KR101326107B1 - 레이저 가공장치 및 그 제어방법 - Google Patents

레이저 가공장치 및 그 제어방법 Download PDF

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Publication number
KR101326107B1
KR101326107B1 KR1020110138699A KR20110138699A KR101326107B1 KR 101326107 B1 KR101326107 B1 KR 101326107B1 KR 1020110138699 A KR1020110138699 A KR 1020110138699A KR 20110138699 A KR20110138699 A KR 20110138699A KR 101326107 B1 KR101326107 B1 KR 101326107B1
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KR
South Korea
Prior art keywords
substrate
unit
reaction chamber
laser
laser processing
Prior art date
Application number
KR1020110138699A
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English (en)
Korean (ko)
Other versions
KR20130071288A (ko
Inventor
정상현
심형기
홍기원
최균욱
Original Assignee
삼성디스플레이 주식회사
에이피시스템 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성디스플레이 주식회사, 에이피시스템 주식회사 filed Critical 삼성디스플레이 주식회사
Priority to KR1020110138699A priority Critical patent/KR101326107B1/ko
Priority to JP2012276993A priority patent/JP5686790B2/ja
Priority to TW101148241A priority patent/TWI484562B/zh
Priority to CN201210557411.1A priority patent/CN103409804B/zh
Publication of KR20130071288A publication Critical patent/KR20130071288A/ko
Application granted granted Critical
Publication of KR101326107B1 publication Critical patent/KR101326107B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
KR1020110138699A 2011-12-20 2011-12-20 레이저 가공장치 및 그 제어방법 KR101326107B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020110138699A KR101326107B1 (ko) 2011-12-20 2011-12-20 레이저 가공장치 및 그 제어방법
JP2012276993A JP5686790B2 (ja) 2011-12-20 2012-12-19 レーザー処理装置及びその制御方法
TW101148241A TWI484562B (zh) 2011-12-20 2012-12-19 雷射處理裝置及其控制方法
CN201210557411.1A CN103409804B (zh) 2011-12-20 2012-12-20 激光处理装置及其控制方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110138699A KR101326107B1 (ko) 2011-12-20 2011-12-20 레이저 가공장치 및 그 제어방법

Publications (2)

Publication Number Publication Date
KR20130071288A KR20130071288A (ko) 2013-06-28
KR101326107B1 true KR101326107B1 (ko) 2013-11-06

Family

ID=48865841

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110138699A KR101326107B1 (ko) 2011-12-20 2011-12-20 레이저 가공장치 및 그 제어방법

Country Status (4)

Country Link
JP (1) JP5686790B2 (zh)
KR (1) KR101326107B1 (zh)
CN (1) CN103409804B (zh)
TW (1) TWI484562B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101894941B1 (ko) * 2016-08-26 2018-09-04 삼성중공업(주) 마크 자동용접 장치 및 방법
CN116586777B (zh) * 2023-07-12 2023-10-13 南通优睿半导体有限公司 具备压力测试功能自动化的半导体激光标记机

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0523877A (ja) * 1991-07-25 1993-02-02 Hitachi Seiko Ltd レーザ加工機
KR20000018189A (ko) * 2000-01-14 2000-04-06 김종신 레이저 가공장치
KR20090031825A (ko) * 2007-09-25 2009-03-30 다이니폰 스크린 세이조우 가부시키가이샤 얼라인먼트 마크 형성 장치
KR20110112026A (ko) * 2010-04-06 2011-10-12 주식회사 제우스 레이저 패터닝 장치 및 방법

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3685837B2 (ja) * 1995-05-30 2005-08-24 宮崎沖電気株式会社 半導体ウエハへのレーザマーキング方法及びその装置
JP2000021807A (ja) * 1998-06-29 2000-01-21 Matsushita Electric Ind Co Ltd 非晶質薄膜の加熱処理装置およびその方法
JP2004103628A (ja) * 2002-09-05 2004-04-02 Hitachi Ltd レーザアニール装置及びｔｆｔ基板のレーザアニール方法
JP4459514B2 (ja) * 2002-09-05 2010-04-28 株式会社半導体エネルギー研究所 レーザーマーキング装置
US6894248B2 (en) * 2003-05-20 2005-05-17 Mitsubishi Denki Kabushiki Kaisha Laser beam machining apparatus
US7615424B2 (en) * 2004-03-25 2009-11-10 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus and method for manufacturing semiconductor device using the laser irradiation apparatus
US7388663B2 (en) * 2004-10-28 2008-06-17 Asml Netherlands B.V. Optical position assessment apparatus and method
US7626701B2 (en) * 2004-12-27 2009-12-01 Asml Netherlands B.V. Lithographic apparatus with multiple alignment arrangements and alignment measuring method
JP5071961B2 (ja) * 2006-11-02 2012-11-14 住友重機械工業株式会社 レーザアニール装置、アニール方法、及び溶融深さ測定装置
JP2008262994A (ja) * 2007-04-10 2008-10-30 Advanced Lcd Technologies Development Center Co Ltd 結晶化方法および結晶化装置
JP4618360B2 (ja) * 2008-10-10 2011-01-26 ソニー株式会社 レーザアニール方法およびレーザアニール装置
JP2010141036A (ja) * 2008-12-10 2010-06-24 Advanced Lcd Technologies Development Center Co Ltd 結晶化装置用位相シフタ、結晶化装置及び結晶化方法
KR101011779B1 (ko) * 2008-12-19 2011-02-07 에이피시스템 주식회사 기판 정렬 장치용 비전 시스템 및 이의 초점 조절 방법
KR101116321B1 (ko) * 2009-08-21 2012-03-09 에이피시스템 주식회사 기판 정렬 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0523877A (ja) * 1991-07-25 1993-02-02 Hitachi Seiko Ltd レーザ加工機
KR20000018189A (ko) * 2000-01-14 2000-04-06 김종신 레이저 가공장치
KR20090031825A (ko) * 2007-09-25 2009-03-30 다이니폰 스크린 세이조우 가부시키가이샤 얼라인먼트 마크 형성 장치
KR20110112026A (ko) * 2010-04-06 2011-10-12 주식회사 제우스 레이저 패터닝 장치 및 방법

Also Published As

Publication number Publication date
CN103409804A (zh) 2013-11-27
JP2013131751A (ja) 2013-07-04
CN103409804B (zh) 2016-08-24
TW201334075A (zh) 2013-08-16
JP5686790B2 (ja) 2015-03-18
TWI484562B (zh) 2015-05-11
KR20130071288A (ko) 2013-06-28

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