JPS6455394A - Production of high-purity electrolytic copper - Google Patents

Production of high-purity electrolytic copper

Info

Publication number
JPS6455394A
JPS6455394A JP62210235A JP21023587A JPS6455394A JP S6455394 A JPS6455394 A JP S6455394A JP 62210235 A JP62210235 A JP 62210235A JP 21023587 A JP21023587 A JP 21023587A JP S6455394 A JPS6455394 A JP S6455394A
Authority
JP
Japan
Prior art keywords
copper
electrolyte
cathode
electrolytic
purity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62210235A
Other languages
Japanese (ja)
Other versions
JPH055903B2 (en
Inventor
Yoichi Takazawa
Shiro Kawai
Yoshichika Toyoshima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eneos Corp
Original Assignee
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co Ltd filed Critical Nippon Mining Co Ltd
Priority to JP62210235A priority Critical patent/JPS6455394A/en
Publication of JPS6455394A publication Critical patent/JPS6455394A/en
Publication of JPH055903B2 publication Critical patent/JPH055903B2/ja
Granted legal-status Critical Current

Links

Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling

Abstract

PURPOSE:To deposit extremely high-purity copper on a cathode by adding glue to an electrolyte in the diaphragmatical electrolytic refining of copper with electrolytic copper as the consumable anode. CONSTITUTION:The acidic electrolyte 5 contg. CuSO4 and H2SO4 is charged in an electrolytic cell 1, the sheet of stainless steel, high-purity copper, etc., is used as the cathode 3 which is covered with a diaphragm 4 consisting of a filter cloth having 0.5-6cc/sec.cm<2> air permeability. Electrolytic copper obtained by electrolytically refining crude copper is used as the anode 2, and electrolytic refining is carried out at the electrolyte temp. of 30-50 deg.C and at 50-150A/dm<2> cathode current density. In this case, glue is supplied into the diaphragm covering the cathode at the rate of 5-20g/ton electrolytic copper, and the amt. of the glue to be added is adjusted so that the estimation value corresponding to the area (hatched part) surrounded by the cathode polarization curves in the polarization characteristic curve of the electrolyte is controlled to 100-450g/m<2>. The electrolyte is filtered by a filter 7 to remove the contained impurities, returned into the diaphragm 4, and circulated. The impurity Ag and S are reduced to the order of magnitude of 1ppm, and copper having 99.999% purity is obtained.
JP62210235A 1987-08-26 1987-08-26 Production of high-purity electrolytic copper Granted JPS6455394A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62210235A JPS6455394A (en) 1987-08-26 1987-08-26 Production of high-purity electrolytic copper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62210235A JPS6455394A (en) 1987-08-26 1987-08-26 Production of high-purity electrolytic copper

Publications (2)

Publication Number Publication Date
JPS6455394A true JPS6455394A (en) 1989-03-02
JPH055903B2 JPH055903B2 (en) 1993-01-25

Family

ID=16586024

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62210235A Granted JPS6455394A (en) 1987-08-26 1987-08-26 Production of high-purity electrolytic copper

Country Status (1)

Country Link
JP (1) JPS6455394A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6451135B1 (en) * 1997-06-02 2002-09-17 Japan Energy Corporation High-purity copper sputtering targets and thin films
WO2010038641A1 (en) 2008-09-30 2010-04-08 日鉱金属株式会社 High-purity copper and process for electrolytically producing high-purity copper
WO2010038642A1 (en) 2008-09-30 2010-04-08 日鉱金属株式会社 High-purity copper or high-purity copper alloy sputtering target, process for manufacturing the sputtering target, and high-purity copper or high-purity copper alloy sputtered film
JP2012072458A (en) * 2010-09-29 2012-04-12 Pan Pacific Copper Co Ltd Glue supply device and glue supply method

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5310930B2 (en) * 1973-07-19 1978-04-18
JPS5532795B2 (en) * 1974-12-24 1980-08-27
JPS5611756B2 (en) * 1974-03-20 1981-03-17
JPS5716188A (en) * 1980-07-03 1982-01-27 Furukawa Electric Co Ltd:The Electrolytic refinery of copper
JPS5716187A (en) * 1980-06-20 1982-01-27 Furukawa Electric Co Ltd:The Electrolytic refinery of copper
JPS5942754A (en) * 1982-08-31 1984-03-09 Shimadzu Corp Grinding processing unit
JPS5976886A (en) * 1982-10-22 1984-05-02 Nippon Mining Co Ltd Method for electrolytically refining copper
JPS607711A (en) * 1983-06-28 1985-01-16 東北金属工業株式会社 Laminated ceramic condenser and method of producing same
JPS6133918A (en) * 1984-07-26 1986-02-18 東洋製罐株式会社 Sealing device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5310930A (en) * 1976-07-19 1978-01-31 Hitachi Ltd Character recognition device
DE2836580C3 (en) * 1978-08-21 1981-11-05 Chemische Werke Hüls AG, 4370 Marl Process for the separation of hydrogen chloride and hydrogen bromide
JPS5611756A (en) * 1979-07-10 1981-02-05 San Ei Chem Ind Ltd Frozen food

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5310930B2 (en) * 1973-07-19 1978-04-18
JPS5611756B2 (en) * 1974-03-20 1981-03-17
JPS5532795B2 (en) * 1974-12-24 1980-08-27
JPS5716187A (en) * 1980-06-20 1982-01-27 Furukawa Electric Co Ltd:The Electrolytic refinery of copper
JPS5716188A (en) * 1980-07-03 1982-01-27 Furukawa Electric Co Ltd:The Electrolytic refinery of copper
JPS5942754A (en) * 1982-08-31 1984-03-09 Shimadzu Corp Grinding processing unit
JPS5976886A (en) * 1982-10-22 1984-05-02 Nippon Mining Co Ltd Method for electrolytically refining copper
JPS607711A (en) * 1983-06-28 1985-01-16 東北金属工業株式会社 Laminated ceramic condenser and method of producing same
JPS6133918A (en) * 1984-07-26 1986-02-18 東洋製罐株式会社 Sealing device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6451135B1 (en) * 1997-06-02 2002-09-17 Japan Energy Corporation High-purity copper sputtering targets and thin films
WO2010038641A1 (en) 2008-09-30 2010-04-08 日鉱金属株式会社 High-purity copper and process for electrolytically producing high-purity copper
WO2010038642A1 (en) 2008-09-30 2010-04-08 日鉱金属株式会社 High-purity copper or high-purity copper alloy sputtering target, process for manufacturing the sputtering target, and high-purity copper or high-purity copper alloy sputtered film
US9441289B2 (en) 2008-09-30 2016-09-13 Jx Nippon Mining & Metals Corporation High-purity copper or high-purity copper alloy sputtering target, process for manufacturing the sputtering target, and high-purity copper or high-purity copper alloy sputtered film
US9476134B2 (en) 2008-09-30 2016-10-25 Jx Nippon Mining & Metals Corporation High purity copper and method of producing high purity copper based on electrolysis
EP3128039A1 (en) 2008-09-30 2017-02-08 JX Nippon Mining & Metals Corp. High-purity copper sputtering target or high-purity copper alloy sputtering target
JP2012072458A (en) * 2010-09-29 2012-04-12 Pan Pacific Copper Co Ltd Glue supply device and glue supply method

Also Published As

Publication number Publication date
JPH055903B2 (en) 1993-01-25

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