor. Specifically, as long as it is a position measurement sensor that detects the displacement of an object by means of ultrasonic waves or lasers, the Use any sensor.

In addition to the magnetic sensor, the position measurement sensor includes, for example, an ultrasonic sensor, an eddy current sensor, a laser sensor, and a touch sensor.

[decompression chamber 50]

The decompression chamber 50 is a space in which the substrate to be processed 30 or the support panel 40 is attached in a decompressible environment, and the plate member 1 and the support member 10 of the attaching apparatus 100 are accommodated therein. In addition, a conventional decompression means (not shown) is provided in the decompression chamber 50, and the internal pressure in the decompression chamber 50 can be controlled by the decompression means.

The decompression chamber 50 is provided with an openable and closable receiving window (not shown) for carrying in the substrate 30 to be processed and the support panel 40 and carrying out the laminated body 60 after sticking. In addition, the carrying-in of the substrate 30 to be processed and the support panel 40, and the carrying-out of the laminated body 60 can be performed by a conventional conveying device such as a robot arm or by a human hand.

The decompression chamber 50 has a structure that can be decompressed. Therefore, the substrate to be processed 30 and the support panel 40 are pasted through the adhesive layer in a decompressed atmosphere, so that between the substrate to be processed 30 and the support panel 40, the adhesive layer can be properly prevented. The generation of air bubbles can appropriately prevent the air bubbles from causing poor adhesion. Also, for example, generation of voids between the adhesive layer and the substrate to be processed 30 can be appropriately prevented.

[Operation of the pasting device 100]

Next, the schematic operation|movement for sticking the to-be-processed board|substrate 30 and the support panel 40 of the sticking apparatus 100 of this embodiment is demonstrated.

FIGS. 4 to 11 are diagrams for explaining the operation of the sticking device 100 of the present embodiment using the state of the inside of the decompression chamber 50 . In addition, for the convenience of description, illustration of the servo motor 13, the upper pressing shaft 14a, and the load cell 15 is omitted.

(1. Carrying in to the support panel 40 of the decompression chamber 50 )

First, the support panel 40 is carried in through the receiving window (not shown) of the decompression chamber 50 . The loaded support panel 40 is supported by the support pins 5 (see FIG. 4 ). In addition, at this stage, the holding portion 16 is set to the disengaged position in advance.

(2. Delivery to the support panel 40 of the spacer 16a)

Next, by moving the support pin 5 in the Z direction, the support panel 40 placed on the support pin 5 is positioned above the holding portion 16 and moved to a position where it does not come into contact with the push pin 9 (see Section 5 picture). And after the spacer piece 16a is moved to an insertion position, the support pin 5 is moved to the lower side of a Z direction. Thereby, the position which does not change the horizontal direction of the support panel 40 is supported by the spacer piece 16a (refer FIG. 6).

(3. Carrying-in of the substrate 30 to be processed into the decompression chamber 50 )

Next, as in the case of the support panel 40 , in this state, the substrate to be processed 30 is carried in through the receiving window of the decompression chamber 50 (see FIG. 7 ). Then, after closing the sending and receiving window, the decompression of the decompression chamber 50 is started. The decompression condition of the decompression chamber 50 is suitably 10 Pa or less.

(4. Heating of the substrate 30 to be processed)

Next, the substrate 30 to be processed is placed on the lower plate member 1 a and heated by moving the support pins 5 to the lower side in the Z direction. Thereby, the adhesive layer formed on the upper surface of the substrate to be processed 30 is heated (see FIG. 8).

(5. Temporarily fixed)

Next, the heated upper-side plate member 1b is lowered to the lower side in the Z direction, and thereby comes into contact with the upper surface of the support panel 40 . As the upper plate member 1b comes into contact with the upper surface of the support panel 40, the push pin 9 moves from the standby position to the push position, so that the support panel 40 supported by the spacer 16a is biased toward the lower side in the Z direction by the spring 9a. force. Next, the substrate to be processed 30 placed on the support pins 5 is moved to the upper side in the Z direction by the support pins 5 . Thereby, the adhesive layer formed on the upper surface of the substrate to be processed 30 is moved to the vicinity of the bottom surface of the support panel 40 supported by the spacer 16a (see FIG. 9). Then, the spacer 16a is moved to the disengaged position, and is sandwiched by the support pins 5 and the push pins 9 by the force of the springs 9a of the push pins 9, and pushes the substrate to be processed 30 and the support panel 40 (refer to Figure 10). Thereby, the substrate 30 to be processed and the support panel 40 are overlapped and temporarily fixed.

(6. Adhesion of the substrate 30 to be processed and the support panel 40 )

Next, the support pin 5 and the upper side plate member 1b are lowered at the same speed. Thereby, between the heated upper plate member 1b and the heated lower plate member 1a, the substrate to be processed 30 and the support panel 40 are sandwiched and pressed, whereby the substrate to be processed 30 and the support panel 40 are adhered (refer to the 11 Figures).

[Laminated body 60]

A schematic description of the substrate to be processed 30 , the support panel 40 , and the laminated body 60 to which the sticking device 100 of the present embodiment shown in FIG. 15 sticks objects. In addition, the laminated body 60 is a laminated body formed by bonding the substrate to be processed 30 and the support panel 40 .

(Substrate 30 to be processed)

In the present embodiment, the substrate 30 to be processed is provided with a rewiring layer 31 for arranging a terminal located at an end of the element 32 outside the wafer area in one flat portion of the sealing body that seals the element 32 by the sealing material 33 . The sealing substrate (substrate) 35 is a substrate supported by the panel (support) 41 through the adhesive layer 43 and the separation layer 42 . An adhesive layer 43 is formed on the surface of the rewiring layer 31 in contact with the support panel 40 . In addition, the bonding layer 43 formed on the rewiring layer 31 may be the same member as the bonding layer 43 between the element 32 and the sealing material 33 and the separation layer 42. The panel (support) 41 of the substrate to be processed 30, the separation layer, etc. can be used. 42 can employ the same members and the like as those included in the support panel 40 to be described later.

After the substrate 30 to be processed is bonded to the support panel 40 by the bonding apparatus 100 to form the laminate 60, light is irradiated from the side of the panel 41 of the substrate to be processed 30 toward the separation layer 42 of the substrate to be processed 30. Thereby, the quality of the separation layer 42 is changed, and the panel 41 on the side of the substrate to be processed 30 is separated from the laminated body 60 . Then, on the surface of the sealing substrate 35 supported by the support panel 40 on which the rewiring layer 31 is not provided, a process of mounting another component (not shown) or the like is performed.

The element 32 is a semiconductor element or other element, and has a structure of a single layer or a plurality of layers. In addition, when the element 32 is a semiconductor element, the electronic component obtained by dicing the sealing substrate 35 becomes a semiconductor device.

As the sealing material 33 , for example, epoxy-based resin, silicon-based resin, or the like can be used. In one embodiment, the sealing material 33 is not provided on each element 32 , but integrally seals all of the plurality of elements 32 attached to the adhesive layer 43 .

The redistribution layer 31 is also called an RDL (Redistribution Layer), and is a thin-film wiring body that constitutes wiring connected to the element 32 and has a single-layer or plural-layer structure. In one embodiment, the rewiring layer 31 is made of a dielectric (eg, silicon oxide (SiO _x ), a photosensitive resin such as a photosensitive epoxy group, etc.), and a dielectric (eg, aluminum, copper, titanium, nickel, gold, etc.) (such as metals, etc.) have a structure in which wiring is formed, but is not limited to this.

Furthermore, in the substrate to be processed 30 shown in FIG. 15, the adhesive layer 43 is provided on the surface in contact with the support panel 40 of the rewiring layer 31, but in another embodiment, the adhesive layer 43 may be provided on the support panel. The surface of the separation layer 42 on the 40 that is in contact with the substrate to be processed 30 .

In addition, the sticking apparatus 100 may stick the sealing substrate 35 not supported by the panel 41 to the support panel 40 instead of the substrate to be processed 30 . Further, the substrate to be processed 30 is not limited to a substrate in which the sealing substrate 35 is supported by the panel 41, and may be any substrate such as a silicon wafer substrate, a ceramic substrate, a thin film substrate, and a flexible substrate.

(Support panel 40)

The support panel 40 is a support body that supports the substrate to be processed 30 , and a panel (support body) 41 and a separation layer 42 on the panel 41 are formed. The support panel 40 is a sealing substrate 35 attached to the substrate to be processed 30 through the separation layer 42 .

The panel 41 only needs to have the required strength to prevent breakage or deformation of the substrate during the process of thinning, conveying, and mounting of the substrate, and it is preferable to further reduce the weight. From the above viewpoints, the panel 41 is preferably made of glass, silicon, acrylic resin, ceramics, or the like, and more preferably made of glass.

The separation layer 42 is a layer changed in quality by absorbing the light irradiated through the panel 41 . Although the separation layer 42 is preferably formed of a material having only a light-absorbing structure, a material that does not have a light-absorbing structure may be added to form the separation layer 42 within the range that does not impair the essential characteristics of the separation layer.

In one embodiment, the separation layer 42 may be formed of a fluorocarbon compound. The separation layer 42 is made of a fluorocarbon compound, and is degraded by absorbing light, and as a result, loses strength or adhesiveness before being irradiated with light. Therefore, applying a slight external force (for example, lifting the support panel 40 , etc.) will destroy the separation layer 42 , and the panel 41 and the sealing substrate 35 can be easily separated. The fluorocarbon compound constituting the separation layer 42 can be appropriately formed into a film by a plasma CVD (chemical vapor deposition) method.

Further, in other embodiments, for example, the separation layer 42 may use a polymer having a light-absorbing structure in its repeating unit; a compound having an inorganic substance or an infrared-absorbing structure; and a reactive polyplex. Formed by semi-siloxane, etc. In addition, the light absorption rate of the separation layer 42 is preferably 80% or more.

The lower limit of the thickness of the separation layer 42 is 0.05 μm or more preferably, and more preferably 0.3 μm or more. In addition, the upper limit of the thickness of the separation layer 42 is preferably 50 μm or less, and more preferably 1 μm or less. When the thickness of the separation layer 42 falls within the range of 0.05 μm to 50 μm, a predetermined change in the separation layer 42 can be caused by irradiation of light for a short time and light of low energy. In addition, the thickness of the separation layer 42 is preferably within the range of 1 μm or less from the viewpoint of productivity.

The next layer 43 is a layer to be followed by the sealing substrate 35 and the support panel 40 of the substrate 30 to be processed, and is formed by applying an adhesive to at least one of the substrate and the panel. The adhesive constituting the adhesive layer may include, for example, a thermoplastic resin whose thermal fluidity is improved by heating as an adhesive material, or may include a curable resin that is cured by heat or light. As a thermoplastic resin, an acrylic resin, a styrene-type resin, a maleimide-type resin, a hydrocarbon-type resin, a thermoplastic elastomer, a polysilicon-type resin, etc. are mentioned, for example. Moreover, the curable resin is, for example, an acrylic resin, an epoxy resin, or the above-mentioned thermoplastic resin is, for example, a resin composition containing a curable monomer such as an acrylic monomer, and the like.

The method of forming the adhesive, that is, the method of applying the adhesive to the substrate or the panel, or the method of applying the adhesive to the substrate to form the adhesive tape, is not particularly limited, but the method of applying the adhesive can be, for example, by rotating The coating method, the dipping method, the hob method, the spray method, the smearing method of the slit nozzle method, etc.

The thickness of the adhesive layer may be appropriately set according to the types of substrates and panels to be pasted, the treatment applied to the substrates after pasting, and the like, but is preferably in the range of 10 to 150 μm, and preferably in the range of 15 to 100 μm Better inside.

[Variation of the laminated body]

The laminated body formed by the bonding apparatus 100 by bonding the substrate and the support is not limited to the above-described embodiment. The laminated body formed by the sticking apparatus 100 only needs to be capable of sticking the sealing substrate 35 and the panel 41 , and may include one of an adhesive layer and a separation layer.

For example, the laminate of a modified example may be a laminate formed by laminating a sealing substrate (substrate) and a panel (support) formed of a material through which light penetrates through a separation layer that absorbs light and degrades. That is, like the laminated body 60 , the adhesive layer 43 may not be provided between the separation layer 42 and the sealing substrate 35 . As the separation layer for forming the laminate in this way, a separation layer having adhesiveness can be exemplified. For example, the separation layer includes a separation layer formed of a curable resin, a thermoplastic resin and a resin having light absorption properties, and a separation layer having a light-absorbing property. The adhesive resin is blended with a separation layer or the like made of a material that absorbs light. As the separation layer formed using a curable resin or a thermoplastic resin and a light-absorbing resin, for example, a separation layer formed using a polyimide resin can be exemplified. In addition, the separation layer composed of an adhesive resin mixed with a light-absorbing material includes, for example, a separation layer composed of an acrylic UV-curable resin mixed with carbon black, and an adhesive resin mixed with a glass bulb for infrared absorption. A separation layer composed of materials, etc. In addition, regardless of the presence or absence of adhesiveness, these separation layers are all in the category of separation layers that absorb light and change in quality.

In addition, the laminated body of another modification example is, for example, a panel (support) formed of a material through which a sealing substrate (substrate) and light transmits through an adhesive layer. A laminate formed by lamination of a carrier), and the adhesive layer is an adhesive layer having an adhesive force to the extent that it can be peeled off by applying a mechanical force. As an adhesive which can form such a laminated body, a pressure-sensitive adhesive (adhesive), a peelable adhesive, etc. are mentioned, for example. Examples of the pressure-sensitive adhesive include conventional pressure-sensitive adhesives. As the peelable adhesive, for example, a thermoplastic resin, a photocurable resin, a thermosetting resin, or the like may be mixed with a release agent such as wax or silicon to adjust the adhesive force. In addition, a thermosetting resin, a photocurable resin, or the like may be contained, and a hardening adhesive such as releasability may be found by curing these resins. Moreover, such a peelable adhesive may be an adhesive mainly composed of a thermoplastic resin having a low adhesive force such as beeswax or wax.

<Paste Device 101>

The sticking device of the present invention is not limited to the above-described embodiment (first embodiment). As shown in FIGS. 12 and 13, for example, the sticking device 101 of one embodiment (the second embodiment) includes four load cells 15', and the servo motor 13 pushes the shaft 14'a through an upper pressing shaft 14'a toward the When the pressing force is applied to the four load cells 15', the load cells 15' are configured to apply the pressing force to the upper plate member 1b through the lower pressing shaft 14'b, respectively.

FIG. 12 is a diagram showing a schematic configuration of the sticking device 101 according to the second embodiment, and (a) of FIG. 13 is a view explaining the arrangement of the load cells 15 ′ of the sticking device 101 according to the second embodiment. (b) of the figure is a figure explaining the arrangement|positioning of the support member 10. FIG. In addition, the members with the same reference numerals as those in the first embodiment refer to the same members, and the description thereof will be omitted. In addition, FIGS. 12 and 13 are symbols only for one of the four load sensors 15', and the Symbols are omitted for other load cells 15' shown in the same shape. Similarly, with respect to the divided pressing regions equally divided by the two-dotted dashed line, only one divided pressing region 19 is given a reference numeral, and the other divided pressing regions 19 are not referenced.

As shown in (a) of FIG. 13, the sticking device 101 is provided with four load cells 15', respectively, and presses the respective center points of the four divided pressing regions 19 divided by the two-dotted dotted line. The four load cells 15' pass through the lower pressing shafts 14'b, respectively, and are provided with the upper plate member 1b. As a result, the pressing force applied by the servo motor 13 to the flat surface portion 11b of the upper plate member 1b can be detected in the divided pressing regions 19 in which the flat surface portion 11b is divided into four equal parts. Therefore, the difference in the pressing force applied to the flat surface portion 11b of the upper plate member 1b can be appropriately detected by a single load sensor 15, which is different from the case of detecting the pressing force applied to the flat surface portion 11b of the upper plate member 1b, That is, the deviation of the pushing force. Thereby, the difference between the pressing forces detected in the divided pressing regions 19 that divide the flat portion 11b into four parts can be reduced, and a load cell can obtain a higher pressure than the detection of the pressing force applied to the plate member 1 by one load sensor. The distribution of the pushing force is more uniform in the occasion.

In addition, the sticking device 101 may arrange the substrate to be processed 30 and the support panel 40 for standard sampling, or the workpiece for adjustment (the to-be-processed plate for standard sampling) between the lower plate member 1a and the upper plate member 1b, and the servo motor may 13. By applying the pushing force, the difference of the pushing force detected by each load sensor 15' is specified, and then, it is adjusted so that the difference in the pushing force becomes smaller.

Reduce the thrust force detected by the four load sensors 15' In this method, for example, a spacer (adjustment member, not shown) is inserted into the gap between the load sensor 15' and the lower pressing shaft 14'b to adjust the difference in the pressing force.

Furthermore, as shown in FIG. 13(b), the sticking device 101 is provided with the support member 10 that supports each of the divided support regions 12 from the back side, as in the case of the sticking device 100, so that the application to the lower side plate member can be prevented uniformly. The pressing force of the flat part 11a of 1a. Thereby, the sticking device 101 can evenly prevent the pressing force applied from the flat surface 11b of the upper plate member 1b from being uniformly distributed on the flat surface 11a of the lower plate member 1a. Therefore, the substrate 30 to be processed and the support panel 40 can be properly bonded with a uniform thickness.

In addition, in the sticking device 101, although the number of divided pressing regions 19 is four, the number of similar divided pressing regions occupying the entire area of the flat surface of the upper plate member is not limited to four, that is, ²² . The number of the divided pressing regions 19 may be a configuration in which an area occupying the entire surface of the plane portion is divided into M ² divided pressing regions or the like. Here, although M can be appropriately designed according to the size of the upper plate member 1b, as long as M is an integer of 2 or more, the distribution of the pressing force applied to the plate member can be appropriately detected. In addition, when M is an integer of 2 or more and is smaller than N, which specifies the number of divided support regions 12, the deviation of the pressing force applied to the entire surface of the plate member can be appropriately detected, and M is preferably an integer of 2 to 8. , and preferably an integer in the range of 4 to 8.

<Paste Device 102>

The sticking apparatus of the present invention is not limited to the above-described embodiments (first embodiment and second embodiment). As shown in Fig. 14, for example, an embodiment The sticking apparatus 102 of the second embodiment (third embodiment) includes four servo motors 13' instead of one servo motor 13 of the second embodiment, and includes a pressing force specifying unit 20 and a control unit 21.

Thereby, the four servo motors 13' can individually adjust the pressing force applied to the plate member 1 according to the pressing force detected by the four load sensors 15', respectively, by the sticking device 102. Thereby, the pressing force applied to the plate member 1 can be appropriately adjusted, for example, in accordance with individual differences or changes in the types of the substrates 30 to be processed and the support panels 40 .

Hereinafter, the plurality of servo motors 13', the pressing force specifying unit 20, and the control unit 21 included in the sticking device 102 of the present embodiment will be described in further detail with reference to Fig. 14 .

FIG. 14 is a diagram showing a schematic configuration of the sticking apparatus 102 of the present embodiment. In addition, the members with the same reference numerals as those in the first embodiment refer to the same members, and the description thereof will be omitted. In addition, in FIG. 14, the member shown in the figure with the same shape has the same structure as the member which attached the code|symbol to one of them.

The sticking device 102 includes four servo motors 13', and applies a pressing force to each of the four load cells 15' (Fig. 14 and (a) of Fig. 13). That is, one servo motor 13' is provided for one load sensor 15'. Thereby, the pressing force applied to the plate member 1 can be individually adjusted by the four servo motors 13'.

The pushing force specifying unit 20 specifies the difference between the pushing forces detected by the four load cells 15'. As shown in FIG. 14, the pressing force specifying portion 20 is connected to each load sensor 15' by wire or wireless, and is obtained by load sensing The data of the value of the pushing force measured by the device 15' respectively. The control unit 21 controls the servo motor 13' based on the values of the respective pressing forces of the load cells 15' acquired by the pressing force specifying unit 20.

More specifically, in the pasting device 102, first, the control unit 21 controls the four servo motors 13' to move the upper plate member 1b downward in the Z direction. Next, the control unit 21 controls each of the four servo motors 13' to apply a predetermined pressing force to the stacked substrates 30 and the support panel 40 to be processed. Here, the pushing force specifying unit 20 receives, as data, the values of the pushing force detected by the load cells 15', respectively. Next, the pressing force specifying unit 20 uses the obtained data on the pressing force, for example, performs an aggregation process, etc., and calculates the correction value of the pressing force to be applied to each of the divided pressing regions 19 by the four servo motors 13 ′, so as to reduce by four The servo motors 13 ′ are applied to the difference of the pressing force of the respective divided pressing regions 19 . Then, the control unit 21 controls the pressing forces applied to the upper plate member 1b by the four servomotors 13' based on the correction value of the pressing force calculated by the pressing force specifying unit 20. Thereby, even if there is a difference in the pressing force applied to the flat surface portion 11b of each upper plate member, that is, the divided pressing region 19, the difference can be reduced. As a result, the to-be-processed substrate 30 and the support panel 40 can be bonded to a uniform thickness. Then, after the control unit 21 adjusts the difference in the pressing force applied to the respective divided pressing regions 19 within a predetermined range, when a predetermined time elapses, the four servo motors 13' are respectively controlled so that the upper plate member 1b faces the Z direction. Move to the side. Thereby, the laminated body 60 can be formed from the substrate to be processed 30 and the support panel 40 .

The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims, and different Embodiments of the technical means disclosed in the embodiments are also included in the technical scope of the present invention.

[Industrial Availability]

The present invention can be suitably used in the manufacture of semiconductor devices.

1‧‧‧Board member

1a‧‧‧Lower side plate member

1b‧‧‧upper side plate member

2‧‧‧Place board

3‧‧‧Lower middle plate

4‧‧‧Lower side support plate

5‧‧‧Support pin

6‧‧‧Push plate

7‧‧‧Top middle plate

8‧‧‧Upper support plate

9‧‧‧Push pin

9a‧‧‧Spring

10‧‧‧Support member

11a‧‧‧Flat portion of lower side plate member

11b‧‧‧Flat part of upper side plate member

13‧‧‧Pushing part

14‧‧‧Push shaft

14a‧‧‧Upper push shaft

14b‧‧‧Lower push shaft

15‧‧‧Push force detection part

16‧‧‧Maintenance Department

16a‧‧‧Spacer

16b‧‧‧cylindrical part

16c‧‧‧Shaft

17‧‧‧Connecting shaft

50‧‧‧Decompression Chamber

71‧‧‧Fixed frame

72‧‧‧Pedestal

100‧‧‧Paste Device

Claims (8)

A bonding apparatus for bonding a substrate and a support for supporting the substrate, comprising: a pair of plate members sandwiching the substrate and the support; and supporting one of the pair of plate members A plurality of supporting members for members; a pressing portion for pressing the other plate member of the pair of plate members toward the one plate member; and detecting the pressing portion between the pressing portion and the other plate member The pressing force detecting portion for the pressing force applied to the other plate member, the pair of plate members each has a rectangular flat surface portion, and the plurality of support members are respectively arranged to support from the back side of the flat surface portion of the one plate member and occupy the space. Each of the divided support regions constituted by N ² (here, N is an integer greater than or equal to 2) divided support regions of the above-mentioned rectangular analogous shape is divided equally over the entire area of the plane portion of the one plate member, the plurality of support members Each is fixed so that the center point of the cross section of the support member and the center point of the divided support region are aligned on the XY plane parallel to the plane portion of the one plate member. The sticking device according to claim 1, wherein the pressing force detecting portion is constituted by a plurality of pressing force detecting portions, and the plurality of supporting members are respectively arranged to detect an area that will occupy the entire surface of the plane portion of the other plate member. The pressing force of each of these divided pressing regions constituted by M ² (here, M is an integer of 2 or more) divided pressing regions equally divided into the above-mentioned rectangular-like shape. The sticking device according to claim 2, wherein the pressing portion is composed of a plurality of pressing portions, and the plurality of pressing portions are respectively arranged to press the respective plurality of pressing force detecting portions, and comprising: a pressing force specifying A part for specifying the difference between the pushing forces detected by the pushing force detecting parts respectively; and a control part for controlling the pushing forces respectively applied by the plurality of pushing parts to the other plate member so as to reduce the pushing force specified by the pushing force specifying part poor. The sticking device according to claim 2, wherein N is an integer larger than M. The sticking device according to claim 3, wherein N is an integer larger than M. The sticking device according to any one of claims 2 to 5, wherein N is 4 and M is 2. A sticking device, characterized by further comprising: A decompression chamber for storing the sticking device according to any one of Claims 1 to 6; a holding part for inserting from the outside of the decompression chamber into the interior, and holding the substrate or the support carried into the decompression chamber in the decompression chamber between a pair of plate members; a driving part provided outside the decompression chamber for parallelly moving the holding part with respect to at least one plane part of the pair of plate members; and a position detection part provided in the decompression chamber The position of the end of the holding portion inside the decompression chamber is detected from the position of the holding portion outside the decompression chamber. The sticking device according to claim 7, wherein the pressing portion is separately fixed to the decompression chamber, and applies a pressing force to the other plate member through a pressing shaft inserted from the outside to the inside of the decompression chamber.

Images