KR101450929B1 - Ｌｅｄ 광원용 광학 접합 조성물 - Google Patents

Ｌｅｄ 광원용 광학 접합 조성물 Download PDF

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Publication number
KR101450929B1
KR101450929B1 KR1020097012537A KR20097012537A KR101450929B1 KR 101450929 B1 KR101450929 B1 KR 101450929B1 KR 1020097012537 A KR1020097012537 A KR 1020097012537A KR 20097012537 A KR20097012537 A KR 20097012537A KR 101450929 B1 KR101450929 B1 KR 101450929B1
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South Korea
Prior art keywords
delete delete
led die
optical
led
light source
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Korean (ko)
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KR20090082496A (ko
Inventor
에이미 에스. 바르네스
디. 스콧 톰슨
토드 에이. 발렌
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쓰리엠 이노베이티브 프로퍼티즈 컴파니
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Publication of KR20090082496A publication Critical patent/KR20090082496A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0091—Reflectors for light sources using total internal reflection
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020097012537A 2006-11-20 2007-11-07 Ｌｅｄ 광원용 광학 접합 조성물 Expired - Fee Related KR101450929B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US86644806P 2006-11-20 2006-11-20
US60/866,448 2006-11-20
PCT/US2007/083874 WO2008063884A1 (en) 2006-11-20 2007-11-07 Optical bonding composition for led light source

Publications (2)

Publication Number Publication Date
KR20090082496A KR20090082496A (ko) 2009-07-30
KR101450929B1 true KR101450929B1 (ko) 2014-10-14

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KR1020097012537A Expired - Fee Related KR101450929B1 (ko) 2006-11-20 2007-11-07 Ｌｅｄ 광원용 광학 접합 조성물

Country Status (7)

Country Link
US (1) US8013345B2 (enExample)
EP (1) EP2087532A1 (enExample)
JP (1) JP2010510685A (enExample)
KR (1) KR101450929B1 (enExample)
CN (1) CN101548398A (enExample)
TW (1) TW200835766A (enExample)
WO (1) WO2008063884A1 (enExample)

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US9946084B2 (en) 2015-08-10 2018-04-17 Corning Incorporated Methods for making optical devices

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US20110062469A1 (en) * 2009-09-17 2011-03-17 Koninklijke Philips Electronics N.V. Molded lens incorporating a window element
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DE102010006072A1 (de) * 2010-01-28 2011-08-18 OSRAM Opto Semiconductors GmbH, 93055 Optoelektronisches Halbleiterbauteil und Verwendung eines optoelektronischen Halbleiterbauteils in einem Kfz-Schweinwerfer
CN102918110B (zh) 2010-05-28 2015-08-12 株式会社钟化 聚硅氧烷类组合物、固化物及光学器件
US9698320B2 (en) 2010-09-22 2017-07-04 Kaneka Corporation Modified product of polyhedral structure polysiloxane, polyhedral structure polysiloxane composition, cured product, and optical semiconductor device
CN202056570U (zh) * 2011-01-20 2011-11-30 木林森股份有限公司 一种带透镜的表面贴装式发光二极管
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DE102011111917A1 (de) * 2011-08-30 2013-02-28 Osram Opto Semiconductors Gmbh Licht emittierendes Halbleiterbauelement und Verfahren zur Herstellung eines Licht emittierenden Halbleiterbauelements
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DE102012108104A1 (de) * 2012-08-31 2014-03-06 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
TWI480344B (zh) 2012-11-05 2015-04-11 Ind Tech Res Inst 白色塗料組合物及包含其所形成之塗層的裝置
TWI525861B (zh) 2012-11-28 2016-03-11 Ｌｇ化學股份有限公司 發光二極體
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JP6821600B2 (ja) * 2015-12-22 2021-01-27 リンテック株式会社 硬化性組成物、硬化性組成物の製造方法、硬化物、及び硬化性組成物の使用方法
US10734540B1 (en) * 2019-07-03 2020-08-04 Advanced Semiconductor Engineering, Inc. Optical device and method for manufacturing the same
JP7631026B2 (ja) * 2021-02-26 2025-02-18 サカタインクス株式会社 接着剤組成物

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Publication number Priority date Publication date Assignee Title
US9946084B2 (en) 2015-08-10 2018-04-17 Corning Incorporated Methods for making optical devices

Also Published As

Publication number Publication date
US8013345B2 (en) 2011-09-06
TW200835766A (en) 2008-09-01
JP2010510685A (ja) 2010-04-02
WO2008063884A1 (en) 2008-05-29
US20100025711A1 (en) 2010-02-04
KR20090082496A (ko) 2009-07-30
EP2087532A1 (en) 2009-08-12
CN101548398A (zh) 2009-09-30

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