KR101357178B1 - 개선된 스위칭을 갖는 pcmo 비휘발성의 저항성 메모리 - Google Patents
개선된 스위칭을 갖는 pcmo 비휘발성의 저항성 메모리 Download PDFInfo
- Publication number
- KR101357178B1 KR101357178B1 KR1020127003651A KR20127003651A KR101357178B1 KR 101357178 B1 KR101357178 B1 KR 101357178B1 KR 1020127003651 A KR1020127003651 A KR 1020127003651A KR 20127003651 A KR20127003651 A KR 20127003651A KR 101357178 B1 KR101357178 B1 KR 101357178B1
- Authority
- KR
- South Korea
- Prior art keywords
- manganese oxide
- diffusion barrier
- calcium manganese
- barrier layer
- oxygen diffusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0007—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising metal oxide memory material, e.g. perovskites
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/30—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having three or more electrodes, e.g. transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
- H10N70/021—Formation of switching materials, e.g. deposition of layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/24—Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/883—Oxides or nitrides
- H10N70/8836—Complex metal oxides, e.g. perovskites, spinels
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/30—Resistive cell, memory material aspects
- G11C2213/31—Material having complex metal oxide, e.g. perovskite structure
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/50—Resistive cell structure aspects
- G11C2213/51—Structure including a barrier layer preventing or limiting migration, diffusion of ions or charges or formation of electrolytes near an electrode
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/50—Resistive cell structure aspects
- G11C2213/56—Structure including two electrodes, a memory active layer and a so called passive or source or reservoir layer which is NOT an electrode, wherein the passive or source or reservoir layer is a source of ions which migrate afterwards in the memory active layer to be only trapped there, to form conductive filaments there or to react with the material of the memory active layer in redox way
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/77—Array wherein the memory element being directly connected to the bit lines and word lines without any access device being used
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/79—Array wherein the access device being a transistor
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/501,533 | 2009-07-13 | ||
| US12/501,533 US8227783B2 (en) | 2009-07-13 | 2009-07-13 | Non-volatile resistive sense memory with praseodymium calcium manganese oxide |
| PCT/US2010/041545 WO2011008651A1 (en) | 2009-07-13 | 2010-07-09 | Pcmo non-volatile resitive memory with improved switching |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20120034119A KR20120034119A (ko) | 2012-04-09 |
| KR101357178B1 true KR101357178B1 (ko) | 2014-01-29 |
Family
ID=42752050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020127003651A Expired - Fee Related KR101357178B1 (ko) | 2009-07-13 | 2010-07-09 | 개선된 스위칭을 갖는 pcmo 비휘발성의 저항성 메모리 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US8227783B2 (enExample) |
| JP (1) | JP5519790B2 (enExample) |
| KR (1) | KR101357178B1 (enExample) |
| CN (1) | CN102473454B (enExample) |
| WO (1) | WO2011008651A1 (enExample) |
Families Citing this family (77)
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| US7082052B2 (en) | 2004-02-06 | 2006-07-25 | Unity Semiconductor Corporation | Multi-resistive state element with reactive metal |
| US20060171200A1 (en) | 2004-02-06 | 2006-08-03 | Unity Semiconductor Corporation | Memory using mixed valence conductive oxides |
| US8559209B2 (en) | 2011-06-10 | 2013-10-15 | Unity Semiconductor Corporation | Array voltage regulating technique to enable data operations on large cross-point memory arrays with resistive memory elements |
| US20130082232A1 (en) | 2011-09-30 | 2013-04-04 | Unity Semiconductor Corporation | Multi Layered Conductive Metal Oxide Structures And Methods For Facilitating Enhanced Performance Characteristics Of Two Terminal Memory Cells |
| US8937292B2 (en) | 2011-08-15 | 2015-01-20 | Unity Semiconductor Corporation | Vertical cross point arrays for ultra high density memory applications |
| US8270193B2 (en) | 2010-01-29 | 2012-09-18 | Unity Semiconductor Corporation | Local bit lines and methods of selecting the same to access memory elements in cross-point arrays |
| KR100983175B1 (ko) * | 2008-07-03 | 2010-09-20 | 광주과학기술원 | 산화물막과 고체 전해질막을 구비하는 저항 변화 메모리소자, 및 이의 동작방법 |
| US9171613B2 (en) * | 2009-07-28 | 2015-10-27 | Hewlett-Packard Development Company, L.P. | Memristors with asymmetric electrodes |
| US20140001429A1 (en) * | 2012-07-02 | 2014-01-02 | 4-Ds Pty, Ltd | Heterojunction oxide memory device with barrier layer |
| KR101392662B1 (ko) | 2009-08-14 | 2014-05-07 | 4디-에스 피티와이 엘티디 | 이종 접합 산화물 비휘발성 메모리 장치 |
| US9634247B2 (en) * | 2009-08-14 | 2017-04-25 | 4D-S Ltd. | Complementary metal oxide heterojunction memory devices and methods related thereto |
| WO2011043448A1 (ja) * | 2009-10-09 | 2011-04-14 | 日本電気株式会社 | 半導体装置及びその製造方法 |
| US8638584B2 (en) | 2010-02-02 | 2014-01-28 | Unity Semiconductor Corporation | Memory architectures and techniques to enhance throughput for cross-point arrays |
| US9601692B1 (en) | 2010-07-13 | 2017-03-21 | Crossbar, Inc. | Hetero-switching layer in a RRAM device and method |
| US9012307B2 (en) | 2010-07-13 | 2015-04-21 | Crossbar, Inc. | Two terminal resistive switching device structure and method of fabricating |
| US8946046B1 (en) | 2012-05-02 | 2015-02-03 | Crossbar, Inc. | Guided path for forming a conductive filament in RRAM |
| US9570678B1 (en) | 2010-06-08 | 2017-02-14 | Crossbar, Inc. | Resistive RAM with preferental filament formation region and methods |
| US8198144B2 (en) | 2010-06-11 | 2012-06-12 | Crossbar, Inc. | Pillar structure for memory device and method |
| US8374018B2 (en) | 2010-07-09 | 2013-02-12 | Crossbar, Inc. | Resistive memory using SiGe material |
| US8884261B2 (en) | 2010-08-23 | 2014-11-11 | Crossbar, Inc. | Device switching using layered device structure |
| US8947908B2 (en) | 2010-11-04 | 2015-02-03 | Crossbar, Inc. | Hetero-switching layer in a RRAM device and method |
| US8569172B1 (en) | 2012-08-14 | 2013-10-29 | Crossbar, Inc. | Noble metal/non-noble metal electrode for RRAM applications |
| US8168506B2 (en) | 2010-07-13 | 2012-05-01 | Crossbar, Inc. | On/off ratio for non-volatile memory device and method |
| US9401475B1 (en) | 2010-08-23 | 2016-07-26 | Crossbar, Inc. | Method for silver deposition for a non-volatile memory device |
| US8889521B1 (en) | 2012-09-14 | 2014-11-18 | Crossbar, Inc. | Method for silver deposition for a non-volatile memory device |
| US8492195B2 (en) | 2010-08-23 | 2013-07-23 | Crossbar, Inc. | Method for forming stackable non-volatile resistive switching memory devices |
| US8391049B2 (en) | 2010-09-29 | 2013-03-05 | Crossbar, Inc. | Resistor structure for a non-volatile memory device and method |
| US8558212B2 (en) | 2010-09-29 | 2013-10-15 | Crossbar, Inc. | Conductive path in switching material in a resistive random access memory device and control |
| US8502185B2 (en) | 2011-05-31 | 2013-08-06 | Crossbar, Inc. | Switching device having a non-linear element |
| USRE46335E1 (en) | 2010-11-04 | 2017-03-07 | Crossbar, Inc. | Switching device having a non-linear element |
| US8377718B2 (en) * | 2010-11-10 | 2013-02-19 | Micron Technology, Inc. | Methods of forming a crystalline Pr1-xCaxMnO3 (PCMO) material and methods of forming semiconductor device structures comprising crystalline PCMO |
| US8930174B2 (en) | 2010-12-28 | 2015-01-06 | Crossbar, Inc. | Modeling technique for resistive random access memory (RRAM) cells |
| US8791010B1 (en) | 2010-12-31 | 2014-07-29 | Crossbar, Inc. | Silver interconnects for stacked non-volatile memory device and method |
| US9153623B1 (en) | 2010-12-31 | 2015-10-06 | Crossbar, Inc. | Thin film transistor steering element for a non-volatile memory device |
| US8815696B1 (en) | 2010-12-31 | 2014-08-26 | Crossbar, Inc. | Disturb-resistant non-volatile memory device using via-fill and etchback technique |
| US8847196B2 (en) | 2011-05-17 | 2014-09-30 | Micron Technology, Inc. | Resistive memory cell |
| US9620206B2 (en) | 2011-05-31 | 2017-04-11 | Crossbar, Inc. | Memory array architecture with two-terminal memory cells |
| US9117495B2 (en) | 2011-06-10 | 2015-08-25 | Unity Semiconductor Corporation | Global bit line pre-charge circuit that compensates for process, operating voltage, and temperature variations |
| US8891276B2 (en) | 2011-06-10 | 2014-11-18 | Unity Semiconductor Corporation | Memory array with local bitlines and local-to-global bitline pass gates and gain stages |
| US10566056B2 (en) | 2011-06-10 | 2020-02-18 | Unity Semiconductor Corporation | Global bit line pre-charge circuit that compensates for process, operating voltage, and temperature variations |
| US8619459B1 (en) | 2011-06-23 | 2013-12-31 | Crossbar, Inc. | High operating speed resistive random access memory |
| US8946669B1 (en) | 2012-04-05 | 2015-02-03 | Crossbar, Inc. | Resistive memory device and fabrication methods |
| US9166163B2 (en) | 2011-06-30 | 2015-10-20 | Crossbar, Inc. | Sub-oxide interface layer for two-terminal memory |
| US9564587B1 (en) | 2011-06-30 | 2017-02-07 | Crossbar, Inc. | Three-dimensional two-terminal memory with enhanced electric field and segmented interconnects |
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| US10056907B1 (en) | 2011-07-29 | 2018-08-21 | Crossbar, Inc. | Field programmable gate array utilizing two-terminal non-volatile memory |
| KR101285903B1 (ko) * | 2011-09-27 | 2013-07-23 | 한양대학교 산학협력단 | 자체 선택 특성을 가지는 3층 저항변화 메모리 및 이의 제조방법 |
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| US10290801B2 (en) | 2014-02-07 | 2019-05-14 | Crossbar, Inc. | Scalable silicon based resistive memory device |
| US10565495B2 (en) * | 2015-12-30 | 2020-02-18 | SK Hynix Inc. | Synapse and neuromorphic device including the same |
| WO2018057022A1 (en) * | 2016-09-25 | 2018-03-29 | Intel Corporation | Barriers for metal filament memory devices |
| US11476416B2 (en) | 2018-03-29 | 2022-10-18 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor device and method for manufacturing the same |
| US11437573B2 (en) * | 2018-03-29 | 2022-09-06 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor device and method for manufacturing the same |
| US11621395B2 (en) * | 2019-04-26 | 2023-04-04 | Intel Corporation | Resistive random-access memory devices and methods of fabrication |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050239262A1 (en) * | 2004-04-23 | 2005-10-27 | Sharp Laboratories Of America, Inc. | PCMO thin film with memory resistance properties |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TW297158B (enExample) * | 1994-05-27 | 1997-02-01 | Hitachi Ltd | |
| US6031287A (en) * | 1997-06-18 | 2000-02-29 | Micron Technology, Inc. | Contact structure and memory element incorporating the same |
| JP2004140208A (ja) * | 2002-10-18 | 2004-05-13 | Toshiba Corp | 半導体記憶装置及びその製造方法 |
| US6911361B2 (en) * | 2003-03-10 | 2005-06-28 | Sharp Laboratories Of America, Inc. | Low temperature processing of PCMO thin film on Ir substrate for RRAM application |
| US6927120B2 (en) * | 2003-05-21 | 2005-08-09 | Sharp Laboratories Of America, Inc. | Method for forming an asymmetric crystalline structure memory cell |
| US6939724B2 (en) * | 2003-08-13 | 2005-09-06 | Sharp Laboratories Of America, Inc. | Method for obtaining reversible resistance switches on a PCMO thin film when integrated with a highly crystallized seed layer |
| US6774054B1 (en) * | 2003-08-13 | 2004-08-10 | Sharp Laboratories Of America, Inc. | High temperature annealing of spin coated Pr1-xCaxMnO3 thim film for RRAM application |
| US7029924B2 (en) * | 2003-09-05 | 2006-04-18 | Sharp Laboratories Of America, Inc. | Buffered-layer memory cell |
| US6955992B2 (en) * | 2003-09-30 | 2005-10-18 | Sharp Laboratories Of America, Inc. | One mask PT/PCMO/PT stack etching process for RRAM applications |
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| KR100811266B1 (ko) * | 2006-09-01 | 2008-03-07 | 주식회사 하이닉스반도체 | 하드 마스크를 이용한 선택적 식각 방법 및 이를 이용한메모리 소자의 소자분리 형성 방법 |
| JP5010891B2 (ja) * | 2006-10-16 | 2012-08-29 | 富士通株式会社 | 抵抗変化型素子 |
| JP2009218260A (ja) | 2008-03-07 | 2009-09-24 | Fujitsu Ltd | 抵抗変化型素子 |
-
2009
- 2009-07-13 US US12/501,533 patent/US8227783B2/en not_active Expired - Fee Related
-
2010
- 2010-07-09 KR KR1020127003651A patent/KR101357178B1/ko not_active Expired - Fee Related
- 2010-07-09 JP JP2012520684A patent/JP5519790B2/ja active Active
- 2010-07-09 CN CN201080032370.3A patent/CN102473454B/zh not_active Expired - Fee Related
- 2010-07-09 WO PCT/US2010/041545 patent/WO2011008651A1/en not_active Ceased
-
2012
- 2012-07-12 US US13/547,376 patent/US8686388B2/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050239262A1 (en) * | 2004-04-23 | 2005-10-27 | Sharp Laboratories Of America, Inc. | PCMO thin film with memory resistance properties |
Also Published As
| Publication number | Publication date |
|---|---|
| US8686388B2 (en) | 2014-04-01 |
| US8227783B2 (en) | 2012-07-24 |
| US20120273744A1 (en) | 2012-11-01 |
| JP2012533193A (ja) | 2012-12-20 |
| CN102473454B (zh) | 2015-01-14 |
| JP5519790B2 (ja) | 2014-06-11 |
| CN102473454A (zh) | 2012-05-23 |
| WO2011008651A1 (en) | 2011-01-20 |
| US20110006275A1 (en) | 2011-01-13 |
| KR20120034119A (ko) | 2012-04-09 |
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