KR101414399B1 - 반도체 접합 장치 및 방법 - Google Patents

반도체 접합 장치 및 방법 Download PDF

Info

Publication number
KR101414399B1
KR101414399B1 KR1020097000673A KR20097000673A KR101414399B1 KR 101414399 B1 KR101414399 B1 KR 101414399B1 KR 1020097000673 A KR1020097000673 A KR 1020097000673A KR 20097000673 A KR20097000673 A KR 20097000673A KR 101414399 B1 KR101414399 B1 KR 101414399B1
Authority
KR
South Korea
Prior art keywords
delete delete
bonding
semiconductor
wafer
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020097000673A
Other languages
English (en)
Korean (ko)
Other versions
KR20090034871A (ko
Inventor
그레고리 죠지
에띠엔느 핸콕
로버트 캠벨
Original Assignee
수스 마이크로텍 리소그라피 게엠바하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 수스 마이크로텍 리소그라피 게엠바하 filed Critical 수스 마이크로텍 리소그라피 게엠바하
Publication of KR20090034871A publication Critical patent/KR20090034871A/ko
Application granted granted Critical
Publication of KR101414399B1 publication Critical patent/KR101414399B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P10/00—Bonding of wafers, substrates or parts of devices
    • H10P10/12—Bonding of semiconductor wafers or semiconductor substrates to semiconductor wafers or semiconductor substrates
    • H10P10/128—Bonding of semiconductor wafers or semiconductor substrates to semiconductor wafers or semiconductor substrates by direct semiconductor to semiconductor bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping

Landscapes

  • Pressure Welding/Diffusion-Bonding (AREA)
KR1020097000673A 2006-06-22 2007-06-22 반도체 접합 장치 및 방법 Active KR101414399B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US81561906P 2006-06-22 2006-06-22
US60/815,619 2006-06-22
US11/766,531 2007-06-21
US11/766,531 US7948034B2 (en) 2006-06-22 2007-06-21 Apparatus and method for semiconductor bonding
PCT/US2007/071857 WO2007150012A2 (en) 2006-06-22 2007-06-22 Apparatus and method for semiconductor bonding

Publications (2)

Publication Number Publication Date
KR20090034871A KR20090034871A (ko) 2009-04-08
KR101414399B1 true KR101414399B1 (ko) 2014-07-01

Family

ID=38834410

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097000673A Active KR101414399B1 (ko) 2006-06-22 2007-06-22 반도체 접합 장치 및 방법

Country Status (5)

Country Link
US (1) US7948034B2 (https=)
EP (1) EP2030229B1 (https=)
JP (1) JP5390380B2 (https=)
KR (1) KR101414399B1 (https=)
WO (1) WO2007150012A2 (https=)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006026331B4 (de) * 2006-06-02 2019-09-26 Erich Thallner Transportable Einheit zum Transport von Wafern und Verwendung einer Gelfolie in einer transportablen Einheit
JP4841412B2 (ja) * 2006-12-06 2011-12-21 日東電工株式会社 基板貼合せ装置
DE102006058493B4 (de) * 2006-12-12 2012-03-22 Erich Thallner Verfahren und Vorrichtung zum Bonden von Wafern
US7939424B2 (en) 2007-09-21 2011-05-10 Varian Semiconductor Equipment Associates, Inc. Wafer bonding activated by ion implantation
JP5320736B2 (ja) * 2007-12-28 2013-10-23 株式会社ニコン 半導体ウエハ貼り合わせ装置
US8139219B2 (en) * 2008-04-02 2012-03-20 Suss Microtec Lithography, Gmbh Apparatus and method for semiconductor wafer alignment
WO2010051106A2 (en) * 2008-09-12 2010-05-06 Arizona Board of Regents, a body corporate acting for and on behalf of Arizona State University Methods for attaching flexible substrates to rigid carriers and resulting devices
EP2351076B1 (en) * 2008-11-16 2016-09-28 Suss MicroTec Lithography GmbH Method and apparatus for wafer bonding with enhanced wafer mating
US7927975B2 (en) 2009-02-04 2011-04-19 Micron Technology, Inc. Semiconductor material manufacture
EP2485244A4 (en) * 2009-09-28 2014-07-30 Nikon Corp PRESSURE APPLICATION MODULE, PRINT APPLICATION DEVICE AND SUBSTRATE BINDING DEVICE
US8640755B2 (en) * 2010-10-05 2014-02-04 Skyworks Solutions, Inc. Securing mechanism and method for wafer bonder
US9719169B2 (en) 2010-12-20 2017-08-01 Novellus Systems, Inc. System and apparatus for flowable deposition in semiconductor fabrication
JP5411177B2 (ja) * 2011-02-24 2014-02-12 東京エレクトロン株式会社 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体
TWI578409B (zh) * 2011-12-08 2017-04-11 尼康股份有限公司 A pressing device, a substrate bonding device and a superimposing substrate
CN102646620B (zh) * 2012-05-08 2015-02-18 中国科学院半导体研究所 硅基iii-v外延材料图形异质键合均匀轴向力施力装置
NL2010252C2 (en) 2013-02-06 2014-08-07 Boschman Tech Bv Semiconductor product processing method, including a semiconductor product encapsulation method and a semiconductor product carrier-mounting method, and corresponding semiconductor product processing apparatus.
US9847222B2 (en) 2013-10-25 2017-12-19 Lam Research Corporation Treatment for flowable dielectric deposition on substrate surfaces
US10121760B2 (en) 2013-11-01 2018-11-06 Nikon Corporation Wafer bonding system and method
US9418830B2 (en) 2014-06-27 2016-08-16 Freescale Semiconductor, Inc. Methods for bonding semiconductor wafers
US10049921B2 (en) 2014-08-20 2018-08-14 Lam Research Corporation Method for selectively sealing ultra low-k porous dielectric layer using flowable dielectric film formed from vapor phase dielectric precursor
US11183401B2 (en) 2015-05-15 2021-11-23 Suss Microtec Lithography Gmbh System and related techniques for handling aligned substrate pairs
US10825705B2 (en) 2015-05-15 2020-11-03 Suss Microtec Lithography Gmbh Apparatus, system, and method for handling aligned wafer pairs
CN106710442B (zh) * 2015-10-21 2021-01-22 京东方科技集团股份有限公司 背光源分离设备
US10388546B2 (en) 2015-11-16 2019-08-20 Lam Research Corporation Apparatus for UV flowable dielectric
US9916977B2 (en) 2015-11-16 2018-03-13 Lam Research Corporation Low k dielectric deposition via UV driven photopolymerization
CN105405793A (zh) * 2015-12-08 2016-03-16 中国科学院半导体研究所 均匀轴向力承片装置
TWI701708B (zh) * 2016-02-24 2020-08-11 德商蘇士微科技印刷術股份有限公司 半導體接合設備及相關技術
US10410892B2 (en) * 2016-11-18 2019-09-10 Taiwan Semiconductor Manufacturing Company Ltd. Method of semiconductor wafer bonding and system thereof
WO2019079281A1 (en) 2017-10-17 2019-04-25 Molekule Inc. SYSTEM AND METHOD FOR PHOTOELECTROCHEMICAL AIR PURIFICATION
KR102576705B1 (ko) * 2018-08-30 2023-09-08 삼성전자주식회사 기판 본딩 장치 및 기판의 본딩 방법
KR102619624B1 (ko) 2018-11-13 2023-12-29 삼성전자주식회사 기판합착 장치 및 방법
WO2021158697A1 (en) * 2020-02-03 2021-08-12 Molekule, Inc. Filter media and system and method for manufacture thereof
US11596900B2 (en) 2020-08-31 2023-03-07 Molekule, Inc. Air filter and filter media thereof
KR102840203B1 (ko) 2020-09-01 2025-08-01 삼성전자주식회사 기판 정렬 장치 및 이를 구비하는 기판 본딩 설비
KR102830238B1 (ko) 2020-09-01 2025-07-04 삼성전자주식회사 레이저 본딩 시스템 및 레이저 본딩 장치
DE102021126716B3 (de) 2021-10-14 2022-09-01 Pink Gmbh Thermosysteme Multifunktionale sinter- oder diffusionslötvorrichtung und presswerkzeug
TWI874823B (zh) 2021-10-14 2025-03-01 德商平克塞莫系統有限公司 多功能設備和衝壓工具
CN114361063B (zh) * 2021-11-24 2024-12-13 苏州科阳半导体有限公司 基板键合方法及基板
TWI769957B (zh) * 2021-11-25 2022-07-01 天虹科技股份有限公司 基板鍵合機台
CN116169041B (zh) * 2021-11-25 2026-04-17 天虹科技股份有限公司 晶圆键合机台
DE102022107462A1 (de) 2022-03-29 2023-10-05 Pva Industrial Vacuum Systems Gmbh Hochtemperatur-Fügeofen
US20230360940A1 (en) * 2022-05-03 2023-11-09 Applied Materials, Inc. Wafer film frame carrier
US20250361615A1 (en) 2024-05-24 2025-11-27 Kaustav Banerjee Methods of forming transistor interconnects on top of a semiconductor device substrate

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH097910A (ja) * 1995-06-21 1997-01-10 Hitachi Ltd 陽極接合装置と陽極接合方法および加速度センサの製造方法
US6829988B2 (en) * 2003-05-16 2004-12-14 Suss Microtec, Inc. Nanoimprinting apparatus and method
KR20050029110A (ko) * 2003-09-19 2005-03-24 가부시끼가이샤 르네사스 테크놀로지 반도체 집적 회로 장치의 제조 방법
JP2005294824A (ja) * 2004-03-12 2005-10-20 Bondotekku:Kk 真空中での超音波接合方法及び装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5273553A (en) * 1989-08-28 1993-12-28 Kabushiki Kaisha Toshiba Apparatus for bonding semiconductor substrates
US5351876A (en) * 1994-01-04 1994-10-04 Texas Instruments Incorporated Apparatus and method for flip-clip bonding
JPH11195567A (ja) * 1997-12-26 1999-07-21 Canon Inc 基板処理装置、基板支持装置及び基板処理方法並びに基板の製造方法
US6383890B2 (en) * 1997-12-26 2002-05-07 Canon Kabushiki Kaisha Wafer bonding method, apparatus and vacuum chuck
DE10030431A1 (de) * 2000-06-21 2002-01-10 Karl Suess Kg Praez Sgeraete F Verfahren und Vorrichtung zum Reinigen und/oder Bonden von Substraten
US6584416B2 (en) * 2001-08-16 2003-06-24 Hewlett-Packard Development Company System and methods for forming data storage devices
US6975016B2 (en) * 2002-02-06 2005-12-13 Intel Corporation Wafer bonding using a flexible bladder press and thinned wafers for three-dimensional (3D) wafer-to-wafer vertical stack integration, and application thereof
JP2003249425A (ja) * 2002-02-22 2003-09-05 Toray Eng Co Ltd 実装方法および装置
US6969667B2 (en) * 2002-04-01 2005-11-29 Hewlett-Packard Development Company, L.P. Electrical device and method of making
US6645831B1 (en) * 2002-05-07 2003-11-11 Intel Corporation Thermally stable crystalline defect-free germanium bonded to silicon and silicon dioxide
JP2004207436A (ja) * 2002-12-25 2004-07-22 Ayumi Kogyo Kk ウエハのプリアライメント方法とその装置ならびにウエハの貼り合わせ方法とその装置
US7064055B2 (en) 2002-12-31 2006-06-20 Massachusetts Institute Of Technology Method of forming a multi-layer semiconductor structure having a seamless bonding interface
US6875636B2 (en) * 2003-07-14 2005-04-05 Delphi Technologies, Inc. Wafer applied thermally conductive interposer
US7407863B2 (en) * 2003-10-07 2008-08-05 Board Of Trustees Of The University Of Illinois Adhesive bonding with low temperature grown amorphous or polycrystalline compound semiconductors
JP2005142537A (ja) * 2003-10-15 2005-06-02 Bondotekku:Kk 縦振接合方法及び装置
WO2005054147A1 (ja) * 2003-12-02 2005-06-16 Bondtech Inc. 接合方法及びこの方法により作成されるデバイス並びに接合装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH097910A (ja) * 1995-06-21 1997-01-10 Hitachi Ltd 陽極接合装置と陽極接合方法および加速度センサの製造方法
US6829988B2 (en) * 2003-05-16 2004-12-14 Suss Microtec, Inc. Nanoimprinting apparatus and method
KR20050029110A (ko) * 2003-09-19 2005-03-24 가부시끼가이샤 르네사스 테크놀로지 반도체 집적 회로 장치의 제조 방법
JP2005294824A (ja) * 2004-03-12 2005-10-20 Bondotekku:Kk 真空中での超音波接合方法及び装置

Also Published As

Publication number Publication date
WO2007150012A3 (en) 2008-02-21
JP2009542012A (ja) 2009-11-26
US20070296035A1 (en) 2007-12-27
WO2007150012A2 (en) 2007-12-27
JP5390380B2 (ja) 2014-01-15
EP2030229B1 (en) 2018-05-02
US7948034B2 (en) 2011-05-24
KR20090034871A (ko) 2009-04-08
EP2030229A4 (en) 2011-10-19
EP2030229A2 (en) 2009-03-04

Similar Documents

Publication Publication Date Title
KR101414399B1 (ko) 반도체 접합 장치 및 방법
CN107123611B (zh) 半导体接合装置及相关技术
US11020953B2 (en) Device and method for bonding substrates
TWI750463B (zh) 用於接合基板之方法及裝置
TWI550680B (zh) Substrate pressurization device and its control method
JP2009542012A5 (https=)
JP7251926B2 (ja) アラインされた基板ペアを扱うシステムと関連技術
KR101299758B1 (ko) 접합 장치 및 접합 방법
JP5892686B2 (ja) 圧着装置および温度制御方法
JP2007115978A (ja) 加圧装置及び半導体装置の製造方法
JP2007109999A (ja) 貼り合せ方法
JP2012004322A (ja) 基板貼り合せ装置、積層半導体装置製造方法及び積層半導体装置

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

N231 Notification of change of applicant
PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20170616

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000