KR101439119B1 - 전자 부품의 제조 방법 및 전자 부품의 제조 장치 - Google Patents

전자 부품의 제조 방법 및 전자 부품의 제조 장치 Download PDF

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Publication number
KR101439119B1
KR101439119B1 KR1020130065143A KR20130065143A KR101439119B1 KR 101439119 B1 KR101439119 B1 KR 101439119B1 KR 1020130065143 A KR1020130065143 A KR 1020130065143A KR 20130065143 A KR20130065143 A KR 20130065143A KR 101439119 B1 KR101439119 B1 KR 101439119B1
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KR
South Korea
Prior art keywords
solder
polyalkylene glycol
base electrode
electronic component
oil
Prior art date
Application number
KR1020130065143A
Other languages
English (en)
Korean (ko)
Other versions
KR20140013909A (ko
Inventor
미치노부 사사키
아키히로 호리타
아쓰히로 쓰요시
Original Assignee
티디케이가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 티디케이가부시기가이샤 filed Critical 티디케이가부시기가이샤
Publication of KR20140013909A publication Critical patent/KR20140013909A/ko
Application granted granted Critical
Publication of KR101439119B1 publication Critical patent/KR101439119B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Coating With Molten Metal (AREA)
  • Wire Bonding (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Electrodes Of Semiconductors (AREA)
KR1020130065143A 2012-07-26 2013-06-07 전자 부품의 제조 방법 및 전자 부품의 제조 장치 KR101439119B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012165715A JP5821797B2 (ja) 2012-07-26 2012-07-26 電子部品の製造方法及び電子部品の製造装置
JPJP-P-2012-165715 2012-07-26

Publications (2)

Publication Number Publication Date
KR20140013909A KR20140013909A (ko) 2014-02-05
KR101439119B1 true KR101439119B1 (ko) 2014-09-11

Family

ID=50050477

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130065143A KR101439119B1 (ko) 2012-07-26 2013-06-07 전자 부품의 제조 방법 및 전자 부품의 제조 장치

Country Status (3)

Country Link
JP (1) JP5821797B2 (zh)
KR (1) KR101439119B1 (zh)
CN (1) CN103578956A (zh)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06252542A (ja) * 1993-02-25 1994-09-09 Sharp Corp 半田層の形成方法
JPH07114205B2 (ja) * 1988-06-30 1995-12-06 日本電装株式会社 はんだバンプの形成方法
KR100985004B1 (ko) * 2002-07-30 2010-10-04 프리스케일 세미컨덕터, 인크. 과포화 정제된 결정 플럭스를 사용하여 솔더링 작업용 금속 표면을 제조하는 방법, 볼 부착 작업용 웨이퍼의 제조 방법, 및 솔더 플럭스의 제조 방법
JP7114205B2 (ja) * 2016-09-27 2022-08-08 三菱電機株式会社 空気調和機の室外機および空気調和機

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01270388A (ja) * 1988-04-22 1989-10-27 Nec Corp プリント基板の半田付方法および半田付装置
US4903631A (en) * 1988-05-27 1990-02-27 Teledyne Industries, Inc. System for soldering printed circuits
CN1701649B (zh) * 2002-12-06 2010-06-02 株式会社田村制作所 一种焊料供给方法以及焊料凸起形成方法
CN100366377C (zh) * 2006-01-24 2008-02-06 昆山成利焊锡制造有限公司 无铅软钎焊料

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07114205B2 (ja) * 1988-06-30 1995-12-06 日本電装株式会社 はんだバンプの形成方法
JPH06252542A (ja) * 1993-02-25 1994-09-09 Sharp Corp 半田層の形成方法
KR100985004B1 (ko) * 2002-07-30 2010-10-04 프리스케일 세미컨덕터, 인크. 과포화 정제된 결정 플럭스를 사용하여 솔더링 작업용 금속 표면을 제조하는 방법, 볼 부착 작업용 웨이퍼의 제조 방법, 및 솔더 플럭스의 제조 방법
JP7114205B2 (ja) * 2016-09-27 2022-08-08 三菱電機株式会社 空気調和機の室外機および空気調和機

Also Published As

Publication number Publication date
CN103578956A (zh) 2014-02-12
KR20140013909A (ko) 2014-02-05
JP5821797B2 (ja) 2015-11-24
JP2014025108A (ja) 2014-02-06

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