KR101741794B1 - Method for manufactuting multilayer pcb comprising solder ball binding part of improved binding reliability - Google Patents
Method for manufactuting multilayer pcb comprising solder ball binding part of improved binding reliability Download PDFInfo
- Publication number
- KR101741794B1 KR101741794B1 KR1020150126442A KR20150126442A KR101741794B1 KR 101741794 B1 KR101741794 B1 KR 101741794B1 KR 1020150126442 A KR1020150126442 A KR 1020150126442A KR 20150126442 A KR20150126442 A KR 20150126442A KR 101741794 B1 KR101741794 B1 KR 101741794B1
- Authority
- KR
- South Korea
- Prior art keywords
- solder ball
- dry film
- etching
- circuit board
- copper foil
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A method of manufacturing a multilayer printed circuit board having solder ball junctions with improved bonding reliability according to the present invention includes the steps of: adhering a dry film to a copper foil in an outer layer of the multilayer printed circuit board; exposing and developing the dry film; Forming a circuit portion including a solder ball junction by etching the copper foil; peeling the remaining dry film from the outer layer; contacting the dry film on the solder ball junction; Exposing and developing the solder ball joints; etching the solder ball joints to form recesses in the solder ball joints; and peeling the remaining dry film from the solder ball joints.
According to the present invention, bonding reliability between the solder ball for bonding the semiconductor chip to the circuit board and the solder ball bonding portion formed on the circuit board can be enhanced.
Description
The present invention relates to a multilayer printed circuit board and a method of manufacturing the same. More particularly, the present invention relates to a multilayer printed circuit board configured to improve bonding reliability with a solder ball in a pad portion for bonding a chip to a printed circuit board, Method according to the present invention.
Recently, electronic technology related technology has been progressing in multi-function and high-speed. In order to cope with this trend, semiconductor chip manufacturing technology is also rapidly developing.
In particular, the thickness of printed circuit boards has also been reduced in order to reduce the thickness of finished electronic products. In recent years, technologies related to multilayer printed circuit boards that constitute more circuit layers in the same thickness printed circuit board have been researched and developed.
The multilayer printed circuit board is usually formed by heat pressing a plurality of printed circuit boards including a prepreg formed by impregnating an epoxy resin with glass fiber and a copper foil circuit formed on the surface thereof.
The multilayer printed circuit board generally comprises a multilayer of 10 or more layers, and the circuits of each layer are electrically connected through a via hole.
When a component such as a semiconductor chip is to be mounted on the surface of a multilayer printed circuit board, the external layer copper foil of the multilayer printed circuit board is subjected to exposure, development and etching in a state in which the dry film is in close contact with the copper foil, grid array region, and a semiconductor chip is mounted on the non-chip area using a solder ball.
The solder ball is used as a bonding pad portion for bonding a semiconductor chip to a printed circuit board by using a solder ball. In addition to shortening the overall length of the electrical circuit, it is possible to form more pins than the number of input / .
The use area of the above-mentioned bezier is increased because the mounting area required for chip mounting can be reduced by 25% or more than that of the conventional CuFeFee method, so that its utilization is very high and thermal resistance and electrical characteristics are good.
However, in the above-mentioned non-jiggle type package, the bonding force between the solder ball and the bonding pad is weakened by the heat generated from the printed circuit board, and interface peeling and cracks are sometimes generated with time.
As a result, the electrical connection between the semiconductor chip and the printed circuit board is released, which causes a failure of the electronic product.
It is an object of the present invention to provide a multilayer printed circuit board configured to improve reliability of bonding between a solder ball for bonding a semiconductor chip to a circuit board and a solder ball bonding portion on a circuit board, And a method for manufacturing the same.
According to another aspect of the present invention, there is provided a method of manufacturing a multilayer printed circuit board having a solder ball junction having improved bonding reliability, the method including: adhering a dry film to a copper foil in an outer layer of the multilayer printed circuit board; Forming a circuit portion including a solder ball bonding portion by etching the copper foil; peeling the remaining dry film from the outer layer; adhering the dry film on the solder ball bonding portion; Exposing and developing the dry film on the solder ball joint portion; etching the solder ball joint portion to form a concave portion in the solder ball joint portion; and peeling the remaining dry film from the solder ball joint portion.
Preferably, the concave portion is formed in a shape of a rectangle or a circular arc in a transverse plane.
Here, the concave portion may be formed in a circular shape or a straight line or a "shape"
Preferably, the depth of the recess is in the range of 1/3 to 2/3 of the thickness of the outer layer copper foil.
More preferably, the depth of the recess is in the range of 1/3 to 1/2 of the thickness of the outer layer copper foil.
The width of the concave portion may be in the range of 1/8 to 1/12 of the solder ball junction width.
In the multilayer printed circuit board having the solder ball bonding portion according to the present invention, a circuit portion including a solder ball bonding portion is formed on an outer layer of the multilayer printed circuit board, and a concave portion is formed on the solder ball bonding portion. do.
Preferably, the concave portion is formed in a shape of a rectangle or a circular arc in a transverse plane.
Here, the concave portion may be formed in a circular shape or a straight line or a "shape"
Preferably, the depth of the recess is in the range of 1/3 to 2/3 of the thickness of the outer layer copper foil.
More preferably, the depth of the recess is in the range of 1/3 to 1/2 of the thickness of the outer layer copper foil.
Further, the width of the concave portion is formed in the range of 1/8 to 1/12 of the width of the solder ball joint portion.
According to the present invention, bonding reliability between the solder ball for bonding the semiconductor chip to the circuit board and the solder ball bonding portion formed on the circuit board can be enhanced.
BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
1 is a cross-sectional view showing a state in which a dry film adheres to an outer layer copper foil of a multilayer printed circuit board,
2 is a cross-sectional view of the dry film exposed and developed,
Fig. 3 is a cross-sectional view of a state where a circuit portion including a solder ball junction is formed by etching a copper foil on a circuit board surface,
4 is a plan view of the circuit board with solder ball joints formed on the surface thereof,
5 is a cross-sectional view showing a solder ball joint portion covered with a dry film,
FIG. 6 is a cross-sectional view of the dry film covered with the solder ball junction and developed with the solder ball junction etched to form a recess;
7 is a plan view of one embodiment in which a recess is formed in the solder ball junction,
8 is a plan view of another embodiment with a recess formed in the solder ball junction,
9 is a plan view of another embodiment with a recess formed in the solder ball junction,
10 is a cross-sectional view of another embodiment in which a dry film covered with a solder ball junction is developed and the solder ball junction is etched to form a recess.
Hereinafter, the configuration of the present invention will be described in detail with reference to the accompanying drawings.
Prior to this, the terms used in the specification and claims should not be construed in a dictionary sense, and the inventor may, on the principle that the concept of a term can be properly defined in order to explain its invention in the best way And should be construed in light of the meanings and concepts consistent with the technical idea of the present invention.
Therefore, the embodiments shown in the present specification and the drawings are only exemplary embodiments of the present invention, and not all of the technical ideas of the present invention are presented. Therefore, various equivalents It should be understood that water and variations may exist.
Fig. 1 is a cross-sectional view showing a state in which a dry film adheres to an outer layer copper foil of a multilayer printed circuit board, Fig. 2 is a cross-sectional view of the dry film exposed and developed, 4 is a plan view in a state where a solder ball junction is formed on a surface of a circuit board, FIG. 5 is a cross-sectional view of a solder ball junction covered with a dry film, FIG. 6 is a cross- FIG. 7 is a plan view of an embodiment in which a concave portion is formed in a solder ball bonding portion, and FIG. 8 is a plan view of the solder ball bonding portion in a state where a concave portion is formed in a solder ball bonding portion 9 is a plan view of another embodiment in which a concave portion is formed in a solder ball joint portion. 10 is a cross-sectional view of another embodiment in which the dry film covered with the solder ball junction is developed and the solder ball junction is etched to form a recess.
A method for manufacturing a multilayer printed circuit board having solder ball joints with improved bonding reliability according to the present invention includes the steps of bringing the
The multilayer printed
The
The prepreg is formed by impregnating a reinforcing base material such as glass fiber with a polymer resin. As the reinforcing base material, a glass fiber fabric, a glass fiber nonwoven fabric, a carbon fiber fabric, or an organic polymer fiber fabric is used.
The polymer resin for forming the prepreg is mixed with an additive such as a hardening agent for adjusting the dielectric constant, thermal expansion rate, and time required for curing.
As the additives to be mixed into the polymer resin for the above-mentioned property control, inorganic fillers such as silica, aluminum hydroxide, calcium carbonate, and organic fillers such as cured epoxy and crosslinked acryl are available.
The
Thereafter, only the copper foil, which is disposed under the remaining
The
Thereafter, when the remaining
At this time, a solder resist is applied to the surface of the
Thereafter, the
Thereafter, the
The surface area of the solder
Thus, the bonding force between the solder and the solder
Further, since the molten solder seeps into the
Therefore, even when a horizontal force is applied to the solidified solder, or when the solidified solder is expanded by heat, the solder is supported by the side wall of the
In order to form a recess in the solder ball joint 220, a spray etching method for spraying an etching solution through a nozzle may be used. In this case, the etching rate is preferably etched with an etching rate of 0.07 to 0.4 μm / sec.
More specifically, when the etching solution is sprayed with sulfuric acid-fruit type etching solution, the etching is preferably performed at an etching rate of 0.1 to 0.12 m / sec. In the case of spraying an etching solution of sodium hydrochloric acid-sodium chloride type, sec etch rate, and in the case of spraying a hydrochloric acid-fruit type etchant, it is preferable to etch at an etch rate of 0.2 to 0.4 mu m / sec.
The etch rate is adjustable through the relative injection rate of the etchant to the solder ball junction and the amount and concentration of the etchant injected.
If the etching rate for etching the solder
That is, when the etching time becomes too long, the etching solution does not penetrate only into the opening portions of the dry film, but the etching solution flowing into the opening portions of the dry film flows laterally, thereby etching the peripheral circuits.
This eventually has an undesirable effect on the formation of the circuit line width of the design dimension or the width of the component connection pad.
If the etching rate is larger than 0.4 占 퐉 / sec, the etching rate becomes too large, and it becomes very difficult to control the depth of the concave portion through etching. If the depth D of the
Preferably, the depth D of the
The width of the
7 and 9, when the plurality of
8, a width in the transverse direction is formed to be slightly smaller than 0.2 mm when a concave portion of "╂" shape is formed in one solder ball
If the depth of the
If the depth of the
Therefore, it is preferable that the depth D of the
In this regard, it is more preferable that the depth of the
As shown in FIG. 7, the
Also, as shown in FIG. 9, the
When the printed circuit board is immersed in the etchant to form the
However, in the case of forming the
This is because when the etchant injected through the
As described above, when the
When the
After the
While the present invention has been described with reference to the exemplary embodiments and the drawings, it is to be understood that the technical scope of the present invention is not limited to these embodiments and that various changes and modifications will be apparent to those skilled in the art. Various modifications and variations may be made without departing from the scope of the appended claims.
10: outer layer
20: Copper foil
22: Solder ball joint
24:
30: Dry film
40: dry film
100: multilayer printed circuit board
Claims (12)
Adhering a dry film to the surface of the copper foil disposed on the outermost prepreg of the multilayer printed circuit board;
Exposing and developing the dry film;
Forming a circuit portion including a solder ball junction by etching the copper foil;
Peeling the remaining dry film from the circuit part;
Contacting the dry film on the solder ball joint;
Exposing and developing the dry film on the solder ball junction;
Forming a recess in the solder ball junction by etching the solder ball junction;
Removing the remaining dry film from the solder ball junction,
The concave portion is formed by a spray etching method for spraying an etching solution through a nozzle,
Said recess being formed in the shape of a transverse arc,
The depth of the recess is formed in a range of 1/3 to 2/3 of the thickness of the copper foil disposed on the outermost prepreg,
The width of the concave portion is formed in the range of 1/8 to 1/12 of the width of the solder ball joint portion,
In the spray etching method,
A sulfuric acid-fruit-like type etching solution is sprayed and etched at an etching rate of 0.1 to 0.12 mu m / sec,
Etching with an etching rate of 0.07 to 0.1 mu m / sec by spraying an etching solution of a hydrochloric acid-sodium chlorate type,
Wherein the etching is performed at an etching rate of 0.2 to 0.4 占 퐉 / sec by spraying a hydrochloric acid-hydrofluoric acid type etchant to the solder ball junction.
Wherein the recess is formed in a planar, circular or " straight "or" elliptical " shape.
Wherein the depth of the recess is in a range of 1/3 to 1/2 of the thickness of the copper foil disposed on the outermost prepreg.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150126442A KR101741794B1 (en) | 2015-09-07 | 2015-09-07 | Method for manufactuting multilayer pcb comprising solder ball binding part of improved binding reliability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150126442A KR101741794B1 (en) | 2015-09-07 | 2015-09-07 | Method for manufactuting multilayer pcb comprising solder ball binding part of improved binding reliability |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20170029289A KR20170029289A (en) | 2017-03-15 |
| KR101741794B1 true KR101741794B1 (en) | 2017-05-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020150126442A KR101741794B1 (en) | 2015-09-07 | 2015-09-07 | Method for manufactuting multilayer pcb comprising solder ball binding part of improved binding reliability |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR101741794B1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220124368A (en) * | 2021-03-03 | 2022-09-14 | 스템코 주식회사 | Circuit board and manufacturing method thereof, and electronic device including the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003264352A (en) * | 2002-03-07 | 2003-09-19 | Fujikura Ltd | Position deviation preventing structure in connection between wiring boards |
| JP2012142506A (en) * | 2011-01-06 | 2012-07-26 | Hitachi Cable Film Device Ltd | Method for manufacturing printed wiring board, and printed wiring board |
-
2015
- 2015-09-07 KR KR1020150126442A patent/KR101741794B1/en active IP Right Grant
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003264352A (en) * | 2002-03-07 | 2003-09-19 | Fujikura Ltd | Position deviation preventing structure in connection between wiring boards |
| JP2012142506A (en) * | 2011-01-06 | 2012-07-26 | Hitachi Cable Film Device Ltd | Method for manufacturing printed wiring board, and printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20170029289A (en) | 2017-03-15 |
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