KR101296461B1 - Glue supplying apparatus and glue supplying method - Google Patents

Abstract

The present invention provides a glue supplying device and a glue supplying method which can suppress decomposition and corrosion of glue and can fully utilize the effects of glue.
The glue supply apparatus 2 which supplies the glue solution 200 to the electrolyte solution 10 in the electrolytic bath 11 which performs electrolytic purification of copper is in the dissolution tank 23 and the dissolution tank 23 for dissolving the glue 20. The liquid level of the feeder device 22 which supplies the glue 22, the liquid level measuring device 27 which measures the liquid level of the glue solution 200 accumulated in the dissolution tank 23, and the glue solution 200 of the dissolution tank 23 is the liquid level. A control device 30 that is measured by a level meter and controls the feeder mechanism 223 and the valve 250 of the feeder device 22 so that the amount of glue and water necessary to replenish the glue solution 200 is controlled. It is provided, and it supplies continuously to electrolyte solution 10, creating a small amount of glue solutions.

Description

Glue SUPPLYING APPARATUS AND GLUE SUPPLYING METHOD}

The present invention relates to a glue supply device and a glue supply method, and more particularly, a glue supply device and a glue for supplying glue to an electrolyte solution accumulated in an electrolytic cell in order to perform electrolytic purification of metals such as copper. It relates to a supply method.

In addition to the metal salt and free acid which are main components, the electrolyte solution used for electrolytic refining of copper adds a small amount of organic or inorganic substance as an additive. An additive is used for the improvement of the precipitation state of copper in a negative electrode plate, etc. As an additive of an organic substance, the additive which forms a protective colloid, such as glue, gelatin, lignin (pulp waste water), etc., organic substance etc. which have functional groups, such as thiourea and alloin, are used. In general, the activation polarization at the time of precipitation increases with an additive and the uniform electrodeposition property is improved by increasing the polarization, so that the precipitated metal is dense and the surface is uniform. Such additives are gradually consumed when the electrolysis is continued, so it is necessary to add them occasionally.

When glue is used as an additive, when the concentration of glue in the electrolyte (hereinafter referred to as "glue concentration") decreases, the effect of glue on electrophoresis is reduced, and the abnormal growth portion of the shape of a bump on the surface of the copper plate is reduced. This tends to occur, resulting in a decrease in production efficiency due to a decrease in quality due to surface roughness and mutual contact between electrode plates provided in the electrolytic cell. On the contrary, when the amount of gluing is increased and the gluing concentration is increased, the electrical resistance of the electrolyte is increased, so that the applied voltage must be increased, thus causing an increase in power consumption. For this reason, it is required to manage the glue concentration in the electrolyte at an optimum value.

About the method of measuring the glue concentration in electrolyte solution, it is described in patent document 1, for example. In the method of measuring the glue concentration of Patent Document 1, the electrolyte sample solution is electrolyzed by a constant current in an electrolytic cell to obtain a cathode potential change rate of the electrolysis cell, and the glue concentration is measured by comparing a calibration curve that sets the cathode potential change rate in advance, The concentration of glue in the electrolyte can be measured quickly.

Japanese Patent Application Publication No. Hei 10-158881

In the glue added to the electrolyte, agglomerates of about 2 to 10 mm square are usually mixed, and the worker dissolves them manually in the dissolution tank, but requires several days to completely use the glue solution in the dissolution tank. There was problem to say. The longer the time the glue stays in the dissolution tank, the more the decomposition and corrosion of the glue progressed, and there was a problem that the effect of the glue in copper electrolysis was not sufficiently exhibited.

In addition, since the glue solution and the additive were stored in a mixed state and added to the electrolyte solution appropriately, there was a problem that the glue was deteriorated by hydrochloric acid contained in the additive, and the effect of the glue was attenuated.

Moreover, since the glue block was large, there existed a problem that nonuniformity was easy to arise at the time of melt | dissolution.

Accordingly, the present invention has been made in view of the above problems, and by preparing a small amount of the glue solution and continuously supplying it to the electrolyte solution, the glue supply device and the glue that can fully utilize the effects of glue by inhibiting the decomposition and corrosion of the glue It is an object to provide a supply method.

In order to solve the said subject, the invention of Claim 1 is the glue supply apparatus for supplying the glue in the electrolyte solution accumulate | stored in the electrolytic cell in order to perform electrolytic purification of a metal, The dissolution tank for dissolving glue, and the said glue in a dissolution tank A feeder device for supplying water, a water supply device for supplying water into the dissolution tank, a liquid level gauge for measuring the liquid level of the glue solution accumulated in the dissolution tank, and a glue solution from the dissolution tank, and the liquid level is lowered. And a control device for controlling the feeder device and the water supply device so as to measure the change in the liquid level of the liquid level by supplying the glue and water in an amount necessary to replenish the glue solution corresponding to the extracted amount. It is provided with a glue supply apparatus characterized by comprising.

In order to solve the said subject, this invention of Claim 2 WHEREIN: The glue supply apparatus of Claim 1 WHEREIN: A feeder apparatus is provided with the hopper for accommodating glue, and the metering apparatus which measures the weight of the glue accommodated in the hopper. The amount of glue added is controlled by measuring the weight of the glue added and reduced in the dissolution tank with a measuring device.

In order to solve the said subject, this invention of Claim 3 WHEREIN: The glue supply apparatus of Claim 1 or 2 WHEREIN: It has two or more dissolution tanks, and forms the input chute of the feeder apparatus for injecting a glue into a dissolution tank rotatably, It is possible to supply glue to each of the dissolution tanks provided in multiple numbers by rotating an injection chute. It is characterized by the above-mentioned.

In order to solve the said subject, this invention is the glue supply apparatus as described in any one of Claims 1-3, Comprising: The electrolyte solution accumulate | stored in the supply tank as electrolyte solution immediately before the glue and an additive are added and injected into an electrolyzer. And determining the decrease in the glue concentration in the electrolyte based on the difference in the cathode potential of the electrolyte extracted from the electrolytic cell and accumulated in the liquid discharge tank, and adjusting the addition amount of the glue solution to be supplied into the supply tank based on the determination result. It is characterized by comprising a function.

In order to solve the said subject, this invention of Claim 5 is the glue supply method using the glue supply apparatus as described in any one of Claims 1-4, The glue supplied to a feeder apparatus is a granule of 2-3 mm It provides a glue supply method characterized in that.

According to the glue supplying device and the glue supplying method according to the present invention, by constructing a small amount of glue solution and continuously supplying it, there is an effect that the decomposition and corrosion of the glue can be suppressed and the effect of the glue can be fully utilized.

BRIEF DESCRIPTION OF THE DRAWINGS The system diagram which shows the structure of the 1st embodiment of the glue supply apparatus which concerns on this invention, and the electrolytic purification apparatus to which this glue supply apparatus was applied.
FIG. 2 is a front view showing the feeder device shown in FIG. 1. FIG.
FIG. 3 is a front view showing details of the screw of the feeder device shown in FIG. 2. FIG.
4 is a front view showing details of the hopper portion of the feeder device shown in FIG. 2;
FIG. 5 is a schematic diagram showing a test electrolytic cell and a cathode potential meter shown in FIG. 1. FIG.
6 is a flow chart showing operation of the glue supply device according to the present invention;
7 is a flowchart showing control of glue concentration based on the measurement of the cathode potential of the electrolyte solution of the glue supply device according to the present invention.
8 is a layout view showing a second embodiment of a glue supply device according to the present invention;
9 is a graph of measurement results in an embodiment of a glue supply device according to the present invention.

EMBODIMENT OF THE INVENTION Hereinafter, one Embodiment of the glue supply apparatus and the glue supply method which concern on this invention is described, referring drawings. BRIEF DESCRIPTION OF THE DRAWINGS It is a system diagram which shows the structure of the glue supply apparatus which concerns on this invention, and the electrolytic purification apparatus to which the said glue supply apparatus was applied.

1. First Embodiment

[Configuration of Electrolytic Purification Apparatus]

The electrolytic refining apparatus 1 roughly includes an electrolytic cell 11 filled with the electrolytic solution 10, a liquid discharge tank 12 for recovering the used electrolyte from the electrolytic cell 11, and a fresh electrolytic solution 10. The additive tank 14 to which the supply tank 13 supplied to the electrolytic tank 11, the additive (hydrochloric acid containing an aqueous solution of thiourea) 140 is stored, and the electrolyte solution to supply the supply tank 13 are stored. An electrolyte solution supply tank 15 is provided. Then, a pump 17a is disposed in the middle of the pipe 16a between the liquid discharge tank 12 and the supply tank 13, and in the middle of the pipe 16b between the additive tank 14 and the supply tank 13. The 17b is arrange | positioned, the pump 17c is arrange | positioned in the middle of the piping 16c between the electrolyte supply tank 15 and the supply tank 13, and the pump 17d is provided between the supply tank 13 and the electrolysis tank 11. As shown in FIG. ) Is arranged. In addition, thiourea is supplied to the additive tank 14 through the pipe 18a and hydrochloric acid through the pipe 18b.

In the electrolytic cell 11, a plurality of anodes (not shown) formed by casting a crude copper to be an anode and a plurality of negative electrode plates 3 for electrodepositing copper on electrodeposited surfaces to purify copper copper are alternated at predetermined intervals. It is immersed in and arrange | positioned. In addition, the electrolytic solution 10 is supplied to the electrolytic cell 11 through the supply tank 13. In addition, when the negative electrode plate 3 performs electrolytic purification by the permanent cathode method (PC method), a stainless steel plate is used.

[Configuration of Glue Feeder]

With respect to the electrolytic refining apparatus 1 according to the above configuration, the glue supply device 2 according to the present invention is configured to supply the glue solution 200 to the supply tank 13 through the pipes 24 and 16a. have. That is, the glue supply device 2 shown in FIG. 1 continuously controls the supply amount of the glue solution 200 supplied to the electrolytic cell 11 to the supply tank 13 continuously by the pump 25. Apparatus for supplying, a hopper (21) into which a screw feeder (not shown) and a crushed glue (20) crushed into granules having a particle diameter of about 2 to 3 mm is introduced, and a glue (in the hopper 21) The feeder device 22 for discharging the chute 220 from the chute 220 while maintaining the flow rate set in advance, and the glue discharged from the chute 220 through the water supply device constituted by the valve 250 and the pipe 251. The amount of glue introduced from the dissolution tank 23 dissolved in the supplied water, the pump 25 provided in the middle of the pipe 24 provided between the dissolution tank 23 and the pipe 16b, and the chute 220 is measured. Liquid level measuring device 27 for measuring the load cell (measuring device) 26 and the liquid level of the melting tank 23. Control of the amount of glue supplied on the basis of the measured values of the electronic thermometer 28 and the load cell 26 and the liquid level measuring instrument 27 that measures the temperature of the glue solution 200 in the dissolution tank 23, and the valve ( 250 and the control device 30 for controlling the pumps 17a to 17d, 25 and the like, and the liquid discharge tank 12 are connected to each other via a pipe 32 and a pump 33, and a part of the discharge liquid is supplied. A test electrolytic cell 31 for introducing and measuring the concentration of the discharged liquid and the cathode potential is provided. In addition, cathode testers 120 and 130 are provided in the test electrolytic cell 31 and the supply tank 13, and the measured value is received by the control apparatus 30, and the glue solution mentioned later based on the potential difference. The supply amount control of the 200 is performed.

[Configuration of Feeder Unit]

As the feeder device 22, "CE-W" type "biaxial screw cassette weighing feeder" made by Kubota Co., Ltd. can be used, for example. This feeder device 22 is also referred to as a loss in feeder. As schematically shown in FIG. 2, the feeder device 22 includes a base 221, a drive unit 222 provided on the base 221, and a drive unit 222. The screw mechanism 223 which the screw mentioned later drives to rotate, the hopper part 224 which supplies the stirred glue | gum which are arrange | positioned on the upper part of the screw mechanism 223, and the edge part of the screw mechanism 223 And a discharge cell 235 for discharging the glue sent to the container, and a load cell 26 capable of measuring the amount of the glue discharged. In addition, a chute 220 serving as a glue supply path to the dissolution tank 23 is connected to the discharge cylinder 235.

3 shows the details of the screw of the screw mechanism 223, and a spiral screw blade 226 is formed on the outer circumference thereof, and includes the screws 225a and 225b, and in the driving portion 222 in a state where they are arranged in parallel. It is rotatably stored in the case. The screw blades 226 of the screws 225a and 225b are provided with a slight gap so as not to contact each other.

4 is an exploded view showing details of the hopper portion 224. In general, an air-shaped supply hopper 227 having a supply port at the bottom of the screw mechanism 223 and a glue for supplying the glue to the screw mechanism 223, and a shaft 227a in the supply hopper 227. The agitator 228 which stirs the glue by being rotated by the drive part 222 and arrange | positioned by the axial support by 227b, the gasket 229 provided in the upper surface of the feed hopper 227, and the gasket ( The clamp 230 provided on the upper surface of the 229, the metering hopper 231 provided on the upper surface of the clamp 230, the gasket 232 provided on the upper surface of the metering hopper 231, the gasket 232 The clamp 233 provided in the upper surface and the cover 234 provided in the upper surface of the clamp 233 are comprised.

In the lower part of the supply hopper 227, the load cell 26 which measures the weight containing the 10 member which extends from the supply hopper 227 to the lid | cover 234, and the glue which injected into the hopper part 224 is provided. If the total weight Wh of the ten members from the supply hopper 227 to the lid 234 is measured beforehand, the total weight Wt accompanying the storage of glue is measured for this weight Wh (Wt-Wh = Wn). The weight Wn of the glue in the hopper part 224 can be measured by the calculation of.

5 shows the configuration of the test electrolytic cell 31, in which a cathode 36, a reference electrode 37 and an anode 38 are immersed in the electrolyte solution 39 in the test electrolytic cell 31. The cathode 36 and the reference electrode 37 are connected in parallel, and electrolysis is performed by connecting the DC power supply 40 between the cathode 36 and the anode 38, and the glue solution is added every predetermined time. The change over time of the cathode potential is measured from the change of the cathode potential with the previous time.

[Operations of Electrolytic Purification Device and Feeder Device]

Next, the operation | movement of the electrolytic purification apparatus 1 and the glue supply apparatus 2 mentioned above is demonstrated with reference to FIG. First, operation | movement of the electrolytic purification apparatus 1 is demonstrated. The electrolytic solution 10 is filled in the electrolytic cell 11, and an anode (not shown) and a negative electrode plate 3 serving as an anode are disposed. And the electrolyte solution of the state in which the additive for improving the precipitation state of the copper in the negative electrode plate 3, etc. was added to the supply tank 13 is accumulated. The additive is a mixed solution of thiourea and hydrochloric acid supplied from the pump 17b and a glue solution 200 supplied from the pump 25. The negative electrode plate 3 is continuously loaded at a predetermined interval from a carrying in / out system not shown. Copper electrolysis is performed by applying a predetermined direct current voltage between the copper bath and the negative electrode plate 3, and copper is electrodeposited on the surface of the negative electrode plate 3. When copper is electrodeposited on the surface of the negative electrode plate 3 to a predetermined thickness, the negative electrode plate 3 is taken out from the electrolytic cell 11 by the above loading / exporting system and transferred to a predetermined place. Thereafter, the new negative electrode plate 3 is carried into the electrolytic cell 11 by the carrying-in system, and the electrolytic purification process is newly performed.

Next, the glue supplying method which concerns on this invention with reference to FIGS. 1-6 is demonstrated with the operation | movement of the glue supply apparatus 2 mentioned above. 6 is a flowchart showing the operation of the glue supply device 2. The process shown in FIG. 6 is executed by the control apparatus 30. First, the glue 20 of predetermined amount (for example, 300 kg) is thrown into the hopper 21 for glue storage shown in FIG. 1 and FIG. 2 by a worker (step S1). Subsequently, the feeder in the hopper 21 is operated by turning on the power supply of each device, and the glue 20 is discharged from the feeder of the hopper 21 by a predetermined flow rate (for example, 2 kg / min). It is supplied to the feeder apparatus 22 (step S2). Weighing the glue 20 in the weighing hopper 231 by the load cell 26 in a step in which a predetermined amount of glue 20 is stored in the weighing hopper 231 of the feeder device 22 (weight of the weighing hopper 231). Is included) (step S3), and the measured value Sm is taken into the control device 30. The control apparatus 30 compares measured value Sm with a set value (reference value) (step S4). For example, comparison is performed by setting 1800 g / hour as the set value Sm. And an upper limit is 3000 g / hour, and a minimum is 1000 g / hour. The control device 30 gives a command to increase the rotation of the screws 225a and 225b of the feeder device 22 when the comparison result is 1800≥Sm (step S5), and when it is 1800 <Sm, the screw ( A command for lowering the rotation of 225a and 225b is issued (step S6). When the measured value Sm exceeds the upper limit, operation of the feeder device 22 is stopped or slowed down until the measurement timing by the load cell 26 thereafter, and when the lower limit is exceeded, the rotation of the screws 225a and 225b is performed. Control to increase

According to the instructions of the steps S5 and S6, the control device 30 rotates the screws 225a and 225b of the feeder device 22 (step S7) while controlling the rotational speed of the drive unit 222 (step S7). ), The glue is pulverized and discharged into the discharge container 235, and further discharged into the dissolution tank 23 through the chute 220. The amount of glue injected into the dissolution tank 23 is measured by the load cell 26 by the difference between the weight before discharge and after discharge. At the same time, the control device 30 opens the valve 250 to supply water to the dissolution tank 23 to dissolve the glue from the chute 220 (step S8). At this time, the glue solution is warmed to about 65 ° C by blowing steam from the waste heat recovery boiler of the magnetic furnace. And the vapor | steam and the valve 250 are closed by the control apparatus 30, when the liquid level gauge 27 detects that the liquid level of the dissolution tank 23 became set value.

The liquid level of the glue solution 200 in the dissolution tank 23 is monitored by the liquid level gauge 27 (step S9). When the liquid level is at or below the set value (step S10: YES), the control device 30 opens the valve 250 to supply steam or water, and increases the glue from the feeder device 22 (step S11). ). The increase of glue is performed by increasing the rotation speed of the screw 225a, 225b. In addition, the temperature of the glue solution 200 is monitored by the electronic thermometer 28, and the control device 30 supplies steam when the temperature is lower than the set value, and supplies water when the temperature rises too high. 250). When the liquid level of the glue solution 200 in the dissolution tank 23 reaches the set level, the control apparatus 30 operates the pump 25 (step S12), and pipes the glue solution 200 in the dissolution tank 23 ( It supplies to the supply tank 13 through 24 and 16a. In addition, the operation of the pump 25 of step S12 is continuously operated after that.

In addition, the control device 30 also executes the control shown in FIG. 7. That is, the control apparatus 30 measures the cathode potential Vt of the electrolyte solution accumulated in the supply tank 13 as the electrolyte solution just before the glue and the additive 140 are added and injected into the electrolytic cell 11, with the potential meter 130. Further, the cathode potential Vd of the electrolyte solution extracted from the electrolytic cell 11 and accumulated in the liquid discharge tank 12 is measured by the potential measuring instrument 120 (steps S21, S22), and the difference between the cathode potentials of both (Vt- Vd) is calculated (step S23), and the decrease of the glue concentration in the electrolyte is determined based on the calculation result (step S24), and the glue solution 200 supplied into the supply tank 13 based on the determination result. ) Control (steps S25, # S26) to adjust the amount of addition, that is, control to adjust the rotation of the screws 225a and 225b of the screw mechanism 223.

Here, a method for determining the decrease of the potential difference and the glue concentration will be described. First, a part of the electrolyte solution in the drainage tank 12 is taken into the test electrolytic bath 31 shown in FIG. 5A as the discharge liquid 39, and the glue concentration as shown in FIG. 5A is shown. N1 and cathode potential V1 are measured. Next, the valve 35 is opened, and a predetermined amount of glue solution 200 is added to the test electrolytic cell 31 from the pipe 24, and the difference between the glue concentration and the cathode potential is measured by measuring the glue concentration N2 and the cathode potential V2. (V2-V1) is calculated, and as shown in FIG. 5 (b), the process of adding the glue solution 200 to the test electrolytic cell 31 and the process of measuring the cathode potential difference are repeated. Create a calibration curve between the concentration and the cathode potential difference. Based on the calibration curve created by the glue concentration and the cathode potential difference thus produced, the control in steps S25 and S26 is executed so that the glue concentration can be controlled to a predetermined concentration by the control method shown in FIG.

[Effect of 1st Embodiment]

According to the glue supply apparatus which concerns on this embodiment, the feeder apparatus 22 is installed, the rotation speed of the screw mechanism 223 is controlled, and the liquid level of the glue dissolution tank 23 is measured while measuring the quantity of the glue. Since the supply amount of the glue was controlled while monitoring the level with the liquid level measuring device 27, the uniformity of the electrolyte solution 10 was improved and the variation of the potential distribution was reduced. As a result, the uniformity of the electrodeposited copper was improved, the quality was improved, and the power efficiency was improved. There is an effect that the improvement can be planned.

In addition, the above-described configuration can optimize the amount of glue supplied, so that the amount of glue used can be managed, thereby reducing the cost.

2. Second Embodiment

Next, 2nd Embodiment of the glue supply apparatus which concerns on this invention is described with reference to FIG. 8, only the main part of the glue supply apparatus 2 is shown, and the other illustration is abbreviate | omitted. In this embodiment, in the first embodiment, the dissolution tank 23 is plural (in this embodiment, two tanks of the existing dissolution tank 23 and the new dissolution tank 29.), and the feeder device 22 By forming the chute 220 so as to rotate in the horizontal direction, the two dissolution tanks can be appropriately switched and used, and the rest of the configuration is the same as in the first embodiment. In addition, in this embodiment, although the chute 220 is rotated manually, it can also be made to rotate by electric transmission.

According to the second embodiment, even when the glue solution to be supplied in the continuous operation of the electrolytic refining is insufficient due to the configuration in which the dissolution tank is plural, the glue solution can be prepared in advance by using another dissolving bath. We do not stop operation by lack.

In addition, it becomes possible to perform cleaning and maintenance of the dissolution tank at an appropriate timing. In addition, in this embodiment, although the number of installation of the dissolution tank was made into two, two or more sets may be sufficient.

[Example]

Next, the Example of this invention is described. As an example, as a result of performing electrolytic purification of copper in the electrolytic refining apparatus 1 and the glue supply apparatus 2 of the structure shown in FIG. 1, the change of the average molecular weight of the glue is a result shown in Table 1 and FIG. Became. Here, continuous dissolution corresponding to the present invention is obtained by dissolving glue only with water at room temperature and continuously supplying it to the supply tank 13. In addition, batch melt | dissolution corresponding to the prior art dissolves glue "water + acid", and supplies the glue to the supply tank 13 regularly. In addition, the numerical value of the continuous melt | dissolution and batch melt | dissolution in Table 1, and the numerical value of the decrease are average molecular weights. In addition, in the Example, the thick sugar-shaped glue of 2-3 mm was used.

As apparent from Table 1 and FIG. 9, the glues of the continuous dissolution of the present invention had an average molecular weight of at least 19,082 and a maximum of 19,965 (excluding the data at 7:00 on the first day), and the change width thereof was 883. On the other hand, in the conventional batch dissolution, the average molecular weight was 12,216 to 19,376 (excluding the data at 7:00 on the first day), and the variation was 4,414. In addition, the difference of the average molecular weight between continuous dissolution and batch dissolution increased with the passage of the dissolution time as shown in the "reduced fraction" in Table 1, and became a difference of 7,453 after 24 hours. As is apparent from the above, according to the present invention, it is understood that the electrolyte 10 is deteriorated with the passage of time while the electrolyte 10 is stable even if time passes.

As mentioned above, although preferred embodiment of this invention was described in detail, this invention is not limited to this specific embodiment, In the range of the summary of this invention described in the claim, various deformation | transformation and a change are made. Of course it is possible.

1: electrolytic purification device
2: glue supply
3: negative electrode plate
10: electrolyte
11: electrolytic cell
12: liquid discharge tank
13: supply tank
14: additive tank
15: electrolyte supply tank
16a: Piping
16b: Piping
17a: pump
17b: pump
17c: pump
17d: pump
18a: Piping
18b: Piping
20: glue
21: Hopper
22: feeder device
23: dissolution tank
24: piping
25: pump
26: load cell
27: liquid level meter
28: electronic thermometer
29: dissolution tank
30: Control device
31: test electrolyzer
32: piping
33: Pump
34: piping
35: valve
36: cathode
37: reference electrode
38: anode
39: drain liquid
40: DC power
120: cathode potential meter
130: cathode potential meter
140: additive
200: glue solution
220: suit
221: base
222: drive unit
223: Screw Mechanism
224 hopper section
225a: screw
225b: Screw
226: Screw Wings
227: Feed Hopper
228: agitator
229: Gasket
230: Clamp
231: Weighing Hopper
232: Gasket
233: Clamp
234: lid
235: discharge bin
250: valve
251: Plumbing

Claims (5)

In the glue supply device for supplying glue in the electrolytic solution accumulated in the electrolytic cell in order to perform electrolytic purification of the metal,
A dissolution tank for dissolving glue,
A feeder device for supplying the glue into the dissolution tank,
A water supply device for supplying water into the dissolution tank,
A liquid level meter for measuring the liquid level of the glue solution accumulated in the dissolution tank;
Glue and water in an amount necessary to replenish the glue solution corresponding to the extracted amount from the change in the liquid level when the glue solution is extracted from the dissolution tank measured by the liquid level gauge and the liquid level is lowered. And a control device for controlling the feeder device and the water supply device to supply the inside. The method of claim 1,
The feeder device,
A hopper for receiving the glue,
A metering device for weighing the glue contained in the hopper;
Glue supply apparatus characterized by controlling the injection amount of the glue by measuring the weight of the glue injected into the dissolution tank and reduced by the measuring device. The method according to claim 1 or 2,
Having a plurality of dissolution tanks,
A feed chute of the feeder device for pouring glue into the dissolution tank is rotatably formed,
Glue supply apparatus which became able to supply glue to each of the said dissolution tank provided in multiple numbers by rotating the said injection chute. The method according to claim 1 or 2,
The amount of reduction in the glue concentration in the electrolyte solution is determined based on the difference between the cathode potential of the electrolyte solution accumulated in the supply tank as the electrolyte solution immediately before the glue and the additive is added to the electrolyte bath and the electrolyte solution extracted from the electrolyte bath and accumulated in the liquid discharge tank. And a function of adjusting the amount of the glue solution to be supplied into the supply tank based on the determination result. In the glue supply method using the glue supply apparatus of Claim 1 or 2,
The glue supplied to the feeder device is a granule of 2 to 3 mm, wherein the glue supply method.

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