KR20130110946A - Optical member and display device having the same - Google Patents

Abstract

PURPOSE: An optical member and a display device having the same are provided to effectively protect wavelength conversion particles by preventing the penetration of external moisture and oxygen. CONSTITUTION: A wavelength conversion layer (503) is arranged on the center region of a first substrate (501). A sealing part (504) is arranged on the edge region of the first substrate. A second substrate is arranged on the wavelength conversion layer and the sealing part. A sealing part includes a resin. The sealing part includes wavelength conversion particles.

Description

TECHNICAL FIELD [0001] The present invention relates to an optical member and a display device including the optical member.

Embodiments relate to an optical member and a display device including the same.

Among display devices, there is a device that requires a backlight unit capable of generating light in order to display an image. The backlight unit is a device for supplying light to a display panel including a liquid crystal or the like and includes a light emitting device and means for effectively transmitting the light output from the light emitting device to the liquid crystal side.

As a light source of such a display device, an LED (Light Emitted Diode) or the like can be applied. Further, in order that the light output from the light source is effectively transmitted to the display panel side, a light guide plate and an optical sheet may be laminated and used.

At this time, an optical member that changes the wavelength of light generated from the light source and causes white light to enter the light guide plate or the display panel can be applied to such a display device. Particularly, in order to change the wavelength of light, a quantum dot or the like can be used.

The quantum dot has a particle size of 10 nm or less and has unique electrical and optical characteristics depending on its size. For example, when the approximate size is 55 to 65 Å, it can emit red, 40 to 50 Å to green, and 20 to 35 Å to blue. Yellow has medium size of red and green quantum dots. As the spectrum of light changes from red to blue, the size of the quantum dots varies from 65 Å to 20 Å, which may be slightly different.

In order to form the optical member including the quantum dots, the quantum dots emitting RGB or RYGB, which are three primary colors of light, can be formed by spin coating or printing on a transparent substrate such as glass. Here, when a quantum dot emitting yellow (Y) is further included, white light closer to natural light can be obtained. The matrix (medium) in which the quantum dots are dispersed can apply an inorganic substance or a polymer having excellent transmittance with respect to light in the visible light region and the ultraviolet region (including Far UV) or in the visible light region. For example, it may be inorganic silica, polymethylmethacrylate (PMMA), polydimethylsiloxane (PDMS), poly lactic acid (PLA), silicon polymer or YAG.

A display device to which such a quantum dot is applied is disclosed in Korean Patent Laid-Open Publication No. 10-2011-0012246.

Embodiments provide an optical member having an improved performance and a display device including the same.

In one embodiment, an optical member includes: a first substrate; A wavelength conversion layer disposed on the central region of the first substrate; A sealing part disposed on an outer region of the first substrate; And a second substrate disposed on the wavelength conversion layer and the sealing portion.

In one embodiment, an optical member includes: a first substrate; A wavelength conversion layer disposed on the first substrate; And a second substrate disposed on the wavelength conversion layer, wherein the first substrate or the second substrate includes a first sealing portion disposed on an opposing surface of the first substrate and the second substrate facing each other; The first sealing part may include a resin, and the resin may include an acrylic resin, an epoxy resin, a urethane resin, or a silicone resin.

In one embodiment, a display device includes a light source; A wavelength conversion member for converting the wavelength of the light emitted from the light source; And a display panel on which light converted by the wavelength conversion member is incident, wherein the wavelength conversion member comprises: a first substrate; A wavelength conversion layer disposed on the central region of the first substrate; A sealing part disposed on an outer region of the first substrate; And a second substrate disposed on the wavelength conversion layer and the sealing portion.

In one embodiment, a display device includes a light source; A wavelength conversion member for converting the wavelength of the light emitted from the light source; And a display panel on which light converted by the wavelength conversion member is incident, wherein the wavelength conversion member comprises: a first substrate; A wavelength conversion layer disposed on the first substrate; And a second substrate disposed on the wavelength conversion layer, wherein the first substrate or the second substrate includes a first sealing portion disposed on an opposing surface of the first substrate and the second substrate facing each other; The first sealing part includes a resin, and the resin includes an acrylic resin, an epoxy resin, a urethane resin, or a silicone resin, and includes a plurality of wavelength converting particles disposed in the resin.

The optical member and the display device including the same may effectively seal the wavelength conversion layer from the outside.

Accordingly, the liquid crystal display according to the embodiment can effectively protect the wavelength conversion particles from external moisture, moisture, and / or oxygen.

Accordingly, the liquid crystal display according to the embodiment may have improved reliability and durability.

In addition, the sealing part may include a multi-layered structure, and may seal the wavelength conversion layer by using various resins having different advantages together, thereby more effectively preventing penetration of moisture, moisture, and / or oxygen. And disposed between the substrates to effectively seal the wavelength conversion layer without increasing the thickness of the optical member.

Therefore, the liquid crystal display according to the embodiment can reduce the leakage light and have improved optical characteristics.

1 is an exploded perspective view showing a liquid crystal display device according to an embodiment.
2 is a perspective view showing an optical member according to an embodiment.
3 is a cross-sectional view showing a cross section of the optical member according to the embodiment.
4 to 8 are cross-sectional views according to various embodiments of the present disclosure, taken along the line AA ′ of FIG. 2.

In the description of the embodiments, it is described that each substrate, frame, sheet, layer or pattern is formed "on" or "under" each substrate, frame, sheet, In this case, "on" and "under " all include being formed either directly or indirectly through another element. In addition, the upper or lower reference of each component is described with reference to the drawings. The size of each component in the drawings may be exaggerated for the sake of explanation and does not mean the size actually applied.

1 is an exploded perspective view showing a liquid crystal display according to an embodiment, FIG. 2 is a perspective view showing an optical member according to a first embodiment, FIG. 3 is a perspective view showing an optical member, and FIGS. 4 to 8 2 is a cross-sectional view according to various embodiments of the present disclosure, taken along line AA ′ of FIG. 2.

Hereinafter, the display device and the optical member according to the exemplary embodiment will be described with reference to FIGS. 1 to 8.

1 to 8, the liquid crystal display according to the embodiment includes a backlight unit 10 and a liquid crystal panel 20.

The backlight unit 10 emits light to the liquid crystal panel 20. The backlight unit 10 is a surface light source and can uniformly irradiate the bottom surface of the liquid crystal panel 20 with light.

The backlight unit 10 is disposed under the liquid crystal panel 20. The backlight unit 10 includes a bottom cover 100, a light guide plate 200, a reflective sheet 300, a light source such as a plurality of light emitting diodes 400, a printed circuit board 401, (500).

The bottom cover 100 has a top opened shape. The bottom cover 100 accommodates the light guide plate 200, the light emitting diodes 400, the printed circuit board 401, the reflective sheet 300, and the optical sheets 500.

The light guide plate 200 is disposed in the bottom cover 100. The light guide plate 200 is disposed on the reflective sheet 300. The light guide plate 200 emits light upward from the light emitting diodes 400 through total reflection, refraction and scattering.

The reflective sheet 300 is disposed under the light guide plate 200. More specifically, the reflective sheet 300 is disposed between the light guide plate 200 and the bottom surface of the bottom cover 100. The reflective sheet 300 reflects light emitted from the lower surface of the light guide plate 200 upward.

The light emitting diodes 400 are light sources for generating light. The light emitting diodes 400 are disposed on one side of the light guide plate 200. The light emitting diodes 400 generate light and enter the light guide plate 200 through the side surface of the light guide plate 200.

The light emitting diodes 400 may be a blue light emitting diode for generating blue light or a UV light emitting diode for generating ultraviolet light. That is, the light emitting diodes 400 may emit blue light having a wavelength range of about 430 nm to about 470 nm or ultraviolet light having a wavelength band of about 300 nm to about 400 nm.

The light emitting diodes 400 are mounted on the printed circuit board 401. The light emitting diodes 400 are disposed under the printed circuit board 401. The light emitting diodes 400 are driven by receiving a drive signal through the printed circuit board 401.

The printed circuit board 401 is electrically connected to the light emitting diodes 400. The printed circuit board 401 may mount the light emitting diodes 400. The printed circuit board (401) is disposed inside the bottom cover (100).

The optical sheets 500 are disposed on the light guide plate 200. The optical sheets 500 change or enhance the characteristics of light emitted from the upper surface of the light guide plate 200 and supply the light to the liquid crystal panel 20. [

The optical sheets 500 may be a wavelength conversion member 510, a diffusion sheet 520, a first prism sheet 530, and a second prism sheet 540.

The wavelength conversion member 510 may be disposed on an optical path between the light source and the liquid crystal panel 20. For example, the wavelength conversion member 510 may be disposed on the light guide plate 200. In more detail, the wavelength conversion member 510 may be interposed between the light guide plate 200 and the diffusion sheet 520. The wavelength conversion member 510 may convert the wavelength of the incident light and emit the light upward.

For example, when the light emitting diodes 400 are blue light emitting diodes, the wavelength conversion member 510 may convert blue light emitted upward from the light guide plate 200 into green light and red light. That is, the wavelength conversion member 510 converts a part of the blue light into green light having a wavelength band of about 520 nm to about 560 nm, and another part of the blue light having a wavelength band of about 630 nm to about 660 nm. Can be converted to red light.

In addition, when the light emitting diodes 400 are UV light emitting diodes, the wavelength conversion member 510 may convert ultraviolet light emitted from the upper surface of the light guide plate 200 into blue light, green light, and red light. That is, the wavelength conversion member 510 converts a part of the ultraviolet light into blue light having a wavelength band between about 430 nm and about 470 nm, and another part of the ultraviolet light having a wavelength band between about 520 nm and about 560 nm. Green light, and another portion of the ultraviolet light to red light having a wavelength band between about 630 nm and about 660 nm.

Accordingly, the light that is not converted and passes through the wavelength conversion member 510 and the light converted by the wavelength conversion member 510 may form white light. That is, the blue light, the green light, and the red light may be combined, and the white light may be incident on the liquid crystal panel 20.

That is, the wavelength conversion member 510 is an optical member that converts the characteristics of incident light. The wavelength conversion member 510 has a sheet shape. That is, the wavelength conversion member 510 may be an optical sheet.

As illustrated in FIGS. 2 and 3, the wavelength conversion member 510 includes a lower substrate 501, an upper substrate 502, a wavelength conversion layer 503, and a sealing unit 504.

The lower substrate 501 is disposed under the wavelength conversion layer 503. The lower substrate 501 is transparent and flexible. The lower substrate 501 may be in close contact with the lower surface of the wavelength conversion layer 503.

Examples of materials used for the lower substrate 501 include transparent polymers such as polyethylene terephthalate (PET) and the like.

The upper substrate 502 is disposed on the wavelength conversion layer 503. The upper substrate 502 is transparent and flexible. The upper substrate 502 may be in close contact with the upper surface of the wavelength conversion layer 503.

Examples of materials used for the upper substrate 520 include transparent polymers such as polyethylene terephthalate.

The lower substrate 501 and the upper substrate 502 sandwich the wavelength conversion layer 503. The lower substrate 501 and the upper substrate 502 support the wavelength conversion layer 503. The lower substrate 501 and the upper substrate 502 protect the wavelength conversion layer 503 from external physical impacts. The lower substrate 501 and the upper substrate 502 may be in direct contact with the wavelength conversion layer 503.

In addition, the lower substrate 501 and the upper substrate 502 have low oxygen permeability and moisture permeability. Accordingly, the lower substrate 501 and the upper substrate 502 can protect the wavelength conversion layer 503 from an external chemical impact such as moisture and / or oxygen.

The wavelength conversion layer 503 is interposed between the lower substrate 501 and the upper substrate 502. Preferably, the wavelength conversion layer 503 may be disposed on the central region with respect to the lower substrate 501 and the upper substrate 502. The wavelength conversion layer 503 may be in close contact with the upper surface of the lower substrate 501 and may be in close contact with the lower surface of the upper substrate 502.

The wavelength conversion layer 503 includes a plurality of wavelength conversion particles 505 and a host layer 506.

The wavelength conversion particles 505 are disposed between the lower substrate 501 and the upper substrate 502. More specifically, the wavelength conversion particles 505 are uniformly dispersed in the host layer 506, and the host layer 506 is disposed between the lower substrate 501 and the upper substrate 502.

The wavelength converting particles 505 convert the wavelength of the light emitted from the light emitting diodes 400. The wavelength conversion particles 505 receive light emitted from the light emitting diodes 400 and convert wavelengths. For example, the wavelength conversion particles 505 may convert blue light emitted from the light emitting diodes 400 into green light and red light. That is, a part of the wavelength conversion particles 505 converts the blue light into green light having a wavelength range of about 520 nm to about 560 nm, and another part of the wavelength conversion particles 505 converts the blue light to about 630 And can be converted into red light having a wavelength band of from about nm to about 660 nm.

Alternatively, the wavelength converting particles 505 may convert ultraviolet rays emitted from the light emitting diodes 400 into blue light, green light, and red light. That is, some of the wavelength converting particles 505 convert the ultraviolet light into blue light having a wavelength range of about 430 nm to about 470 nm, and another part of the wavelength converting particles 505 converts the ultraviolet light to about 520 Can be converted into green light having a wavelength band between nm and 560 nm. Further, another part of the wavelength converting particles 505 may convert the ultraviolet ray into red light having a wavelength range of about 630 nm to about 660 nm.

That is, when the light emitting diodes 400 are blue light emitting diodes that generate blue light, wavelength conversion particles 505 that convert blue light into green light and red light, respectively, may be used. Alternatively, when the light emitting diodes 400 are UV light emitting diodes that generate ultraviolet rays, the wavelength conversion particles 505 that convert ultraviolet light into blue light, green light, and red light, respectively, may be used.

The wavelength conversion particles 505 may be a plurality of quantum dots (QDs). The quantum dot may include a core nanocrystal and a shell nanocrystal surrounding the core nanocrystal. In addition, the quantum dot may include an organic ligand bound to the shell nanocrystal. In addition, the quantum dot may include an organic coating layer surrounding the shell nanocrystals.

The shell nanocrystals may be formed of two or more layers. The shell nanocrystals are formed on the surface of the core nanocrystals. The quantum dot may convert the wavelength of the light incident on the core core crystal into a long wavelength through the shell nanocrystals forming the shell layer and increase the light efficiency.

The quantum dot may include at least one of a group II compound semiconductor, a group III compound semiconductor, a group V compound semiconductor, and a group VI compound semiconductor. More specifically, the core nanocrystals may include Cdse, InGaP, CdTe, CdS, ZnSe, ZnTe, ZnS, HgTe or HgS. The shell nanocrystals may include CuZnS, CdSe, CdTe, CdS, ZnSe, ZnTe, ZnS, HgTe or HgS. The diameter of the quantum dot may be 1 nm to 10 nm.

The wavelength of the light emitted from the quantum dot can be adjusted according to the size of the quantum dot. The organic ligand may include pyridine, mercapto alcohol, thiol, phosphine, phosphine oxide, and the like. The organic ligands serve to stabilize unstable quantum dots after synthesis. After synthesis, a dangling bond is formed on the outer periphery, and the quantum dots may become unstable due to the dangling bonds. However, one end of the organic ligand is in an unbonded state, and one end of the unbound organic ligand bonds with the dangling bond, thereby stabilizing the quantum dot.

Particularly, when the quantum dot has a size smaller than the Bohr radius of an exciton formed by electrons and holes excited by light, electricity or the like, a quantum confinement effect is generated to have a staggering energy level and an energy gap The size of the image is changed. Further, the charge is confined within the quantum dots, so that it has a high luminous efficiency.

Unlike general fluorescent dyes, the quantum dots vary in fluorescence wavelength depending on the particle size. That is, as the size of the particle becomes smaller, it emits light having a shorter wavelength, and the particle size can be adjusted to produce fluorescence in a visible light region of a desired wavelength. In addition, since the extinction coefficient is 100 to 1000 times higher than that of a general dye, and the quantum yield is also high, highly fluorescent light is generated.

The quantum dot can be synthesized by a chemical wet process. Here, the chemical wet method is a method of growing particles by adding a precursor material to an organic solvent, and the quantum dots can be synthesized by a chemical wet method.

The host layer 506 surrounds the wavelength converting particles 505. That is, the host layer 506 uniformly disperses the wavelength converting particles 505 therein. The host layer 506 may be comprised of a polymer. The host layer 506 is transparent. That is, the host layer 506 may be formed of a transparent polymer.

The host layer 506 is disposed between the lower substrate 501 and the upper substrate 502. Preferably, the host layer 506 is disposed on the central region with respect to the lower substrate 501 and the upper substrate 502. The host layer 506 may be in close contact with the upper surface of the lower substrate 501 and the lower surface of the upper substrate 502.

Referring to FIG. 4, the sealing part 504 is disposed between the lower substrate 501 and the upper substrate 502. Preferably, the sealing part 504 is disposed on an outer region of the lower substrate 501 and the upper substrate 502. That is, the sealing part directly contacts the wavelength conversion layer 503 disposed on the center region with respect to the lower substrate 50 and the upper substrate 502, and the lower substrate 501 and the upper substrate ( 502 may be disposed on two outer regions. In addition, the sealing part 504 may be in close contact with the upper surface of the lower substrate 501 and the lower surface of the upper substrate 502.

Accordingly, the sealing part 504 may seal the side surface of the wavelength conversion layer 503. That is, the sealing part 504 is a protection part that protects the wavelength conversion layer 503 from external chemical and physical shock, that is, penetration of moisture or oxygen.

The sealing part 504 may include a resin. Preferably, the resin may include an acrylic resin, an epoxy resin, a urethane resin, or a silicone resin. However, the embodiment is not limited thereto, and the sealing portion may include various kinds of resins that can prevent the penetration of oxygen or moisture.

In addition, the sealing unit 504 may further include wavelength conversion particles 505. The wavelength converting particles may be particles of the same type as the wavelength converting particles 505 included in the wavelength converting layer 503 described above. The wavelength conversion particles 505 may be disposed in the resin.

In addition, the sealing part 504 may have a length of 0.1mm to 30mm. When the length of the sealing part 504 is less than 0.1 mm, it may not function as a protection part, and moisture or oxygen may penetrate into the wavelength conversion layer 503.

Referring to FIG. 5, the sealing part 504 may also include a multilayer structure. That is, the sealing part 504 may include a first sealing part 504a and a second sealing part 504b. The first sealing part 504a and the second sealing part 504b may be arranged in a line in an outer region of the lower substrate 501 and the upper substrate 502. Although only a two-layer structure is illustrated in FIG. 5, the embodiment is not limited thereto and may include a sealing unit 504 having a multilayer structure including a plurality of layers.

The first sealing part 504a may be disposed at the outermost regions of the lower substrate 501 and the upper substrate 502. In addition, the second sealing part 504b may be disposed between the wavelength conversion layer 503 and the first sealing part 504a. That is, the second sealing part 504b may be disposed in direct contact with the wavelength conversion layer 503 and the first sealing part 504a.

The first sealing part 504a and / or the second sealing part 504b may have a length of 0.1 mm to 30 mm. When the length of the first sealing part 504a and / or the second sealing part 504b is less than 0.1 mm, moisture or oxygen may penetrate into the wavelength conversion layer 503 without serving as a protective part. have.

The first sealing part 504a and / or the second sealing part 504b may also include any one of the acrylic resin, epoxy resin, urethane resin, or silicone resin described above. Preferably, the first sealing portion 504a and the second sealing portion 504b may each include a different kind of resin. In addition, the first sealing part 504a and / or the second sealing part 504b may further include a plurality of wavelength conversion particles 505.

Hereinafter, a display device and an optical member according to various embodiments will be described with reference to FIGS. 6 to 8. Detailed descriptions of parts that are the same as or similar to those of the display device and the optical member described above will be omitted for clarity and simplicity.

The wavelength conversion member according to the embodiment may include a lower substrate 501, an upper substrate 502, a wavelength conversion layer 503, and a first sealing part 504c.

Referring to FIG. 6, the first sealing part 504c may be disposed on the lower substrate 501 and / or the upper substrate 502. Preferably, the first sealing part 504c may be disposed on opposing surfaces of the lower substrate 501 and the upper substrate 502 where the lower substrate 501 and the upper substrate 502 face each other. have. The first sealing part 504c may be disposed only on any one of the lower substrate 501 and the upper substrate 502, or may be disposed on each of the lower substrate 501 or the upper substrate 502.

The first sealing part 504c may include a resin and wavelength converting particles disposed in the resin. The resin may include an acrylic resin, an epoxy resin, a urethane resin, or a silicone resin. However, the embodiment is not limited thereto, and the resin may include various kinds of resins capable of preventing the penetration of moisture or oxygen.

The first sealing part 504c may be disposed to have a thickness of 1 μm to 300 μm. When the thickness of the first sealing portion 504c is less than 1 μm, infiltration of oxygen or moisture cannot be effectively prevented, and when the thickness of the first sealing portion 504c is 300 μm or more, The thickness can be thicker and less efficient.

Referring to FIG. 7, the optical member according to the embodiment may further include a second sealing part 504d. The second sealing part 504d may be disposed on the outer regions of the lower substrate 501 and the upper substrate 502. That is, the wavelength conversion layer 503 is disposed on the central region of the lower substrate 501 and the upper substrate 502 and the second sealing portion 504d is in direct contact with the wavelength conversion layer 503. The substrate may be disposed on outer regions of the lower substrate 501 and the upper substrate 502.

The second sealing part 504d may include a resin and wavelength converting particles disposed in the resin. The resin may include an acrylic resin, an epoxy resin, a urethane resin, or a silicone resin. However, the embodiment is not limited thereto, and the resin may include various kinds of resins capable of preventing the penetration of moisture or oxygen.

The second sealing part 504d may have a length of 0.1 mm to 30 mm. When the length of the sealing portion 504d is less than 0.1 mm, the sealing portion 504d may not function as a protection portion, and moisture or oxygen may penetrate into the wavelength conversion layer 503.

In addition, referring to FIG. 8, the second sealing part 504d may include a multilayer structure. Each of these multilayer structures may include different kinds of resins. 8 illustrates only a two-layer structure, the embodiment is not limited thereto and may include a plurality of multilayer structures.

In addition, the first sealing part 504c and the second sealing part 504d may include the same type of resin or different types of resins.

The first sealing part 504c may be disposed to have a thickness of 1 μm to 300 μm. When the thickness of the first sealing portion 504c is less than 1 μm, infiltration of oxygen or moisture cannot be effectively prevented, and when the thickness of the first sealing portion 504c is 300 μm or more, The thickness can be thicker and less efficient.

In addition, the second sealing portion 504d may have a length of 0.1 mm to 30 mm. When the length of the sealing portion 504d is less than 0.1 mm, the sealing portion 504d may not function as a protection portion, and moisture or oxygen may penetrate into the wavelength conversion layer 503.

The diffusion sheet 520 is disposed on the wavelength conversion member 510. The diffusion sheet 520 improves the uniformity of the transmitted light. The diffusion sheet 520 may include a plurality of beads.

The first prism sheet 530 is disposed on the diffusion sheet 520. The second prism sheet 540 is disposed on the first prism sheet 530. The first prism sheet 530 and the second prism sheet 540 increase the straightness of light passing therethrough.

The liquid crystal panel 20 is disposed on the optical sheets 500. Further, the liquid crystal panel 20 is disposed on the panel guide 23. The liquid crystal panel 20 may be guided by the panel guide 23.

The liquid crystal panel 20 displays an image by adjusting the intensity of light passing through the liquid crystal panel 20. That is, the liquid crystal panel 20 is a display panel for displaying an image using light emitted from the backlight unit 10. [ The liquid crystal panel 20 includes a TFT substrate 21, a color filter substrate 22, and a liquid crystal layer interposed between the two substrates. In addition, the liquid crystal panel 20 includes polarizing filters.

Although not shown in detail in the drawings, the TFT substrate 21 and the color filter substrate 22 will be described in detail. The TFT substrate 21 defines pixels by intersecting a plurality of gate lines and data lines, A thin film transistor (TFT) is provided for each region and is connected in a one-to-one correspondence with the pixel electrodes mounted on the respective pixels. The color filter substrate 22 includes color filters of R, G and B colors corresponding to the respective pixels, a black matrix for covering the gate lines, the data lines, the thin film transistors, etc., .

And a driving PCB 25 for supplying a driving signal to the gate line and the data line is provided at an edge of the liquid crystal display panel 210.

The drive PCB 25 is electrically connected to the liquid crystal panel 20 by a chip on film (COF) 24. Here, the COF 24 may be changed to a TCP (Tape Carrier Package).

As described above, the sealing unit 504 may effectively seal the wavelength conversion layer 530 from the outside. Accordingly, the liquid crystal display according to the embodiment can effectively protect the wavelength conversion particles 505 from external moisture, moisture, and / or oxygen.

Accordingly, the liquid crystal display according to the embodiment may have improved reliability and durability.

In addition, the sealing part 504 may include a multi-layered structure, and may seal the wavelength conversion layer 503 by using various resins having different advantages together, thereby more effectively moisture, moisture, and / or oxygen. It is possible to prevent penetration of the back and the like, and may be disposed between the substrates to effectively seal the wavelength conversion layer 503 without increasing the thickness of the optical member.

Therefore, the liquid crystal display according to the embodiment can reduce the leakage light and have improved optical characteristics.

The features, structures, effects and the like described in the embodiments are included in at least one embodiment of the present invention and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims (20)

A first substrate;
A wavelength conversion layer disposed on the central region of the first substrate;
A sealing part disposed on an outer region of the first substrate; And
And a second substrate disposed on the wavelength conversion layer and the sealing portion. The method of claim 1,
Wherein the sealing portion comprises a resin,
The resin is an optical member comprising an acrylic resin, an epoxy resin, a urethane resin or a silicone resin. The method of claim 2,
The sealing member further comprises a plurality of wavelength conversion particles disposed in the resin. The method of claim 1,
The sealing member is disposed in the length of 0.1mm to 30mm optical member. The method of claim 1,
The sealing part includes a first sealing part and a second sealing part,
The second sealing portion is in direct contact with the wavelength conversion layer;
The first sealing portion is in direct contact with the second sealing portion,
The first sealing part and the second sealing part include any one of an acrylic resin, an epoxy resin, a urethane resin, and a silicone resin,
The first sealing portion and the second sealing portion is an optical member comprising a different resin. 6. The method of claim 5,
The first sealing part or the second sealing part further comprises a plurality of wavelength conversion particles. 6. The method of claim 5,
The first sealing portion or the second sealing portion is an optical member disposed in the length of 0.1mm to 30mm. A first substrate;
A wavelength conversion layer disposed on the first substrate; And
A second substrate disposed on the wavelength conversion layer;
In the first substrate or the second substrate,
A first sealing part disposed on an opposing surface of the first substrate and the second substrate facing each other;
The first sealing portion includes a resin,
The resin is an optical member comprising an acrylic resin, an epoxy resin, a urethane resin or a silicone resin. The method of claim 9,
The wavelength conversion layer is disposed on a central region of the first substrate,
Further comprising a second sealing portion on the outer region of the first substrate,
The second sealing portion includes a resin,
The resin is an optical member comprising an acrylic resin, an epoxy resin, a urethane resin or a silicone resin. 10. The method according to claim 8 or 9,
The first sealing part or the second sealing part further comprises a plurality of wavelength conversion particles disposed in the resin. The method of claim 8,
The first sealing part is an optical member disposed in a thickness of 1㎛ to 300㎛. The method of claim 9,
The second sealing part is an optical member disposed in the length of 0.1mm to 30mm. Light source;
A wavelength conversion member for converting the wavelength of the light emitted from the light source; And
A display panel to which light converted by the wavelength conversion member is incident;
The wavelength conversion member,
A first substrate;
A wavelength conversion layer disposed on the central region of the first substrate;
A sealing part disposed on an outer region of the first substrate; And
And a second substrate disposed on the wavelength conversion layer and the sealing portion. The method of claim 13,
The sealing portion
Suzy; And
A plurality of wavelength converting particles disposed in the resin,
The resin includes an acrylic resin, an epoxy resin, a urethane resin, or a silicone resin. The method of claim 13,
The sealing part includes a first sealing part and a second sealing part,
The second sealing portion is in direct contact with the wavelength conversion layer;
The first sealing portion is in direct contact with the second sealing portion,
The first sealing portion and the second sealing portion,
Suzy; And
It includes a plurality of wavelength conversion particles disposed in the resin,
The resin includes an acrylic resin, an epoxy resin, a urethane resin or a silicone resin,
The display device of claim 1, wherein the first sealing part and the second sealing part include different resins. The method of claim 13,
The sealing unit is disposed in the length of 0.1mm to 30mm. Light source;
A wavelength conversion member for converting the wavelength of the light emitted from the light source; And
A display panel to which light converted by the wavelength conversion member is incident;
The wavelength conversion member,
A first substrate;
A wavelength conversion layer disposed on the first substrate; And
A second substrate disposed on the wavelength conversion layer;
In the first substrate or the second substrate,
A first sealing part disposed on an opposing surface of the first substrate and the second substrate facing each other;
The first sealing portion includes a resin,
The resin includes an acrylic resin, an epoxy resin, a urethane resin or a silicone resin,
And a plurality of wavelength converting particles disposed in the resin. 18. The method of claim 17,
The wavelength conversion layer is disposed on a central region of the first substrate,
Further comprising a second sealing portion on the outer region of the first substrate,
The second sealing portion includes a resin,
The resin includes an acrylic resin, an epoxy resin, a urethane resin or a silicone resin,
And a plurality of wavelength converting particles disposed in the resin. 18. The method of claim 17,
The first sealing unit has a thickness of 1 μm to 300 μm. 18. The method of claim 17,
The second sealing unit is disposed to have a length of 0.1mm to 30mm.

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