KR101251775B1 - Optical member, display device having the same and method of fabricating the same - Google Patents

Abstract

Disclosed are an optical member, a display device including the same, and a method of manufacturing the same. The optical member includes a first substrate including a central region and an outer region disposed around the central region; A wavelength conversion layer disposed on the central region on the first substrate; And a second substrate disposed on the wavelength conversion layer and the first substrate, wherein the first substrate is directly bonded to the second substrate.

Description

Optical member, display device including same, and manufacturing method therefor {OPTICAL MEMBER, DISPLAY DEVICE HAVING THE SAME AND METHOD OF FABRICATING THE SAME}

Embodiments disclose an optical member, a display device including the same, and a manufacturing method thereof.

Light emitting diodes (LEDs) are semiconductor devices that convert electricity into ultraviolet rays, visible rays, and infrared rays by using the characteristics of compound semiconductors. They are mainly used in home appliances, remote controllers, and large electric sign boards.

The high-intensity LED light source is used as an illumination light. It has high energy efficiency, long life and low replacement cost. It is resistant to vibration and shock, and it does not require the use of toxic substances such as mercury. It is replacing incandescent lamps and fluorescent lamps.

Also, the LED is very advantageous as a light source such as a medium and large-sized LCD TV and a monitor. Compared to CCFL (Cold Cathode Fluorescent Lamp), which is mainly used in LCD (Liquid Crystal Display), it has excellent color purity, low power consumption, and easy miniaturization, Is in progress.

Embodiments provide an optical member having improved reliability and durability, a display device including the same, and a manufacturing method thereof.

In one embodiment, an optical member includes: a first substrate including a central area and an outer area disposed around the central area; A wavelength conversion layer disposed on the central region on the first substrate; And a second substrate disposed on the wavelength conversion layer and the first substrate, wherein the first substrate is directly bonded to the second substrate.

According to an exemplary embodiment, a display device includes a light source, an optical member for converting a wavelength of light emitted from the light source, and a display panel to which light converted by the optical member is incident, wherein the optical member includes a central region and the central region. A first substrate comprising an outer region disposed around the first substrate; A wavelength conversion layer disposed on the central region on the first substrate; And a second substrate disposed on the wavelength conversion layer and the first substrate, wherein the first substrate is directly bonded to the second substrate.

According to one or more exemplary embodiments, a method of manufacturing an optical member includes: providing a first substrate including a central area and an outer area disposed around the central area; Forming a wavelength conversion layer on the central region; Forming a second substrate on the wavelength conversion layer; And bonding the first substrate and the second substrate to each other.

In the optical member according to the exemplary embodiment, the first substrate and the second substrate may be bonded to each other to seal the wavelength conversion layer. That is, the first substrate and the second substrate may sandwich the wavelength conversion layer, and outer regions of the first substrate and the second substrate may be bonded to each other.

Accordingly, the optical member according to the embodiment can effectively protect the wavelength conversion particles of the wavelength conversion layer. That is, since the first substrate and the second substrate seal the wavelength converting particles by bonding to each other, the wavelength converting particles can be effectively protected from external moisture and / or oxygen.

In addition, the optical member according to the embodiment is bonded by the first substrate and the second substrate by a simple thermal compression, etc., it can be manufactured in a simple process.

Therefore, the optical member and the display device including the same according to the embodiment can be easily manufactured with improved reliability.

1 is an exploded perspective view showing a liquid crystal display device according to a first embodiment.
2 is a perspective view showing a wavelength conversion sheet.
FIG. 3 is a cross-sectional view taken along the line AA ′ of FIG. 2.
4 is an enlarged view illustrating a portion B of FIG. 2.
5 to 7 are views illustrating a process of manufacturing the wavelength conversion sheet according to the first embodiment.
8 is a plan view of the wavelength conversion sheet according to the second embodiment.
FIG. 9 is a cross-sectional view illustrating a cross section taken along CC ′ in FIG. 8.

In the description of the embodiments, it is described that each substrate, frame, sheet, layer or pattern is formed "on" or "under" each substrate, frame, sheet, In this case, "on" and "under " all include being formed either directly or indirectly through another element. In addition, the upper or lower reference of each component is described with reference to the drawings. The size of each component in the drawings may be exaggerated for the sake of explanation and does not mean the size actually applied.

1 is an exploded perspective view showing a liquid crystal display device according to a first embodiment. 2 is a perspective view showing a wavelength conversion sheet. FIG. 3 is a cross-sectional view taken along the line A-A 'of FIG. 2. 4 is an enlarged view illustrating a portion B of FIG. 2. 5 to 7 are views illustrating a process of manufacturing the wavelength conversion sheet according to the first embodiment.

1 to 7, the liquid crystal display according to the embodiment includes a backlight unit 10 and a liquid crystal panel 20.

The backlight unit 10 emits light to the liquid crystal panel 20. The backlight unit 10 may irradiate light uniformly to the bottom surface of the liquid crystal panel 20 with a surface light source.

The backlight unit 10 is disposed below the liquid crystal panel 20. The backlight unit 10 includes a bottom cover 100, a light guide plate 200, a reflective sheet 300, a light source, for example, a plurality of light emitting diodes 400, a printed circuit board 401, and a plurality of optical sheets. Field 500.

The bottom cover 100 has a shape in which an upper portion thereof is opened. The bottom cover 100 accommodates the light guide plate 200, the light emitting diodes 400, the printed circuit board 401, the reflective sheet 300, and the optical sheets 500.

The light guide plate 200 is disposed in the bottom cover 100. The light guide plate 200 is disposed on the reflective sheet 300. The light guide plate 200 emits light incident from the light emitting diodes 400 upward through total reflection, refraction, and scattering.

The reflective sheet 300 is disposed below the light guide plate 200. In more detail, the reflective sheet 300 is disposed between the light guide plate 200 and the bottom surface of the bottom cover 100. The reflective sheet 300 reflects the light emitted from the lower surface of the light guide plate 200 upward.

The light emitting diodes 400 are light sources for generating light. The light emitting diodes 400 are disposed on one side of the light guide plate 200. The light emitting diodes 400 generate light and enter the light guide plate 200 through a side surface of the light guide plate 200.

The light emitting diodes 400 may be blue light emitting diodes generating blue light or UV light emitting diodes generating ultraviolet light. That is, the light emitting diodes 400 may generate blue light having a wavelength band between about 430 nm and about 470 nm or ultraviolet rays having a wavelength band between about 300 nm and about 400 nm.

The light emitting diodes 400 are mounted on the printed circuit board 401. The light emitting diodes 400 are disposed under the printed circuit board 401. The light emitting diodes 400 are driven by receiving a driving signal through the printed circuit board 401.

The printed circuit board 401 is electrically connected to the light emitting diodes 400. The printed circuit board 401 may mount the light emitting diodes 400. The printed circuit board 401 is disposed inside the bottom cover 100.

The optical sheets 500 are disposed on the light guide plate 200. The optical sheets 500 change or improve characteristics of light emitted from the upper surface of the light guide plate 200 to supply the light to the liquid crystal panel 20.

The optical sheets 500 may be a wavelength conversion sheet 501, a diffusion sheet 502, a first prism sheet 503, and a second prism sheet 504.

The wavelength conversion sheet 501 is disposed on the light guide plate 200. In more detail, the wavelength conversion sheet 501 may be interposed between the light guide plate 200 and the diffusion sheet 502. The wavelength conversion sheet 501 may convert the wavelength of incident light and exit upward.

For example, when the light emitting diodes 400 are blue light emitting diodes, the wavelength conversion sheet 501 may convert blue light emitted upward from the light guide plate 200 into green light and red light. That is, the wavelength conversion sheet 501 converts a part of the blue light into green light having a wavelength band of about 520 nm to about 560 nm, and another part of the blue light having a wavelength band of about 630 nm to about 660 nm. Can be converted to red light.

In addition, when the light emitting diodes 400 are UV light emitting diodes, the wavelength conversion sheet 501 may convert ultraviolet light emitted from the upper surface of the light guide plate 200 into blue light, green light, and red light. That is, the wavelength conversion sheet 501 converts a part of the ultraviolet light into blue light having a wavelength band between about 430 nm and about 470 nm, and another part of the ultraviolet light having a wavelength band between about 520 nm and about 560 nm. Green light, and another portion of the ultraviolet light to red light having a wavelength band between about 630 nm and about 660 nm.

Accordingly, the light that is not converted and passes through the wavelength conversion sheet 501 and the light converted by the wavelength conversion sheet 501 may form white light. That is, blue light, green light, and red light may be combined to allow white light to enter the liquid crystal panel 20.

As illustrated in FIGS. 2 and 3, the wavelength conversion sheet 501 may include a lower substrate 510, an upper substrate 520, a wavelength conversion layer 530, a first inorganic protective layer 540, and a second inorganic protective layer. 550.

The lower substrate 510 is disposed under the wavelength conversion layer 530. The lower substrate 510 is transparent and flexible. The lower substrate 510 may be in close contact with the lower surface of the wavelength conversion layer 530.

Examples of the material used for the lower substrate 510 include transparent polymers such as polyethylene terephthalate (PET) and the like.

The lower substrate 510 may include a central region CR and an outer region OR. The central region CR is disposed in the central portion of the lower substrate 510. The central region CR may correspond to the wavelength conversion layer 530. The outer periphery of the central region CR may correspond to the outer periphery of the wavelength conversion layer 530. That is, the center region CR may be defined by the wavelength conversion layer 530.

In addition, the center area CR may correspond to an area in which an image is actually displayed on the liquid crystal panel 20.

The outer region OR is disposed around the central region CR. That is, the outer region OR may surround the center region CR. The outer region OR is defined at an outer portion of the lower substrate 510. The outer region OR may have a closed loop shape when viewed from the top side. The width of the outer area OR may be about 1 mm to about 10 mm.

The upper substrate 520 is disposed on the wavelength conversion layer 530. The upper substrate 520 is transparent and flexible. The upper substrate 520 may be in close contact with the upper surface of the wavelength conversion layer 530.

Examples of the material used as the upper substrate 520 may include a transparent polymer such as polyethyleneterephthalate (PET).

In addition, the upper substrate 520, like the lower substrate 510, may have a central region CR and an outer region OR defined therein.

The wavelength conversion layer 530 is interposed between the lower substrate 510 and the upper substrate 520. The wavelength conversion layer 530 may be in close contact with the upper surface of the lower substrate 510 and may be in close contact with the lower surface of the upper substrate 520.

The wavelength conversion layer 530 includes a plurality of wavelength conversion particles 531 and a host layer 532.

The wavelength conversion particles 531 are disposed between the lower substrate 510 and the upper substrate 520. More specifically, the wavelength converting particles 531 are uniformly dispersed in the host layer 532, and the host layer 532 is disposed between the lower substrate 510 and the upper substrate 520.

The wavelength conversion particles 531 convert wavelengths of light emitted from the light emitting diodes 400. The wavelength conversion particles 531 receive light emitted from the light emitting diodes 400 to convert wavelengths. For example, the wavelength conversion particles 531 may convert blue light emitted from the light emitting diodes 400 into green light and red light. That is, some of the wavelength converting particles 531 convert the blue light into green light having a wavelength range of about 520 nm to about 560 nm, and another part of the wavelength converting particles 531 converts the blue light to about 630 And can be converted into red light having a wavelength band of from about nm to about 660 nm.

Alternatively, the wavelength conversion particles 531 may convert ultraviolet light emitted from the light emitting diodes 400 into blue light, green light, and red light. That is, a part of the wavelength converting particles 531 converts the ultraviolet ray into blue light having a wavelength range of about 430 nm to about 470 nm, and another part of the wavelength converting particles 531 converts the ultraviolet ray to about 520 Can be converted into green light having a wavelength band between nm and 560 nm. Further, another part of the wavelength converting particles 531 may convert the ultraviolet ray into red light having a wavelength range of about 630 nm to about 660 nm.

That is, when the light emitting diodes 400 are blue light emitting diodes generating blue light, wavelength converting particles 531 for converting blue light into green light and red light may be used. Alternatively, when the light emitting diodes 400 are UV light emitting diodes that generate ultraviolet light, wavelength converting particles 531 which convert ultraviolet light into blue light, green light, and red light may be used.

The wavelength conversion particles 531 may be a plurality of quantum dots (QDs). The quantum dot may include a core nanocrystal and a shell nanocrystal surrounding the core nanocrystal. In addition, the quantum dot may include an organic ligand bound to the shell nanocrystal. In addition, the quantum dot may include an organic coating layer surrounding the shell nanocrystals.

The shell nanocrystals may be formed of two or more layers. The shell nanocrystals are formed on the surface of the core nanocrystals. The quantum dot may convert the wavelength of the light incident on the core core crystal into a long wavelength through the shell nanocrystals forming the shell layer and increase the light efficiency.

The quantum dot may include at least one of a group II compound semiconductor, a group III compound semiconductor, a group V compound semiconductor, and a group VI compound semiconductor. More specifically, the core nanocrystals may include Cdse, InGaP, CdTe, CdS, ZnSe, ZnTe, ZnS, HgTe or HgS. The shell nanocrystals may include CuZnS, CdSe, CdTe, CdS, ZnSe, ZnTe, ZnS, HgTe or HgS. The diameter of the quantum dot may be 1 nm to 10 nm.

The wavelength of light emitted from the quantum dots can be controlled by the size of the quantum dots or the molar ratio of the molecular cluster compound and the nanoparticle precursor in the synthesis process. The organic ligand may include pyridine, mercapto alcohol, thiol, phosphine, phosphine oxide, and the like. The organic ligands serve to stabilize unstable quantum dots after synthesis. After synthesis, a dangling bond is formed on the outer periphery, and the quantum dots may become unstable due to the dangling bonds. However, one end of the organic ligand is in an unbonded state, and one end of the unbound organic ligand bonds with the dangling bond, thereby stabilizing the quantum dot.

Particularly, when the quantum dot has a size smaller than the Bohr radius of an exciton formed by electrons and holes excited by light, electricity or the like, a quantum confinement effect is generated to have a staggering energy level and an energy gap The size of the image is changed. Further, the charge is confined within the quantum dots, so that it has a high luminous efficiency.

Unlike general fluorescent dyes, the quantum dots vary in fluorescence wavelength depending on the particle size. That is, as the size of the particle becomes smaller, it emits light having a shorter wavelength, and the particle size can be adjusted to produce fluorescence in a visible light region of a desired wavelength. In addition, since the extinction coefficient is 100 to 1000 times higher than that of a general dye, and the quantum yield is also high, it produces very high fluorescence.

The quantum dot can be synthesized by a chemical wet process. Here, the chemical wet method is a method of growing particles by adding a precursor material to an organic solvent, and the quantum dots can be synthesized by a chemical wet method.

The host layer 532 surrounds the wavelength converting particles 531. That is, the host layer 532 uniformly disperses the wavelength converting particles 531 therein. The host layer 532 may be comprised of a polymer. The host layer 532 is transparent. That is, the host layer 532 may be formed of a transparent polymer.

The host layer 532 is disposed between the lower substrate 510 and the upper substrate 520. The host layer 532 may be in close contact with an upper surface of the lower substrate 510 and a lower surface of the upper substrate 520.

The first inorganic passivation layer 540 is disposed under the wavelength conversion layer 530. In more detail, the first inorganic passivation layer 540 may be disposed under the lower substrate 510. In more detail, the first inorganic protective layer 540 may be coated on the bottom surface of the lower substrate 510.

The first inorganic protective layer 540 may protect the wavelength conversion layer 530 together with the lower substrate 510. That is, the first inorganic protective layer 540 may protect the wavelength conversion layer 530 from external physical shocks. In addition, the first inorganic protective layer 540 may prevent oxygen and / or moisture from penetrating into the wavelength conversion layer 530.

In addition, the first inorganic protective layer 540 may have a lower refractive index than the lower substrate 510. For example, the refractive index of the first inorganic protective layer 540 may be about 1.3 to 1.6.

Accordingly, the first inorganic passivation layer 540 may perform an optical buffer function between the lower substrate 510 and the capping unit 560 to reduce reflection on the lower surface of the lower substrate 510. have.

Examples of the material used as the first inorganic protective layer 540 include silicon oxide (Si _X O _Y ), silicon nitride (Si _X N _Y ), and the like.

The second inorganic protective film 550 is disposed on the wavelength conversion layer 530. In more detail, the second inorganic passivation layer 550 may be disposed on the upper substrate 520. In more detail, the second inorganic protective layer 550 may be coated on the upper surface of the upper substrate 520.

The second inorganic protective layer 550 may protect the wavelength conversion layer 530 together with the upper substrate 520. That is, the second inorganic protective layer 550 may protect the wavelength conversion layer 530 from external physical shocks. In addition, the second inorganic protective layer 550 may prevent oxygen and / or moisture from penetrating into the wavelength conversion layer 530.

The second inorganic protective layer 550 may have a lower refractive index than the upper substrate 520. For example, the refractive index of the second inorganic protective layer 550 may be about 1.3 to 1.6.

Accordingly, the second inorganic passivation layer 550 may perform an optical buffer function between the upper substrate 520 and the capping unit 560 to reduce reflection on the upper surface of the upper substrate 520. .

Examples of the material used as the second inorganic protective layer 550 include silicon oxide or silicon nitride.

The first inorganic passivation layer 540 and the second inorganic passivation layer 550 not only perform an optical function such as an antireflection function, but also seal the wavelength conversion layer 530 so that external physical and chemical impacts To protect against

The lower substrate 510 and the upper substrate 520 sandwich the wavelength conversion layer 530. The lower substrate 510 and the upper substrate 520 support the wavelength conversion layer 530. The lower substrate 510 and the upper substrate 520 protect the wavelength conversion layer 530 from external physical impacts.

In addition, a portion of the lower substrate 510 and a portion of the upper substrate 520 may be bonded to each other and integrated. In more detail, the outer region OR of the lower substrate 510 and the outer region OR of the upper substrate 520 may be integrated with each other.

In more detail, the outer region OR of the lower substrate 510 includes a junction region CP. The junction region CP may be formed in the entire outer region OR. Alternatively, the junction region CP may be formed in a portion of the outer region OR. Accordingly, the outer region OR may include a non-joint region NCP adjacent to the junction region CP.

The bonding region CP is a portion in which the lower substrate 510 and the upper substrate 520 are integrated with each other and bonded to each other. The junction region CP extends along the circumference of the central region CR. In more detail, the junction region CP may surround the center region CR when viewed from the top side.

The junction region CP may extend along the outer region OR and may have a closed loop shape. In addition, a groove 511 is formed on a lower surface of the lower substrate 510 corresponding to the bonding region CP. In addition, a groove 521 is formed on an upper surface of the upper substrate 520 to correspond to the bonding region CP.

As shown in FIG. 4, the junction region CP may extend in a repeating shape. For example, the bonding region CP may extend in the shape of a zig zag. For example, the bonding region CP includes a first extension region E1 extending in a first direction and a second extension region E2 extending in a second direction. In this case, the second extension area E2 extends from an end of the first extension area E1, and the first direction and the second direction cross each other.

In addition, the junction region CP may include a third extension region E3 extending in the third direction and a fourth extension region E4 extending in the fourth direction. In this case, the third extension area E3 extends from an end of the second extension area E2, and the third direction is a direction crossing with respect to the second direction. In addition, the fourth extension area E4 extends from an end of the third extension area E3, and the fourth direction is a direction crossing with respect to the third direction.

As described above, the first extension region E1, the second extension region E2, the third extension region E3, and the fourth extension region E4 are periodically repeated, so that the junction region CP is extended. This can be configured.

As such, since the bonding region CP extends in a shape that is constantly repeated, the lower substrate 510 and the upper substrate 520 may be bonded to each other with improved bonding force. Therefore, the lower substrate 510 and the upper substrate 520 may effectively protect the wavelength conversion particles 531.

In addition, a groove may be formed on the bottom surface of the lower substrate 510 corresponding to the bonding area CP. In addition, grooves may be formed on the upper surface of the upper substrate 520 to correspond to the bonding region CP.

In addition, the lower substrate 510, the upper substrate 520, the first inorganic protective layer 540, and the second inorganic protective layer 550 have low oxygen permeability and moisture permeability. Accordingly, the lower substrate 510, the upper substrate 520, the first inorganic passivation layer 540, and the second inorganic passivation layer 550 may have the wavelength from an external chemical shock such as moisture and / or oxygen. The conversion layer 530 may be protected.

5 to 7, the wavelength conversion sheet 501 may be formed by the following process.

Referring to FIG. 5, a resin composition including wavelength converting particles 531 is coated on a lower substrate 510 on which a first inorganic protective layer 540 is coated on a bottom surface thereof. Thereafter, the resin composition is cured by ultraviolet rays or the like, and the wavelength conversion layer 530 is formed. The lower substrate 510 may be divided into a central region CR and an outer region OR by the wavelength conversion layer 530.

Referring to FIG. 6, an upper substrate 520 is laminated on the lower substrate 510 and the wavelength conversion layer 530. The second inorganic passivation layer 550 may be formed on the upper surface of the upper substrate 520. The upper substrate 520 may be in close contact with the upper surface of the lower substrate 510 and the wavelength conversion layer 530.

Referring to FIG. 7, the lower substrate 510 and the upper substrate 520 are bonded to each other. Accordingly, a junction region CP is formed in the lower substrate 510 and the upper substrate 520. In order to bond the lower substrate 510 and the upper substrate 520, thermal bonding apparatuses 30 and 40 may be used. The thermal bonding apparatuses 30 and 40 may include a first thermal bonding apparatus 30 and a second thermal bonding apparatus 40.

The first thermal bonding apparatus 30 may be disposed under the lower substrate 510, and the second thermal bonding apparatus 40 may be disposed on the upper substrate 520. The first thermal bonding apparatus 30 and the second thermal bonding apparatus 40 may correspond to each other.

In addition, the first thermal bonding apparatus 30 and the second thermal bonding apparatus 40 apply heat and pressure to the lower substrate 510 and the upper substrate 520 locally, thereby providing the lower substrate 510. And the upper substrate 520 may be bonded. Accordingly, a junction region CP is formed in the lower substrate 510 and the upper substrate 520. In addition, grooves 511 and 521 may be formed on a lower surface of the lower substrate 510 and an upper surface of the upper substrate 520, respectively.

In addition, the first thermal bonding apparatus 30 and the second thermal bonding apparatus 40 may have a closed loop shape when viewed from the top side. In addition, the first thermal bonding apparatus 30 and the second thermal bonding apparatus 40 may be disposed to surround the wavelength conversion layer 530.

The diffusion sheet 502 is disposed on the wavelength conversion sheet 501. The diffusion sheet 502 improves the uniformity of light passing therethrough. The diffusion sheet 502 may include a plurality of beads.

The first prism sheet 503 is disposed on the diffusion sheet 502. The second prism sheet 504 is disposed on the first prism sheet 503. The first prism sheet 503 and the second prism sheet 504 increase the straightness of light passing therethrough.

The liquid crystal panel 20 is disposed on the optical sheets 500. In addition, the liquid crystal panel 20 is disposed on the panel guide 23. The liquid crystal panel 20 may be guided by the panel guide 23.

The liquid crystal panel 20 displays an image by adjusting the intensity of light passing through the liquid crystal panel 20. That is, the liquid crystal panel 20 is a display panel that displays an image by using light emitted from the backlight unit 10. The liquid crystal panel 20 includes a TFT substrate 21, a color filter substrate 22, and a liquid crystal layer interposed between the two substrates. In addition, the liquid crystal panel 20 includes polarization filters.

Although not shown in detail in the drawings, the TFT substrate 21 and the color filter substrate 22 will be described in detail. In the TFT substrate 21, a plurality of gate lines and data lines cross each other to define pixels, and respective intersections are performed. A thin flim transistor (TFT) is provided in each region and is connected in one-to-one correspondence with the pixel electrode mounted in each pixel. The color filter substrate 22 includes a color filter of R, G, and B colors corresponding to each pixel, a black matrix bordering each of them, covering a gate line, a data line, a thin film transistor, and the like, and a common electrode covering all of them. Include.

A driving PCB 25 is provided at the edge of the liquid crystal display panel 210 to supply driving signals to the gate line and the data line.

The driving PCB 25 is electrically connected to the liquid crystal panel 20 by a chip on film (COF) 24. Here, the COF 24 may be changed to a tape carrier package (TCP).

As described above, in the wavelength conversion layer 530, the lower substrate 510 and the upper substrate 520 are bonded to each other and sealed to the outside. Accordingly, the wavelength conversion sheet 501 according to the embodiment may effectively protect the wavelength conversion layer 530 from external chemical impact such as oxygen and / or moisture.

Therefore, the wavelength conversion sheet 501 may prevent the wavelength conversion particles 531 from being denatured by oxygen and / or moisture.

Accordingly, the wavelength conversion sheet 501 may have improved durability and reliability, and the liquid crystal display according to the embodiment may have improved reliability and image quality.

In the liquid crystal display according to the embodiment, the lower substrate 510 and the upper substrate 520 are bonded to each other by a simple thermocompression bonding process. That is, the liquid crystal display according to the embodiment may block moisture and / or oxygen penetrating into the side surface by a simple process.

Therefore, the liquid crystal display device according to the embodiment can be easily manufactured by a simple process.

8 is a plan view of the wavelength conversion sheet according to the second embodiment. FIG. 9 is a cross-sectional view taken along the line CC ′ in FIG. 8. In the description of the embodiments, reference is made to the description of the foregoing embodiment. That is, the foregoing description of the wavelength converting member may be essentially combined with the description of the present wavelength converting members, except for the changed part.

8 and 9, an outer region OR of the lower substrate 510 may include a first bonding region CP1 and a second bonding region CP2. The first junction region CP1 and the second junction region CP2 may be spaced apart from each other. Accordingly, the non-junction region NCP may be interposed between the first junction region CP1 and the second junction region CP2.

In addition, the first junction region CP1 may surround the wavelength conversion layer 530. The first junction region CP1 may have a closed loop shape.

The second junction region CP2 may surround the first junction region CP1. The second junction region CP2 is disposed outside the first junction region CP1. The second junction region CP2 may have a closed loop shape.

A first groove 512 may be formed on a lower surface of the lower substrate 510 to correspond to the first bonding region CP1. In addition, a second groove 522 may be formed on an upper surface of the upper substrate 520 to correspond to the first bonding region CP1.

In addition, a third groove 513 may be formed on a lower surface of the lower substrate 510 to correspond to the second bonding region CP2. In addition, a fourth groove 523 may be formed on an upper surface of the upper substrate 520 to correspond to the second bonding region CP2.

The wavelength conversion sheet 501 according to the present embodiment double bonds the lower substrate 510 and the upper substrate 520. Accordingly, the lower substrate 510 and the upper substrate 520 may seal the wavelength conversion layer 530 more efficiently.

Accordingly, the wavelength conversion sheet 501 according to the present embodiment may effectively protect the wavelength conversion particles 531 of the wavelength conversion layer 530 from external oxygen and / or moisture.

The wavelength conversion sheet 501 described in the embodiments broadly corresponds to the wavelength conversion member, more broadly the optical member. Thus, the bonding structure in the embodiments can be modified and applied to various optical members.

In addition, the features, structures, effects and the like described in the embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims (11)

A first substrate comprising a central region and an outer region disposed around the central region;
A wavelength conversion layer disposed on the central region on the first substrate; And
A second substrate disposed on the wavelength conversion layer and the first substrate and directly bonded to the first substrate in the outer region;
The outer region is,
And the joining region in which the first substrate and the second substrate are integrally bonded to each other and extend in a zig zag shape. The method of claim 1, wherein the outer region is
And an unbonded region adjacent the junction region and separated from the second substrate. The optical member according to claim 1, wherein the junction region surrounds the wavelength conversion layer. The optical member according to claim 1, wherein the joining region has a closed loop shape. The method of claim 1, wherein the junction region is
A first extension region extending in a first direction;
And a second extension region extending in the second direction from the first extension region. The method of claim 2, wherein the junction region is
A first bonding region in which the first substrate and the second substrate are integrally bonded to each other; And
And a second bonding region spaced apart from the first bonding region, wherein the first substrate and the second substrate are integrally bonded to each other.
And the non-bonded region is disposed between the first bonded region and the second bonded region. The method of claim 6, wherein the first junction region surrounds the wavelength conversion layer,
And the second bonding region surrounds the first bonding region. Light source;
An optical member for converting a wavelength of light emitted from the light source; And
A display panel to which light converted by the optical member is incident;
Wherein the optical member comprises:
A first substrate comprising a central region and an outer region disposed around the central region;
A wavelength conversion layer disposed on the central region on the first substrate; And
A second substrate disposed on the wavelength conversion layer and the first substrate and directly bonded to the first substrate in the outer region;
The outer region is,
And a bonding region in which the first substrate and the second substrate are integrally bonded to each other and extend in a zig zag shape. Providing a first substrate comprising a central region and an outer region disposed around the central region;
Forming a wavelength conversion layer on the central region;
Forming a second substrate on the wavelength conversion layer; And
Bonding the first substrate and the second substrate to each other in the outer region;
The outer region is,
And a joining region in which the first substrate and the second substrate are integrally bonded to each other and extend in a zig zag shape. The method of claim 9, wherein the bonding of the first substrate and the second substrate is performed.
And applying heat and pressure to the first substrate and the second substrate. The method of claim 10, wherein applying heat and pressure to the first substrate and the second substrate comprises:
The said joining area | region is formed so that the circumference | surroundings of the said wavelength conversion layer may be formed.

Images