KR101290952B1 - Testing apparatus and test head - Google Patents

Abstract

According to the present invention, the motherboard can be easily attached to the test head of the test apparatus.

The present invention includes a test head incorporating a pin card that transmits and receives a signal to and from a device under test, and a motherboard mounted on the test head and electrically connecting the pin card to the device under test. The head includes a test head side guide part for slidably holding the motherboard in a predetermined movement direction substantially parallel to the upper surface of the test head, and a motherboard side connector provided at the lower side of the motherboard by sliding the motherboard pins. In the state moved to the position which opposes the pin card side connector provided on the side of the upper surface side of the test head in a card, it connects a motherboard side connector to a corresponding pin card side connector by moving a motherboard to a test head side. It provides a test apparatus including a detachable portion.

Motherboard, Test Head, Slide, Guide Section, Connector

Description

Test apparatus and test heads {TESTING APPARATUS AND TEST HEAD}

1 shows a configuration of a test apparatus 10 according to an embodiment of the present invention.

2 is a perspective view of a test head 110 according to the embodiment of the present invention.

3 is a perspective view of the motherboard 120 according to the embodiment of the present invention.

4 is a perspective view of the lifting unit 220 according to the embodiment of the present invention.

5 is a view of the lifting unit 220 according to the embodiment of the present invention as seen from the direction A. FIG.

[Description of Symbols]

10 test device

100 mainframe

110 test head

120 motherboard

125 conveying device

130 DUT

200 pin card

210 connector

220 elevators

230 guide pin

305 Device Mount

310 motherboard body

320 motherboard frame

325 rail

330 handle

335 pin hole

400 guide parts

405 rail support

410 roller

420 detachable part

430 guide support

The present invention relates to a test apparatus and a test head. In particular, the present invention relates to a test apparatus and a test head for mounting on a test head a mother board which electrically connects between the device under test and the test apparatus main body.

Background Art Conventionally, a test apparatus is electrically connected between a pin card and a device under test on a test head that includes a plurality of pin cards that exchange signals with a device under test (DUT) such as a semiconductor device. The connected motherboard was mounted, and the device under test was mounted on the motherboard to perform the test.

In addition, since the presence of a prior art document is not recognized at this time, description regarding a prior art document is abbreviate | omitted.

Conventionally, when mounting a motherboard, the mother board was lifted up by a human hand, moved to the test head upper surface, and the position was adjusted, and it mounted down carefully. In recent years, with the high integration of a test apparatus, the number of the device under test which can be tested simultaneously is increasing, and with this, a motherboard becomes large and becomes heavy. For this reason, in order to replace a motherboard, the work of the large number of people, such as four or more people, is needed.

In addition, in order to match the position of the test head upper surface and the motherboard, guide pins are provided on the test head, and pin holes are provided in the lower part of the motherboard. However, since the motherboard is enlarged and heavy, there is a high possibility that the motherboard may be tilted up or down at an angle during the replacement operation, and the connector on the motherboard or the pin card side may be damaged.

Therefore, an object of this invention is to provide the test apparatus and test head which can solve the said subject. This object is achieved by a combination of the features described in the independent claims in the claims. The dependent claims also define more advantageous specific examples of the invention.

According to the first aspect of the present invention, there is provided a test apparatus for testing a device under test, which is mounted on a test head having a pin card incorporating a pin card to communicate with the device under test, and on the test head, A motherboard electrically connecting the pin card to the device under test, wherein the test head slidably slides the motherboard in a predetermined movement direction substantially parallel to the top surface on an upper surface of the test head. By holding the test head side guide portion and the motherboard, the motherboard side connector provided on the lower side of the motherboard includes a pin card side connector provided on the side of the upper surface side of the test head of the pin card. In the opposite position, moving the motherboard to the test head side By providing a test apparatus including detachable portion to be connected to the card-side connector pins corresponding to the mother board side connector.

The mother board includes a plate-shaped rail extending in the moving direction, and the test head side guide portion is shifted in a direction perpendicular to the moving direction on the upper surface of the test head. The rail may be moved in the moving direction while being supported.

The rail has a plate-like shape parallel to the upper surface of the test head, the test head side guide portion is a direction in which the rail is perpendicular to the moving direction in the upper surface of the test head, and an upper surface of the test head. You may support the said rail so that it may not shift | deviate in the direction perpendicular | vertical to it.

The said test head side guide part may be provided in the lower side of the said rail, and may include the roller which hold | maintains the said rail so that a movement to the said moving direction is possible.

The detachable portion may move the motherboard in a direction substantially perpendicular to the upper surface of the test head by moving the test head side guide portion in a direction substantially perpendicular to the upper surface of the test head.

The motherboard includes a motherboard side positioning portion for lowering the position to be mounted on the upper surface of the test head, the test head is installed on the upper surface of the test head, the motherboard to the test head side It may further include a test head side positioning portion for engaging with the motherboard side connector and the pin card side connector by being coupled with the motherboard side positioning portion when moved.

And a conveying apparatus for conveying the motherboard, wherein the conveying apparatus is configured to move the motherboard so that the test head side guide portion is flush with the side that slides the motherboard with the side attached to the test head. A carrying side guide part slidably retained may be included, and the mother board may slide in the moving direction from the carrying side guide part and move to the side of the test head side guide part.

The conveying apparatus further includes a lifting part for moving the conveying side guide part up and down, and the lifting part is the conveying side guide when moving the motherboard from the conveying device to the test head. You may move the said conveyance guide part up or down so that the height of a part may become the same height as the said test head side guide part.

According to the second aspect of the present invention, a test head having a pin card that transmits and receives a signal between the device under test and the device under test is placed on the test head. A test head side guide portion for slidably holding a motherboard electrically connecting the pin card to the device under test in a predetermined movement direction substantially parallel to the upper surface on the upper surface of the test head; The motherboard is tested by sliding the motherboard side connector provided under the motherboard to a position opposite to the pin card side connector provided on the side of the upper surface side of the test head of the pin card. The pin corresponding to the motherboard side connector by moving to the head side A test head including a detachable portion connected to a card side connector is provided.

According to a third aspect of the present invention, there is provided a pin card placed on a test head included in a test apparatus for testing a device under test, and having a signal exchanged with the device under test, which is built in the test head. And a mother board electrically connected to the device under test, the device mounting portion on which the device under test is mounted, and the mother board being slid in a predetermined movement direction substantially parallel to the upper surface on an upper surface of the test head. A motherboard side connector mounted on the motherboard frame held by the test head and a pin card side connector mounted on the side of an upper surface side of the test head of the pin card, the motherboard side connector being held by the test head. The lower side, and the terminal of the motherboard side connector is connected to the Through the mounting provides a motherboard that includes a mother board main body having a wiring pattern to be connected to corresponding terminals of the device under test.

The motherboard frame may include a plate-shaped rail extending in the moving direction.

The motherboard is installed to match a position to be mounted on an upper surface of the test head, and is coupled with a test head side positioning unit provided on an upper surface of the test head when the motherboard is moved to the test head side. The motherboard side positioning portion for matching the position of the side connector and the pin card side connector may be included in the lower surface.

Note that the above summary of the invention does not enumerate all of the necessary features of the present invention, and subcombinations of such feature groups can also be inventions.

Hereinafter, although this invention is demonstrated through embodiment of this invention, the following embodiment does not limit invention which belongs to a claim, and all the combination of the features demonstrated in embodiment are essential for the solution of this invention. It is not limited to that.

1 shows a configuration of a test apparatus 10 according to the present embodiment. The test apparatus 10 is a test system for testing the DUT 130 and includes a main frame 100, a test head 110, a motherboard 120, and a transport apparatus 125. The main frame 100 generates a test pattern for testing the DUT 130 and / or an expected value pattern of an output signal output by the DUT 130 according to the test pattern, and determines whether the DUT 130 is good or bad. The test head 110 incorporates one or a plurality of pin cards 200 to exchange signals with the DUT 130. The pin card 200 is, for example, a test module that supplies a test signal based on a test pattern to the DUT 130 and compares an output signal output by the DUT 130 based on the test signal with an expected value based on the expected value pattern. The motherboard 120, also called the performance board, is placed on top of the test head 110 and mounts the DUT 130. The motherboard 120 electrically connects the pin card 200 to the DUT 130. The conveying apparatus 125 conveys the motherboard 120. And when carrying the motherboard 120 to the test head 110, the conveying apparatus 125 attaches a side surface to the test head 110, and slides the conveyed motherboard 120 on a test head 110 by a human hand or mechanically.

The test apparatus 10 according to the present embodiment allows the motherboard 120 to slide from the transport apparatus 125 with respect to the test head 110. Thereby, the test apparatus 10 can put the motherboard 120 on the test head 110 more safely and work efficiency compared with the case where the motherboard 120 is lifted by a human hand and put on the test head 110. FIG.

2 is a perspective view of the test head 110 of the test head 110 according to the present embodiment. In the test of the DUT 130, the test head 110 according to the present embodiment has a structure in which the mother board 120 is rotated so that the mother board 120 is turned upward when the mother board 120 is held on the lower side. Therefore, in this embodiment, an up-down direction is shown on the basis of the case where the operation | work which mounts the motherboard 120 is performed.

The test head 110 includes one or a plurality of pin cards 200, a lifting unit 220, and a guide pin 230. One or a plurality of pin cards 200 are accommodated in the test head 110 main body so as to be substantially parallel to each other. On the side of the upper surface side of the test head 110 in each pin card 200, the connector 210 connected with the connector provided in the motherboard 120 lower part is provided. Here, the connector 210 is an example of the pin card side connector according to the present invention, and the connector provided below the motherboard 120 is an example of the motherboard side connector according to the present invention.

The lifting unit 220 slidably holds the motherboard 120 substantially in parallel with the upper surface of the test head 110. And the lifting part 220 is moved to the position which each connector on the motherboard 120 side opposes the corresponding connector 210, and moves the motherboard 120 below, and connects connectors.

The guide pin 230 is an example of the test head side positioning unit according to the present invention, and is provided on the upper surface of the test head 110. The guide pin 230 is engaged with the motherboard side positioning portion provided on the bottom surface of the motherboard 120 when the motherboard 120 is moved to the test head 110 side, thereby aligning the connectors on the motherboard side and the connector 210 on the pin card side. . The guide pin 230 by this embodiment is a pin extending | stretching upward of the test head 110 as an example, and is inserted in the guide hole provided in the motherboard 120 side when moving the motherboard 120 downward, and the motherboard 120 Position it so that the position difference between the connector of the side and the connector 210 may be eliminated.

3 is a perspective view of the motherboard 120 according to the present embodiment. The motherboard 120 includes a device mounting portion 305, a motherboard body 310, a motherboard frame 320, and a handle 330. The device mounting unit 305 is a socket for mounting the DUT 130 or the like, and electrically connects the terminal of the DUT 130 to the motherboard main body 310. The motherboard main body 310 mounts the device mounting part 305 on the upper side, and the connector of the motherboard 120 side connected with the connector 210 is provided in the lower side. The motherboard main body 310 has a wiring pattern for electrically connecting the terminals of the connector to the corresponding terminals of the DUT 130 via the device mounting unit 305.

The motherboard frame 320 is inserted from the end of the lifting unit 220 when the motherboard 120 is installed on the test head 110. And the motherboard frame 320 is hold | maintained in the lifting part 220 so that the motherboard 120 can slide in the extending direction of the motherboard frame 320 in the upper surface of the test head 110. FIG. As an example, in this embodiment, two motherboard frames 320 are provided in parallel along the opposite sides of the rectangular motherboard 120. Each motherboard frame 320 has an L-shaped cross section as an example. Each motherboard frame 320 includes a plate-shaped rail 325 extending in a predetermined movement direction (slide direction) substantially parallel to the upper surface on the upper surface of the test head 110. The rail 325 has a plate-like shape parallel to the upper surface of the test head 110 and is held by the lifting unit 220 so that the mother board 120 can move in the slide direction by being placed on the upper side of the roller provided on the lifting unit 220 side.

The handle 330 is used to grasp the motherboard 120 when the motherboard 120 is slid on the upper surface of the test head 110 or when the motherboard 120 is moved by a human hand. In addition, the motherboard 120 includes a pin hole 335 on the lower surface for aligning the position mounted on the upper surface of the test head 110, and the pin hole 335 is an example of the motherboard side positioning unit according to the present invention. In this embodiment, the pinhole 335 engages with the guide pin 230, thereby matching the position of the test head 110 and the motherboard 120 in the plane direction.

4 is a perspective view of the lifting unit 220 according to the present embodiment. 5 is the figure which looked at the elevation part 220 which concerns on this embodiment from the direction A. Moreover, FIG. The lifting unit 220 includes a guide unit 400, a detachable unit 420, and a guide support unit 430. The guide part 400 is an example of the test head side guide part according to the present invention, and on the upper surface of the test head 110, the motherboard 120 is slidably held in a predetermined movement direction (slide direction) substantially parallel to the upper surface. .

As an example, in this embodiment, two guide parts 400 are provided so that the two motherboard frames 320 which the motherboard 120 contains may be moved in a slide direction, respectively. Each guide part 400 holds the rail 325 in the slide direction while supporting the rail 325 coupled to the guide part 400 so as not to be displaced in the direction perpendicular to the moving direction on the upper surface of the test head 110. In addition, the guide part 400 may support the rail 325 so that the rail 325 may not shift in the direction perpendicular | vertical to the moving direction in the upper surface of the test head 110, and a direction perpendicular to the upper surface of the test head 110. As shown in FIG. Thereby, when the guide part 400 is moved to the test head 110 side so that the mother board 120 can be precisely moved to a slide direction, and can be electrically mounted to the pin card 200, the mother board 120 is prevented by the pressure from the connector 210. It can prevent you from lifting upwards. In addition, even when the test head 110 is rotated so that the motherboard 120 becomes the lower side when the connector is not connected, the motherboard 120 can be prevented from falling off from the test head 110.

In this embodiment, the guide part 400 includes a member which has a U-shaped cross section and extends in a slide direction as an example, and between these boards and the lower board which forms the upper and lower sides of a Co-shaped, Hold the rail 325 in parallel. In addition, the guide part 400 may also include the stopper which prevents the motherboard 120 from sliding further, when the motherboard 120 is moved to a mounting position so that it can be electrically attached to the pin card 200. FIG.

Each guide portion 400 is installed to be positioned below the rail 325 while the motherboard 120 slides on the upper surface of the test head 110, and rotates in contact with the lower surface of the rail 325 to hold the rail 325 movably in the slide direction. One or more rollers 410. As a result, the test head 110 can smoothly slide the motherboard 120.

The detachable part 420 moves the motherboard 120 to the test head 110 in a state where the connector 120 on the motherboard 120 is moved to a position opposed to the connector 210 by sliding the motherboard 120. More specifically, the detachable part 420 moves the motherboard 120 in a direction substantially perpendicular to the top surface of the test head 110 by moving the guide part 400 in a direction substantially perpendicular to the top surface of the test head 110. Thereby, the attachment / detachment part 420 connects the connector of the motherboard 120 side to the connector 210 of the corresponding pin card 200 side. The detachable part 420 supports the guide part 400 by the guide support part 430, and may make the guide part 400 up and down by an air cylinder, for example. According to the test apparatus 10 which concerns on this embodiment, by using the attachment / detachment part 420, the motherboard 120 can be lowered in the state which hold | maintained the motherboard 120 parallel with respect to the upper surface of the test head 110. FIG. Thereby, damage to the connector 210 of the pin card 200 side or the connector of the motherboard 120 side, etc. which arise when the motherboard 120 is obliquely engaged can be prevented.

Furthermore, the conveying apparatus 125 carries the slide side guide which slidably holds the motherboard 120 so that the guide part 400 of the test head 110 side may become the same height as the height which slides the motherboard 120 in the state which attached the side to the test head 110. Contains wealth. Since the structure of the conveyance side guide part is similar to the guide part 400 shown in FIG. 4 and FIG. 5, description is abbreviate | omitted. In the case where the motherboard 120 is mounted on the test head 110, the user of the test apparatus 10 attaches the transport apparatus 125 to the test head 110, and slides the transported motherboard 120 in the slide direction from the transport side guide part. To the side of the guide portion 400. Thereby, the user of the test apparatus 10 can replace the large motherboard 120 efficiently also in the small number of people, such as one person.

Moreover, the conveying apparatus 125 may further include the lifting part which moves the motherboard 120 during conveyance up and down by moving a conveyance side guide part up and down. Thereby, the conveying apparatus 125 can make it easy to place the motherboard 120 by moving a conveyance side guide part to a low position, when placing the motherboard 120 on the conveying apparatus 125. FIG. In addition, when moving the motherboard 120 from the conveying apparatus 125 to the test head 110, the conveyance guide part is moved up or down so that the height of the conveying side guide part may be flush with the guide part 400 of the test head 110 side, and the height may be increased. I can regulate it. As a result, the user can slide the motherboard 120 to the test head 110 side. As an example, the lifting unit may adopt a function and configuration similar to that of the attaching and detaching unit 420. In addition, in order to make it easy to place the motherboard 120 on the conveyance apparatus 125, the lifting part may have a wide range which can move a conveyance side guide part up and down compared with the detachable part 420. FIG.

As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various changes or improvements can be made to the above embodiment. It is evident from the description of the claims that the various modifications or improvements can be included in the technical scope of the present invention.

For example, the roller 410 may be provided on the motherboard 120 side. In this case, when the motherboard 120 is placed on the ground, it is preferable to install a fixture on the motherboard 120 so that the motherboard 120 can be fixed at that position.

According to the present invention, the motherboard can be easily attached to the test head of the test apparatus.

Claims (12)

In a test apparatus for testing a device under test, A test head incorporating a pin card for transmitting and receiving a signal to and from the device under test, A mother board placed on the test head and electrically connecting the pin card to the device under test, A conveying device for conveying said motherboard, The test head, A test head side guide portion slidably holding the motherboard in a predetermined movement direction parallel to the top surface on an upper surface of the test head; In the state where the motherboard side connector installed in the lower part of the said motherboard was moved to the position which opposes the pin card side connector provided on the side of the upper surface side of the said test card of the said pin card by sliding said motherboard, And a detachable portion for connecting the motherboard side connector to the corresponding pin card side connector by moving the motherboard to the test head side, When installing the motherboard to the test head, the side of the conveying device is attached to the test head, The conveying apparatus includes a conveying side guide portion for slidably holding the motherboard so that the test head side guide portion is at the same height as that of sliding the motherboard in a state where the side is attached to the test head, The motherboard is slid in the moving direction from the carrying side guide part and moved to the test head side guide part side. tester. The method of claim 1, The mother board includes a plate-shaped rail extending in the moving direction, The test head side guide unit moves the rail in the moving direction while supporting the rail so as not to be displaced in a direction perpendicular to the moving direction on the upper surface of the test head. 3. The method of claim 2, The rail has a plate shape parallel to the upper surface of the test head, The said test head side guide part supports the said rail so that a said rail may not shift in the direction perpendicular | vertical to the said moving direction in the upper surface of the said test head, and a direction perpendicular | vertical to the upper surface of the said test head. The method of claim 3, The test head side guide part includes a roller provided below the rail and holding the rail so as to be movable in the moving direction. The method of claim 3, And the detachable part moves the motherboard in a direction perpendicular to the upper surface of the test head by moving the test head side guide part in a direction perpendicular to the upper surface of the test head. The method of claim 1, The motherboard includes a motherboard side positioning portion for lowering the position mounted on the upper surface of the test head on the lower surface, The test head is installed on an upper surface of the test head, and when the motherboard is moved to the test head side, the test head is coupled with the motherboard side positioning unit to adjust the position of the motherboard side connector and the pin card side connector. Further comprising a test head side positioning portion to align tester. delete The method of claim 1, The conveying apparatus further includes a lifting part for moving the conveying side guide part up and down, The lifting unit moves the carrying side guide part up or down so that the height of the carrying side guide part is the same height as the test head side guide part when the mother board is moved from the carrying device to the test head. tester. delete A mother, which is placed on a test head included in a test apparatus for testing a device under test and electrically connected to the device under test with a pin card embedded in the test head to transmit and receive a signal to and from the device under test. On board, A device mounting part for mounting the device under test, A motherboard frame held by the test head for slidably sliding the motherboard in a predetermined movement direction parallel to the upper surface, on an upper surface of the test head; A motherboard side connector mounted on the upper side and connected to a pin card side connector provided on the side of the upper surface side of the test head of the pin card, the terminal of the motherboard side connector being connected to the device A motherboard main body having a wiring pattern connected to a corresponding terminal of the device under test via a mounting portion; A roller for moving the mother board held in the test head side guide portion slidably holding the motherboard in a predetermined movement direction parallel to the upper surface, on the upper surface of the test head; Fixture to fix the motherboard in place when the motherboard is placed on the ground Motherboard comprising a. The method of claim 10, The motherboard frame includes a plate-shaped rail extending in the moving direction. The method of claim 10, The motherboard is installed to match a position to be mounted on an upper surface of the test head, and is coupled with a test head side positioning unit provided on an upper surface of the test head when the motherboard is moved to the test head side. A motherboard comprising a motherboard side positioning portion for aligning the side connector and the pin card side connector on a lower surface thereof.

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