KR101396845B1 - 스트립 형태 부품의 전해 디플래시 장치 - Google Patents
스트립 형태 부품의 전해 디플래시 장치 Download PDFInfo
- Publication number
- KR101396845B1 KR101396845B1 KR1020120081563A KR20120081563A KR101396845B1 KR 101396845 B1 KR101396845 B1 KR 101396845B1 KR 1020120081563 A KR1020120081563 A KR 1020120081563A KR 20120081563 A KR20120081563 A KR 20120081563A KR 101396845 B1 KR101396845 B1 KR 101396845B1
- Authority
- KR
- South Korea
- Prior art keywords
- strip
- brush
- electrode
- shaped part
- electrolytic
- Prior art date
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020120081563A KR101396845B1 (ko) | 2012-07-26 | 2012-07-26 | 스트립 형태 부품의 전해 디플래시 장치 |
CN201210361262.1A CN103572361B (zh) | 2012-07-26 | 2012-09-25 | 带状部件的电解去毛刺方法和装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020120081563A KR101396845B1 (ko) | 2012-07-26 | 2012-07-26 | 스트립 형태 부품의 전해 디플래시 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20140015860A KR20140015860A (ko) | 2014-02-07 |
KR101396845B1 true KR101396845B1 (ko) | 2014-05-20 |
Family
ID=50045046
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020120081563A KR101396845B1 (ko) | 2012-07-26 | 2012-07-26 | 스트립 형태 부품의 전해 디플래시 장치 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR101396845B1 (zh) |
CN (1) | CN103572361B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105018966B (zh) * | 2014-04-21 | 2018-09-25 | 上海奇谋能源技术开发有限公司 | 一种从废旧线路板上直接电解铜的方法及装置 |
DE102015201080A1 (de) * | 2015-01-22 | 2016-07-28 | Siemens Aktiengesellschaft | Verfahren und Vorrichtung zum elektrochemischen Abtragen von Material von einem Werkstück |
CN104942880A (zh) * | 2015-07-02 | 2015-09-30 | 张宝宝 | 一种纸质载带用去毛刺系统及去毛刺方法 |
CN110725001B (zh) * | 2019-10-30 | 2023-11-17 | 昆山金易得环保科技有限公司 | 用于退锡设备的导电刷及包含其的退锡设备 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1187593A (ja) * | 1997-09-02 | 1999-03-30 | Oki Electric Ind Co Ltd | 半導体装置端子部の表面処理方法 |
KR100203931B1 (ko) * | 1996-10-04 | 1999-07-01 | 윤종용 | 화학적 디플래쉬 장치 및 그를 이용한 디플래쉬-플레이팅 방법 |
KR101063260B1 (ko) | 2008-07-02 | 2011-09-07 | 엔알티 주식회사 | 디버링 장치 및 이를 이용한 디버링 방법 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101862871B (zh) * | 2010-06-24 | 2012-01-04 | 东莞东运镁业有限公司 | 一种电化学去毛刺设备及其去毛刺工艺 |
-
2012
- 2012-07-26 KR KR1020120081563A patent/KR101396845B1/ko active IP Right Grant
- 2012-09-25 CN CN201210361262.1A patent/CN103572361B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100203931B1 (ko) * | 1996-10-04 | 1999-07-01 | 윤종용 | 화학적 디플래쉬 장치 및 그를 이용한 디플래쉬-플레이팅 방법 |
JPH1187593A (ja) * | 1997-09-02 | 1999-03-30 | Oki Electric Ind Co Ltd | 半導体装置端子部の表面処理方法 |
KR101063260B1 (ko) | 2008-07-02 | 2011-09-07 | 엔알티 주식회사 | 디버링 장치 및 이를 이용한 디버링 방법 |
Also Published As
Publication number | Publication date |
---|---|
KR20140015860A (ko) | 2014-02-07 |
CN103572361B (zh) | 2016-03-16 |
CN103572361A (zh) | 2014-02-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101396845B1 (ko) | 스트립 형태 부품의 전해 디플래시 장치 | |
US6887113B1 (en) | Contact element for use in electroplating | |
US20060082021A1 (en) | Leadframe and method for reducing mold compound adhesion problems | |
JP7007756B2 (ja) | 表面処理装置 | |
CN114250501A (zh) | 一种可连续进行电镀和化镀的设备和方法 | |
CA2341218A1 (en) | Contact element | |
JP6737527B2 (ja) | 表面処理装置 | |
JPH1112779A (ja) | 電解槽の電気的接触部の構造 | |
KR101303623B1 (ko) | 스트립 형태 부품의 디플래시 장치 | |
JP6166492B1 (ja) | 電気メッキ装置と電気メッキ方法 | |
KR100708212B1 (ko) | 대기압 플라즈마 샤워유닛 이를 이용한 와이어본딩 장치 및방법 | |
KR200425044Y1 (ko) | 연속 도금장치의 인쇄회로기판용 통전지그 | |
KR100978803B1 (ko) | 스트립형태 부품의 이송용 벨트 | |
JP6740428B1 (ja) | 電解剥離装置 | |
CN110622304B (zh) | 引线框架、引线框架的制造方法和半导体装置的制造方法 | |
KR100572896B1 (ko) | 바렐을 이용한 반도체 패키지 소자의 전해 디플래쉬 장치및 그 방법 | |
CN116971019A (zh) | 电镀阴极接点自动化退镀装置和连续电镀作业方法 | |
KR20070093479A (ko) | 플렉시블 플랫케이블 도금용 전극 | |
JPH05121620A (ja) | めつき装置 | |
JPH07254674A (ja) | リードフレームのめっき装置およびそれに用いる電極の剥離装置 | |
JP2011500960A (ja) | 電力を供給するための方法及び装置 | |
KR19990056349A (ko) | 반도체 제조용 도금장치의 커넥터 | |
KR101400244B1 (ko) | 지그 장치를 이용한 부분 금 도금 방법 | |
JP2011052259A (ja) | 置換めっき層の剥離方法 | |
JPH07335810A (ja) | 電子部品用リードフレームの電解式表面処理装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20170511 Year of fee payment: 4 |
|
FPAY | Annual fee payment |
Payment date: 20190328 Year of fee payment: 6 |