KR101411894B1 - Method of Manufacturing Electric Device-Package Unit and Package Set Assembly - Google Patents

Method of Manufacturing Electric Device-Package Unit and Package Set Assembly Download PDF

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Publication number
KR101411894B1
KR101411894B1 KR1020120117692A KR20120117692A KR101411894B1 KR 101411894 B1 KR101411894 B1 KR 101411894B1 KR 1020120117692 A KR1020120117692 A KR 1020120117692A KR 20120117692 A KR20120117692 A KR 20120117692A KR 101411894 B1 KR101411894 B1 KR 101411894B1
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South Korea
Prior art keywords
package
package set
metal
electric device
cavities
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KR1020120117692A
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Korean (ko)
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KR20140051553A (en
Inventor
최두환
최재선
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주식회사 엠디티
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Priority to KR1020120117692A priority Critical patent/KR101411894B1/en
Publication of KR20140051553A publication Critical patent/KR20140051553A/en
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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

The present invention relates to a method of manufacturing an electric device-package unit, and more particularly, to a method of manufacturing an electric device-package unit with an electric device packaged by mounting an electric device in a ceramic package manufactured by sintering a green sheet .
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package set assembly, and more particularly, to a package set assembly that can be used to implement the electric device-package unit manufacturing method of the present invention as described above.
The method for manufacturing an electric device-package unit of the present invention has the effect of improving the productivity of the process of manufacturing the electric device-package unit by improving the process of manufacturing the electric device-package unit.
The method for manufacturing an electric device-package unit of the present invention has an effect of improving the overall quality by preventing the package from being damaged in the process of manufacturing the electric device-package unit by improving the process of manufacturing the electric device-package unit.
The package set assembly of the present invention has the effect of enabling the process of manufacturing the electric device-package unit to be performed with high quality and excellent productivity.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an electric device-package unit manufacturing method and a package set assembly used in the method.

The present invention relates to a method of manufacturing an electric device-package unit, and more particularly, to a method of manufacturing an electric device-package unit in which an electric device is packaged by mounting an electric device in a ceramic package manufactured by sintering a green sheet .

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package set assembly, and more particularly, to a package set assembly that can be used to implement the electric device-package unit manufacturing method of the present invention as described above.

Electrical devices such as semiconductor chips, capacitors, and inductors are often mounted after being sealed in a ceramic package and then used in many cases.

Ceramic packages formed by laminating green sheets are widely used for packaging electric devices due to reasons such as electrical stability, superior mechanical strength, and airtightness.

A general method for packaging electric devices using such a ceramic package is as follows.

First, a green sheet is laminated by forming a package array in which a plurality of cavities are arranged. Next, the package array in the green sheet state is sintered to manufacture a package in a ceramic state. At this time, the green sheet is cut into individual cavity units before sintering, or cut into individual cavity units after sintering is completed, thereby forming a ceramic package capable of mounting one electric element, respectively.

As described above, the electric element is mounted on the package formed by cutting the individual cavity unit, and the metal lead is adhered to the upper surface thereof to seal the cavity interior space.

Thus, in order to mount an electrical element on an individual package and to attach a metal lead thereon, a process of clamping the individual package and aligning the correct position is required. Recently, with the miniaturization of the electric device, not only the size of the electric device but also the size of the package becomes very small.

The package of the electric device used for the mobile communication part is usually within 5 mm.

The process of clamping and aligning a small package as described above and then mounting the electrical element and attaching the metal lead has a problem that it takes a very long time.

In addition, there is a problem that the package is broken due to the force applied to the package in the process of mounting the electrical element in the cavity with the small package clamped or pressing the metal lead into the package.

SUMMARY OF THE INVENTION The present invention has been conceived to solve the problems as described above, and it is an object of the present invention to efficiently perform a process of manufacturing an electric device-package unit by mounting an electric device in a small size package, And a method for manufacturing an electric device-package unit.

Another object of the present invention is to provide a package set assembly which can be used in the electric device-package unit manufacturing method as described above.

According to an aspect of the present invention, there is provided a method of manufacturing an electric device-package unit in which an electric device is mounted in a ceramic package, the method comprising: (a) Forming a package set in which a plurality of cavities to be arranged are arranged in rows and columns and electrode pads to be electrically connected to the electric elements are formed by laminating a ceramic green sheet; (b) sintering the package set formed in step (a); (c) mounting the electric device for each cavity of the package set sintered in the step (b); (d) attaching at least one metal lead to an upper surface of the package set in which the step (c) is completed so as to cover the plurality of cavities with one metal lead, thereby forming a package set assembly; And (e) cutting the package set assembly completed in step (d) into individual electric device-package units each having one electric device.

According to another aspect of the present invention, there is provided a package set assembly for mounting and sealing an electric element so as to be mounted on a substrate, the package set assembly comprising: a package set sintered such that a plurality of cavities in which electric elements are to be arranged are arranged in rows and columns; An electrode pad formed for each cavity of the package set so as to be electrically connected to an electric element to be disposed in the cavity; And at least one metal lead that is bonded to the package set and covers the cavities.

The method for manufacturing an electric device-package unit of the present invention has the effect of improving the productivity of the process of manufacturing the electric device-package unit by improving the process of manufacturing the electric device-package unit.

The method for manufacturing an electric device-package unit of the present invention has an effect of improving the overall quality by preventing the package from being damaged in the process of manufacturing the electric device-package unit by improving the process of manufacturing the electric device-package unit.

The package set assembly of the present invention has the effect of enabling the process of manufacturing the electric device-package unit to be performed with high quality and excellent productivity.

1 is a plan view of a package set of a package set assembly according to an embodiment of the present invention.
Fig. 2 is a plan view of the package set of the package set assembly shown in Fig. 1 with the metal leads adhered. Fig.
3 is a III-III line cross-sectional view of the package set assembly shown in Fig.
4 is a perspective view of an electrical device-package unit manufactured by cutting the package set assembly shown in Fig.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of a method of manufacturing an electric device-package unit according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a plan view of a package set of a package set assembly according to an embodiment of the present invention. Fig. 2 is a plan view of the package set of the package set assembly shown in Fig. 1 with the metal leads adhered. Fig. 3 is a III-III line cross-sectional view of the package set assembly shown in Fig.

First, a plurality of cavities 10 in which the electric elements 430 are to be arranged are arranged in rows and columns, and the package 10 in which the electrode pads 11 to be electrically connected to the electric elements 430 to be respectively arranged in the cavities 10 are formed The set 100 is formed by laminating a ceramic green sheet (step (a)).

1, a green sheet printed with a pattern to be electrically connected to the electrode pad 11 and the external electrodes 401 and 402 is stacked to form a package set 100 as shown in FIG. . In this embodiment, the cavities 10 in which the electric devices 430 are to be arranged are arranged in rows and columns at regular intervals. Particularly, in this embodiment, as shown in FIG. 1, 15 cavities 10 in total are arranged at regular intervals to constitute one cavity unit 110. The package set 100 is configured such that five cavity units 110, three vertical units, and fifteen total cavity units 110 are arranged.

2, when the cavity unit 110 is covered with a single metal lead 200, the package set 100 may be provided with a plurality of metal leads 200 on the upper surface of the package set 100 A lead groove 111 is formed. That is, a groove having a height lower than the circumference is formed at a position where the metal lead 200 is to be disposed, and the metal lead 200 is fitted in the lead groove 111, thereby fixing the position. In this embodiment, the lead grooves 111 are formed so that the cavities 10 included in one cavity unit 110 can be covered with one metal lead 200.

A step of sintering the package set 100 in a state in which the package set 100 is configured by the green sheet as described above is performed (step (b)).

In the sintered package set 100, the metal paste is printed in consideration of adhesion with the metal lead 200 (step (f)). A metal paste is printed on the upper surface 112 of the package set 100 to be brought into contact with the lower surface of the metal lead 200 and then the heat is applied and cooled so that the adhesive material is attached to the package set 100 made of ceramic material . Depending on the application, the metal paste may be a conductive paste.

Next, a step of mounting the electric element 430 for each cavity 10 of the package set 100 is performed (step (c)). The electric element 430 may be electrically connected to the electrode 11 inside the cavity 10 by wire bonding depending on the type of the electric element 430 and may be electrically connected to the electrode 11 ) Are electrically connected to each other. In the present embodiment, an EDLC (electric double layer capacitor) is mounted as the electric device 430. FIG.

After the electrical element 430 is mounted in the cavity 10, the cavities 10 are covered with the metal lead 200 and then attached to the package set 100 to form the package set assembly 300 (Step (d)). Since the lead grooves 111 are formed on the upper surface of the package set 100 as described above, the metal leads 200 can be easily disposed at predetermined positions. In this embodiment, one metal lead 200 simultaneously covers all the cavities 10 belonging to the cavity unit 110.

Various methods known for attaching the metal leads 200 to the package set 100 can be used. Unlike the step (f) described above, the metal lead 200 and the package set 100 are bonded by applying heat to the adhesive metal paste 112, the metal thin film alloy, or the alloy applicator printed in the laminating step of the green sheet It is possible. In some cases, after applying an adhesive such as epoxy to the upper surface of the package set 100, the metal lead 200 may be pressed and adhered to the package set 100. Or by a welding method using a laser or a welding electrode. By adhering the metal leads 200 to the package set 100 as described above, the inner space of each cavity 110 is sealed. The state in which the package set 100 and the metal lead 200 are bonded will be referred to as a package set assembly 300 hereinafter.

Next, the package set assembly 300 is cut and separated into individual electric device-package units 400 each having one electric device 430 (step (e)).

In this embodiment, the package set assembly 300 is cut using a wheel-shaped saw in a state where the package set assembly 300 is attached to the adhesive film 500. The electrical device-package unit 400 formed by cutting the package set assembly 300 has a structure as shown in FIG. The electrical device-package unit 400 with the metal leads 420 in a cut state attached to the package 410 in the transferred state is completed as shown in Fig.

When the package set 100 is cut along the cutting line 102 shown in the package set 100 with reference to FIGS. 1 and 3, it is separated into the individual electric element-package units 400. At this time, when the adhesive film 500 is used as described above, it is advantageous to maintain the state that the adhesive film 500 is attached to the adhesive film 500 in an aligned state even after separated into the respective electric device-package units 400.

1 and 2, in the process of forming the package set 100, the package set 100 is formed such that a mark 101 for guiding a line 102 for cutting the package set assembly 300 is displayed There is an advantage in that it is easy to align the cutting saw in the above-described cutting step to determine an accurate position.

The method for manufacturing an electric device-package unit of the present invention is characterized in that an electric element 430 is mounted on each cavity 10 and the metal lead 200 is attached before the package set 100 is cut. A method of covering two or more cavities 10 with one metal lead 200 can be used as described above since the metal leads 200 are attached before the package set 100 is cut in units of the electric elements 430 have. There is an advantage in that the operation is much easier and more efficient than the conventional process of mounting the electric element in the ceramic package formed by cutting each electric element unit and attaching the metal lead individually. It is very cumbersome and less productive to clamp and align small electrical component unit ceramic packages individually to mount the electrical elements internally and then attach small sized metal leads to each individual ceramic package again. In the case of the present invention, the electric device 430 is mounted for each cavity 10 in a state where the package set 100 formed of one body is fixed and aligned. Further, since the metal leads 200, which can cover the plurality of cavities 10 at the same time, are used instead of the metal leads made of the respective cavity units, the efficiency of the process of attaching the metal leads 200 can be dramatically improved . The metal lead attaching operation which is conventionally performed 15 times repeatedly is advantageous in that it can be processed at one time only by attaching one metal lead 200 in the method of manufacturing the electric element and the package unit of this embodiment.

Since the step of mounting the electric element 430 and the step of attaching the metal lead 200 are performed in a state that the package set 100 is not cut and the plurality of cavity units 110 are combined and configured, There is an advantage that there is little risk that the package set 100 is damaged in the course of performing the operation.

When the package set assembly 300 is attached to the adhesive film 500 as described above and separated into individual electric device-package units 400 using a saw-shaped wheel, 430) - The cage holding units remain attached to the adhesive film (500) even after being cut.

The electric element-package unit 400 having a small size, typically about 3 to 5 mm, remains aligned and attached to the adhesive film 500 without being disturbed or lost. Thus, it is very easy to perform the process of picking up the completed electric device-package unit 400 in the next process and attaching it to the substrate.

While the preferred embodiments of the package set assembly according to the present invention have been described above, the scope of the present invention is not limited to the above-described and illustrated forms.

For example, although the package set 100 includes a plurality of cavity units 110 in the foregoing description, the cavity units 110 may be divided into a plurality of cavities 10 arranged in rows and columns at regular intervals It is also possible to configure the package set 100 having the structure of the first embodiment. In this case, all of the cavities 10 may be covered with one metal lead 200, or the metal leads 200 may be divided into two or three regions.

Although the mark 101 for guiding the cutting line is displayed on the package set 100 in the foregoing description, the guide mark 101 may not be displayed in some cases.

Although it has been described above that the package set assembly 300 is cut in the state that the package set assembly 300 is attached to the adhesive film 500, the package set assembly 300 may be cut in a state where it is not attached to the adhesive film 500 It is also possible.

In the above description, the lead grooves 111 are formed in the package set 100. However, the method of manufacturing the electric device-package unit of the present invention is performed by using the package set 100 without the lead grooves 111 It is also possible. When the lead grooves 111 are not formed in the package set 100, the positions where the metal leads 200 are to be attached are determined by using a camera, and then the metal leads 200 are attached to the corresponding positions to be bonded.

Hereinafter, the package set assembly used for carrying out the electric device-package unit manufacturing method as described above will be described in detail.

The present exemplary package set assembly includes the package set 100, the electrode pads 11, and at least one metal lead 200 as described above.

The package set 100 is formed by laminating and sintering a green sheet as described above. In the package set 100, a plurality of cavities 10 in which the electric elements 430 are to be arranged are arranged in rows and columns. In this embodiment, the fifteen cavities 10 constitute one cavity unit 110, and the fifteen cavity units 110 are arranged in a row and a row so as to maintain the same spacing.

In each of the cavities 10, an electrode pad 11 is formed so as to be electrically connected to the electric element 430. The electrode pad 11 is electrically connected to external electrodes 401 and 402 formed outside the package set 100.

The package set assembly of the present embodiment has a metal lead 200 that can cover each cavity unit 110 of the package set 100. [ The metal leads 200 are adhered to the package set 100 so that all the cavities 10 belonging to the cavity unit 110 are formed in a size and shape that can be simultaneously covered.

As described above, on the upper surface of the package set 100, lead grooves 111 of a size and shape matching the outer shape of the metal leads 200 are formed. The metal lead 200 is easily positioned at a predetermined position of the package set 100 in such a manner as to be fitted in the lead groove 111. [

In the case of the package set 100 of the present embodiment, a metal paste is printed on the portion 112 to be bonded to the metal lead 200 in the process of forming the package set 100 by facing the green sheet. In the step of attaching the metal leads 200 to the package set 100 after the electrical elements 430 are mounted on the respective cavities 10 by using the package set 100 of the present embodiment, The metal leads 200 and the package set 100 are bonded to each other.

In the course of forming the package set 100 by laminating the green sheets, the package set 100 to which the metal leads 200 are attached is cut so that the individual electrical-device-package units 400 can be easily cut A mark 101 for guiding the line 102 is displayed.

The package set assembly constructed as described above is manufactured and sold in the form of a package set 100 and a metal lead 200 that are not bonded to each other in the package manufacturer. A company that manufactures the electrical elements 430 or packages the electrical elements 430 uses the package set assembly configured as described above to load the electrical elements 430 in the respective cavities 10, Unit 110, and then cut into individual electric-device-package units 400 and sold or provided to the next process.

Although the preferred embodiments of the present invention have been described above, the scope of the present invention is not limited to the above-described embodiments.

For example, a metal layer is formed on the upper surface 112 of the package set 100 to be brought into contact with the metal lead 200 by applying a metal paste. However, . It is also possible to form a metal layer for attaching the metal leads 200 after sintering the ceramic package without forming a metal layer for attaching the metal leads 200 in the green sheet sintering process. In this case, the cream solder may be applied to prepare the metal lead 200 for attachment.

The metal lead 200 may be adhered to the package set 100 using an adhesive such as epoxy or may be formed by laser welding using a metal thin film or an alloying agent, or may be attached to the package set 100 in a seam welding manner. .

It is also possible to use a package set in which the lead grooves 111 are not formed.

100: Package set 10: Cavity
11: electrode pad 110: cavity unit
111: Lead groove 101: Mark
200: metal lead 500: adhesive film
300: Package Set Assembly 430: Electrical Element
400: electric element-packaged unit
410: cut package 420: cut metal leads
401, 402: external electrode

Claims (13)

A method of manufacturing an electric element-package unit in which an electric element is mounted in a ceramic package, the method comprising:
(a) stacking a ceramic green sheet by stacking a package set in which a plurality of cavities on which the electric elements are to be arranged are arranged in rows and columns and electrode pads to be electrically connected to the electric elements are formed;
(b) sintering the package set formed in step (a);
(c) mounting the electric device for each cavity of the package set sintered in the step (b);
(d) attaching at least one metal lead to an upper surface of the package set in which the step (c) is completed so as to cover the plurality of cavities with one metal lead, thereby forming a package set assembly; And
(e) cutting the package set assembly having completed step (d) into individual electric device-package units each having one electric device,
The step (a) may include forming a package set including a plurality of cavity units each having a plurality of cavities arranged at equal intervals,
Wherein the step (d) includes the step of attaching one metal lead to each of the cavity units so as to cover all the cavities belonging to the cavity unit. delete The method according to claim 1,
In the step (a), a metal paste is printed on the upper surface of the green sheet to be brought into contact with the metal lead to laminate the green sheet,
Wherein the step (d) is performed by heating the metal lead to be welded to the package set by the metal paste. The method according to claim 1,
(f) printing the metal paste on the upper surface of the package set in which the step (c) is completed,
Wherein the step (d) is performed by applying heat to the metal lead to be adhered to the package set by the metal paste applied in the step (f). The method according to claim 1,
Wherein the step (d) comprises adhering the metal lead to the package set by laser welding or seam welding using a metal thin film or an alloying agent, A method of manufacturing a package unit. The method according to claim 1,
Wherein the package set is formed on a top surface of the package set such that a lead groove capable of fitting the metal leads is formed on the package set. The method according to claim 1,
Wherein the step (e) comprises cutting the package set assembly using a wheel-shaped saw while the package set assembly is attached to the adhesive film. The method according to claim 1,
Wherein the package set is formed such that a mark for guiding a line cutting the package set assembly is displayed in the step (e). 1. A package set assembly for mounting and sealing an electrical element on a substrate for use,
A set of packages sintered such that a plurality of cavities in which electrical elements are to be arranged are arranged in rows and columns;
An electrode pad formed for each cavity of the package set so as to be electrically connected to an electric element to be disposed in the cavity; And
And at least one metal lead attached to the package set and configured to cover the cavities. 10. The method of claim 9,
And a metal paste to be adhered to the metal leads is printed on a portion of the upper surface of the package set that is in contact with the metal leads. 11. The method according to claim 9 or 10,
Wherein the package set is formed to include a plurality of cavity units each having a plurality of cavities arranged at equal intervals,
Wherein the metal leads are formed to cover all the cavities included in the cavity unit, one for each of the cavity units. 12. The method of claim 11,
Wherein the package set is formed with a lead groove through which the metal lead can be inserted. 12. The method of claim 11,
The package set includes an electrical element mounted on each of the cavities, and after the lead is bonded to the package set, the package set and the lead are cut to separate into individual electric element-package units each having one electric element Wherein a mark for guiding the cutting line is displayed so that the cutting line is guided.
KR1020120117692A 2012-10-23 2012-10-23 Method of Manufacturing Electric Device-Package Unit and Package Set Assembly KR101411894B1 (en)

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KR101411894B1 true KR101411894B1 (en) 2014-06-25

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004119735A (en) * 2002-09-26 2004-04-15 Kyocera Corp Connected substrate, its manufacturing method and ceramic package
JP2005531137A (en) 2002-04-29 2005-10-13 アドヴァンスト インターコネクト テクノロジーズ リミテッド Partially patterned leadframe and method for its manufacture and use in semiconductor packaging
KR100571355B1 (en) 2003-12-22 2006-04-14 주식회사 티씨오 Leadframes for Light Emitting Diodes
KR20080026221A (en) * 2005-07-25 2008-03-24 엔엑스피 비 브이 Flip-chip package with air cavity

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005531137A (en) 2002-04-29 2005-10-13 アドヴァンスト インターコネクト テクノロジーズ リミテッド Partially patterned leadframe and method for its manufacture and use in semiconductor packaging
JP2004119735A (en) * 2002-09-26 2004-04-15 Kyocera Corp Connected substrate, its manufacturing method and ceramic package
KR100571355B1 (en) 2003-12-22 2006-04-14 주식회사 티씨오 Leadframes for Light Emitting Diodes
KR20080026221A (en) * 2005-07-25 2008-03-24 엔엑스피 비 브이 Flip-chip package with air cavity

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