KR101269976B1 - 엘이디 부품의 3차원비전검사장치 및 비전검사방법 - Google Patents

엘이디 부품의 3차원비전검사장치 및 비전검사방법 Download PDF

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Publication number
KR101269976B1
KR101269976B1 KR1020110069196A KR20110069196A KR101269976B1 KR 101269976 B1 KR101269976 B1 KR 101269976B1 KR 1020110069196 A KR1020110069196 A KR 1020110069196A KR 20110069196 A KR20110069196 A KR 20110069196A KR 101269976 B1 KR101269976 B1 KR 101269976B1
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KR
South Korea
Prior art keywords
height
unit
led component
led
measuring
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KR1020110069196A
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English (en)
Korean (ko)
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KR20130008694A (ko
Inventor
박찬화
김성현
Original Assignee
주식회사 미르기술
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Application filed by 주식회사 미르기술 filed Critical 주식회사 미르기술
Priority to KR1020110069196A priority Critical patent/KR101269976B1/ko
Priority to TW101124216A priority patent/TWI507660B/zh
Priority to PCT/KR2012/005442 priority patent/WO2013009065A2/fr
Publication of KR20130008694A publication Critical patent/KR20130008694A/ko
Application granted granted Critical
Publication of KR101269976B1 publication Critical patent/KR101269976B1/ko

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G01M11/08—Testing mechanical properties
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
KR1020110069196A 2011-07-13 2011-07-13 엘이디 부품의 3차원비전검사장치 및 비전검사방법 KR101269976B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020110069196A KR101269976B1 (ko) 2011-07-13 2011-07-13 엘이디 부품의 3차원비전검사장치 및 비전검사방법
TW101124216A TWI507660B (zh) 2011-07-13 2012-07-05 發光二極體元件的三維視覺檢查方法及三維視覺檢查裝置
PCT/KR2012/005442 WO2013009065A2 (fr) 2011-07-13 2012-07-10 Appareil pour contrôler la vision 3d d'un composant led et procédé de contrôle de vision

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110069196A KR101269976B1 (ko) 2011-07-13 2011-07-13 엘이디 부품의 3차원비전검사장치 및 비전검사방법

Publications (2)

Publication Number Publication Date
KR20130008694A KR20130008694A (ko) 2013-01-23
KR101269976B1 true KR101269976B1 (ko) 2013-06-05

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Family Applications (1)

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KR1020110069196A KR101269976B1 (ko) 2011-07-13 2011-07-13 엘이디 부품의 3차원비전검사장치 및 비전검사방법

Country Status (3)

Country Link
KR (1) KR101269976B1 (fr)
TW (1) TWI507660B (fr)
WO (1) WO2013009065A2 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160118722A (ko) 2015-04-03 2016-10-12 유종재 3d 비전검사 시스템
KR20240061385A (ko) 2022-10-31 2024-05-08 주식회사 미르기술 그림자식 미니엘이디 본딩자세 측정장치

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG2013084975A (en) * 2013-11-11 2015-06-29 Saedge Vision Solutions Pte Ltd An apparatus and method for inspecting asemiconductor package
KR101657982B1 (ko) 2014-09-15 2016-09-30 (주)자비스 엘이디 패키지의 엑스레이 검사 장치
KR20170006385A (ko) 2015-07-08 2017-01-18 최보윤 구이판
KR101784987B1 (ko) * 2015-08-26 2017-10-12 (주)제이티 비전검사모듈 및 그를 가지는 소자검사시스템
CN107037378A (zh) * 2017-05-12 2017-08-11 广东天圣高科股份有限公司 一种红外感应灯具检测装置
CN112683190B (zh) * 2020-10-27 2022-10-04 广东奥普特科技股份有限公司 一种透明体内置物深度检测方法及其检测系统
CN112540093A (zh) * 2020-11-10 2021-03-23 河北光兴半导体技术有限公司 玻璃类产品深度信息的精确定位装置及其方法
CN112461503A (zh) * 2020-11-15 2021-03-09 珠海速乐科技有限公司 一种led灯板视觉检测装置及检测方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090110495A (ko) * 2008-04-18 2009-10-22 주식회사 미르기술 비전 검사 시스템
KR20100090234A (ko) * 2010-07-23 2010-08-13 삼성엘이디 주식회사 Ｌｅｄ 검사 장치 및 그 방법
JP2011064482A (ja) 2009-09-15 2011-03-31 Kurabo Ind Ltd 高速三次元計測装置及び高速三次元計測方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007327836A (ja) * 2006-06-07 2007-12-20 Olympus Corp 外観検査装置及び方法
FR2914422B1 (fr) * 2007-03-28 2009-07-03 Soitec Silicon On Insulator Procede de detection de defauts de surface d'un substrat et dispositif mettant en oeuvre ledit procede.
KR100839167B1 (ko) * 2007-09-18 2008-06-17 주식회사 엔씨비네트웍스 모아레 무늬 발생기를 적용한 위상천이 영사식 3차원형상측정장치 및 그 방법
KR101251372B1 (ko) * 2008-10-13 2013-04-05 주식회사 고영테크놀러지 3차원형상 측정방법
JP5256251B2 (ja) * 2009-07-03 2013-08-07 コー・ヤング・テクノロジー・インコーポレーテッド 測定対象物の検査方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090110495A (ko) * 2008-04-18 2009-10-22 주식회사 미르기술 비전 검사 시스템
JP2011064482A (ja) 2009-09-15 2011-03-31 Kurabo Ind Ltd 高速三次元計測装置及び高速三次元計測方法
KR20100090234A (ko) * 2010-07-23 2010-08-13 삼성엘이디 주식회사 Ｌｅｄ 검사 장치 및 그 방법

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
(논문, 2010) *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160118722A (ko) 2015-04-03 2016-10-12 유종재 3d 비전검사 시스템
KR20240061385A (ko) 2022-10-31 2024-05-08 주식회사 미르기술 그림자식 미니엘이디 본딩자세 측정장치

Also Published As

Publication number Publication date
WO2013009065A3 (fr) 2013-04-11
TW201315965A (zh) 2013-04-16
WO2013009065A2 (fr) 2013-01-17
TWI507660B (zh) 2015-11-11
KR20130008694A (ko) 2013-01-23

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