KR101449969B1 - 반도체 장치의 제작 방법 - Google Patents

반도체 장치의 제작 방법 Download PDF

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Publication number
KR101449969B1
KR101449969B1 KR1020070138229A KR20070138229A KR101449969B1 KR 101449969 B1 KR101449969 B1 KR 101449969B1 KR 1020070138229 A KR1020070138229 A KR 1020070138229A KR 20070138229 A KR20070138229 A KR 20070138229A KR 101449969 B1 KR101449969 B1 KR 101449969B1
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KR
South Korea
Prior art keywords
droplet
region
diameter
substrate
circuit
Prior art date
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Expired - Fee Related
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KR1020070138229A
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English (en)
Korean (ko)
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KR20080061316A (ko
Inventor
겐 후지이
에리카 다카하시
Original Assignee
가부시키가이샤 한도오따이 에네루기 켄큐쇼
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Publication of KR20080061316A publication Critical patent/KR20080061316A/ko
Application granted granted Critical
Publication of KR101449969B1 publication Critical patent/KR101449969B1/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Thin Film Transistor (AREA)
  • Electroluminescent Light Sources (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020070138229A 2006-12-27 2007-12-27 반도체 장치의 제작 방법 Expired - Fee Related KR101449969B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2006-00351985 2006-12-27
JP2006351985 2006-12-27

Publications (2)

Publication Number Publication Date
KR20080061316A KR20080061316A (ko) 2008-07-02
KR101449969B1 true KR101449969B1 (ko) 2014-10-14

Family

ID=39584555

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070138229A Expired - Fee Related KR101449969B1 (ko) 2006-12-27 2007-12-27 반도체 장치의 제작 방법

Country Status (3)

Country Link
US (1) US7827521B2 (https=)
JP (1) JP5371240B2 (https=)
KR (1) KR101449969B1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5095650B2 (ja) * 2008-09-30 2012-12-12 シャープ株式会社 膜パターンとその膜パターン形成方法、及び導電膜配線、並びに電気光学装置
TW201214577A (en) * 2010-09-20 2012-04-01 E Ink Holdings Inc Manufacture method of thin-film transistor
CN102456573A (zh) * 2010-10-22 2012-05-16 元太科技工业股份有限公司 薄膜晶体管的制造方法
JP2012114157A (ja) * 2010-11-22 2012-06-14 Toshiba Corp ドロップレシピ作成方法およびデータベース作成方法
CN102117840B (zh) * 2010-12-15 2012-04-25 杭州杭鑫电子工业有限公司 一种多重金属扩散快恢复二极管及其制备方法
JP5711585B2 (ja) * 2011-03-30 2015-05-07 株式会社アドテックエンジニアリング 薄膜トランジスタの製造装置およびその製造方法、ならびにプログラム
US9349922B2 (en) * 2014-08-25 2016-05-24 Boe Technology Group Co., Ltd. Mask, mask group, manufacturing method of pixels and pixel structure
US11474441B2 (en) * 2020-06-25 2022-10-18 Canon Kabushiki Kaisha Systems and methods for generating drop patterns

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001030478A (ja) * 1999-07-19 2001-02-06 Canon Inc 記録装置および記録装置の画像データ処理方法
JP2004080041A (ja) * 2002-08-20 2004-03-11 Xerox Corp 印刷パターン形成方法、プリントヘッド、印刷システム、集積回路、及び印刷システム操作方法
JP2005012179A (ja) * 2003-05-16 2005-01-13 Seiko Epson Corp 薄膜パターン形成方法、デバイスとその製造方法及び電気光学装置並びに電子機器、アクティブマトリクス基板の製造方法
JP2005103820A (ja) * 2003-09-29 2005-04-21 Seiko Epson Corp 印刷装置、印刷方法、および印刷用プログラム

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3507415B2 (ja) 2000-07-17 2004-03-15 キヤノン株式会社 記録装置および記録方法
JP2005203434A (ja) * 2004-01-13 2005-07-28 Fuji Photo Film Co Ltd パターン形成方法
US20050166411A1 (en) * 2004-01-22 2005-08-04 Scorvo Sean K. Fishing system
US20050196710A1 (en) * 2004-03-04 2005-09-08 Semiconductor Energy Laboratory Co., Ltd. Method for forming pattern, thin film transistor, display device and method for manufacturing the same, and television apparatus
JP4700484B2 (ja) * 2004-12-17 2011-06-15 株式会社半導体エネルギー研究所 半導体装置の作製方法
US7687326B2 (en) * 2004-12-17 2010-03-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US7756600B2 (en) 2005-09-22 2010-07-13 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP5100070B2 (ja) * 2005-09-22 2012-12-19 株式会社半導体エネルギー研究所 半導体装置の作製方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001030478A (ja) * 1999-07-19 2001-02-06 Canon Inc 記録装置および記録装置の画像データ処理方法
JP2004080041A (ja) * 2002-08-20 2004-03-11 Xerox Corp 印刷パターン形成方法、プリントヘッド、印刷システム、集積回路、及び印刷システム操作方法
JP2005012179A (ja) * 2003-05-16 2005-01-13 Seiko Epson Corp 薄膜パターン形成方法、デバイスとその製造方法及び電気光学装置並びに電子機器、アクティブマトリクス基板の製造方法
JP2005103820A (ja) * 2003-09-29 2005-04-21 Seiko Epson Corp 印刷装置、印刷方法、および印刷用プログラム

Also Published As

Publication number Publication date
US7827521B2 (en) 2010-11-02
JP5371240B2 (ja) 2013-12-18
JP2008193061A (ja) 2008-08-21
US20080160649A1 (en) 2008-07-03
KR20080061316A (ko) 2008-07-02

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