KR101380621B1 - Semiconductor device testing apparatus - Google Patents

Abstract

A semiconductor device test apparatus is disclosed. According to one aspect, a socket and a socket cover portion into which a semiconductor device is inserted are provided. This configuration combines the socket and the socket cover part one-to-one to maintain electrical connection of the semiconductor device. According to another aspect, a plurality of sockets are arranged in a tester board, each socket is capable of inspecting the semiconductor device when the inserted semiconductor device is in the connection position to be electrically connected, the semiconductor device inserted into the plurality of sockets And a batch pressing structure that is pressably installed at the same time so that some or all of the portions thereof are positioned at respective connection positions of the corresponding sockets. According to the above configuration, the number of devices that can be inspected at the same time is increased, and the index time is reduced, thereby increasing inspection efficiency and productivity.

Description

Semiconductor device test device {SEMICONDUCTOR DEVICE TESTING APPARATUS}

The present invention relates to a multi-stage test head supply apparatus for a semiconductor device. More particularly, the test heads are stacked or stacked in a unit space to increase space efficiency and to extend the test quantity of the semiconductor device to a multi-stage test head. It is about how to increase the number of parallel tests by N times in a single handler facility and how to operate it.

The present invention relates to a method of using a device connector in the form of a plurality of socket covers or a socket self-binding jig without using a contactor, that is, a conventional device connector in a multi-stage test head.

The testing of conventional semiconductor devices is mainly carried out by "semiconductor device handler systems". Conventional semiconductor device handler systems use shuttles to supply and discharge semiconductor devices outside the test site. The test is performed by vacuum adsorbing the materials arranged in the shuttle to maintain electrical contact with the test socket, and the tested device is placed in the shuttle and discharged.

However, this conventional general approach increases the number of components of the contactor and the area or volume of the contactor in proportion to the increase in the number of simultaneous test materials. Therefore, the distance between the test sockets from the material transfer device is increased, which results in an increase in the time at which the test is started at the end of the test, that is, the index time. In addition, the contactor plays an essential role in the electrical connection and discharge of material transfer of the semiconductor device, but in order to maintain the electrical connection, a force for maintaining it is required. Therefore, to configure the contactor, other drive shafts and the mechanical configuration to support them are required. Under these conditions, there are limitations on the method of expansion and increase of semiconductor devices that can be simultaneously tested.

Recent trends in semiconductor device test methods have increased the number of test sockets for testing at the same time, the number of mounting boards with a large pitch (Pitch) between the test sockets. The advantage of the mounting board is that it can achieve higher cost performance than traditional high priced auto test equipment (ATE) type testers. Therefore, there is a need for a method that can increase space and productivity using a mounting tester.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described conventional problems, and provides a semiconductor device test apparatus that can test more quickly.

The present invention provides a semiconductor device test apparatus capable of testing a plurality of devices at the same time.

The present invention provides a semiconductor device test apparatus which greatly reduces the area occupied by the apparatus itself and minimizes the moving distance of the apparatus for testing.

The present invention provides a semiconductor device test apparatus according to a first embodiment, comprising: a socket capable of inspecting a semiconductor device when an inserted semiconductor device is in a connection position to be electrically connected; And a socket cover portion installed to be coupled to and detached from the socket, and including a pressing structure to be pressurized so that the inserted semiconductor device is positioned at the connection position when in a coupled state.

The socket cover portion: a cover body; A pair of latches installed on the cover body to grip both sides of the socket to maintain the coupling state; And the pressing structure installed on the cover body, wherein the pressing structure has a movable section between a pressing position and a releasing position and has a screw type for positioning the inserted semiconductor device in the connecting position when in the pressing position. Including a movable blade and a nut element mounted to the cover body, the movable blade is rotated to move in the movable section.

The present invention provides a device for testing a semiconductor device according to a second embodiment, the device comprising: a tester board having a plurality of sockets arranged thereon, each socket having a corresponding semiconductor when the inserted semiconductor device is in a connection position electrically connected thereto; Inspection of the device is possible; And an arrangement pressing structure in which part or all of the semiconductor devices inserted into the plurality of sockets are pressurized at the same time so as to be positioned at respective connection positions of the sockets.

The arrangement pressurization structure includes: an elevating plate mounted on the tester board so as to be elevated, and at least one blade installed on a lower surface of the elevating plate corresponding to some or all of the plurality of sockets.

The arrangement pressurizing structure may include: a fixed plate disposed to be coupled to the tester board at an upper portion of the elevating plate and having a plurality of bushing elements penetrating up and down; An adjusting plate disposed on the fixing plate and connected to the elevating plate through a plurality of first adjusting rods passing through the plurality of bushing elements, the adjusting plate having a plurality of through holes penetrating up and down; A ball bushing element supported by the plurality of second adjustment rods passing through the plurality of through holes and installed on the adjustment plate; And a ball screw coupled to the ball bushing element and capable of moving up and down, and having a lower end connected to the adjustment plate infinitely. The ball screw is moved up and down through the ball bushing element. The plate and the plurality of blades move together.

Preferably further includes a tester rack for supporting one or more of the tester board to a predetermined height.

The tester rack has a plurality of tester boards arranged in a longitudinal direction, and the tester rack supports each of the plurality of tester boards so as to be slidable in the transverse direction so that each tester board is outside of the tester rack. May be exposed.

The apparatus may further include a lifting device configured to lift at least one of the tester racks.

According to the present invention, since a relatively simple socket cover portion is employed, which is not a conventional handler or a logic handler contactor, the system can be implemented at low cost and the number of testers can be increased. Since the socket cover part electrically connects the semiconductor devices to the plurality of sockets in a 1: 1 manner, space utilization is improved by not installing a plurality of contacts in a vertical direction, and peripheral parts according to the expansion of the contacts. This eliminates the need for costly equipment. Moreover, even if the socket arrangement of the tester is changed, it is easy to change. In addition, since the batch pressurization structure of the present invention can simultaneously inspect a plurality of semiconductor devices, the test time can be greatly reduced, which can have a great effect in terms of cost and cost. The effect can be further magnified by the fact that the area occupied by the device itself is significantly reduced and the travel distance for testing is reduced. In addition, the tester rack and the structure of elevating the tester rack of the present invention can be carried out more quickly because the device can be placed in place at each inspection step within their operating range without variation of the devices for other inspections already installed. In addition, it enables efficient use of workplace space. In the contactor-based semiconductor device test, the output per unit time is affected by the index time (INDEX TIME), which is the test entry time after the end of the test. However, the socket cover part, the tester board, and the tester rack method employed in the present invention end the test. Since the test is based on the machine cycle time according to the time difference, the continuous tester operation according to the test time increases the number of infinite simultaneous tests.

1 is a diagram illustrating a semiconductor device test apparatus according to a first embodiment of the present invention.
2 is a cross-sectional view of the socket cover portion in the apparatus of FIG.
3 is a view showing a part of the socket cover portion in the apparatus of FIG.
4 is a diagram illustrating a semiconductor device test apparatus according to a second exemplary embodiment of the present invention.
5A and 5B are diagrams for explaining the operation of the apparatus of FIG.
6 and 7 are diagrams showing examples of the multi-stage tester rack of the present invention and its utilization.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In describing the embodiments of the present invention, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

The semiconductor device test apparatus according to the first embodiment of the present invention includes a socket 1 and a socket cover portion 2, as shown in FIG.

The socket 1 has a form in which the device insertion groove 12 into which the individual semiconductor device under test (not shown) is inserted into the socket body 11 is formed. Such a socket 1 is in a state where inspection of the semiconductor device is possible when the inserted semiconductor device is in a connection position to which it is electrically connected. In addition, the socket 1 is provided on both sides of the engaging jaw 13 to which the latch 22 of the socket cover portion 2 as described later.

The socket cover portion 2 is an element which is installed to be coupled to and detached from the socket 1, and the semiconductor device inserted into the socket when the state is engaged with the socket 1 is located in the connection position in the socket 1. Pressurized to The socket cover 2 for this includes a cover body 21, a pair of latches 22 installed on the cover body 21, and a pressing structure installed on the cover body 21.

As described above, the socket cover part 2 is an element that can be engaged with and detached from the socket 1, and is gripped so as to be caught by the latching jaws 13 of both side portions of the socket 1 by a pair of latches 22. Maintain a bond. In this coupling state, the pressing structure is operated so that the semiconductor device inserted into the socket 1 is positioned at the connection position in the socket 1 so that the inspection can be performed.

The pair of clasps 22 may be installed to rotate with elasticity toward the cover body 21 from both sides of the cover body 21, for example.

As described above, the semiconductor device is inserted into or removed from the socket 1 and the socket cover 2 is coupled to or separated from the socket 1 by an external device such as a picker and a gripper.

The pressing structure includes a screw-type movable blade 231 and a nut element 211 formed in the cover body 21. The movable blade 231 and the nut element 211 are configured such that the movable blade 231 has a movable section between the pressed position and the released position. When the movable blade 231 is in the pushed position, the semiconductor device inserted into the socket 1 is pressed and placed in the connecting position.

The movable blade 231 and the nut element 211 may be implemented in a screw and nut configuration such as a ball screw and a ball bushing, and may be other configurations.

In addition, the configuration for rotating the movable blade 231, it is also possible to directly rotate the movable blade 231, as shown in the rotatably disposed on the cover body 21 and to the cover body 21 The movable blade 231 may be rotated by rotating the rotating plate 24 having the nut hole 241 formed to communicate with the formed nut element 211. The rotating plate 24 may be provided with a pinhole 242 and a pin 243 inserted into the pinhole 242 to assist the rotation of the rotating plate 24.

In addition, as can be seen in Figure 3, under the rotating plate 24 may include a guide plate 25 that defines the rotation range of the rotating plate 24, that is, the movable section of the movable blade 231. Guide plate 25 is provided by the guide groove 251 is installed on the upper surface, the pin is inserted into the guide groove 251 on the lower surface of the rotating plate 24 corresponding to it is movable by limiting the rotation range of the rotating plate 24 The moving section of the blade 231 is defined. In other words, the movable blade 231 can be moved up and down only from the release position to the push position by the guide plate 25. Similarly, the guide plate 25 has a nut hole 242 to communicate with the nut element 211 formed in the cover body 21 and can be fixed to the cover body 21.

Therefore, in the semiconductor device test apparatus according to the first embodiment, the movable blade 231 moves in the movable section in the vertical direction by directly rotating the movable blade 231 or rotating the rotating plate 24. This moves from the release position to the push position or from the push position to the release position. When it is lowered from the release position to the pressed position, the semiconductor device, which is the object to be inserted into the socket 1, is pressed and placed in the connection position, and the test proceeds.

Hereinafter, a semiconductor device test apparatus according to a second embodiment will be described.

4 to 7 show a semiconductor device test apparatus and a tester rack according to a second embodiment of the present invention. As can be seen from the figure, the second embodiment relates to a configuration in which a test can be carried out in a batch.

In detail, the semiconductor device test apparatus according to the second exemplary embodiment may include a tester board 100 having a plurality of sockets 110 arranged thereon and a batch pressurizing structure capable of simultaneously pressing the semiconductor devices inserted into the sockets 110. ).

Each semiconductor device inserted into each of the plurality of sockets 110 can be inspected when it is in a connection position electrically connected within the socket 110.

The arrangement pressing structure 3 employed in the second embodiment is pressurized at the same time so that a part or all of the semiconductor devices inserted into the plurality of sockets 110 are located at respective connection positions of the sockets 110.

The arrangement pressurizing structure 3 includes an elevating plate 200 which is installed on the tester board 100 so as to be elevated, and one or more blades 210 installed on the lower surface of the elevating plate 200. One or more blades 210 are installed corresponding to some or all of the plurality of sockets.

Therefore, when the elevating plate 200 is elevated, at least one blade 210 installed on the lower surface of the elevating plate 200 moves up and down, so that the blade 210 moves the movable section between the pressed position and the released position. That is, when the blade 210 descends from the release position to the pressed position, the corresponding semiconductor devices inserted into the plurality of sockets 110 are pressed to be positioned at the connection position. On the contrary, when the lifting plate 200 rises, the blade 210 returns from the push position to the release position.

The lifting of the lifting plate 200 may be implemented by, for example, the following configuration.

The semiconductor device test apparatus according to the second exemplary embodiment includes a fixing plate 300 disposed above the lifting plate 200 so as to be coupled to the tester board 100 and having a plurality of bushing elements 310 penetrating up and down. Include. The fixing plate 300 is provided with a plurality of grip elements 320 that can be locked and unlocked, for example, so that the grip elements 320 can be fixed in such a manner as to grip the sides of the tester 100. Can be. Therefore, the locking plate 300 and the entire mounting pressing structure 3 may be moved and fixed on the tester board 100 through locking and unlocking of the grip element 320.

In addition, the semiconductor device test apparatus according to the second embodiment includes an adjustment plate 400 disposed on the fixed plate 300. The adjusting plate 400 is connected to the elevating plate 200 through a plurality of first adjusting rods 410 passing through the plurality of bushing elements 310. The adjustment plate 400 also has a plurality of through holes 420 penetrating up and down. Therefore, when the adjustment plate 400 is raised and lowered, the lifting plate 200 is raised and lowered together.

A ball bushing element 500 is disposed above the adjustment plate 400, and the ball bushing element 500 includes a plurality of second adjustment rods 520 passing through a plurality of through holes 420 formed in the adjustment plate 400. It is fixed to the fixing plate 300 by being supported by).

A ball screw 600 is coupled to the ball bushing element 500 so as to be shangdong, and its lower end is connected to the adjustment plate 400. Therefore, when the ball screw 600 is lifted, the adjustment plate 400 is lifted. To this end, preferably, the ball screw 600 may be coupled to the adjustment plate 400 to rotate indefinitely.

5A and 5B, when the ball screw 600 rotates and descends through the ball bushing element 500, a plurality of adjustment plates 400, a lifting plate 200, and a bottom of the lifting plate 200 are installed. When the blade 210 moves downward from the release position to the pressing position, the blade 210 is positioned at the connection position by pressing the semiconductor device inserted into the corresponding socket 110. On the contrary, when the ball screw 600 rotates and rises, the plurality of blades 210 installed on the lower surface of the adjusting plate 400, the lifting plate 200, and the lifting plate 200 rises, and the blade 210 is pressed. It will rise from the position to the release position.

Thereafter, the grip element 320 may be unlocked to move the above-described arrangement pressing structure 3 including the fixing plate 300 to another position of the tester board 100 so as to inspect other semiconductor devices. At this time, the picker separates the inspected semiconductor device from the socket 110 and moves it.

Preferably, the present invention includes a tester rack 100 and a batch pressurizing structure as shown in FIGS. 6 and 7 including a tester rack capable of supporting a plurality of semiconductor device test apparatuses of the second embodiment described above. (3) can be laminated and used in multiple layers. That is, the tester rack 700 may preferably support the arrangement pressing structure including the tester board 100 described above in the longitudinal direction. Tester board 100 is arranged in a multi-layer in the tester rack 700, the cylinder 31 for moving each tester board 100 forward and backward are disposed respectively. The cylinder 31 is exposed from the tester rack 700 by sliding movement in order to mount or detach the device to be inspected on the tester board 100. In addition, even when the test is in progress, the individual tester board 100 is exposed from the tester rack 700 can be tested by operating the batch pressing structure (3) by the pressing means (not shown). In addition, it is also possible to further provide a pressurized structure inside the tester rack 700 so that the tester board 100 can be inspected while being positioned inside the tester rack 700.

In addition, as can be seen in FIG. 7, one or more of the tester racks 700 may be mounted, for example, to be elevated in the elevator 4. In this case, the tester rack 700 can be positioned in stages quickly within the operating range of the equipment for inspection of pre-installed handlers, pickups, pressurization devices, etc., by moving in the elevator 4. have.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments.

1, 110: socket 2: socket cover
3: batch pressurized structure 11: socket body
12: Device insertion groove 13: Jamming jaw
21: cover body 22: latch
24: rotating plate 25: guide plate
100: tester board 200: elevating plate
210: blade 211: nut element
231: movable blade 300: fixed plate
310: bushing element 320: grip element
400: adjustment plate 410: first adjustment rod
420: through hole 500: ball bushing element
520: second adjusting rod 600: ball screw
700: tester rack

Claims (8)

delete delete In the semiconductor device test apparatus:
A tester board in which a plurality of sockets are arranged, each socket capable of inspecting the semiconductor device when the inserted semiconductor device is in a connection position to which it is electrically connected; And,
And a batch pressing structure in which part or all of the semiconductor devices inserted into the plurality of sockets are pressurized at the same time so as to be positioned at respective connection positions of the sockets.
The batch pressurized structure is:
It includes a lifting plate which is installed on the tester board to be elevated, and at least one blade installed on the lower surface of the lifting plate corresponding to some or all of the plurality of sockets,
Semiconductor device test apparatus.
delete The system of claim 3, wherein the batch pressurization structure is:
A fixed plate disposed to be coupled to the tester board at an upper portion of the elevating plate and having a plurality of bushing elements penetrating upward and downward;
An adjusting plate disposed on the fixing plate and connected to the elevating plate through a plurality of first adjusting rods passing through the plurality of bushing elements, the adjusting plate having a plurality of through holes penetrating up and down;
A ball bushing element supported by the plurality of second adjustment rods passing through the plurality of through holes and installed on the adjustment plate; And
And a ball screw coupled to the ball bushing element so as to be movable, and having a lower end connected to the adjustment plate infinitely.
When the ball screw is moved through the ball bushing element, the adjustment plate, the lifting plate, and the plurality of blades are moved together,
Semiconductor device test apparatus.
The method according to any one of claims 3 to 5,
Further comprising a tester rack for supporting one or more of the tester board to a predetermined height,
Semiconductor device test apparatus.
The method of claim 6,
The tester rack is arranged in a plurality of longitudinal tester boards arranged,
The tester rack is to support each of the plurality of tester boards to be movable in the transverse direction to expose each tester board to the outside of the tester rack,
Semiconductor device test apparatus.
The method of claim 7,
It further comprises a lifting device for mounting and lifting one or more of the tester rack,
Semiconductor device test apparatus.

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