KR101508892B1 - 첩부 장치 및 첩부 방법 - Google Patents

첩부 장치 및 첩부 방법 Download PDF

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Publication number
KR101508892B1
KR101508892B1 KR20147034704A KR20147034704A KR101508892B1 KR 101508892 B1 KR101508892 B1 KR 101508892B1 KR 20147034704 A KR20147034704 A KR 20147034704A KR 20147034704 A KR20147034704 A KR 20147034704A KR 101508892 B1 KR101508892 B1 KR 101508892B1
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KR
South Korea
Prior art keywords
laminate
plate member
supporting
support
plate
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KR20147034704A
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English (en)
Korean (ko)
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KR20150005715A (ko
Inventor
준이치 가츠라가와
요시히로 이나오
시게루 가토
Original Assignee
도오꾜오까고오교 가부시끼가이샤
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Publication of KR20150005715A publication Critical patent/KR20150005715A/ko
Application granted granted Critical
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Assigned to 아이메카테크 가부시키가이샤 reassignment 아이메카테크 가부시키가이샤 권리의 전부이전등록 Assignors: 도오꾜오까고오교 가부시끼가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/32—Discharging presses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/56—Compression moulding under special conditions, e.g. vacuum
    • B29C2043/561—Compression moulding under special conditions, e.g. vacuum under vacuum conditions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/20—Making multilayered or multicoloured articles
    • B29C43/203—Making multilayered articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/04—Time
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/08—Dimensions, e.g. volume
    • B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/12—Pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/085—Isolated-integrated

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Press Drives And Press Lines (AREA)
KR20147034704A 2012-05-11 2013-04-26 첩부 장치 및 첩부 방법 Active KR101508892B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2012-110098 2012-05-11
JP2012110098A JP5639617B2 (ja) 2012-05-11 2012-05-11 貼付装置および貼付方法
PCT/JP2013/062408 WO2013168611A1 (ja) 2012-05-11 2013-04-26 貼付装置および貼付方法

Publications (2)

Publication Number Publication Date
KR20150005715A KR20150005715A (ko) 2015-01-14
KR101508892B1 true KR101508892B1 (ko) 2015-04-07

Family

ID=49550656

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20147034704A Active KR101508892B1 (ko) 2012-05-11 2013-04-26 첩부 장치 및 첩부 방법

Country Status (4)

Country Link
JP (1) JP5639617B2 (https=)
KR (1) KR101508892B1 (https=)
TW (1) TWI499508B (https=)
WO (1) WO2013168611A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6291275B2 (ja) * 2014-02-13 2018-03-14 東京応化工業株式会社 貼付方法
JP6836003B1 (ja) * 2020-08-27 2021-02-24 信越エンジニアリング株式会社 ワーク分離装置及びワーク分離方法
CN114966145A (zh) * 2021-02-25 2022-08-30 上海为彪汽配制造有限公司 接触式ict测试针床及其测试方法
CN115195264B (zh) * 2022-08-01 2024-01-19 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 叠压工作台及叠压机

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050053008A (ko) * 2003-12-01 2005-06-07 도쿄 오카 고교 가부시키가이샤 첩부장치 및 첩부방법
KR20070059994A (ko) * 2005-12-06 2007-06-12 도쿄 오카 고교 가부시키가이샤 서포트 플레이트의 첩합수단과 첩합장치, 및 서포트플레이트의 첩합방법
KR20100058913A (ko) * 2008-11-25 2010-06-04 세메스 주식회사 기판처리방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003241157A (ja) * 2002-02-21 2003-08-27 Shibaura Mechatronics Corp 基板貼り合わせ装置、基板貼り合わせ方法、及び液晶表示パネルの製造装置、並びに製造方法
JP4751612B2 (ja) * 2004-12-28 2011-08-17 芝浦メカトロニクス株式会社 基板貼り合わせ装置及び基板貼り合わせ方法
JP4480660B2 (ja) * 2005-10-27 2010-06-16 Ｎｅｃエンジニアリング株式会社 基板貼り合わせ装置
JP4671841B2 (ja) * 2005-11-09 2011-04-20 パナソニック株式会社 対象物間の脱ガス方法および脱ガス装置
TWM317916U (en) * 2006-11-13 2007-09-01 Cheng Uei Prec Ind Co Ltd An organ of quickly mold change
JP2010010207A (ja) * 2008-06-24 2010-01-14 Tokyo Ohka Kogyo Co Ltd 剥離装置および剥離方法
JP5210060B2 (ja) * 2008-07-02 2013-06-12 東京応化工業株式会社 剥離装置および剥離方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050053008A (ko) * 2003-12-01 2005-06-07 도쿄 오카 고교 가부시키가이샤 첩부장치 및 첩부방법
KR20070059994A (ko) * 2005-12-06 2007-06-12 도쿄 오카 고교 가부시키가이샤 서포트 플레이트의 첩합수단과 첩합장치, 및 서포트플레이트의 첩합방법
KR20100058913A (ko) * 2008-11-25 2010-06-04 세메스 주식회사 기판처리방법

Also Published As

Publication number Publication date
KR20150005715A (ko) 2015-01-14
TW201404596A (zh) 2014-02-01
JP2013239499A (ja) 2013-11-28
JP5639617B2 (ja) 2014-12-10
TWI499508B (zh) 2015-09-11
WO2013168611A1 (ja) 2013-11-14

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