CN219409972U

CN219409972U - Electroplating device for circuit board

Info

Publication number: CN219409972U
Application number: CN202320276520.XU
Authority: CN
Inventors: 温小强; 麦树荣; 苏建龙; 梁荣培
Original assignee: Jiangmen Haoyuan Electronic Technology Co ltd
Current assignee: Jiangmen Haoyuan Electronic Technology Co ltd
Priority date: 2023-02-20
Filing date: 2023-02-20
Publication date: 2023-07-25
Anticipated expiration: 2033-02-20

Abstract

The utility model discloses a circuit board electroplating device, which comprises: the electrolytic bath, the current detector and the pumping piece are arranged in the electrolytic bath, and electroplating liquid is contained in the electrolytic bath; the current detector can detect the current value passing through the electroplating solution; the water outlet end of the water pumping piece is connected with the electrolytic tank, and the water inlet end is immersed in electrolyte solution; the electrolysis trough is connected with the electric current detector for detect the current value through the plating bath, metal cation in the plating bath is consumed gradually, leads to cation concentration to reduce, then reduce through the current value of plating bath, the electric current detector electricity is connected in pumping the piece, when the electric current value that the electric current detector detected is less than the default, the electric current detector can send the signal to pumping the piece, so that pumping the piece and can carry electrolyte solution to the electrolysis trough in, thereby can be timely supplement electrolyte in to the plating bath, in order to ensure the electroplating effect of circuit board.

Description

Electroplating device for circuit board

Technical Field

The utility model relates to the technical field of circuit board production, in particular to a circuit board electroplating device.

Background

In the related art, in the production process of the circuit board, an electroplating process is generally required to be performed on the circuit board so as to improve the wear resistance, corrosion resistance and the like of the circuit board, thereby improving the quality of the circuit board. The circuit board is generally electroplated in the electroplating liquid, and as the electroplating is carried out, metal cations in the electroplating liquid are gradually consumed, so that the concentration of the cations is reduced, and electrolyte needs to be supplemented in time to the electroplating liquid.

Disclosure of Invention

The present utility model aims to solve at least one of the technical problems existing in the prior art. Therefore, the utility model provides a circuit board electroplating device which can timely supplement electrolyte into electroplating liquid so as to ensure the electroplating effect of a circuit board.

According to an embodiment of the utility model, a circuit board electroplating device comprises:

the electrolytic tank is internally filled with electroplating liquid;

a current detector for detecting a current value passing through the plating solution;

the water outlet end of the water pumping piece is connected with the electrolytic tank, and the water inlet end of the water pumping piece is immersed in electrolyte solution;

the current detector can be electrically connected to the pumping piece, and when the current value detected by the current detector is smaller than a preset value, the pumping piece can convey electrolyte solution into the electrolytic tank.

The circuit board electroplating device provided by the embodiment of the utility model has at least the following beneficial effects: the current detector is used for detecting the current value through the electroplating solution, when metal cations in the electroplating solution are gradually consumed, and the concentration of cations is reduced, then the current value through the electroplating solution is reduced, the current detector is electrically connected to a pumping piece, and when the current value detected by the current detector is smaller than a preset value, the current detector can send a signal to the pumping piece so that the pumping piece can convey electrolyte solution into the electrolytic tank, and electrolyte can be timely supplemented into the electroplating solution, so that the electroplating effect of a circuit board is ensured.

According to some embodiments of the utility model, the circuit board electroplating apparatus further comprises a control system, and the current detector is electrically connected to the pumping member through the control system.

According to some embodiments of the utility model, a liquid level sensor is also installed in the electrolytic tank for detecting the liquid level of the electroplating liquid.

According to some embodiments of the utility model, the circuit board electroplating device further comprises a liquid inlet pipe communicated with the electrolytic tank, the liquid inlet pipe can convey electroplating liquid to the electrolytic tank, and the liquid inlet pipe is closed when the liquid level sensor detects that the liquid level of the electroplating liquid reaches a first preset position.

According to some embodiments of the utility model, the liquid inlet pipe is provided with a first electromagnetic valve for controlling a switch, and the first electromagnetic valve is electrically connected to the liquid level sensor.

According to some embodiments of the utility model, the circuit board electroplating device further comprises a liquid outlet pipe communicated with the bottom of the electrolytic tank, and the liquid level sensor detects that the liquid level of the electroplating liquid reaches a second preset position, and the liquid outlet pipe is opened.

According to some embodiments of the utility model, the outlet pipe is provided with a second solenoid valve for controlling a switch, which is electrically connected to the liquid level sensor.

According to some embodiments of the utility model, the second preset position is higher than the first preset position, and the drain pipe is closed when the level of the plating solution is lower than the first preset position.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The utility model is further described with reference to the accompanying drawings and examples, in which:

FIG. 1 is a schematic diagram of a circuit board electroplating apparatus according to some embodiments of the present utility model;

fig. 2 is a schematic structural diagram of a circuit board electroplating apparatus according to some embodiments of the utility model.

Reference numerals:

an electrolytic cell 100; a liquid level sensor 200; a liquid inlet pipe 300; a first solenoid valve 310; a liquid outlet pipe 400; a second solenoid valve 410.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.

In the description of the present utility model, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present utility model and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present utility model.

In the description of the present utility model, a number means one or more, a number means two or more, and greater than, less than, exceeding, etc. are understood to not include the present number, and above, below, within, etc. are understood to include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present utility model, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present utility model can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.

In order to solve the above problems, the present utility model provides a circuit board electroplating device, which can timely supplement electrolyte into the electroplating solution to ensure the electroplating effect of the circuit board.

Referring to fig. 1 and 2, the circuit board electroplating apparatus of the present utility model includes: an electrolytic cell 100, a current detector and a pumping member. Wherein, the electroplating solution is contained in the electrolysis bath 100, the current detector is used for detecting the current value through the electroplating solution, the water outlet end of the water pumping piece is communicated with the electrolysis bath 100, the water inlet end of the water pumping piece is immersed in the electrolyte solution, the water pumping piece can pump the electrolyte solution into the electrolysis bath 100, the current detector is electrically connected with the water pumping piece, when the current value through the electroplating solution detected by the current detector is smaller than a preset value, the cation concentration in the electroplating solution is lower, at the moment, the current detector can send a signal to the water pumping piece, so that the water pumping piece can start to work, the electrolyte solution is pumped into the electrolysis bath 100, and electrolyte can be timely supplemented into the electroplating solution, so as to ensure the electroplating effect of the circuit board.

In some embodiments of the present utility model, the circuit board electroplating device further includes a control system, the current detector can be electrically connected to the pumping member through the control system, the control system can receive an electrical signal of the current detector, and can control the opening or closing of the pumping member, so that electrolyte solution can be automatically replenished into the electroplating solution, the automation degree of the circuit board electroplating device is improved, and the convenience of the circuit board electroplating device in use is improved. It is understood that the pumping member may be a water pump.

In some embodiments of the present utility model, a level sensor 200 is also mounted within the electrolytic cell 100 and can be used to detect the level of the plating solution. It should be noted that, the circuit board electroplating device further includes a liquid inlet pipe 300, the liquid inlet pipe 300 is connected to the electrolytic tank 100, and is capable of conveying the electroplating liquid into the electrolytic tank 100, and after the liquid level sensor 200 detects that the liquid level of the electroplating liquid reaches the first preset position, the electroplating liquid in the electrolytic tank 100 is proper, and at this time, the liquid inlet pipe 300 is closed to stop conveying the electroplating liquid.

It should be noted that, the liquid inlet pipe 300 is provided with a first electromagnetic valve 310 capable of controlling the opening and closing of the liquid inlet pipe 300, and the first electromagnetic valve 310 may be electrically connected to the liquid level sensor 200 through a control system. It will be appreciated that after the level sensor 200 detects that the level of the plating solution reaches the first predetermined position, the level sensor 200 can send a signal to the control system, and the control system can control the first solenoid valve 310 to close, thereby closing the feed pipe 300 to stop the supply of the plating solution to the electrolytic cell 100.

In some embodiments of the present utility model, the circuit board electroplating apparatus further includes a drain pipe 400, the drain pipe 400 is connected to the bottom of the electrolytic tank 100, and is capable of draining the electroplating solution in the electrolytic tank 100, and when the level sensor 200 detects that the level of the electroplating solution reaches the second preset position, the drain pipe 400 is opened to drain the excess electroplating solution.

It should be noted that, the liquid outlet pipe 400 is provided with a second electromagnetic valve 410 capable of controlling the opening and closing of the liquid outlet pipe 400, and the second electromagnetic valve 410 may be electrically connected to the liquid level sensor 200 through a control system. It will be appreciated that after the level sensor 200 detects that the level of the plating solution reaches the second predetermined position, the level sensor 200 can send a signal to the control system, and the control system can control the second solenoid valve 410 to open, thereby opening the drain pipe 400 to drain the excess plating solution.

It should be noted that, the second preset position is higher than the first preset position, when the liquid level sensor 200 detects that the liquid level of the plating solution reaches the second preset position, the control system can control the second electromagnetic valve 410 to be opened, so that the liquid outlet pipe 400 can discharge the plating solution, and when the position of the plating solution reaches the first preset position, the liquid outlet pipe 400 is closed.

The embodiments of the present utility model have been described in detail with reference to the accompanying drawings, but the present utility model is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present utility model.

Claims

1. A circuit board electroplating device, comprising:

the electrolytic tank is internally filled with electroplating liquid;

2. The circuit board electroplating device of claim 1, further comprising a control system, wherein the current detector is electrically connected to the water pumping member via the control system.

3. The plating apparatus as recited in claim 1, wherein a liquid level sensor is further installed in said electrolytic bath for detecting a liquid level of said plating liquid.

4. The circuit board electroplating device of claim 3, further comprising a liquid inlet pipe communicated with the electrolytic tank, wherein the liquid inlet pipe can convey electroplating liquid to the electrolytic tank, and the liquid level sensor detects that the liquid level of the electroplating liquid reaches a first preset position, and the liquid inlet pipe is closed.

5. The circuit board electroplating device according to claim 4, wherein the liquid inlet pipe is provided with a first solenoid valve for controlling a switch, and the first solenoid valve is electrically connected to the liquid level sensor.

6. The plating apparatus according to claim 4, further comprising a drain pipe connected to a bottom of the electrolytic cell, wherein the liquid level sensor detects that the liquid level of the plating solution reaches a second predetermined position, and the drain pipe is opened.

7. The circuit board electroplating device according to claim 6, wherein the drain pipe is provided with a second solenoid valve for controlling a switch, the second solenoid valve being electrically connected to the liquid level sensor.

8. The plating apparatus as recited in claim 6, wherein said second predetermined position is higher than said first predetermined position, and said drain pipe is closed when a level of said plating solution is lower than said first predetermined position.