KR101267670B1 - 웨이퍼 척용 온도 센서 - Google Patents

웨이퍼 척용 온도 센서 Download PDF

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Publication number
KR101267670B1
KR101267670B1 KR1020100053856A KR20100053856A KR101267670B1 KR 101267670 B1 KR101267670 B1 KR 101267670B1 KR 1020100053856 A KR1020100053856 A KR 1020100053856A KR 20100053856 A KR20100053856 A KR 20100053856A KR 101267670 B1 KR101267670 B1 KR 101267670B1
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KR
South Korea
Prior art keywords
temperature sensor
wafer chuck
fixing block
wafer
chuck
Prior art date
Application number
KR1020100053856A
Other languages
English (en)
Korean (ko)
Other versions
KR20100136915A (ko
Inventor
에이이치 시노하라
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20100136915A publication Critical patent/KR20100136915A/ko
Application granted granted Critical
Publication of KR101267670B1 publication Critical patent/KR101267670B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
KR1020100053856A 2009-06-19 2010-06-08 웨이퍼 척용 온도 센서 KR101267670B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2009-147061 2009-06-19
JP2009147061A JP5197505B2 (ja) 2009-06-19 2009-06-19 ウエハチャック用の温度センサ

Publications (2)

Publication Number Publication Date
KR20100136915A KR20100136915A (ko) 2010-12-29
KR101267670B1 true KR101267670B1 (ko) 2013-05-24

Family

ID=43510815

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100053856A KR101267670B1 (ko) 2009-06-19 2010-06-08 웨이퍼 척용 온도 센서

Country Status (3)

Country Link
JP (1) JP5197505B2 (zh)
KR (1) KR101267670B1 (zh)
TW (1) TWI471538B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103277651B (zh) * 2013-06-13 2016-04-06 新乡学院 一种用于高温热探测的陶瓷基座
JP2016161356A (ja) * 2015-02-27 2016-09-05 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
WO2017169032A1 (ja) * 2016-03-28 2017-10-05 株式会社日立国際電気 基板処理装置、温度測定ユニット及び半導体装置の製造方法
CN110739657B (zh) * 2018-07-20 2021-09-21 施耐德电器工业公司 用于环网柜的电缆头及环网柜
TWI797484B (zh) * 2020-10-06 2023-04-01 致茂電子股份有限公司 晶圓吸盤檢測系統
JP7474678B2 (ja) 2020-10-28 2024-04-25 東京エレクトロン株式会社 載置台、検査装置及び検査方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009042070A (ja) 2007-08-09 2009-02-26 Sei Hybrid Kk 半導体製造装置用測温装置及びそれを搭載した半導体製造装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6090638U (ja) * 1983-11-26 1985-06-21 株式会社三共合金鋳造所 温度測定治具
JPS6124628U (ja) * 1984-07-11 1986-02-14 三菱重工業株式会社 熱電対取付治具
US5220171A (en) * 1990-11-01 1993-06-15 Canon Kabushiki Kaisha Wafer holding device in an exposure apparatus
JPH0945752A (ja) * 1995-07-27 1997-02-14 Dainippon Screen Mfg Co Ltd 基板処理装置
JP3814359B2 (ja) * 1996-03-12 2006-08-30 キヤノン株式会社 Ｘ線投影露光装置及びデバイス製造方法
JP2000286207A (ja) * 1999-03-30 2000-10-13 Tokyo Electron Ltd 熱処理装置及び熱処理方法
JP4659328B2 (ja) * 2002-10-21 2011-03-30 東京エレクトロン株式会社 被検査体を温度制御するプローブ装置
JP4307130B2 (ja) * 2003-04-08 2009-08-05 キヤノン株式会社 露光装置
CN101065616A (zh) * 2004-10-14 2007-10-31 迅捷公司 用于晶片温度控制的方法和系统

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009042070A (ja) 2007-08-09 2009-02-26 Sei Hybrid Kk 半導体製造装置用測温装置及びそれを搭載した半導体製造装置

Also Published As

Publication number Publication date
TWI471538B (zh) 2015-02-01
TW201129787A (en) 2011-09-01
JP2011002390A (ja) 2011-01-06
JP5197505B2 (ja) 2013-05-15
KR20100136915A (ko) 2010-12-29

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