KR101440413B1 - 가변 주사 주파수를 구비하는 이온 주입기 - Google Patents

가변 주사 주파수를 구비하는 이온 주입기 Download PDF

Info

Publication number
KR101440413B1
KR101440413B1 KR1020087024562A KR20087024562A KR101440413B1 KR 101440413 B1 KR101440413 B1 KR 101440413B1 KR 1020087024562 A KR1020087024562 A KR 1020087024562A KR 20087024562 A KR20087024562 A KR 20087024562A KR 101440413 B1 KR101440413 B1 KR 101440413B1
Authority
KR
South Korea
Prior art keywords
energy
frequency
ion beam
scan
threshold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020087024562A
Other languages
English (en)
Korean (ko)
Other versions
KR20080106966A (ko
Inventor
죠셉 씨. 올슨
모건 에반스
Original Assignee
베리안 세미콘덕터 이큅먼트 어소시에이츠, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 베리안 세미콘덕터 이큅먼트 어소시에이츠, 인크. filed Critical 베리안 세미콘덕터 이큅먼트 어소시에이츠, 인크.
Publication of KR20080106966A publication Critical patent/KR20080106966A/ko
Application granted granted Critical
Publication of KR101440413B1 publication Critical patent/KR101440413B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/026—Means for avoiding or neutralising unwanted electrical charges on tube components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/08—Ion sources; Ion guns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/147—Arrangements for directing or deflecting the discharge along a desired path
    • H01J37/1472—Deflecting along given lines
    • H01J37/1474—Scanning means
    • H01J37/1477—Scanning means electrostatic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/302—Controlling tubes by external information, e.g. programme control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
    • H10P30/20—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/004—Charge control of objects or beams
    • H01J2237/0041—Neutralising arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/304—Controlling tubes
    • H01J2237/30472—Controlling the beam
    • H01J2237/30483—Scanning
    • H01J2237/30488—Raster scan

Landscapes

  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Physical Vapour Deposition (AREA)
  • Electron Sources, Ion Sources (AREA)
  • Particle Accelerators (AREA)
KR1020087024562A 2006-03-27 2007-03-23 가변 주사 주파수를 구비하는 이온 주입기 Active KR101440413B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/390,518 2006-03-27
US11/390,518 US7358510B2 (en) 2006-03-27 2006-03-27 Ion implanter with variable scan frequency
PCT/US2007/007224 WO2007111991A2 (en) 2006-03-27 2007-03-23 Ion implanter with variable scan frequency

Publications (2)

Publication Number Publication Date
KR20080106966A KR20080106966A (ko) 2008-12-09
KR101440413B1 true KR101440413B1 (ko) 2014-09-15

Family

ID=38532387

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087024562A Active KR101440413B1 (ko) 2006-03-27 2007-03-23 가변 주사 주파수를 구비하는 이온 주입기

Country Status (6)

Country Link
US (1) US7358510B2 (enExample)
JP (1) JP5075193B2 (enExample)
KR (1) KR101440413B1 (enExample)
CN (1) CN101410929B (enExample)
TW (1) TWI413999B (enExample)
WO (1) WO2007111991A2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5373702B2 (ja) * 2010-06-07 2013-12-18 株式会社Ｓｅｎ イオンビームスキャン処理装置及びイオンビームスキャン処理方法
US9490185B2 (en) 2012-08-31 2016-11-08 Axcelis Technologies, Inc. Implant-induced damage control in ion implantation
EP2779205B1 (en) * 2013-03-15 2017-10-18 ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH High throughput scan deflector and method of manufacturing thereof
US10483086B2 (en) * 2014-12-26 2019-11-19 Axcelis Technologies, Inc. Beam profiling speed enhancement for scanned beam implanters
JP6689544B2 (ja) * 2016-09-06 2020-04-28 住友重機械イオンテクノロジー株式会社 イオン注入装置及びイオン注入方法
US9905396B1 (en) * 2016-10-18 2018-02-27 Varian Semiconductor Equipment Associates, Inc. Curved post scan electrode
US10770261B2 (en) 2017-12-14 2020-09-08 Varian Semiconductor Equipment Associates, Inc. System and method to monitor glitch energy
WO2020073218A1 (en) * 2018-10-10 2020-04-16 Applied Materials, Inc. Techniques and apparatus for anisotropic stress compensation in substrates using ion implantation

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6075249A (en) 1998-06-19 2000-06-13 Varian Semiconductor Equipment Associates, Inc. Methods and apparatus for scanning and focusing an ion beam
WO2002025692A1 (en) 2000-09-20 2002-03-28 Fei Company Real time monitoring for simultaneous imaging and exposure in charged particle beam systems
US20020066872A1 (en) 2000-12-06 2002-06-06 Ulvac Inc. Ion implantation system and ion implantation method
US6838685B1 (en) 2002-07-30 2005-01-04 Sii Nanotechnology Inc. Ion beam apparatus, ion beam processing method and sample holder member

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2412939A1 (fr) * 1977-12-23 1979-07-20 Anvar Implanteur d'ions a fort courant
US5418378A (en) * 1994-03-14 1995-05-23 Advanced Micro Devices Ion implant device with modulated scan output
JPH0896744A (ja) * 1994-09-27 1996-04-12 Hitachi Ltd イオン注入装置
JPH08167398A (ja) * 1994-12-02 1996-06-25 Hitachi Ltd イオン注入装置
US6423976B1 (en) * 1999-05-28 2002-07-23 Applied Materials, Inc. Ion implanter and a method of implanting ions
JP3341749B2 (ja) 1999-12-28 2002-11-05 日新電機株式会社 イオン注入方法およびイオン注入装置
US6710359B2 (en) * 2001-03-23 2004-03-23 Varian Semiconductor Equipment Associates, Inc. Methods and apparatus for scanned beam uniformity adjustment in ion implanters
US6879109B2 (en) * 2003-05-15 2005-04-12 Axcelis Technologies, Inc. Thin magnetron structures for plasma generation in ion implantation systems
US6903350B1 (en) * 2004-06-10 2005-06-07 Axcelis Technologies, Inc. Ion beam scanning systems and methods for improved ion implantation uniformity
US6992309B1 (en) * 2004-08-13 2006-01-31 Axcelis Technologies, Inc. Ion beam measurement systems and methods for ion implant dose and uniformity control

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6075249A (en) 1998-06-19 2000-06-13 Varian Semiconductor Equipment Associates, Inc. Methods and apparatus for scanning and focusing an ion beam
WO2002025692A1 (en) 2000-09-20 2002-03-28 Fei Company Real time monitoring for simultaneous imaging and exposure in charged particle beam systems
US20020066872A1 (en) 2000-12-06 2002-06-06 Ulvac Inc. Ion implantation system and ion implantation method
US6838685B1 (en) 2002-07-30 2005-01-04 Sii Nanotechnology Inc. Ion beam apparatus, ion beam processing method and sample holder member

Also Published As

Publication number Publication date
KR20080106966A (ko) 2008-12-09
WO2007111991A3 (en) 2008-01-24
TW200809904A (en) 2008-02-16
US20070221872A1 (en) 2007-09-27
TWI413999B (zh) 2013-11-01
JP5075193B2 (ja) 2012-11-14
CN101410929B (zh) 2010-07-28
CN101410929A (zh) 2009-04-15
WO2007111991A2 (en) 2007-10-04
JP2009531831A (ja) 2009-09-03
US7358510B2 (en) 2008-04-15

Similar Documents

Publication Publication Date Title
KR101440413B1 (ko) 가변 주사 주파수를 구비하는 이온 주입기
KR100681968B1 (ko) 이온 주입기의 빔 평행성 조정 방법 및 장치
CN101002294B (zh) 用于改进离子注入均匀性的离子束扫描系统和方法
US8637838B2 (en) System and method for ion implantation with improved productivity and uniformity
KR101365103B1 (ko) 이온 주입기용 주사 패턴
US6521895B1 (en) Wide dynamic range ion beam scanners
KR20130102597A (ko) 이온 빔 튜닝
JP4305801B2 (ja) イオンビームを走査しかつ集束するための方法および装置
KR20040005988A (ko) 가변 공간 주파수 주사선으로 이온 주입하는 방법 및 장치
GB2345574A (en) Apparatus and method for monitoring and tuning an ion beam in an ion implantation apparatus
KR101778515B1 (ko) 포토레지스트 가스 방출 동안 주입 균일성을 향상시키는 방법

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20170629

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000