KR101362546B1 - 인서트 조립체 및 이를 포함하는 전자 부품 수납 장치 - Google Patents

인서트 조립체 및 이를 포함하는 전자 부품 수납 장치 Download PDF

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Publication number
KR101362546B1
KR101362546B1 KR1020120071473A KR20120071473A KR101362546B1 KR 101362546 B1 KR101362546 B1 KR 101362546B1 KR 1020120071473 A KR1020120071473 A KR 1020120071473A KR 20120071473 A KR20120071473 A KR 20120071473A KR 101362546 B1 KR101362546 B1 KR 101362546B1
Authority
KR
South Korea
Prior art keywords
electronic component
pusher
insert assembly
latch
support sheet
Prior art date
Application number
KR1020120071473A
Other languages
English (en)
Korean (ko)
Other versions
KR20140004829A (ko
Inventor
허광철
Original Assignee
세메스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세메스 주식회사 filed Critical 세메스 주식회사
Priority to KR1020120071473A priority Critical patent/KR101362546B1/ko
Priority to PCT/KR2012/007106 priority patent/WO2014003238A1/ko
Priority to TW101137605A priority patent/TWI471969B/zh
Publication of KR20140004829A publication Critical patent/KR20140004829A/ko
Application granted granted Critical
Publication of KR101362546B1 publication Critical patent/KR101362546B1/ko

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR1020120071473A 2012-06-30 2012-06-30 인서트 조립체 및 이를 포함하는 전자 부품 수납 장치 KR101362546B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020120071473A KR101362546B1 (ko) 2012-06-30 2012-06-30 인서트 조립체 및 이를 포함하는 전자 부품 수납 장치
PCT/KR2012/007106 WO2014003238A1 (ko) 2012-06-30 2012-09-05 인서트 조립체 및 이를 포함하는 전자 부품 수납 장치
TW101137605A TWI471969B (zh) 2012-06-30 2012-10-12 插入件組合及包含該組合之電子元件收容裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120071473A KR101362546B1 (ko) 2012-06-30 2012-06-30 인서트 조립체 및 이를 포함하는 전자 부품 수납 장치

Publications (2)

Publication Number Publication Date
KR20140004829A KR20140004829A (ko) 2014-01-14
KR101362546B1 true KR101362546B1 (ko) 2014-02-17

Family

ID=49783356

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120071473A KR101362546B1 (ko) 2012-06-30 2012-06-30 인서트 조립체 및 이를 포함하는 전자 부품 수납 장치

Country Status (3)

Country Link
KR (1) KR101362546B1 (zh)
TW (1) TWI471969B (zh)
WO (1) WO2014003238A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102658477B1 (ko) * 2016-05-04 2024-04-17 세메스 주식회사 반도체 패키지 테스트 장치
CN112313412A (zh) 2018-06-25 2021-02-02 维斯塔斯风力系统有限公司 与风力涡轮机维护有关的改进
KR102213079B1 (ko) * 2020-01-08 2021-02-08 (주)마이크로컨텍솔루션 반도체 칩 패키지 테스트 소켓

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101077940B1 (ko) * 2011-03-17 2011-10-31 유니셉 주식회사 반도체 패키지 인서트 장치

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0750763B2 (ja) * 1992-12-22 1995-05-31 山一電機株式会社 Ｉｃキャリア
JPH08248095A (ja) * 1995-03-14 1996-09-27 Tokyo Electron Ltd 検査装置
TW440699B (en) * 1998-06-09 2001-06-16 Advantest Corp Test apparatus for electronic parts
JP4299383B2 (ja) * 1998-06-25 2009-07-22 株式会社アドバンテスト Ｉｃ試験装置
US6636060B1 (en) * 1999-07-16 2003-10-21 Advantest Corporation Insert for electric devices testing apparatus
AU2003227357A1 (en) * 2003-04-23 2004-11-19 Advantest Corporation Insert and tray respectively for electronic component handling device and electronic component handling device
EP1943528A1 (en) * 2005-03-01 2008-07-16 Sv Probe Pte Ltd. Probe card with stacked substrate
US7477063B1 (en) * 2007-08-17 2009-01-13 Powertech Technologies, Inc. Universal insert tool for fixing a BGA package under test
KR101505956B1 (ko) * 2010-08-11 2015-03-27 (주)테크윙 테스트핸들러용 인서트

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101077940B1 (ko) * 2011-03-17 2011-10-31 유니셉 주식회사 반도체 패키지 인서트 장치

Also Published As

Publication number Publication date
WO2014003238A1 (ko) 2014-01-03
TWI471969B (zh) 2015-02-01
KR20140004829A (ko) 2014-01-14
TW201401417A (zh) 2014-01-01

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