KR101318613B1 - 3차원 측정 방법 - Google Patents

3차원 측정 방법 Download PDF

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Publication number
KR101318613B1
KR101318613B1 KR1020120059943A KR20120059943A KR101318613B1 KR 101318613 B1 KR101318613 B1 KR 101318613B1 KR 1020120059943 A KR1020120059943 A KR 1020120059943A KR 20120059943 A KR20120059943 A KR 20120059943A KR 101318613 B1 KR101318613 B1 KR 101318613B1
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KR
South Korea
Prior art keywords
lens
measured
measurement
wafer
alignment mark
Prior art date
Application number
KR1020120059943A
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English (en)
Korean (ko)
Other versions
KR20120137248A (ko
Inventor
게이시 구보
Original Assignee
파나소닉 주식회사
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Publication of KR20120137248A publication Critical patent/KR20120137248A/ko
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Publication of KR101318613B1 publication Critical patent/KR101318613B1/ko

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/20—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring contours or curvatures, e.g. determining profile
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0608—Height gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/2408—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures for measuring roundness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/20—Measuring arrangements characterised by the use of mechanical techniques for measuring contours or curvatures
    • G01B5/201—Measuring arrangements characterised by the use of mechanical techniques for measuring contours or curvatures for measuring roundness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/20—Measuring arrangements characterised by the use of mechanical techniques for measuring contours or curvatures
    • G01B5/213—Measuring arrangements characterised by the use of mechanical techniques for measuring contours or curvatures for measuring radius of curvature

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Microscoopes, Condenser (AREA)
KR1020120059943A 2011-06-10 2012-06-04 3차원 측정 방법 KR101318613B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011130321A JP5260703B2 (ja) 2011-06-10 2011-06-10 ３次元測定方法
JPJP-P-2011-130321 2011-06-10

Publications (2)

Publication Number Publication Date
KR20120137248A KR20120137248A (ko) 2012-12-20
KR101318613B1 true KR101318613B1 (ko) 2013-10-15

Family

ID=47302803

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120059943A KR101318613B1 (ko) 2011-06-10 2012-06-04 3차원 측정 방법

Country Status (4)

Country Link
JP (1) JP5260703B2 (ja)
KR (1) KR101318613B1 (ja)
CN (1) CN102818532B (ja)
TW (1) TWI438394B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101536426B1 (ko) * 2012-12-06 2015-07-13 파나소닉 주식회사 형상 측정 방법 및 형상 측정 장치

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CN102374835A (zh) * 2010-08-25 2012-03-14 鸿富锦精密工业（深圳）有限公司 量测仪
CN105102927B (zh) * 2013-02-05 2019-09-06 瑞尼斯豪公司 用于测量零件的方法及装置
US11159784B2 (en) * 2014-10-23 2021-10-26 Cognex Corporation System and method for calibrating a vision system with respect to a touch probe
CN104332433B (zh) * 2014-10-29 2018-04-10 武汉新芯集成电路制造有限公司 一种清针片及其清针方法
CN104457539B (zh) * 2014-11-05 2017-06-06 大族激光科技产业集团股份有限公司 一种飞针测试机测试探针抬针高度的计算方法
JP6570393B2 (ja) * 2015-09-25 2019-09-04 株式会社ミツトヨ 形状測定装置の制御方法
CN105785257B (zh) * 2016-04-13 2019-06-14 大族激光科技产业集团股份有限公司 一种飞针测试机的校正方法
JP6843585B2 (ja) * 2016-10-28 2021-03-17 株式会社日立エルジーデータストレージ 走査型画像計測装置及び走査型画像計測方法
JP2019027924A (ja) * 2017-07-31 2019-02-21 セイコーエプソン株式会社 電子部品搬送装置、電子部品検査装置、位置決め装置、部品搬送装置および位置決め方法
CN110118533B (zh) * 2018-02-05 2021-08-03 上海微电子装备（集团）股份有限公司 一种三维检测方法及检测装置
US20190253700A1 (en) * 2018-02-15 2019-08-15 Tobii Ab Systems and methods for calibrating image sensors in wearable apparatuses
WO2019163288A1 (ja) * 2018-02-26 2019-08-29 ヤマハファインテック株式会社 位置決め装置及び位置決め方法
CN110111383B (zh) * 2018-05-08 2022-03-18 广东聚华印刷显示技术有限公司 玻璃基板的偏移校正方法、装置和系统
CN109855517B (zh) * 2019-01-30 2020-10-30 温岭市宏晟建设有限公司 一种桥面平整度检测装置
CN110186391A (zh) * 2019-05-22 2019-08-30 浙江大学 一种三维模型梯度扫描方法
JP2021040002A (ja) 2019-09-02 2021-03-11 キオクシア株式会社 半導体記憶装置および半導体記憶装置の製造方法
CN111210479B (zh) * 2020-01-02 2023-06-02 浙江大学台州研究院 一种用于不同高度零件尺寸测量时的激光辅助标定装置和方法
JP7296334B2 (ja) * 2020-03-26 2023-06-22 住友重機械工業株式会社 真直度計測システム、変位センサ校正方法、及び真直度計測方法
CN111473694B (zh) * 2020-06-01 2022-11-25 浏阳市棠花烟花有限公司 烟花燃放炮筒固定装置及其燃放系统、燃放方法
CN114719752B (zh) * 2022-04-11 2023-07-21 中国科学院光电技术研究所 基于万能工具显微镜、测头测量精密零件几何参数的方法

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KR100446653B1 (ko) 2002-04-09 2004-09-04 아남반도체 주식회사 웨이퍼 정렬기와 이를 이용한 웨이퍼 정렬 방법
JP2010072665A (ja) 2008-04-28 2010-04-02 Konica Minolta Opto Inc ウエハレンズ集合体の製造方法及びウエハレンズ集合体
KR20100040667A (ko) * 2008-10-10 2010-04-20 파나소닉 주식회사 3차원 형상 측정 방법
KR20110089519A (ko) * 2010-02-01 2011-08-09 주식회사 고영테크놀러지 3차원 형상 검사방법

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EP1701231A1 (en) * 2005-03-08 2006-09-13 Mydata Automation AB Method of calibration
JP5260119B2 (ja) * 2008-04-02 2013-08-14 東京エレクトロン株式会社 アライメント方法
JP5644765B2 (ja) * 2009-08-31 2014-12-24 コニカミノルタ株式会社 ウエハレンズの製造方法
JP5350171B2 (ja) * 2009-10-13 2013-11-27 株式会社ミツトヨ オフセット量校正方法および表面性状測定機
JP5138656B2 (ja) * 2009-10-15 2013-02-06 シャープ株式会社 レンズ評価方法
CN201555561U (zh) * 2009-12-10 2010-08-18 中国华录·松下电子信息有限公司 测量具有复杂不规则圆柱螺旋曲线轨道轨迹的工件的设备

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
KR100446653B1 (ko) 2002-04-09 2004-09-04 아남반도체 주식회사 웨이퍼 정렬기와 이를 이용한 웨이퍼 정렬 방법
JP2010072665A (ja) 2008-04-28 2010-04-02 Konica Minolta Opto Inc ウエハレンズ集合体の製造方法及びウエハレンズ集合体
KR20100040667A (ko) * 2008-10-10 2010-04-20 파나소닉 주식회사 3차원 형상 측정 방법
KR20110089519A (ko) * 2010-02-01 2011-08-09 주식회사 고영테크놀러지 3차원 형상 검사방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101536426B1 (ko) * 2012-12-06 2015-07-13 파나소닉 주식회사 형상 측정 방법 및 형상 측정 장치

Also Published As

Publication number Publication date
JP2012255756A (ja) 2012-12-27
TW201305533A (zh) 2013-02-01
CN102818532B (zh) 2014-11-05
KR20120137248A (ko) 2012-12-20
CN102818532A (zh) 2012-12-12
JP5260703B2 (ja) 2013-08-14
TWI438394B (zh) 2014-05-21

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