KR101362834B1 - 다성분 배리어 폴리싱 용액 - Google Patents

다성분 배리어 폴리싱 용액 Download PDF

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Publication number
KR101362834B1
KR101362834B1 KR1020070010571A KR20070010571A KR101362834B1 KR 101362834 B1 KR101362834 B1 KR 101362834B1 KR 1020070010571 A KR1020070010571 A KR 1020070010571A KR 20070010571 A KR20070010571 A KR 20070010571A KR 101362834 B1 KR101362834 B1 KR 101362834B1
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South Korea
Prior art keywords
acid
weight
polishing
anionic surfactant
solution
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KR1020070010571A
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Korean (ko)
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KR20070080826A (ko
Inventor
진루 바이안
젠동 리우
Original Assignee
롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드
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Application filed by 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 filed Critical 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드
Publication of KR20070080826A publication Critical patent/KR20070080826A/ko
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Publication of KR101362834B1 publication Critical patent/KR101362834B1/ko
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020070010571A 2006-02-08 2007-02-01 다성분 배리어 폴리싱 용액 Active KR101362834B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/349,863 2006-02-08
US11/349,863 US7842192B2 (en) 2006-02-08 2006-02-08 Multi-component barrier polishing solution

Publications (2)

Publication Number Publication Date
KR20070080826A KR20070080826A (ko) 2007-08-13
KR101362834B1 true KR101362834B1 (ko) 2014-02-14

Family

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KR1020070010571A Active KR101362834B1 (ko) 2006-02-08 2007-02-01 다성분 배리어 폴리싱 용액

Country Status (7)

Country Link
US (1) US7842192B2 (https=)
JP (1) JP2007251141A (https=)
KR (1) KR101362834B1 (https=)
CN (1) CN101016440B (https=)
DE (1) DE102007004881A1 (https=)
FR (1) FR2897065B1 (https=)
TW (1) TWI396731B (https=)

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US8540893B2 (en) * 2008-08-04 2013-09-24 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing composition and methods relating thereto
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US8119529B2 (en) * 2009-04-29 2012-02-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for chemical mechanical polishing a substrate
CN101671527A (zh) * 2009-09-27 2010-03-17 大连三达奥克化学股份有限公司 高去除率、低损伤的铜化学机械抛光液及制备方法
CN102051128B (zh) * 2009-11-06 2015-10-07 安集微电子（上海）有限公司 一种化学机械抛光液
CN102093816B (zh) * 2009-12-11 2017-02-22 安集微电子（上海）有限公司 一种化学机械抛光液
CN102093817A (zh) * 2009-12-11 2011-06-15 安集微电子（上海）有限公司 一种用于钽阻挡抛光的化学机械抛光液
US8232208B2 (en) 2010-06-15 2012-07-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Stabilized chemical mechanical polishing composition and method of polishing a substrate
US8821751B2 (en) * 2010-06-24 2014-09-02 Air Products And Chemicals, Inc. Chemical mechanical planarization composition and method with low corrosiveness
US9040473B1 (en) 2010-07-21 2015-05-26 WD Media, LLC Low foam media cleaning detergent with nonionic surfactants
US8568610B2 (en) 2010-09-20 2013-10-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Stabilized, concentratable chemical mechanical polishing composition and method of polishing a substrate
US8513126B2 (en) 2010-09-22 2013-08-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Slurry composition having tunable dielectric polishing selectivity and method of polishing a substrate
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JP2013074036A (ja) * 2011-09-27 2013-04-22 Toshiba Corp Ｃｍｐ用スラリーおよび半導体装置の製造方法
US9029308B1 (en) 2012-03-28 2015-05-12 WD Media, LLC Low foam media cleaning detergent
US8545715B1 (en) 2012-10-09 2013-10-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing composition and method
US8859428B2 (en) 2012-10-19 2014-10-14 Air Products And Chemicals, Inc. Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereof
US9058976B2 (en) * 2012-11-06 2015-06-16 International Business Machines Corporation Cleaning composition and process for cleaning semiconductor devices and/or tooling during manufacturing thereof
CN104745086A (zh) * 2013-12-25 2015-07-01 安集微电子（上海）有限公司 一种用于阻挡层平坦化的化学机械抛光液及其使用方法
US9275899B2 (en) * 2014-06-27 2016-03-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing composition and method for polishing tungsten
CN105802509B (zh) * 2014-12-29 2018-10-26 安集微电子（上海）有限公司 一种组合物在阻挡层抛光中的应用
CN105463466A (zh) * 2015-11-22 2016-04-06 全椒县志宏机电设备设计有限公司 一种用于不锈钢材质的机械设备的抛光液及其制备方法
CN106637222A (zh) * 2016-12-11 2017-05-10 戴琪 一种降低返锈率不锈钢抛光液的制备方法
JP7120846B2 (ja) * 2018-08-10 2022-08-17 株式会社フジミインコーポレーテッド 研磨用組成物及びその製造方法並びに研磨方法並びに基板の製造方法
US11680186B2 (en) * 2020-11-06 2023-06-20 Fujifilm Electronic Materials U.S.A., Inc. Polishing compositions and methods of using same
KR102773670B1 (ko) * 2022-04-13 2025-02-25 에스케이엔펄스 주식회사 반도체 공정용 조성물 및 이를 이용한 반도체 소자의 제조방법

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Also Published As

Publication number Publication date
US20070184661A1 (en) 2007-08-09
KR20070080826A (ko) 2007-08-13
FR2897065B1 (fr) 2011-03-18
TWI396731B (zh) 2013-05-21
JP2007251141A (ja) 2007-09-27
TW200738853A (en) 2007-10-16
FR2897065A1 (fr) 2007-08-10
CN101016440B (zh) 2012-07-18
DE102007004881A1 (de) 2007-08-09
CN101016440A (zh) 2007-08-15
US7842192B2 (en) 2010-11-30

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