KR101314414B1 - 광 장치 - Google Patents

광 장치 Download PDF

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Publication number
KR101314414B1
KR101314414B1 KR1020097002782A KR20097002782A KR101314414B1 KR 101314414 B1 KR101314414 B1 KR 101314414B1 KR 1020097002782 A KR1020097002782 A KR 1020097002782A KR 20097002782 A KR20097002782 A KR 20097002782A KR 101314414 B1 KR101314414 B1 KR 101314414B1
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KR
South Korea
Prior art keywords
radiation
semiconductor chip
optical device
optoelectronic component
reflector
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KR1020097002782A
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English (en)
Korean (ko)
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KR20090034966A (ko
Inventor
마리오 바니거
마커스 제일러
허버트 오트
Original Assignee
오스람 옵토 세미컨덕터스 게엠베하
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Publication of KR20090034966A publication Critical patent/KR20090034966A/ko
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Publication of KR101314414B1 publication Critical patent/KR101314414B1/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/02—Simple or compound lenses with non-spherical faces
    • G02B3/04—Simple or compound lenses with non-spherical faces with continuous faces that are rotationally symmetrical but deviate from a true sphere, e.g. so called "aspheric" lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Planar Illumination Modules (AREA)
KR1020097002782A 2006-07-31 2007-07-27 광 장치 Active KR101314414B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102006035635.7 2006-07-31
DE102006035635A DE102006035635A1 (de) 2006-07-31 2006-07-31 Beleuchtungsanordnung
PCT/DE2007/001348 WO2008014771A1 (de) 2006-07-31 2007-07-27 Beleuchtungsanordnung

Publications (2)

Publication Number Publication Date
KR20090034966A KR20090034966A (ko) 2009-04-08
KR101314414B1 true KR101314414B1 (ko) 2013-10-04

Family

ID=38692073

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097002782A Active KR101314414B1 (ko) 2006-07-31 2007-07-27 광 장치

Country Status (8)

Country Link
US (1) US8585252B2 (https=)
EP (1) EP2047526B1 (https=)
JP (2) JP5675101B2 (https=)
KR (1) KR101314414B1 (https=)
CN (1) CN101496189B (https=)
DE (1) DE102006035635A1 (https=)
TW (1) TWI396309B (https=)
WO (1) WO2008014771A1 (https=)

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US8083380B2 (en) * 2009-04-17 2011-12-27 Mig Technology Inc. Integrated structure for optical refractor
TWI384177B (zh) * 2009-09-04 2013-02-01 Au Optronics Corp 具高發光效率之光源裝置及其製造方法
JP5263788B2 (ja) * 2009-10-22 2013-08-14 シャープ株式会社 表示装置
CN102054920A (zh) * 2009-10-27 2011-05-11 展晶科技(深圳)有限公司 发光二极管封装结构
TWI422074B (zh) 2010-01-07 2014-01-01 首爾半導體股份有限公司 非球面ｌｅｄ鏡片以及含有此鏡片的發光元件
US20110273892A1 (en) * 2010-05-07 2011-11-10 Tyco Electronics Corporation Solid state lighting assembly
CN104154463A (zh) * 2010-09-27 2014-11-19 北京京东方光电科技有限公司 发光二极管光源及其制造方法、具有其的背光源
DE102010048162A1 (de) 2010-10-11 2012-04-12 Osram Opto Semiconductors Gmbh Konversionsbauteil
JP6087904B2 (ja) 2011-05-05 2017-03-01 フィリップス ライティング ホールディング ビー ヴィ 光線を形成する光デバイス
KR101978634B1 (ko) * 2012-07-27 2019-05-15 엘지이노텍 주식회사 조명기기
CN104235754B (zh) * 2013-06-20 2019-06-18 欧司朗有限公司 用于照明装置的透镜和具有该透镜的照明装置
TW201508220A (zh) * 2013-08-27 2015-03-01 Hon Hai Prec Ind Co Ltd 發光二極體模組
JP6323020B2 (ja) 2014-01-20 2018-05-16 セイコーエプソン株式会社 光源装置およびプロジェクター
JP6374723B2 (ja) * 2014-07-25 2018-08-15 スタンレー電気株式会社 半導体発光装置
DE102015101216A1 (de) * 2015-01-28 2016-07-28 Osram Opto Semiconductors Gmbh Optoelektronische Anordnung mit Strahlungskonversionselement und Verfahren zur Herstellung eines Strahlungskonversionselements
US10393341B2 (en) 2015-04-24 2019-08-27 Abl Ip Holding Llc Tri-lobe optic and associated light fixtures
USD779112S1 (en) 2015-04-24 2017-02-14 Abl Ip Holding Llc Tri-lobe light fixture optic
DE102015112042B4 (de) * 2015-07-23 2021-07-01 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronische Leuchtvorrichtung
US10466533B2 (en) * 2015-10-07 2019-11-05 Enplas Corporation Light flux control member, light-emitting device, surface light source device and display device
JP6110528B2 (ja) * 2016-02-03 2017-04-05 京セラコネクタプロダクツ株式会社 半導体発光素子用ホルダ、及び、半導体発光素子モジュール
US11128100B2 (en) 2017-02-08 2021-09-21 Princeton Optronics, Inc. VCSEL illuminator package including an optical structure integrated in the encapsulant
FR3085465B1 (fr) 2018-08-31 2021-05-21 St Microelectronics Grenoble 2 Mecanisme de protection pour source lumineuse
US10865962B2 (en) * 2018-06-12 2020-12-15 Stmicroelectronics (Grenoble 2) Sas Protection mechanism for light source
CN110594704B (zh) 2018-06-12 2021-10-29 意法半导体(格勒诺布尔2)公司 光源的保护机构
CN110594705A (zh) 2018-06-12 2019-12-20 意法半导体(格勒诺布尔2)公司 光源的保护机构
US10738985B2 (en) 2018-06-12 2020-08-11 Stmicroelectronics (Research & Development) Limited Housing for light source
DE102020121656A1 (de) * 2020-08-18 2022-02-24 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zum herstellen eines optoelektronischen bauelements und optoelektronisches bauelement
KR102543767B1 (ko) * 2020-11-26 2023-06-16 주식회사 사이언 야시조명계통용 발광다이오드
KR102733081B1 (ko) * 2021-09-17 2024-11-25 주식회사 사이언 야시조명계통용 led 패키지 및 그 제조 방법

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JPH01258481A (ja) * 1988-04-08 1989-10-16 Toshiba Corp Ｌｅｄアレイ
EP1227458A2 (de) * 2001-01-11 2002-07-31 Dr. techn. Josef Zelisko, Fabrik für Elektrotechnik und Maschinenbau Gesellschaft m.b.H. Anzeige- und/oder Signalsiervorrichtung
KR20050104696A (ko) * 2004-04-29 2005-11-03 엘지.필립스 엘시디 주식회사 Ｌｅｄ 램프 유닛
JP2006186158A (ja) 2004-12-28 2006-07-13 Sharp Corp 発光ダイオードランプおよび発光ダイオード表示装置

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JPH02306289A (ja) 1989-05-22 1990-12-19 Rohm Co Ltd 発光ダイオード
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JP4050444B2 (ja) * 2000-05-30 2008-02-20 信越半導体株式会社 発光素子及びその製造方法
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Publication number Priority date Publication date Assignee Title
JPH01258481A (ja) * 1988-04-08 1989-10-16 Toshiba Corp Ｌｅｄアレイ
EP1227458A2 (de) * 2001-01-11 2002-07-31 Dr. techn. Josef Zelisko, Fabrik für Elektrotechnik und Maschinenbau Gesellschaft m.b.H. Anzeige- und/oder Signalsiervorrichtung
KR20050104696A (ko) * 2004-04-29 2005-11-03 엘지.필립스 엘시디 주식회사 Ｌｅｄ 램프 유닛
JP2006186158A (ja) 2004-12-28 2006-07-13 Sharp Corp 発光ダイオードランプおよび発光ダイオード表示装置

Also Published As

Publication number Publication date
TWI396309B (zh) 2013-05-11
JP6141248B2 (ja) 2017-06-07
JP5675101B2 (ja) 2015-02-25
CN101496189B (zh) 2014-06-18
JP2015015260A (ja) 2015-01-22
JP2009545864A (ja) 2009-12-24
DE102006035635A1 (de) 2008-02-07
EP2047526B1 (de) 2018-07-25
WO2008014771A1 (de) 2008-02-07
TW200814376A (en) 2008-03-16
KR20090034966A (ko) 2009-04-08
US8585252B2 (en) 2013-11-19
CN101496189A (zh) 2009-07-29
EP2047526A1 (de) 2009-04-15
US20100073907A1 (en) 2010-03-25

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