KR101503975B1 - 임프린트 장치, 임프린트 방법 및 디바이스 제조 방법 - Google Patents
임프린트 장치, 임프린트 방법 및 디바이스 제조 방법 Download PDFInfo
- Publication number
- KR101503975B1 KR101503975B1 KR1020120044491A KR20120044491A KR101503975B1 KR 101503975 B1 KR101503975 B1 KR 101503975B1 KR 1020120044491 A KR1020120044491 A KR 1020120044491A KR 20120044491 A KR20120044491 A KR 20120044491A KR 101503975 B1 KR101503975 B1 KR 101503975B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- pattern
- suction force
- shot
- holding mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
- H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/0003—Discharging moulded articles from the mould
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/56—Compression moulding under special conditions, e.g. vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/021—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of profiled articles, e.g. hollow or tubular articles, beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
- B29C2059/023—Microembossing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/757—Moulds, cores, dies
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2011-101311 | 2011-04-28 | ||
| JP2011101311A JP5875250B2 (ja) | 2011-04-28 | 2011-04-28 | インプリント装置、インプリント方法及びデバイス製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20120122955A KR20120122955A (ko) | 2012-11-07 |
| KR101503975B1 true KR101503975B1 (ko) | 2015-03-18 |
Family
ID=47067295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020120044491A Active KR101503975B1 (ko) | 2011-04-28 | 2012-04-27 | 임프린트 장치, 임프린트 방법 및 디바이스 제조 방법 |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US9387607B2 (https=) |
| JP (1) | JP5875250B2 (https=) |
| KR (1) | KR101503975B1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200140717A (ko) * | 2019-06-07 | 2020-12-16 | 캐논 가부시끼가이샤 | 성형 장치 및 물품 제조 방법 |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6140966B2 (ja) | 2011-10-14 | 2017-06-07 | キヤノン株式会社 | インプリント装置、それを用いた物品の製造方法 |
| JP6021365B2 (ja) * | 2012-03-12 | 2016-11-09 | キヤノン株式会社 | インプリント装置、それを用いた物品の製造方法 |
| JP6242099B2 (ja) * | 2013-07-23 | 2017-12-06 | キヤノン株式会社 | インプリント方法、インプリント装置およびデバイス製造方法 |
| JP6178694B2 (ja) * | 2013-10-17 | 2017-08-09 | キヤノン株式会社 | インプリント装置、および物品の製造方法 |
| JP6333031B2 (ja) | 2014-04-09 | 2018-05-30 | キヤノン株式会社 | インプリント装置および物品の製造方法 |
| JP6478565B2 (ja) * | 2014-11-06 | 2019-03-06 | キヤノン株式会社 | インプリントシステム及び物品の製造方法 |
| TWI619145B (zh) * | 2015-04-30 | 2018-03-21 | 佳能股份有限公司 | 壓印裝置,基板運送裝置,壓印方法以及製造物件的方法 |
| US10199244B2 (en) | 2015-08-11 | 2019-02-05 | Canon Kabushiki Kaisha | Imprint apparatus, and method of manufacturing article |
| JP6774178B2 (ja) * | 2015-11-16 | 2020-10-21 | キヤノン株式会社 | 基板を処理する装置、及び物品の製造方法 |
| JP7039222B2 (ja) * | 2017-09-11 | 2022-03-22 | キオクシア株式会社 | インプリント装置及びインプリント方法 |
| US11036130B2 (en) * | 2017-10-19 | 2021-06-15 | Canon Kabushiki Kaisha | Drop placement evaluation |
| JP7508285B2 (ja) | 2020-06-22 | 2024-07-01 | キヤノン株式会社 | パターン形成方法、インプリント装置、及び物品の製造方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100633019B1 (ko) * | 2004-12-24 | 2006-10-12 | 한국기계연구원 | 미세 임프린트 리소그래피 공정에서 스탬프와 기판의이격공정 및 그 장치 |
| JP2008529826A (ja) * | 2005-01-31 | 2008-08-07 | モレキュラー・インプリンツ・インコーポレーテッド | ナノ加工のためのチャッキング・システム |
| US7635263B2 (en) * | 2005-01-31 | 2009-12-22 | Molecular Imprints, Inc. | Chucking system comprising an array of fluid chambers |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1077393A2 (en) * | 1999-08-19 | 2001-02-21 | Canon Kabushiki Kaisha | Substrate attracting and holding system for use in exposure apparatus |
| US6734117B2 (en) | 2002-03-12 | 2004-05-11 | Nikon Corporation | Periodic clamping method and apparatus to reduce thermal stress in a wafer |
| US7641840B2 (en) * | 2002-11-13 | 2010-01-05 | Molecular Imprints, Inc. | Method for expelling gas positioned between a substrate and a mold |
| US7798801B2 (en) * | 2005-01-31 | 2010-09-21 | Molecular Imprints, Inc. | Chucking system for nano-manufacturing |
| US20070035717A1 (en) * | 2005-08-12 | 2007-02-15 | Wei Wu | Contact lithography apparatus, system and method |
| JP2007083626A (ja) * | 2005-09-22 | 2007-04-05 | Ricoh Co Ltd | 微細構造転写装置 |
| US7517211B2 (en) * | 2005-12-21 | 2009-04-14 | Asml Netherlands B.V. | Imprint lithography |
| US7695667B2 (en) * | 2006-03-01 | 2010-04-13 | Hitachi Global Storage Technologies Netherlands B.V. | Method and apparatus for separating a stamper from a patterned substrate |
| KR20090004910A (ko) * | 2006-04-03 | 2009-01-12 | 몰레큘러 임프린츠 인코퍼레이티드 | 유체 챔버의 어레이를 포함하는 처킹 시스템 |
| JP4854383B2 (ja) * | 2006-05-15 | 2012-01-18 | アピックヤマダ株式会社 | インプリント方法およびナノ・インプリント装置 |
| WO2008068701A2 (en) * | 2006-12-04 | 2008-06-12 | Koninklijke Philips Electronics N.V. | Method and apparatus for applying a sheet to a substrate |
| NL2003380A (en) | 2008-10-17 | 2010-04-20 | Asml Netherlands Bv | Imprint lithography apparatus and method. |
| US8652393B2 (en) * | 2008-10-24 | 2014-02-18 | Molecular Imprints, Inc. | Strain and kinetics control during separation phase of imprint process |
| US8309008B2 (en) * | 2008-10-30 | 2012-11-13 | Molecular Imprints, Inc. | Separation in an imprint lithography process |
| JP2010239118A (ja) * | 2009-03-11 | 2010-10-21 | Canon Inc | インプリント装置および方法 |
| NL2004932A (en) | 2009-07-27 | 2011-01-31 | Asml Netherlands Bv | Imprint lithography template. |
| JP5833636B2 (ja) * | 2010-04-27 | 2015-12-16 | モレキュラー・インプリンツ・インコーポレーテッド | ナノインプリント・リソグラフィのテンプレート製作方法およびそのシステム |
| JP2012134214A (ja) * | 2010-12-20 | 2012-07-12 | Canon Inc | インプリント装置、および、物品の製造方法 |
-
2011
- 2011-04-28 JP JP2011101311A patent/JP5875250B2/ja active Active
-
2012
- 2012-04-20 US US13/451,925 patent/US9387607B2/en active Active
- 2012-04-27 KR KR1020120044491A patent/KR101503975B1/ko active Active
-
2015
- 2015-06-23 US US14/748,104 patent/US10144156B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100633019B1 (ko) * | 2004-12-24 | 2006-10-12 | 한국기계연구원 | 미세 임프린트 리소그래피 공정에서 스탬프와 기판의이격공정 및 그 장치 |
| JP2008529826A (ja) * | 2005-01-31 | 2008-08-07 | モレキュラー・インプリンツ・インコーポレーテッド | ナノ加工のためのチャッキング・システム |
| US7635263B2 (en) * | 2005-01-31 | 2009-12-22 | Molecular Imprints, Inc. | Chucking system comprising an array of fluid chambers |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200140717A (ko) * | 2019-06-07 | 2020-12-16 | 캐논 가부시끼가이샤 | 성형 장치 및 물품 제조 방법 |
| KR102559861B1 (ko) | 2019-06-07 | 2023-07-27 | 캐논 가부시끼가이샤 | 성형 장치 및 물품 제조 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20120274006A1 (en) | 2012-11-01 |
| JP2012234913A (ja) | 2012-11-29 |
| JP5875250B2 (ja) | 2016-03-02 |
| US10144156B2 (en) | 2018-12-04 |
| US20150290846A1 (en) | 2015-10-15 |
| US9387607B2 (en) | 2016-07-12 |
| KR20120122955A (ko) | 2012-11-07 |
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