KR101407252B1 - 후막 반도체성 잉크 - Google Patents

후막 반도체성 잉크 Download PDF

Info

Publication number
KR101407252B1
KR101407252B1 KR1020087018039A KR20087018039A KR101407252B1 KR 101407252 B1 KR101407252 B1 KR 101407252B1 KR 1020087018039 A KR1020087018039 A KR 1020087018039A KR 20087018039 A KR20087018039 A KR 20087018039A KR 101407252 B1 KR101407252 B1 KR 101407252B1
Authority
KR
South Korea
Prior art keywords
oil
binder
ink
semiconducting
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020087018039A
Other languages
English (en)
Korean (ko)
Other versions
KR20080100170A (ko
Inventor
데이비드 토마스 브리톤
에쿤다레 아요데일 오두
마르기트 하르팅
Original Assignee
피에스티 센서스 (피티와이) 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 피에스티 센서스 (피티와이) 리미티드 filed Critical 피에스티 센서스 (피티와이) 리미티드
Publication of KR20080100170A publication Critical patent/KR20080100170A/ko
Application granted granted Critical
Publication of KR101407252B1 publication Critical patent/KR101407252B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/08—Printing inks based on natural resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D191/00—Coating compositions based on oils, fats or waxes; Coating compositions based on derivatives thereof
    • C09D191/005—Drying oils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D191/00—Coating compositions based on oils, fats or waxes; Coating compositions based on derivatives thereof
    • C09D191/02—Vulcanised oils, e.g. factice
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/60—Electrodes characterised by their materials
    • H10D64/64—Electrodes comprising a Schottky barrier to a semiconductor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Thin Film Transistor (AREA)
  • Conductive Materials (AREA)
KR1020087018039A 2005-12-22 2006-12-18 후막 반도체성 잉크 Expired - Fee Related KR101407252B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ZA2005/10436 2005-12-22
ZA200510436 2005-12-22
PCT/IB2006/003666 WO2007072162A1 (en) 2005-12-22 2006-12-18 Thick film semiconducting inks

Publications (2)

Publication Number Publication Date
KR20080100170A KR20080100170A (ko) 2008-11-14
KR101407252B1 true KR101407252B1 (ko) 2014-06-16

Family

ID=37907452

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087018039A Expired - Fee Related KR101407252B1 (ko) 2005-12-22 2006-12-18 후막 반도체성 잉크

Country Status (8)

Country Link
US (1) US9206324B2 (enExample)
EP (1) EP1971651B1 (enExample)
JP (1) JP5106414B2 (enExample)
KR (1) KR101407252B1 (enExample)
CN (1) CN101346441B (enExample)
ES (1) ES2609413T3 (enExample)
WO (1) WO2007072162A1 (enExample)
ZA (1) ZA200804813B (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6599631B2 (en) 2001-01-26 2003-07-29 Nanogram Corporation Polymer-inorganic particle composites
US8568684B2 (en) 2000-10-17 2013-10-29 Nanogram Corporation Methods for synthesizing submicron doped silicon particles
US7226966B2 (en) 2001-08-03 2007-06-05 Nanogram Corporation Structures incorporating polymer-inorganic particle blends
US20090075083A1 (en) 1997-07-21 2009-03-19 Nanogram Corporation Nanoparticle production and corresponding structures
US7892872B2 (en) 2007-01-03 2011-02-22 Nanogram Corporation Silicon/germanium oxide particle inks, inkjet printing and processes for doping semiconductor substrates
JP5560640B2 (ja) * 2008-09-30 2014-07-30 大日本印刷株式会社 半導体基板の製造方法及びその方法により得られた半導体基板
US8895962B2 (en) 2010-06-29 2014-11-25 Nanogram Corporation Silicon/germanium nanoparticle inks, laser pyrolysis reactors for the synthesis of nanoparticles and associated methods
WO2012035494A1 (en) 2010-09-13 2012-03-22 University Of Cape Town Printed temperature sensor
JP2013539908A (ja) 2010-09-13 2013-10-28 ピーエスティ・センサーズ・（プロプライエタリー）・リミテッド ディスクリート電子部品の組立およびパッケージング方法
WO2012069480A1 (en) * 2010-11-23 2012-05-31 Acreo Ab Diode, use thereof, and a method for producing the same
US20140179049A1 (en) * 2012-12-20 2014-06-26 Nanogram Corporation Silicon/germanium-based nanoparticle pastes with ultra low metal contamination
US9475695B2 (en) 2013-05-24 2016-10-25 Nanogram Corporation Printable inks with silicon/germanium based nanoparticles with high viscosity alcohol solvents
US20150108632A1 (en) * 2013-10-23 2015-04-23 Nano And Advanced Materials Institute Limited Thin film with negative temperature coefficient behavior and method of making thereof
JP6651165B2 (ja) * 2014-09-17 2020-02-19 旭化成株式会社 薄膜トランジスタ及びその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3947278A (en) * 1973-12-19 1976-03-30 Universal Oil Products Company Duplex resistor inks

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2014760A (en) * 1934-10-18 1935-09-17 Dewsbury Wilfred Graham Paint, lithographic varnish, printing ink, and the like and process of making same
US3015632A (en) * 1956-12-31 1962-01-02 Tribune Company Electrically conductive printing ink and method of producing same
US3105632A (en) * 1960-03-14 1963-10-01 Dresser Ind High pressure centrifugal compressor
US3992212A (en) * 1972-08-18 1976-11-16 Universal Oil Products Company Electrical resistor inks
US3989644A (en) * 1974-09-27 1976-11-02 General Electric Company Radiation curable inks
DE2934528A1 (de) * 1979-08-27 1981-04-02 Henkel KGaA, 4000 Düsseldorf Hilfsmittel fuer pigmentpasten
JPS62262025A (ja) 1986-05-07 1987-11-14 Canon Inc 液晶用セル
JPH064799B2 (ja) * 1987-03-31 1994-01-19 谷口インキ製造株式会社 印刷インキ
JPH0713212B2 (ja) * 1987-10-16 1995-02-15 東レ株式会社 導電性インキ組成物
JPH01153776A (ja) * 1987-12-10 1989-06-15 Fuji Kagakushi Kogyo Co Ltd 印字用液状インク
JPH08194790A (ja) 1995-01-18 1996-07-30 Apo Syst Kk ２次元コードカードシステム
JP2963657B2 (ja) * 1996-07-05 1999-10-18 株式会社信州セラミックス 被着処理剤
EP1104791A1 (en) * 1999-11-25 2001-06-06 Sicpa Holding S.A. Printing ink, use of micro-wires as antennas in security documents, method for producing a security document and methods for authentication of security documents
JP4722269B2 (ja) * 2000-08-29 2011-07-13 Ａｚエレクトロニックマテリアルズ株式会社 低誘電率多孔質シリカ質膜、半導体装置およびコーティング組成物、ならびに低誘電率多孔質シリカ質膜の製造方法
JP2003036520A (ja) 2001-07-25 2003-02-07 Fuji Photo Film Co Ltd 磁気記録媒体
AU2003246713A1 (en) * 2002-06-28 2004-01-19 Merck Patent Gmbh Hardening and drying of lacquer systems and printing colors
JP2004244525A (ja) * 2003-02-14 2004-09-02 Kyocera Chemical Corp 導電性塗料
US7306823B2 (en) * 2004-09-18 2007-12-11 Nanosolar, Inc. Coated nanoparticles and quantum dots for solution-based fabrication of photovoltaic cells

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3947278A (en) * 1973-12-19 1976-03-30 Universal Oil Products Company Duplex resistor inks

Also Published As

Publication number Publication date
JP2009520866A (ja) 2009-05-28
ZA200804813B (en) 2016-07-27
CN101346441B (zh) 2012-04-18
ES2609413T3 (es) 2017-04-20
US20090004832A1 (en) 2009-01-01
JP5106414B2 (ja) 2012-12-26
KR20080100170A (ko) 2008-11-14
US9206324B2 (en) 2015-12-08
WO2007072162A1 (en) 2007-06-28
EP1971651A1 (en) 2008-09-24
CN101346441A (zh) 2009-01-14
EP1971651B1 (en) 2016-10-05

Similar Documents

Publication Publication Date Title
KR101407252B1 (ko) 후막 반도체성 잉크
Li et al. Inkjet printing of 2D layered materials
US8506849B2 (en) Additives and modifiers for solvent- and water-based metallic conductive inks
KR101133466B1 (ko) 태양전지용 저온 건조형 전극 페이스트 조성물 및 이를 이용한 인쇄방법
EP3243224B1 (de) Elektronisches bauelement
US20110198113A1 (en) Electroconductive inks made with metallic nanoparticles
EP1338038B1 (de) Elektronisches bauelement mit halbleitenden schichten, elektronische schaltung, sowie verfahren zur herstellung
US10144066B2 (en) Silver nanoparticles, method for producing silver nanoparticles, and silver nanoparticle ink
WO2018228407A1 (zh) 一种石墨烯/金属纳米带复合导电油墨及其制备方法和应用
JP2011526054A (ja) 導電性インクおよびペースト
JP5819712B2 (ja) 加熱硬化型導電性ペースト組成物
DE10229118A1 (de) Verfahren zur kostengünstigen Strukturierung von leitfähigen Polymeren mittels Definition von hydrophilen und hydrophoben Bereichen
Orrill et al. Ink synthesis and inkjet printing of electrostatically stabilized multilayer graphene nanoshells
DE102016225051A1 (de) Zwischenschichtzusammensetzung für elektronisches drucken
JP2009520866A5 (enExample)
Taroata et al. High integration density capacitors directly integrated in a single copper layer of printed circuit boards
TWI690946B (zh) 導電性糊劑
CN106398398B (zh) 一种金属纳米导电墨水及其制备方法
JP5200515B2 (ja) ニッケルインキの製造方法、ニッケルインキパターンの形成方法、及び積層セラミックコンデンサの製造方法
TW201736528A (zh) 導電膏
KR102373020B1 (ko) 기판 표면상에 3차원 구조 또는 구조 요소를 제조하기 위한 페이스트상 조성물 및 방법
Rocks et al. Direct writing of lead zirconate titanate piezoelectric structures by electrohydrodynamic atomisation
KR101637884B1 (ko) 금속 나노선을 포함하는 전도성 잉크 조성물 및 이를 이용한 전도성 패턴 또는 막의 제조방법
CN115985550A (zh) 一种具有抗氧化性的铜浆及其制备方法
WO2011131535A1 (de) Verfahren und vorrichtung zur herstellung elektronischer und/oder energieerzeugender und/oder energieumwandelnder elemente und komponenten

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

N231 Notification of change of applicant
PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20180529

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20200610

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20200610

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000