KR101368998B1 - Selective filling method of insulating material on circuit board by surface treatment - Google Patents

Abstract

In the method of half-etching one side of the conductive raw material and filling the insulating material in the etching site, the method of filling the insulating material in the circuit board to minimize the inefficiency according to the front work and to have high reliability in a simple manner Is initiated. The present invention provides a method of filling an insulating material in a circuit board in which at least one groove and a bump are formed on a conductive raw material and is surface treated to selectively fill an insulating material only in the groove. A method of filling an insulating material in a circuit board, which is carried out by treatment and hydrophilic treatment on the exposed side of the bump, and after the surface treatment is applied a hydrophobic insulating material to selectively fill the insulating material only in the grooves.

Description

Selective FILLING METHOD OF INSULATING MATERIAL ON CIRCUIT BOARD BY SURFACE TREATMENT

The present invention relates to a method of filling an insulating material in a circuit board, and more particularly, to the filling, excluding the method of applying the entire surface to the substrate surface including the filling element when filling the insulating material to the filling element of the circuit board, such as a printed circuit board. A method of selectively filling only elements.

In general, semiconductor device technology has been developed in pursuit of miniaturization and high density at low cost, and various types of semiconductor devices have been developed and used accordingly. In particular, in recent years, the proliferation of portable devices such as notebook computers, digital video cameras, mobile phones, and the like, has made importance of miniaturization and light weight of each semiconductor device.

In line with this trend, so-called chip scale packages (CSPs) among semiconductor devices are centered around products that are an extension of lead on chip (LOC) technology or ball grid array (BGA) technology. In addition, various solutions are introduced to implement existing BGA substrates at lower cost. Among them, there is a method of half-etching one side of the conductive element material, filling an insulator in the etching portion, curing the half, and half-etching the other side again to implement a rewired circuit. For example, in Korean Patent Laid-Open No. 2011-0021407, as shown in FIG. 1, a conductive base substrate 10 is prepared (FIG. 1A) and at least one surface is etched according to a predetermined pattern to form a base pattern layer. (11) is formed (FIG. 1 (b)), the etched portion 12 of one surface of the base pattern layer 11 is filled with the insulating material 13 (FIG. 1 (c)), and the pattern layer 11 Disclosed is a method of fabricating a semiconductor package including removing the insulating material 13 formed on the substrate) to form the support 14 (FIG. 1D). This method is an inexpensive solution that maintains the shape of BGA, and has advantages in thermal and electrical properties than conventional organic-based BGA substrate.

This process is a technical constraint that is not considered in conventional BGA substrate manufacturing, and particularly involves a frontal treatment process of filling insulating material and polishing the coated insulating material higher than the thickness of the raw material through polishing equipment such as a brush. do. 2 is a cross-sectional view illustrating a method of half-etching one side of a conductive element material known to date and filling an insulating material in an etching site. First, FIG. 2 (a) shows a general method of applying an insulating material, and the insulating material 13 is applied to the empty space of the half-etched raw material 10 to be thicker than the raw material, and also on the surface of the raw material not subjected to half etching. Difficulties arise in the application of the frontal brush. In addition, as shown in Fig. 2 (b), after the insulating material 13 is applied in a general manner, the thickness of the resin on the surface of the raw material can be reduced through additional equipment such as a doctor blade or a knife. However, there is a disadvantage in that the thickness of the insulating material 13 filled in the half-etched space as well as the surface of the raw material 10 that is not half-etched is reduced. In addition, Figure 2 (c) shows an insulating material filling method using a screen mask, this method has a disadvantage in that the filling speed of the insulating material 13 is slower than the front coating method, but by forming a pattern in the mask to fill the insulating material Overfilled parts can be controlled. However, in order to completely unapply the insulating material on the raw material 10, optimization is required depending on the application method and mask conditions. On the other hand, when the partial insulating material 13 may be applied, such as a screen mask, a step of the thickness of the insulating material 13 applied onto the raw material 10 may be formed as compared to the front coating method. Easier frontal work can be achieved than if applied.

As described above, in the method of half-etching one side of the conductive raw material and filling an insulating material in the etching site, it is required to develop a filling method having a high reliability in a simple manner while minimizing the inefficiency according to the front work. have.

Accordingly, the present invention provides a method for half-etching one side of a conductive raw material and filling an insulating material in an etching site, and in a circuit board that has high reliability in a simple manner while minimizing inefficiency due to frontal operation. An object of the present invention is to provide an insulating material filling method.

According to an aspect of the present invention for solving the above problems, by forming an at least one groove and bump in the conductive raw material and surface-treated by filling the insulating material only in the groove, the insulating material filling method in the circuit board, Surface treatment is performed by hydrophobic treatment on the exposed surface of the groove and hydrophilic treatment on the exposed surface of the bump, and after the surface treatment, a hydrophobic insulating material is applied so that the insulating material is selectively filled only in the groove. The present invention provides a method for filling insulating materials.

In addition, the method comprises the steps of: (a) forming a photo solder resist layer on one surface of the conductive element material and forming the grooves and bumps by exposure, development and half etching according to a predetermined pattern; (b) hydrophobic treatment using a hydrophobic material on one surface of the grooves and bumps; (c) removing the photo solder resist layer; (d) hydrophilic treatment using a first hydrophilic material on one surface of the grooves and bumps; And (e) applying a hydrophobic insulating material to one surface of the grooves and bumps to fill the insulating material only with the grooves.

According to another aspect of the present invention for solving the above problems, a step of hydrophilic treatment using a second hydrophilic material to increase the hydrophilicity of the surface of the conductive raw material material before the step (a); An insulating material filling method in a circuit board is provided.

In addition, the second hydrophilic material is a silane coupling agent (silane coupling agent) (mercaptoalkanoic acid) (mercaptoalkanoic acid), cysteine (cysteine), alcandithiol (alcanedithiol) and aminothiophenol (aminothiophenol) selected from the group consisting of Provided is an insulating material filling method in a circuit board characterized in that the species or more.

In addition, in the step (c) it provides a method for filling an insulating material in a circuit board, characterized in that using a non-alkaline organic solvent.

In addition, the hydrophobic material of step (b) is a circuit board, characterized in that at least one selected from the group consisting of alkanethiol (alkanethiol), alkyl silane (alkyl silane), halogenated alkyl silane (halogenated alkyl silane) and anionic surfactant The present invention provides a method for filling insulating materials.

According to another aspect of the present invention for solving the above problems, the method, (A) forming a photo solder resist layer on one surface of the conductive raw material and exposed, developed and half-etched according to a predetermined pattern to the grooves and bumps Forming a; (B) removing the photo solder resist layer; (C) hydrophobic treatment using a hydrophobic material that can be changed to hydrophilic by a photoreaction on one surface of the groove and bump; (D) exposing using a mask pattern prepared to be exposed only to the bumps; (E) hydrophilic treatment using a first hydrophilic material on one surface of the groove and bump; And (F) filling an insulating material with only the groove by applying a hydrophobic insulating material to one surface of the groove and the bump, thereby providing an insulating material filling method in a circuit board.

In addition, the hydrophobic material of the step (C) provides an insulating material filling method in a circuit board, characterized in that the azobenzene derivatives (azobenzene derivatives).

In addition, the photo solder resist layer is formed by laminating a dry film photoresist provides an insulating material filling method in a circuit board.

In addition, the first hydrophilic material provides a method for filling an insulating material in a circuit board, characterized in that the moisture.

The hydrophobic insulating material application also provides a method for filling insulating material in a circuit board, characterized in that the first hydrophilic material on the bump is carried out simultaneously with the air blowing of the strength to prevent evaporation.

In addition, the step of imparting a roughness to the exposed surface of the groove prior to the hydrophobic treatment provides a method for filling an insulating material in a circuit board.

In addition, the surface roughness (Ra) of the exposed surface of the groove to which the roughness is provided provides an insulating material filling method in a circuit board, characterized in that 500 ~ 5000Å.

In addition, the roughening is provided with a method of filling an insulating material in a circuit board, characterized in that the plating is carried out by the same material as the conductive material or micro-etched.

According to the present invention, the insulating material may be simply filled in only the grooves by applying the insulating material after the hydrophobic treatment and the hydrophilicity treatment of the grooves and the bumps formed in the conductive element material, respectively.

In addition, by preventing the application of the insulating material on the bumps, it is possible to significantly reduce the amount of wear of the front equipment such as brushes to reduce the cost or improve productivity.

In addition, as the number of front faces decreases, the exposed surface may be formed more homogeneously and flatly, thereby providing a circuit board having excellent reliability.

1 is a cross-sectional view sequentially showing a method of manufacturing a circuit board using a conventional conductive raw material;
2 is a cross-sectional view illustrating a method of half-etching one side of a conventional conductive element material and filling an insulating material in an etching site;
3 is a flowchart for explaining a method of filling an insulating material in a circuit board according to a first embodiment of the present invention;
4 is a cross-sectional view sequentially showing a circuit board manufactured according to the first embodiment of the present invention;
5 is a flowchart illustrating a method of filling an insulating material in a circuit board according to a second embodiment of the present invention;
6 is a cross-sectional view sequentially showing a circuit board manufactured according to a second embodiment of the present invention;
7 is a flowchart illustrating an insulating material filling method in a circuit board according to a third embodiment of the present invention.
8 is a cross-sectional view sequentially showing a circuit board manufactured according to the third embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In the drawings, parts irrelevant to the description are omitted for clarity, and like reference numerals refer to like parts throughout the specification, and the up and down directions of the substrate will be described with reference to the drawings. Also, throughout the specification, when an element is referred to as "comprising ", it means that it can include other elements, not excluding other elements, unless specifically stated otherwise.

First Embodiment

3 is a flowchart illustrating a method of filling an insulating material in a circuit board according to a first embodiment of the present invention, and FIG. 4 is a cross-sectional view sequentially illustrating a circuit board manufactured according to the first embodiment of the present invention.

3 and 4, in the insulating material filling method of the circuit board 100 according to the first embodiment of the present invention, (a) a photo solder resist layer 120 is formed on one surface of the conductive raw material 110. Indentation 111 and bump 112 formation (S101), hydrophobic surface 130 treatment (S102), photo solder resist layer 120 removal (S103), hydrophilic surface 140 treatment (S104) and insulating material 150 ) Filling (S105). Hereinafter, each step will be described in detail.

First, as shown in FIGS. 4A and 4B, the photo solder resist layer 120 is formed on one surface of the conductive raw material 110 and exposed, developed, and half-etched according to a predetermined pattern to form a groove ( 111 and bumps 112 are formed (S101). The conductive raw material 110 is not particularly limited as long as it is a material that realizes electrical conduction as a metal material, but may be essentially a material made of copper or a copper alloy prepared by mixing nickel, silicon, phosphorus, and the like.

The photo solder resist layer 120 may be formed by applying and drying a liquid photo resist (LPR) or laminating a dry film photoresist (DFR) at a predetermined pressure. In consideration of the thickness uniformity of the formed resist layer 120 and the resolution during exposure, it is preferable to use DFR.

When laminating using the DFR 120, when the coating thickness of the insulating material 150 is based on 5 ~ 100㎛, it may be laminated to a thickness of 10 ~ 100㎛, preferably 20 ~ 50㎛.

The exposure and development are to form a mask having a predetermined pattern on the photo solder resist layer 120 having photosensitive characteristics. In FIG. 4A, exposure and development are performed on one surface of the conductive raw material 110. Although an example is shown, the conductive material material 110 may be performed on both surfaces.

The exposure may be performed by irradiating UV or the like, and the exposure intensity may be performed at a light amount of 50 to 300 mJ / cm 2, preferably 70 to 200 mJ / cm 2 when the DFR 120 is laminated to the desired thickness. .

As shown in FIG. 4B, the half etching is a step of half etching the conductive raw material surface 113 exposed by the developing process to form the recess 111 and the bump 112. The bumps 112 serve as electrical conduction between circuit patterns formed on the front and rear surfaces of the circuit board.

Meanwhile, the photo solder resist layer 120 does not exist on the recess 111 by the half etching.

Next, the hydrophobic surface treatment step S102 is performed on the groove 111 and the photo solder resist layer 120 using a hydrophobic material 130 as shown in FIG. 4C. It's a step. The hydrophobic treatment may be performed by coating using a chemical agent having hydrophobic property, etc., but the exposed surface of the photo solder resist layer 120 on the grooves 111 and the bumps 112 may be hydrophobic. There is no particular limitation as long as it is possible to exhibit surface properties.

As the hydrophobic material 130, for example, alkanethiol, alkyl silane, halogenated alkyl silane, anionic surfactant, and the like may be used. Specifically, the alkane thiol may be used alkane thiol having 7 to 21 carbon atoms, preferably hexadecanethiol, octadecanethiol (octadecanethiol) may be used. In addition, the alkylsilane may be tetraethylsilane (triethylsilane), triethylsilane (triethylsilane), triisopropylsilane (triisopropylsilane), tetramethylsilane (tetramethylsilane) and the like. In addition, as the halogenated alkyl silane, fluorotrimethylsilane, bromotrimethylsilane, or the like may be used. In addition, as the anionic surfactant, a phosphate-based surfactant, a sulfonate-based surfactant, or the like may be used. However, the degree of super water-repellent surface treatment to be described later, the degree of removal of the hydrophobic material 130 according to the curing conditions of the insulating material 150 filled in the groove 111, the resistance to the photosolder resist layer 120 removal solution It will be necessary to select the hydrophobic material 130 to be treated in consideration of such.

On the other hand, in order to give a stronger effect of the hydrophobic surface treatment on the exposed surface of the groove 111 and a strong anchor effect between the insulating material 150 and the raw material 110 to be filled in a subsequent process, Roughness may be forcibly formed (not shown) on the surface where the recess 111 is exposed before the hydrophobic treatment. At this time, the surface roughness (Ra) of the exposed surface of the groove 111 formed with roughness is preferably about 500 ~ 5000Å, the surface energy by the hydrophobic material 130 used in the hydrophobic surface treatment in the surface roughness range Since it is lowered, even after applying the hydrophilic material 140, such as water, it is possible to form a super water-repellent surface that does not wet the hydrophilic material 140. This super water-repellent surface is not affected by the subsequent photo solder resist layer 120 removal process.

Although not particularly limited to the method of forming the roughness surface, a micro etching process may be applied, and a roughness plating process of a material such as a material of the raw material 110 may be preferably applied to improve reliability. have. For example, when copper is used as the conductive element material 110, the rough copper plating process may be performed, and when nickel is used as the conductive element material 110, the rough nickel plating process may be performed.

As shown in FIG. 4 (d) after the hydrophobic treatment, the photo solder resist layer 120 is removed (S103) to expose the conductive element surface of the bump 112 to the outside. At this time, the hydrophobic treatment is performed only on the groove 111 surface, and the exposed surface of the bump 112 is not in a hydrophobic treatment.

Next, the hydrophilic surface treatment step (S104), as shown in FIG. 4E, is performed by using a first hydrophilic material 140 on one surface of the groove 111 and the bump 112. It's a step. Here, since the surface of the conductive element 110 such as copper and nickel exhibits hydrophilic properties in a natural state, the first hydrophilic material 140 is present on the surface where the bump 112 is exposed during the hydrophilic treatment. The first hydrophilic material 140 is hardly present because the groove 111 is exposed to the hydrophobic treatment 130. The hydrophilic treatment may be performed by applying a material having hydrophilic properties, and the method may be particularly limited as long as the exposed surface of the bump may exhibit hydrophilic surface properties such as coating, spraying, and dipping. no.

Since the first hydrophilic material 140 is sufficient to impart a characteristic distinguished from the hydrophobic groove 111, it is preferable to use water that is easily available.

Next, the insulating material filling step (S105), as shown in Figure 4 (f), by applying the insulating material 150 on the groove 111 and the hydrophilic surface-treated bump 112, the groove 111 ) Only filling the insulating material 150. That is, in the present invention, the insulating material 150 has a hydrophobic property and is not applied on the bump 112 but is filled only in the groove 111 having similar surface properties. Specifically, the application of the hydrophobic insulating material 150 is performed simultaneously with the air blowing of the strength so that the first hydrophilic material 140 on the bump 112 is not evaporated, so that the insulating material 150 is formed in the groove 111. Can only be filled. That is, while the hydrophilic material 140 that may be present in the groove 111 is blown, the hydrophilic material 140 present on the surface of the bump 112 that is hydrophilic may be subjected to an air knife or the like under conditions that do not evaporate. By filling the air while blowing, the insulating material 150 may be filled only in the recess 111 without the insulating material 150 being applied to the surface of the bump 112 that is hydrophilic.

As such, the insulating material 150 is filled and cured only in the recess 111 to form the filling part 150, and the filling part 150 supports the conductive raw material 110 as a whole. By replacing the core material such as FR-4 (flame retardant composition 4), BT (bisaleimide triazine) of the conventional copper clad laminate. Here, the curing of the filled insulating material 150 may be performed for 30 to 100 minutes at a temperature of 150 ~ 250 ℃, because the hydrophobic material 130 surface-treated during curing the insulating material 150 is volatilized by heat When the half-etched groove 111 surface and the insulating material 150 are bonded or bonded to each other, there is no problem.

On the other hand, the height of the filling portion 150 formed after the curing may be formed at the same height or higher than the surface (bump surface) of the raw material 110, but when the volume shrinkage (hard volume shrinkage) during hardening raw material 110 It may be formed lower than the face. When the insulating material 150 filled by the volume shrinkage is formed lower than the surface of the raw material 110 or the same height as the surface of the raw material 110, a separate front brush treatment is not required. 150) Although the filling height is formed higher than the surface of the raw material 110, since the filled form is the same as the case filled with the screen mask, it is easier to face the surface than the case where the insulating material 150 is applied over the entire surface. Flattening operation is possible.

Although not particularly limited to the insulating material 150, a polymer resin having hydrophobic properties is generally used, and a material having good insulating properties and adhesion to the conductive element 110 and having a good rigidity and handling properties when cured is used. Can be. For example, a molding resin such as an epoxy mold compound (EMC), or a photosensitive polymer resin such as a photo solder resist may be used.

The insulating material 150 may be applied using a known coating method. For example, thin film coating may be implemented using a coating technique such as comma coater, screen printing, squeeze coater, slit coater, or injection.

When the filling part 150 is formed higher than the surface of the bump 112 after the filling and curing, the surface of the bump 112 and the filling part are formed by fronting the cured insulating material 150 on the groove 111. 150) planarizing the surface may be further performed. According to the present invention, the face treatment may be such that even two face treatment steps, and preferably only one step, achieve very uniform surface accuracy to flatness. The front treatment may be performed by a known method, for example, a mechanical front process using a buffer brush, a ceramic brush, or the like, or an etching process using a chemical agent.

Second Embodiment

5 is a flowchart illustrating a method of filling an insulating material in a circuit board according to a second embodiment of the present invention, and FIG. 6 is a cross-sectional view sequentially illustrating a circuit board manufactured according to the second embodiment of the present invention.

5 and 6, a method of filling an insulating material in a circuit board 200 according to a second embodiment of the present invention may include (a1) hydrophilic surface 260 treatment (S200) and (a2) conductive raw material 210. ) After forming the photo solder resist layer 220 on one surface, the grooves 211 and the bumps 212 are formed (S201), (b) the hydrophobic surface 230 treatment (S202), and (c) the photo solder resist layer 220 is removed. (S203), (d) hydrophilic surface 240 treatment (S204) and (e) insulating material 250 filling (S205). In the method according to the second embodiment of the present invention, all steps except for step (a1) are applied in the same manner as in the first embodiment, and will be described below with a different configuration from the first embodiment.

Unlike the first embodiment, the method of filling the insulating material 250 in the circuit board 200 according to the second embodiment is as shown in FIG. 6A before the formation of the photo solder resist layer 220 (S201). The method may further include performing a hydrophilic treatment using the second hydrophilic material 260 to increase the hydrophilicity of the surface of the conductive raw material 210 (S200). As described above, in the present invention, the surface of the pure raw material 210 also has hydrophilic properties, but the raw material 210 is treated to have a stronger hydrophilic property, which is subsequently followed by (d) the first hydrophilic material 240. During the hydrophilic treatment (S204, see FIG. 6 (f)), it becomes easier to have the hydrophilic material 240 exist only on the surface where the bump 212 is exposed, and the bump to which the second hydrophilic material 260 is coated is applied. (212) The adhesion between the surface and the first hydrophilic material 240 is further improved, further preventing the first hydrophilic material 240 from evaporating during blowing in the subsequent insulating material 250 filling process (S205), Allow easy filling.

The hydrophilic treatment (S200) may be performed by applying a material using the material 260 having hydrophilic properties, and may make the hydrophilic property of the surface of the conductive element 210 such as coating, spray, or immersion stronger. If so, it is not particularly limited.

As the second hydrophilic material 260, for example, a silane coupling agent, a mercaptoalkanoic acid, cysteine, alcanedithiol, aminothiophenol, etc. As the silane coupling agent, cyanoalkylsilane, acetoxyalkylsilane, hydroxyalkylsilane, carboxyalkylsilanetriol sodium salt, imida Imidazolinalkylsilane, trihydroxysilyl-1-propanesulfonic acid, trihydroxysilylpropylmethylphosphonate, epoxy functional silane and the like can be used. have.

Meanwhile, when the photo solder resist layer 220 is formed after the photo solder resist layer 220 is formed in FIG. 6B, the second hydrophilic material 260 between the photo solder resist layers 220 to be developed is hydrophilic. By nature it can be easily removed by the developing solution.

In addition, when the general alkaline solution is used as the peeling solution used to remove the photo solder resist layer 220 in step (c) (S203, see FIG. 6 (e)), the photo solder resist layer 220 may be peeled off. 2 Since the coating film 260 by the hydrophilic material can also be removed, it is preferable to use a non-alkaline organic solvent. Since the non-alkaline organic solvent has a non-polarity, repelling force may be generated with the hydrophilic coating film 260 to prevent the removal of the hydrophilic coating film 260.

Third Embodiment

7 is a flowchart illustrating a method of filling an insulating material in a circuit board according to a third embodiment of the present invention, and FIG. 8 is a cross-sectional view sequentially illustrating a circuit board manufactured according to a third embodiment of the present invention.

7 and 8, in the insulating material filling method of the circuit board 300 according to the third embodiment of the present invention, (A) after the photo solder resist layer 320 is formed on one surface of the conductive raw material 310. Formation of grooves 311 and bumps 312 (S301), (B) photo solder resist layer 320 removal (S302), (C) hydrophobic surface 330 treatment (S303), (D) mask pattern 370 Exposure (S304), (E) hydrophilic surface 340 treatment (S305), and (F) insulating material 350 filling (S306) using the following steps. Hereinafter, a configuration different from the first embodiment will be mainly described.

In the method of filling the insulating material 350 in the circuit board 300 according to the third embodiment, the process of performing the hydrophobic surface 330 treatment on the groove 311 is different from that of the first embodiment. That is, in the first embodiment, the recess 111 and the bump 112 are formed in the conductive raw material 110 (S101), the hydrophobic treatment 130 is performed (S102), and then the photo solder resist layer 120 is removed. However, in the third embodiment, the photo solder resist layer 320 is removed (S302) and then hydrophobic treatment is performed (S302). At this time, the hydrophobic surface treatment methods S303 and S304 are different from the first embodiment and the second embodiment, and will be described in detail below.

In step (B), as shown in FIG. 8B, the photo solder resist layer 320 is removed (S302) to expose the surface of the exposed raw material 310 of the grooves 311 and the bumps 312. Subsequently, as shown in FIG. 8 (c), a hydrophobic material that can be changed to hydrophilicity by photoreaction on the surface on which the grooves 311 and the bumps 312 are formed is referred to as 'photoconductive material' 380) (S303). The photoconductive material 380 is a material whose chemical structure is changed when hydrophobic property is changed to hydrophilic property when it receives light such as UV. First, the grooves 311 and bumps are treated by the photoconductive material 380. The hydrophobic photoconductive material 380 is formed on the layer 312, and only a portion of the photoconductive material layer 380 that receives light by the subsequent photoreaction S304 is changed to hydrophilic.

An exposure process S304 for changing a portion of the photoconductive material layer 380 into hydrophilicity is performed by using a mask pattern 370 prepared to be exposed only to the bumps 312, as shown in FIG. 8D. The bump 312 surface is converted into a surface having hydrophilic properties (corresponding to the second hydrophilic material 260 of the second embodiment), and the groove 311 surface is The surface 330 having hydrophobic properties is maintained as it is.

The hydrophobic treatment by the photoconductive material 380 may be performed by coating using the photoconductive material 380, but the exposed surfaces of the grooves 311 and the bumps 312, such as spraying and dipping, are exposed. It is not particularly limited as long as it is a way that it can exhibit the surface properties of the hydrophobic.

For example, azobenzene derivatives may be used as the photoconductive material 380, and specifically 7-[(trifluoromethoxyphenylazo) phenoxy] pentanoic acid (7-[(trifluoromethoxyphenylazo) phenoxy pentanoic acid) can be used.

Thereafter, the steps (E) (S305) and (F) (S306) are performed in the same manner as the steps (d) (S104) and (e) (S105) of the first embodiment to obtain the insulating material 350. Only the groove 311 may be filled.

On the other hand, the method of filling the insulating material in the circuit board according to the third embodiment of the present invention, in comparison with the method according to the first and second embodiments, in the hydrophobic surface treatment only in the selective region, It has the advantage of distinguishing the selective areas with precision. However, a process of separately preparing and exposing a mask pattern after the photoconversion material is added and the use of expensive special chemicals that react to light such as UV increases, thereby increasing the process cost compared to the method according to the first embodiment. Considering the process cost-effectiveness, the method according to the first embodiment will be more advantageous.

The preferred embodiments of the present invention have been described in detail with reference to the drawings. It will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the appended claims.

Accordingly, the scope of the present invention is defined by the appended claims rather than the foregoing detailed description, and all changes or modifications derived from the meaning, range, and equivalence of the claims are included in the scope of the present invention Should be interpreted.

100, 200, 300: circuit board 110, 210, 310: conductive raw material
111, 211, 311: Groove 112, 212, 312: Bump
120, 220, 320: photo solder resist layer 130, 230, 330: hydrophobic material (surface)
140, 240, 340: first hydrophilic material (surface) 150, 250, 350: insulating material, filling part
260, 360: second hydrophilic material (surface) 370: mask pattern
380: photoconductive material

Claims (14)

delete An insulating material filling method in a circuit board in which at least one groove and a bump are formed on a conductive raw material and the surface is treated to selectively fill an insulating material only in the groove, wherein the surface treatment is performed by hydrophobic treatment on the exposed surface of the groove and the A method of filling an insulating material in a circuit board which is carried out by hydrophilic treatment on the exposed surface of the bump, and after applying the hydrophobic insulating material after the surface treatment, so that the insulating material is selectively filled only in the grooves, the method includes:
(a) forming a photo solder resist layer on one surface of the conductive raw material and exposing, developing and half etching the grooves and bumps according to a predetermined pattern;
(b) hydrophobic treatment using a hydrophobic material on one surface of the grooves and bumps;
(c) removing the photo solder resist layer;
(d) hydrophilic treatment using a first hydrophilic material on one surface of the grooves and bumps; And
(e) filling the insulating material with only the groove by applying a hydrophobic insulating material to one surface of the groove and the bump;
Method for filling an insulating material in a circuit board comprising a. 3. The method of claim 2,
And hydrophilic treatment using a second hydrophilic material to increase the hydrophilicity of the surface of the conductive element material prior to the step (a). The method of claim 3,
The second hydrophilic material is at least one selected from the group consisting of a silane coupling agent, a mercaptoalkanoic acid, a cysteine, an alcanedithiol, and an aminothiophenol. A method for filling insulating materials in a circuit board, characterized in that. The method of claim 3,
Method for filling an insulating material in a circuit board, characterized in that using the non-alkaline organic solvent in the step (c). The method according to claim 2 or 3,
The hydrophobic material of step (b) is at least one member selected from the group consisting of alkanethiol, alkyl silane, halogenated alkyl silane and anionic surfactant. How to fill insulating material. An insulating material filling method in a circuit board in which at least one groove and a bump are formed on a conductive raw material and the surface is treated to selectively fill an insulating material only in the groove, wherein the surface treatment is performed by hydrophobic treatment on the exposed surface of the groove and the A method of filling an insulating material in a circuit board which is carried out by hydrophilic treatment on the exposed surface of the bump, and after applying the hydrophobic insulating material after the surface treatment, so that the insulating material is selectively filled only in the grooves, the method includes:
(A) forming a photo solder resist layer on one surface of the conductive raw material and forming the grooves and bumps by exposure, development and half etching according to a predetermined pattern;
(B) removing the photo solder resist layer;
(C) hydrophobic treatment using a hydrophobic material that can be changed to hydrophilic by a photoreaction on one surface of the groove and bump;
(D) exposing using a mask pattern prepared to be exposed only to the bumps;
(E) hydrophilic treatment using a first hydrophilic material on one surface of the groove and bump; And
(F) filling the insulating material with only the grooves by applying a hydrophobic insulating material to one surface of the grooves and bumps;
Method for filling an insulating material in a circuit board comprising a. 8. The method of claim 7,
The hydrophobic material of step (C) is azobenzene derivatives (azobenzene derivatives) characterized in that the filling method for insulating material on a circuit board. The method according to any one of claims 2, 3 and 7,
Forming the photo solder resist layer is performed by laminating a dry film photoresist. Claim 10 has been abandoned due to the setting registration fee. The method according to any one of claims 2, 3 and 7,
And the first hydrophilic material is moisture. delete Claim 12 is abandoned in setting registration fee. The method according to any one of claims 2, 3 and 7,
And imparting roughness to the exposed surface of the groove prior to the hydrophobic treatment. Claim 13 has been abandoned due to the set registration fee. The method of claim 12,
Surface roughness (Ra) of the exposed surface of the groove given the roughness is 500 ~ 5000Å method for filling an insulating material in a circuit board. delete

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