KR101503975B1 - 임프린트 장치, 임프린트 방법 및 디바이스 제조 방법 - Google Patents

임프린트 장치, 임프린트 방법 및 디바이스 제조 방법 Download PDF

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KR101503975B1
KR101503975B1 KR1020120044491A KR20120044491A KR101503975B1 KR 101503975 B1 KR101503975 B1 KR 101503975B1 KR 1020120044491 A KR1020120044491 A KR 1020120044491A KR 20120044491 A KR20120044491 A KR 20120044491A KR 101503975 B1 KR101503975 B1 KR 101503975B1
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South Korea
Prior art keywords
substrate
pattern
suction force
shot
holding mechanism
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Korean (ko)
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KR20120122955A (ko
Inventor
히데끼 마쯔모또
후미오 사까이
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캐논 가부시끼가이샤
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0003Discharging moulded articles from the mould
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/56Compression moulding under special conditions, e.g. vacuum
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/021Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of profiled articles, e.g. hollow or tubular articles, beams
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023Microembossing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00Other particular articles
    • B29L2031/757Moulds, cores, dies

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020120044491A 2011-04-28 2012-04-27 임프린트 장치, 임프린트 방법 및 디바이스 제조 방법 Active KR101503975B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2011-101311 2011-04-28
JP2011101311A JP5875250B2 (ja) 2011-04-28 2011-04-28 インプリント装置、インプリント方法及びデバイス製造方法

Publications (2)

Publication Number Publication Date
KR20120122955A KR20120122955A (ko) 2012-11-07
KR101503975B1 true KR101503975B1 (ko) 2015-03-18

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Country Status (3)

Country Link
US (2) US9387607B2 (https=)
JP (1) JP5875250B2 (https=)
KR (1) KR101503975B1 (https=)

Cited By (1)

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KR20200140717A (ko) * 2019-06-07 2020-12-16 캐논 가부시끼가이샤 성형 장치 및 물품 제조 방법

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JP6140966B2 (ja) 2011-10-14 2017-06-07 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
JP6021365B2 (ja) * 2012-03-12 2016-11-09 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
JP6242099B2 (ja) * 2013-07-23 2017-12-06 キヤノン株式会社 インプリント方法、インプリント装置およびデバイス製造方法
JP6178694B2 (ja) * 2013-10-17 2017-08-09 キヤノン株式会社 インプリント装置、および物品の製造方法
JP6333031B2 (ja) 2014-04-09 2018-05-30 キヤノン株式会社 インプリント装置および物品の製造方法
JP6478565B2 (ja) * 2014-11-06 2019-03-06 キヤノン株式会社 インプリントシステム及び物品の製造方法
TWI619145B (zh) * 2015-04-30 2018-03-21 佳能股份有限公司 壓印裝置,基板運送裝置,壓印方法以及製造物件的方法
US10199244B2 (en) 2015-08-11 2019-02-05 Canon Kabushiki Kaisha Imprint apparatus, and method of manufacturing article
JP6774178B2 (ja) * 2015-11-16 2020-10-21 キヤノン株式会社 基板を処理する装置、及び物品の製造方法
JP7039222B2 (ja) * 2017-09-11 2022-03-22 キオクシア株式会社 インプリント装置及びインプリント方法
US11036130B2 (en) * 2017-10-19 2021-06-15 Canon Kabushiki Kaisha Drop placement evaluation
JP7508285B2 (ja) 2020-06-22 2024-07-01 キヤノン株式会社 パターン形成方法、インプリント装置、及び物品の製造方法

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JP2008529826A (ja) * 2005-01-31 2008-08-07 モレキュラー・インプリンツ・インコーポレーテッド ナノ加工のためのチャッキング・システム
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JP2008529826A (ja) * 2005-01-31 2008-08-07 モレキュラー・インプリンツ・インコーポレーテッド ナノ加工のためのチャッキング・システム
US7635263B2 (en) * 2005-01-31 2009-12-22 Molecular Imprints, Inc. Chucking system comprising an array of fluid chambers

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200140717A (ko) * 2019-06-07 2020-12-16 캐논 가부시끼가이샤 성형 장치 및 물품 제조 방법
KR102559861B1 (ko) 2019-06-07 2023-07-27 캐논 가부시끼가이샤 성형 장치 및 물품 제조 방법

Also Published As

Publication number Publication date
US20120274006A1 (en) 2012-11-01
JP2012234913A (ja) 2012-11-29
JP5875250B2 (ja) 2016-03-02
US10144156B2 (en) 2018-12-04
US20150290846A1 (en) 2015-10-15
US9387607B2 (en) 2016-07-12
KR20120122955A (ko) 2012-11-07

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