KR101393748B1 - Light conversion member and method of fabricating light conversion member - Google Patents

Abstract

A method of manufacturing a light conversion member according to an embodiment of the present invention includes: preparing a lower substrate and an upper substrate including an injection portion; Joining the lower substrate and the upper substrate; Injecting a wavelength conversion material through the injection unit; Injecting a sealing material into the injection unit; And removing the injection section.
The light conversion member according to an embodiment includes: a lower substrate; A wavelength conversion layer formed on the lower substrate; An upper substrate formed on the wavelength conversion layer; And a sealing member for bonding the lower substrate and the upper substrate and sealing at least one surface of the wavelength conversion layer, wherein the sealing member includes a resin and a bead.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a light conversion member and a method for manufacturing the same,

Embodiments relate to a photo-conversion member and a method of manufacturing a photo-conversion member.

Among display devices, there is a device that requires a backlight unit capable of generating light in order to display an image. The backlight unit is a device for supplying light to a display panel including a liquid crystal or the like and includes a light emitting device and means for effectively transmitting the light output from the light emitting device to the liquid crystal side.

As a light source of such a display device, an LED (Light Emitted Diode) or the like can be applied. Further, in order that the light output from the light source is effectively transmitted to the display panel side, a light guide plate and an optical sheet may be laminated and used.

At this time, an optical member that changes the wavelength of light generated from the light source and causes white light to enter the light guide plate or the display panel can be applied to such a display device. Particularly, in order to change the wavelength of light, a quantum dot or the like can be used.

The quantum dot has a particle size of 10 nm or less and has unique electrical and optical characteristics depending on its size. For example, when the approximate size is 55 to 65 Å, it can emit red, 40 to 50 Å to green, and 20 to 35 Å to blue. Yellow has medium size of red and green quantum dots. As the spectrum of light changes from red to blue, the size of the quantum dots varies from 65 Å to 20 Å, which may be slightly different.

In order to form the optical member including the quantum dots, the quantum dots emitting RGB or RYGB, which are three primary colors of light, can be formed by spin coating or printing on a transparent substrate such as glass. Here, when a quantum dot emitting yellow (Y) is further included, white light closer to natural light can be obtained. The matrix (medium) in which the quantum dots are dispersed can apply an inorganic substance or a polymer having excellent transmittance with respect to light in the visible light region and the ultraviolet region (including Far UV) or in the visible light region. For example, it may be inorganic silica, polymethylmethacrylate (PMMA), polydimethylsiloxane (PDMS), poly lactic acid (PLA), silicon polymer or YAG.

A display device to which such a quantum dot is applied is disclosed in Korean Patent Laid-Open Publication No. 10-2011-0012246.

The embodiments are directed to a photo-conversion member and a method of manufacturing a photo-conversion member having improved performance.

A method of manufacturing a light conversion member according to an embodiment of the present invention includes: preparing a lower substrate and an upper substrate including an injection portion; Joining the lower substrate and the upper substrate; Injecting a wavelength conversion material through the injection unit; Injecting a sealing material into the injection unit; And removing the injection section.

The light conversion member according to an embodiment includes: a lower substrate; A wavelength conversion layer formed on the lower substrate; An upper substrate formed on the wavelength conversion layer; And a sealing member for bonding the lower substrate and the upper substrate and sealing at least one surface of the wavelength conversion layer, wherein the sealing member includes a resin and a bead.

A method of manufacturing a light conversion member according to an embodiment of the present invention is manufactured by first laminating a lower substrate and an upper substrate, and then injecting a wavelength conversion material between the lower substrate and the upper substrate.

That is, after joining the lower substrate and the upper substrate through the adhesive material including the resin and / or the beads, a wavelength conversion material is formed between the lower substrate and the upper substrate through an injection part formed on at least one side of the substrates Inject. Thereafter, a sealing material containing resin and / or beads is injected into the injection unit, and then the injection unit is removed to seal the outer surface of the wavelength conversion material injected between the lower substrate and the upper substrate with a sealing material have.

Thus, the method for manufacturing a light conversion member according to the embodiment can effectively protect the wavelength conversion layer from impurities such as moisture and oxygen outside. That is, since the wavelength conversion material is sealed by laminating the lower substrate and the upper substrate using the adhesive material serving as a sealant, and then injecting the sealing material to remove the injection portion, Can be formed smoothly without a surface.

Therefore, the method for manufacturing a light conversion member according to the embodiment can manufacture a light conversion member with improved reliability and durability.

The light conversion member according to the embodiment can seal the wavelength conversion layer formed between the lower substrate and the upper substrate while the lower substrate and the upper substrate are laminated together by the sealing member. Thus, the wavelength conversion layer can be protected from external moisture and oxygen, thereby providing a light conversion member with improved reliability and durability.

1 is an exploded perspective view showing a liquid crystal display device according to an embodiment.
2 is a perspective view showing an optical member according to an embodiment.
FIG. 3 is a cross-sectional view showing a section cut along AA 'in FIG. 2. FIG.
4 is a process flow chart for explaining the method of manufacturing the light conversion member according to the embodiment.
5 to 10 are cross-sectional views illustrating a method of manufacturing a light conversion member and a light conversion member according to an embodiment.

In the description of the embodiments, it is described that each substrate, frame, sheet, layer or pattern is formed "on" or "under" each substrate, frame, sheet, In this case, "on" and "under " all include being formed either directly or indirectly through another element. In addition, the upper or lower reference of each component is described with reference to the drawings. The size of each component in the drawings may be exaggerated for the sake of explanation and does not mean the size actually applied.

FIG. 1 is an exploded perspective view showing a liquid crystal display device according to an embodiment, FIG. 2 is a perspective view showing an optical member according to an embodiment, FIG. 3 is a cross-sectional view taken along line AA ' FIGS. 5 to 10 are cross-sectional views illustrating a method of manufacturing a light conversion member and a light conversion member according to an exemplary embodiment of the present invention. Referring to FIG.

Hereinafter, before describing the method of manufacturing the light conversion member according to the embodiment, the light conversion member and the liquid crystal display device applied to the method of manufacturing the light conversion member will be described with reference to Figs. 1 to 3. Fig.

1 to 3, a liquid crystal display device according to an embodiment includes a backlight unit 10 and a liquid crystal panel 20.

The backlight unit 10 emits light to the liquid crystal panel 20. The backlight unit 10 is a surface light source and can uniformly irradiate the bottom surface of the liquid crystal panel 20 with light.

The backlight unit 10 is disposed under the liquid crystal panel 20. The backlight unit 10 includes a bottom cover 100, a light guide plate 200, a reflective sheet 300, a light source such as a plurality of light emitting diodes 400, a printed circuit board 401, (500).

The bottom cover 100 has a top opened shape. The bottom cover 100 accommodates the light guide plate 200, the light emitting diodes 400, the printed circuit board 401, the reflective sheet 300, and the optical sheets 500.

The light guide plate 200 is disposed in the bottom cover 100. The light guide plate 200 is disposed on the reflective sheet 300. The light guide plate 200 emits light upward from the light emitting diodes 400 through total reflection, refraction and scattering.

The reflective sheet 300 is disposed under the light guide plate 200. More specifically, the reflective sheet 300 is disposed between the light guide plate 200 and the bottom surface of the bottom cover 100. The reflective sheet 300 reflects light emitted from the lower surface of the light guide plate 200 upward.

The light emitting diodes 400 are light sources for generating light. The light emitting diodes 400 are disposed on one side of the light guide plate 200. The light emitting diodes 400 generate light and enter the light guide plate 200 through the side surface of the light guide plate 200.

The light emitting diodes 400 may be a blue light emitting diode for generating blue light or a UV light emitting diode for generating ultraviolet light. That is, the light emitting diodes 400 may emit blue light having a wavelength range of about 430 nm to about 470 nm or ultraviolet light having a wavelength band of about 300 nm to about 400 nm.

The light emitting diodes 400 are mounted on the printed circuit board 401. The light emitting diodes 400 are disposed under the printed circuit board 401. The light emitting diodes 400 are driven by receiving a drive signal through the printed circuit board 401.

The printed circuit board 401 is electrically connected to the light emitting diodes 400. The printed circuit board 401 may mount the light emitting diodes 400. The printed circuit board (401) is disposed inside the bottom cover (100).

The optical sheets 500 are disposed on the light guide plate 200. The optical sheets 500 change or enhance the characteristics of light emitted from the upper surface of the light guide plate 200 and supply the light to the liquid crystal panel 20. [

The optical sheets 500 may be a light conversion member 501, a diffusion sheet 502, a first prism sheet 503, and a second prism sheet 504. [

The light-converting member 501 may be disposed on the light path between the light source and the liquid crystal panel 20. For example, the light conversion member 501 may be disposed on the light guide plate 200. More specifically, the light conversion member 501 may be interposed between the light guide plate 200 and the diffusion sheet 520. The light conversion member 501 can convert the wavelength of the incident light and emit the light upward.

For example, when the light emitting diodes 400 are a blue light emitting diode, the light converting member 501 may convert blue light emitted upward from the light guide plate 200 into green light and red light. That is, the photo-conversion member 501 converts part of the blue light into green light having a wavelength range of about 520 nm to about 560 nm, and converts the other part of the blue light to a light having a wavelength range of about 630 nm to about 660 nm It can be converted into red light.

When the light emitting diodes 400 are UV light emitting diodes, the light converting member 501 may convert ultraviolet light emitted from the upper surface of the light guide plate 200 into blue light, green light, and red light. That is, the photo-conversion member 501 converts a part of the ultraviolet ray into blue light having a wavelength band of about 430 nm to about 470 nm, and another part of the ultraviolet ray has a wavelength band of about 520 nm to about 560 nm Green light, and another part of the ultraviolet light into red light having a wavelength band between about 630 nm and about 660 nm.

Accordingly, light passing through the light conversion member 501 without conversion and light converted by the light conversion member 501 can form white light. That is, the blue light, the green light, and the red light may be combined, and the white light may be incident on the liquid crystal panel 20.

That is, the photo-conversion member 501 is an optical member that converts the characteristics of the incident light. The photo-conversion member 501 has a sheet shape. That is, the photo-conversion member 501 may be an optical sheet.

2 and 3, the light conversion member 501 includes a lower substrate 510, an upper substrate 520, a wavelength conversion layer 513, and a sealing portion 540.

The lower substrate 510 is disposed under the wavelength conversion layer 530. The lower substrate 510 is transparent and flexible. The lower substrate 510 may be in close contact with the lower surface of the wavelength conversion layer 530.

 Examples of the material used for the lower substrate 510 include transparent polymers such as polyethylene terephthalate (PET) and the like.

The upper substrate 520 is disposed on the wavelength conversion layer 530. The upper substrate 520 is transparent and flexible. The upper substrate 520 may be in close contact with the upper surface of the wavelength conversion layer 530.

Examples of materials used for the upper substrate 520 include transparent polymers such as polyethylene terephthalate.

The lower substrate 510 and the upper substrate 520 sandwich the wavelength conversion layer 530. The lower substrate 510 and the upper substrate 520 support the wavelength conversion layer 530. The lower substrate 510 and the upper substrate 520 protect the wavelength conversion layer 530 from external physical impacts. The lower substrate 510 and the upper substrate 520 may be in direct contact with the wavelength conversion layer 530.

In addition, the lower substrate 510 and the upper substrate 520 have low oxygen permeability and moisture permeability. Accordingly, the lower substrate 510 and the upper substrate 520 can protect the wavelength conversion layer 530 from external chemical impacts such as moisture and / or oxygen.

The wavelength conversion layer 530 is interposed between the lower substrate 510 and the upper substrate 520. Preferably, the wavelength conversion layer 530 may be disposed on the central region with respect to the lower substrate 510 and the upper substrate 520. The wavelength conversion layer 530 may be in close contact with the upper surface of the lower substrate 510 and may be in close contact with the lower surface of the upper substrate 520.

The wavelength conversion layer 530 includes a plurality of wavelength conversion particles 531 and a host layer 532.

The wavelength conversion particles 531 are disposed between the lower substrate 510 and the upper substrate 520. More specifically, the wavelength converting particles 531 are uniformly dispersed in the host layer 532, and the host layer 532 is disposed between the lower substrate 510 and the upper substrate 520.

The wavelength converting particles 531 convert the wavelength of the light emitted from the light emitting diodes 400. The wavelength conversion particles 531 receive the light emitted from the light emitting diodes 400 and convert wavelengths. For example, the wavelength conversion particles 531 may convert blue light emitted from the light emitting diodes 400 into green light and red light. That is, some of the wavelength converting particles 531 convert the blue light into green light having a wavelength range of about 520 nm to about 560 nm, and another part of the wavelength converting particles 531 converts the blue light to about 630 And can be converted into red light having a wavelength band of from about nm to about 660 nm.

Alternatively, the wavelength converting particles 531 may convert ultraviolet rays emitted from the light emitting diodes 400 into blue light, green light, and red light. That is, a part of the wavelength converting particles 531 converts the ultraviolet ray into blue light having a wavelength range of about 430 nm to about 470 nm, and another part of the wavelength converting particles 531 converts the ultraviolet ray to about 520 Can be converted into green light having a wavelength band between nm and 560 nm. Further, another part of the wavelength converting particles 531 may convert the ultraviolet ray into red light having a wavelength range of about 630 nm to about 660 nm.

That is, when the light emitting diodes 400 are blue light emitting diodes that generate blue light, wavelength conversion particles 531 that convert blue light into green light and red light, respectively, may be used. Alternatively, when the light emitting diodes 400 are UV light emitting diodes that generate ultraviolet rays, the wavelength conversion particles 531 that convert ultraviolet light into blue light, green light, and red light, respectively, may be used.

The wavelength conversion particles 531 may be a plurality of quantum dots (QDs). The quantum dot may include core nanocrystals and shell nanocrystals surrounding the core nanocrystals. In addition, the quantum dot may include an organic ligand bound to the shell nanocrystal. In addition, the quantum dot may include an organic coating layer surrounding the shell nanocrystals.

The shell nanocrystals may be formed of two or more layers. The shell nanocrystals are formed on the surface of the core nanocrystals. The quantum dot may convert the wavelength of the light incident on the core core crystal into a long wavelength through the shell nanocrystals forming the shell layer and increase the light efficiency.

The quantum dot may include at least one of a group II compound semiconductor, a group III compound semiconductor, a group V compound semiconductor, and a group VI compound semiconductor. More specifically, the core nanocrystals may include Cdse, InGaP, CdTe, CdS, ZnSe, ZnTe, ZnS, HgTe or HgS. The shell nanocrystals may include CuZnS, CdSe, CdTe, CdS, ZnSe, ZnTe, ZnS, HgTe or HgS. The diameter of the quantum dot may be 1 nm to 10 nm.

The wavelength of the light emitted from the quantum dot can be adjusted according to the size of the quantum dot. The organic ligand may include pyridine, mercapto alcohol, thiol, phosphine, phosphine oxide, and the like. The organic ligands serve to stabilize unstable quantum dots after synthesis. After synthesis, a dangling bond is formed on the outer periphery, and the quantum dots may become unstable due to the dangling bonds. However, one end of the organic ligand is in an unbonded state, and one end of the unbound organic ligand bonds with the dangling bond, thereby stabilizing the quantum dot.

Particularly, when the quantum dot has a size smaller than the Bohr radius of an exciton formed by electrons and holes excited by light, electricity or the like, a quantum confinement effect is generated to have a staggering energy level and an energy gap The size of the image is changed. Further, the charge is confined within the quantum dots, so that it has a high luminous efficiency.

Unlike general fluorescent dyes, the quantum dots vary in fluorescence wavelength depending on the particle size. That is, as the size of the particle becomes smaller, it emits light having a shorter wavelength, and the particle size can be adjusted to produce fluorescence in a visible light region of a desired wavelength. In addition, since the extinction coefficient is 100 to 1000 times higher than that of a general dye, and the quantum yield is also high, highly fluorescent light is generated.

The quantum dot can be synthesized by a chemical wet process. Here, the chemical wet method is a method of growing particles by adding a precursor material to an organic solvent, and the quantum dots can be synthesized by a chemical wet method.

The host layer 532 surrounds the wavelength converting particles 531. That is, the host layer 532 uniformly disperses the wavelength converting particles 531 therein. The host layer 532 may be comprised of a polymer. The host layer 532 is transparent. That is, the host layer 532 may be formed of a transparent polymer.

The host layer 532 is disposed between the lower substrate 510 and the upper substrate 520. Preferably, the host layer 532 is disposed on the central region with respect to the lower substrate 510 and the upper substrate 520. The host layer 532 may be in close contact with the upper surface of the lower substrate 510 and the lower surface of the upper substrate 520.

The sealing portion 540 may seal the wavelength conversion layer 530 located between the lower substrate 510 and the upper substrate 520. That is, the portion of the wavelength conversion layer 530 exposed to the outside, rather than the portion covered by the lower substrate 510 and the upper substrate 520, can be sealed by the sealing portion.

The sealing portion 540 may include a resin. In detail, the sealing portion may include an acrylic resin, an epoxy resin, a urethane resin, or a silicone resin. However, the embodiment is not limited thereto, and the sealing portion may include various kinds of resins that can prevent the penetration of oxygen or moisture.

The diffusion sheet 502 is disposed on the light conversion member 501. The diffusion sheet 502 improves the uniformity of light passing therethrough. The diffusion sheet 502 may include a plurality of beads.

The first prism sheet 503 is disposed on the diffusion sheet 502. The second prism sheet 504 is disposed on the first prism sheet 503. The first prism sheet 503 and the second prism sheet 504 increase the straightness of light passing therethrough.

The liquid crystal panel 20 is disposed on the optical sheets 500. Further, the liquid crystal panel 20 is disposed on the panel guide 23. The liquid crystal panel 20 may be guided by the panel guide 23.

The liquid crystal panel 20 displays an image by adjusting the intensity of light passing through the liquid crystal panel 20. That is, the liquid crystal panel 20 is a display panel for displaying an image using light emitted from the backlight unit 10. [ The liquid crystal panel 20 includes a TFT substrate 21, a color filter substrate 22, and a liquid crystal layer interposed between the two substrates. In addition, the liquid crystal panel 20 includes polarizing filters.

Although not shown in detail in the drawings, the TFT substrate 21 and the color filter substrate 22 will be described in detail. The TFT substrate 21 defines pixels by intersecting a plurality of gate lines and data lines, A thin film transistor (TFT) is provided for each region and is connected in a one-to-one correspondence with the pixel electrodes mounted on the respective pixels. The color filter substrate 22 includes color filters of R, G and B colors corresponding to the respective pixels, a black matrix for covering the gate lines, the data lines, the thin film transistors, etc., .

And a driving PCB 25 for supplying a driving signal to the gate line and the data line is provided at an edge of the liquid crystal display panel 210.

The drive PCB 25 is electrically connected to the liquid crystal panel 20 by a chip on film (COF) 24. Here, the COF 24 may be changed to a TCP (Tape Carrier Package).

In the case of the light conversion member described above, the wavelength conversion layer 530 may be exposed to external air or moisture, which may reduce efficiency. For this purpose, the outside of the wavelength conversion layer 530 can be sealed using a sealing part. In order to form such a sealing portion, ultrasonic waves may be applied to the lower substrate or the upper substrate, or the wavelength conversion layer may be sealed from the outside using an adhesive.

However, in the case of the process using the ultrasonic wave or the adhesive, the sealing portion is not completely sealed, so that the wavelength conversion layer may be exposed to external moisture or air, which may cause reliability and durability.

In addition, there is a problem that the luminance reduction and the light change efficiency are reduced due to the light leakage phenomenon through the sealing portion.

Therefore, the method of manufacturing the light conversion member according to the embodiment provides a novel method of manufacturing the light conversion member that can solve the problems in the sealing process.

Hereinafter, a method of manufacturing a light conversion member according to an embodiment will be described with reference to FIGS. 4 to 9. FIG. FIG. 4 is a process flow diagram of a method for manufacturing a light conversion member according to an exemplary embodiment, and FIGS. 5 to 10 sequentially illustrate a method for manufacturing a light conversion member according to an exemplary embodiment.

4 to 10, a method of manufacturing a light conversion member according to an embodiment of the present invention includes: preparing a lower substrate and an upper substrate (ST10); Joining the lower substrate and the upper substrate (ST20); (ST30) of injecting the wavelength converting material through the injecting portion; Injecting a sealing material into the injection part (ST40); And removing the injection part (ST50).

In the step of preparing the lower substrate and the upper substrate (ST10), a lower substrate 510 and an upper substrate 520 for preparing a light conversion member are prepared.

The lower substrate or the upper substrate includes a polymer, and the polymer includes polyethyleneterephthalate (PET).

In addition, the lower substrate 510 includes a first injection portion 551, and the upper substrate 520 includes a second injection portion 552. The first injection portion 551 may be formed on one surface of the lower substrate and the second injection portion 552 may be formed on a surface of the upper substrate. In detail, the first injection portion 551 and the second injection portion 552 may be formed on the side surfaces of the lower substrate 510 and the upper substrate 520, respectively.

The first injection portion 551 of the lower substrate 510 and the second injection portion 552 of the upper substrate 520 may be formed at positions corresponding to each other. That is, when the lower substrate 510 and the upper substrate 520 are connected to each other, the lower substrate 510 and the injection unit 550 of the upper substrate 520 are overlapped with each other, .

As described below, the wavelength conversion material may be injected into the injection channel 550 between the lower substrate and the upper substrate.

The upper substrate 520 is stacked on the lower substrate 510 to form the upper substrate 520 and the upper substrate 520. In this case, 520 may be joined together to form the injection channel 550.

The step of laminating the lower substrate and the upper substrate includes: applying an adhesive material to the lower substrate; And laminating the upper substrate on the lower substrate. In detail, an adhesive material is applied to a side region, that is, an outer region, of the lower substrate 510. The adhesive material may comprise a resin. Preferably, the adhesive material may comprise a resin and a plurality of beads.

The resin may include an acrylic resin, an epoxy resin, a urethane resin, or a silicone resin. Preferably, the resin may include an epoxy resin.

In addition, the plurality of beads may scatter light emitted from the light emitting diodes 300. The beads may be transparent. The beads may comprise aluminum oxide or titanium oxide. However, the embodiment is not limited thereto, and may include various kinds of beads capable of scattering light.

Subsequently, the upper substrate 520 is laminated on the lower substrate 510. Accordingly, the lower substrate 510 and the upper substrate 520 may be bonded to each other by an adhesive material applied on the lower substrate 510. The first injection portion 551 of the lower substrate 510 and the second injection portion 552 of the upper substrate 520 are coupled to each other by the coupling of the lower substrate 510 and the upper substrate 520, An injection passageway 550 may be formed to overlap the upper substrate 520 and the lower substrate 510 to inject a substance therebetween.

In the step ST30 of injecting the wavelength converting material through the injection path, the lower substrate 510 and the upper substrate 520 are connected to each other through the injection passages 550 formed between the lower substrate 510 and the upper substrate 520, And the wavelength conversion material 533 is injected between the upper substrate 520.

The wavelength converting material includes a host and a plurality of wavelength converting particles accommodated in the host. In detail, the wavelength conversion material 533 may be a wavelength conversion layer 530 formed between the lower substrate 510 and the upper substrate 520. More specifically, the wavelength conversion layer 530 includes a host layer 532; And a plurality of wavelength conversion particles 531 accommodated in the host layer 532.

 The step of injecting the wavelength converting material through the injection path 550 may include preparing a bath containing the wavelength converting material, And immersing the injection unit in the bath.

In detail, a bath 600 for accommodating the wavelength conversion material 533, that is, a plurality of wavelength conversion particles accommodated in the host and the host, is prepared. Then, the host containing the wavelength converting particles is filled in the bath 600. Subsequently, the injection channel 550 is immersed in the bath 600 to inject the wavelength conversion material from the bath 600 through the injection channel 550 between the lower substrate and the upper substrate. The step of injecting the wavelength converting material may be performed using an osmotic pressure principle, and nitrogen (N ₂ ) gas may be used as an atmospheric gas.

Through the above process, a wavelength conversion layer may be formed between the lower substrate and the upper substrate.

Next, in step ST40 of injecting the sealing material into the injection path, the sealing material may be injected through the injection path 550. [

Cleaning the wavelength conversion material injected first through the injection channel 550 and curing the wavelength conversion material before implanting the sealing material.

The cleaning step may be subdivided into a burping process and a cleaning process. The buffing process may be performed using thermal expansion. That is, heat is applied at a temperature of about 1400 ° C to 1500 ° C, thermal expansion is performed for about 5 minutes to 10 minutes, and the wavelength conversion material existing at the interface between the injection channel 550 and the lower substrate and the upper substrate is doped with 10 Mm to 20 mm. Subsequently, the pushed wavelength conversion material can be removed using a cleaning material such as toluene. By using such a cleaning process, impurities such as the wavelength conversion material remaining in the injection path 550 can be removed.

Subsequently, the wavelength conversion material injected between the lower substrate and the upper substrate is cured by UV curing or the like.

Then, a sealing material 541 may be injected into the injection path 550. The step of injecting the sealing material into the injection path 550 may be the same as the method of injecting the wavelength conversion material described above. That is, a filling material containing a resin including an acrylic resin, an epoxy resin, a urethane resin or a silicone resin and a bead is filled on the bath 600, and then the filling passage 550 is immersed in the bath 600 The sealing material may be injected into the injection path 550 using an osmotic pressure principle under a nitrogen atmosphere.

Subsequently, in the step of removing the injection part (ST50), the first injection part and the second injection part connected to the lower substrate and the upper substrate may be removed.

Prior to the step of removing the first injection portion and the second injection portion, curing the sealing material injected into the injection passage. That is, the sealing material injected into the injection path 550 may be cured by UV curing or the like.

Subsequently, the first injection portion and the second injection portion may be removed from the lower substrate and the upper substrate. The injection unit may be removed by a mechanical method or a chemical method using a laser or a cutting member.

The step of removing the first injection portion and the second injection portion may seal the portion where the injection path and the lower substrate and the upper substrate are connected by the sealing material. That is, the sealing material accommodated in the injection path and cured may seal portions of the injection path where the lower substrate and the upper substrate are connected, and the remaining portions of the injection paths may be removed from the lower substrate and the upper substrate .

A method of manufacturing a light conversion member according to an embodiment of the present invention is manufactured by first laminating a lower substrate and an upper substrate, and then injecting a wavelength conversion material between the lower substrate and the upper substrate.

That is, after joining the lower substrate and the upper substrate through the adhesive material including the resin and / or the bead, the first and second injection parts formed on one surface of the substrates, And a wavelength conversion material is injected between the lower substrate and the upper substrate. Thereafter, a sealing material containing resin and / or beads is injected into the injection path, and then the injection path is removed to seal the outer surface of the wavelength conversion material injected between the lower substrate and the upper substrate with a sealing material .

Thus, the method for manufacturing a light conversion member according to the embodiment can effectively protect the wavelength conversion layer from impurities such as moisture and oxygen outside. That is, since the wavelength conversion material is sealed by laminating the lower substrate and the upper substrate using the adhesive material serving as a sealant, and then injecting the sealing material to remove the injection portion, Can be formed smoothly without a surface.

Therefore, the method for manufacturing a light conversion member according to the embodiment can manufacture a light conversion member with improved reliability and durability.

Hereinafter, the light conversion member according to the embodiment will be described. The description of the light conversion member according to the embodiment is essentially combined with the description of the light conversion member manufacturing method described above.

The light conversion member according to an embodiment includes: a lower substrate; A wavelength conversion layer formed on the lower substrate; An upper substrate formed on the wavelength conversion layer; And a sealing member for bonding the lower substrate and the upper substrate and sealing at least one surface of the wavelength conversion layer, wherein the sealing member includes a resin and a bead.

The sealing member is formed between the lower substrate and the upper substrate, and is formed on the lower substrate and the side regions of the upper substrate. Further, the sealing member seals at least one surface of the wavelength conversion layer.

The sealing member may include an acrylic resin, an epoxy resin, a urethane resin, or a silicone resin, and may further include beads together with the resin.

The light conversion member according to the embodiment can seal the outer surface of the wavelength conversion member with a sealing member including resin and bead.

Accordingly, the light conversion member according to the embodiment can protect the wavelength conversion layer from external moisture and oxygen penetration by the sealing member. Thus, the light conversion member according to the embodiment can have improved reliability and durability.

The features, structures, effects and the like described in the embodiments are included in at least one embodiment of the present invention and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects and the like illustrated in the embodiments can be combined and modified by other persons skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims (20)

Preparing an upper substrate including a lower substrate including a first injection portion and a second injection portion formed at a position corresponding to the first injection portion;
Forming an injection path by laminating the lower substrate and the upper substrate;
Injecting a wavelength converting material through the injection path;
Injecting a sealing material into the injection path; And
Removing the first injection portion and the second injection portion,
Forming an injection path by laminating the lower substrate and the upper substrate,
Applying an adhesive material to the lower substrate;
Stacking the upper substrate on the lower substrate and bonding the lower substrate and the upper substrate; And
And forming the injection channel between the first injection unit and the second injection unit,
Wherein the lower substrate or the upper substrate includes polyethyleneterephthalate (PET)
Wherein the sealing material comprises an acrylic resin, an epoxy resin, a urethane resin or a silicone resin,
Wherein the adhesive material comprises an acrylic resin, an epoxy resin, a urethane resin or a silicone resin. The method according to claim 1,
Wherein the first injection portion is formed on one surface of the lower substrate,
Wherein the second injection portion is formed on one surface of the upper substrate. delete delete The method according to claim 1,
Wherein the adhesive material further comprises a bead. delete The method according to claim 1,
Further comprising: after the step of injecting the wavelength converting material through the injection path, removing the wavelength converting material of the injection path. 8. The method of claim 7,
Further comprising the step of cleaning the injection pass after the step of removing the wavelength converting material of the injection pass. 9. The method of claim 8,
Further comprising the step of curing the wavelength converting material after cleaning the injection passages. The method according to claim 1,
Further comprising: after the step of injecting the sealing material through the injection passage, curing the sealing material. delete The method according to claim 1,
The wavelength conversion material may include,
Host; And
And a plurality of wavelength converting particles contained in the host. delete delete The method according to claim 1,
Wherein the sealing material further comprises a bead. The method according to claim 1,
Wherein the step of injecting the wavelength converting material through the injection path comprises:
Preparing a bath containing the wavelength converting material; And
And immersing the injection passage in the bath. The method according to claim 1,
Wherein the step of injecting the sealing material into the injection path comprises:
Preparing a bath containing the sealing material; And
And immersing the injection passage in the bath. delete delete delete

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