KR101388558B1 - 기판 상의 층 형성 - Google Patents
기판 상의 층 형성 Download PDFInfo
- Publication number
- KR101388558B1 KR101388558B1 KR1020077027709A KR20077027709A KR101388558B1 KR 101388558 B1 KR101388558 B1 KR 101388558B1 KR 1020077027709 A KR1020077027709 A KR 1020077027709A KR 20077027709 A KR20077027709 A KR 20077027709A KR 101388558 B1 KR101388558 B1 KR 101388558B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- liquid composition
- layer
- solid layer
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
- B41M3/006—Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/0041—Digital printing on surfaces other than ordinary paper
- B41M5/0047—Digital printing on surfaces other than ordinary paper by ink-jet printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/0041—Digital printing on surfaces other than ordinary paper
- B41M5/0064—Digital printing on surfaces other than ordinary paper on plastics, horn, rubber, or other organic polymers
Landscapes
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Laminated Bodies (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Electrodes Of Semiconductors (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US68195005P | 2005-05-18 | 2005-05-18 | |
| US60/681,950 | 2005-05-18 | ||
| GB0510094.6 | 2005-05-18 | ||
| GBGB0510094.6A GB0510094D0 (en) | 2005-05-18 | 2005-05-18 | Formation of layers on substrates |
| PCT/GB2006/001819 WO2006123144A2 (en) | 2005-05-18 | 2006-05-16 | Formation of layers on substrates |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020137029132A Division KR20130126753A (ko) | 2005-05-18 | 2006-05-16 | 기판 상의 층 형성 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20080007639A KR20080007639A (ko) | 2008-01-22 |
| KR101388558B1 true KR101388558B1 (ko) | 2014-04-23 |
Family
ID=37431619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020077027709A Expired - Fee Related KR101388558B1 (ko) | 2005-05-18 | 2006-05-16 | 기판 상의 층 형성 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8642117B2 (enExample) |
| EP (1) | EP1891251A2 (enExample) |
| JP (1) | JP5537805B2 (enExample) |
| KR (1) | KR101388558B1 (enExample) |
| WO (1) | WO2006123144A2 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB0902398D0 (en) | 2009-02-13 | 2009-04-01 | Conductive Inkjet Tech Ltd | Diffractive optical elements |
| US7867916B2 (en) * | 2009-06-15 | 2011-01-11 | Palo Alto Research Center Incorporated | Horizontal coffee-stain method using control structure to pattern self-organized line structures |
| US8158465B2 (en) * | 2009-06-15 | 2012-04-17 | Palo Alto Research Center Incorporated | Vertical coffee-stain method for forming self-organized line structures |
| US8689123B2 (en) | 2010-12-23 | 2014-04-01 | Microsoft Corporation | Application reporting in an application-selectable user interface |
| US10353566B2 (en) | 2011-09-09 | 2019-07-16 | Microsoft Technology Licensing, Llc | Semantic zoom animations |
| US9450952B2 (en) | 2013-05-29 | 2016-09-20 | Microsoft Technology Licensing, Llc | Live tiles without application-code execution |
| CN105359055A (zh) | 2014-04-10 | 2016-02-24 | 微软技术许可有限责任公司 | 计算设备的滑盖 |
| US10592080B2 (en) | 2014-07-31 | 2020-03-17 | Microsoft Technology Licensing, Llc | Assisted presentation of application windows |
| US10678412B2 (en) | 2014-07-31 | 2020-06-09 | Microsoft Technology Licensing, Llc | Dynamic joint dividers for application windows |
| WO2017154913A1 (ja) * | 2016-03-09 | 2017-09-14 | 日産化学工業株式会社 | 感光性無電解めっき下地剤 |
| CN115992354A (zh) * | 2022-11-16 | 2023-04-21 | 浙江鑫柔科技有限公司 | 一种柔性基板上形成金属膜的方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6444019B1 (en) * | 1998-11-06 | 2002-09-03 | Videojet Technologies Inc. | Ink jet ink composition |
| US6461678B1 (en) * | 1997-04-29 | 2002-10-08 | Sandia Corporation | Process for metallization of a substrate by curing a catalyst applied thereto |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3399268A (en) * | 1966-06-07 | 1968-08-27 | Photocircuits Corp | Chemical metallization and products produced thereby |
| DE3625587A1 (de) * | 1986-07-29 | 1988-02-04 | Bayer Ag | Verfahren zur verbesserung der haftfestigkeit von stromlos abgeschiedenen metallschichten auf kunststoffoberflaechen |
| US5079600A (en) * | 1987-03-06 | 1992-01-07 | Schnur Joel M | High resolution patterning on solid substrates |
| US5227223A (en) * | 1989-12-21 | 1993-07-13 | Monsanto Company | Fabricating metal articles from printed images |
| DE4209708A1 (de) * | 1992-03-25 | 1993-09-30 | Bayer Ag | Verfahren zur Verbesserung der Haftfestigkeit von stromlos abgeschiedenen Metallschichten |
| BE1007879A3 (fr) | 1994-01-05 | 1995-11-07 | Blue Chips Holding | Resine polymerique a viscosite ajustable pour le depot de palladium catalytique sur un substrat, son procede de preparation et son utilisation. |
| JP2003073585A (ja) * | 2001-06-19 | 2003-03-12 | Hitachi Chem Co Ltd | チタニア膜形成用液体、チタニア膜の形成法、チタニア膜及び光触媒性部材 |
| JP4189532B2 (ja) | 2002-12-10 | 2008-12-03 | 奥野製薬工業株式会社 | 無電解めっき用触媒の活性化方法 |
| JP2006516818A (ja) * | 2003-01-28 | 2006-07-06 | コンダクティブ・インクジェット・テクノロジー・リミテッド | 基板上に導電性金属領域を製造する方法 |
| JP2004315718A (ja) * | 2003-04-18 | 2004-11-11 | Toyo Ink Mfg Co Ltd | インクジェット用記録液 |
| KR100529371B1 (ko) * | 2003-07-29 | 2005-11-21 | 주식회사 엘지화학 | 촉매전구체 수지조성물 및 이를 이용한 투광성 전자파차폐재 제조방법 |
| KR20060123213A (ko) * | 2003-10-29 | 2006-12-01 | 컨덕티브 잉크젯 테크놀로지 리미티드 | 기판 상의 층 형성 방법 |
| WO2005056875A2 (en) | 2003-12-05 | 2005-06-23 | Conductive Inkjet Technology Limited | Formation of solid layers on substrates |
-
2006
- 2006-05-16 US US11/920,621 patent/US8642117B2/en not_active Expired - Fee Related
- 2006-05-16 WO PCT/GB2006/001819 patent/WO2006123144A2/en not_active Ceased
- 2006-05-16 KR KR1020077027709A patent/KR101388558B1/ko not_active Expired - Fee Related
- 2006-05-16 JP JP2008511787A patent/JP5537805B2/ja not_active Expired - Fee Related
- 2006-05-16 EP EP06743918A patent/EP1891251A2/en not_active Withdrawn
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6461678B1 (en) * | 1997-04-29 | 2002-10-08 | Sandia Corporation | Process for metallization of a substrate by curing a catalyst applied thereto |
| US6444019B1 (en) * | 1998-11-06 | 2002-09-03 | Videojet Technologies Inc. | Ink jet ink composition |
Also Published As
| Publication number | Publication date |
|---|---|
| US20090047423A1 (en) | 2009-02-19 |
| JP2008541470A (ja) | 2008-11-20 |
| WO2006123144A2 (en) | 2006-11-23 |
| WO2006123144A3 (en) | 2007-03-08 |
| EP1891251A2 (en) | 2008-02-27 |
| US8642117B2 (en) | 2014-02-04 |
| JP5537805B2 (ja) | 2014-07-02 |
| KR20080007639A (ko) | 2008-01-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8519048B2 (en) | Formation of solid layers on substrates | |
| KR101388558B1 (ko) | 기판 상의 층 형성 | |
| KR20050097956A (ko) | 기판상에 도전성 금속을 형성하는 방법 | |
| US8323739B2 (en) | Method for forming a metal pattern on a substrate | |
| EP2162237A2 (en) | Method of patterning a substrate | |
| CN112219459B (zh) | 具有金属图案的成型体的制造方法 | |
| KR20190030218A (ko) | 적층체, 메탈 메시 및 터치 패널 | |
| US20050130397A1 (en) | Formation of layers on substrates | |
| TWI871283B (zh) | 印刷配線板用積層體及使用其之印刷配線板 | |
| KR102463945B1 (ko) | 배선 형성 방법 | |
| KR20130126753A (ko) | 기판 상의 층 형성 | |
| EP1689909B1 (en) | Formation of solid layers on substrates | |
| JP2007510063A (ja) | 基板上の層の形成 | |
| JP5504216B2 (ja) | 基板上の固体層の形成 | |
| CN1898413B (zh) | 基材上固体层的形成 | |
| JP7181141B2 (ja) | 下地塗料およびめっき物の製造方法 | |
| KR100783471B1 (ko) | 실리콘계 점착제 조성물, 이를 이용한 기판의 표면처리방법및 미세 패턴의 형성방법 | |
| TW202020222A (zh) | 具有金屬圖案的成形體之製造方法 | |
| CN113195788A (zh) | 包含高分子和金属微粒的非电解镀基底剂 | |
| KR20230101816A (ko) | 금속 피막 형성 방법 | |
| Yang et al. | Circuit fabrication by ink jet printing on hybrid-multilayer polyelectrolytes |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| A201 | Request for examination | ||
| AMND | Amendment | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| AMND | Amendment | ||
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
St.27 status event code: N-2-6-B10-B15-exm-PE0601 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| J201 | Request for trial against refusal decision | ||
| PJ0201 | Trial against decision of rejection |
St.27 status event code: A-3-3-V10-V11-apl-PJ0201 |
|
| A107 | Divisional application of patent | ||
| AMND | Amendment | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0104 | Divisional application for international application |
St.27 status event code: A-0-1-A10-A18-div-PA0104 St.27 status event code: A-0-1-A10-A16-div-PA0104 |
|
| PB0901 | Examination by re-examination before a trial |
St.27 status event code: A-6-3-E10-E12-rex-PB0901 |
|
| E90F | Notification of reason for final refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| B701 | Decision to grant | ||
| PB0701 | Decision of registration after re-examination before a trial |
St.27 status event code: A-3-4-F10-F13-rex-PB0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U12-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20170418 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20170418 |