KR101266079B1 - 적층형 ｉｃ들을 위한 정전기적 방전（ｅｓｄ）실딩 - Google Patents

적층형 ｉｃ들을 위한 정전기적 방전（ｅｓｄ）실딩 Download PDF

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Publication number
KR101266079B1
KR101266079B1 KR1020117010996A KR20117010996A KR101266079B1 KR 101266079 B1 KR101266079 B1 KR 101266079B1 KR 1020117010996 A KR1020117010996 A KR 1020117010996A KR 20117010996 A KR20117010996 A KR 20117010996A KR 101266079 B1 KR101266079 B1 KR 101266079B1
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layer
stacked
unpatterned
esd
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KR20110069883A (ko
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토마스 알. 톰스
레자 잘릴리제이날리
시쿤 구
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퀄컴 인코포레이티드
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/274—Manufacturing methods by blanket deposition of the material of the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01055—Cesium [Cs]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Semiconductor Integrated Circuits (AREA)
KR1020117010996A 2008-10-15 2009-10-15 적층형 ｉｃ들을 위한 정전기적 방전（ｅｓｄ）실딩 Expired - Fee Related KR101266079B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/251,802 2008-10-15
US12/251,802 US20100091475A1 (en) 2008-10-15 2008-10-15 Electrostatic Discharge (ESD) Shielding For Stacked ICs
PCT/US2009/060764 WO2010045413A1 (en) 2008-10-15 2009-10-15 Electrostatic discharge (esd) shielding for stacked ics

Publications (2)

Publication Number Publication Date
KR20110069883A KR20110069883A (ko) 2011-06-23
KR101266079B1 true KR101266079B1 (ko) 2013-05-27

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KR1020117010996A Expired - Fee Related KR101266079B1 (ko) 2008-10-15 2009-10-15 적층형 ｉｃ들을 위한 정전기적 방전（ｅｓｄ）실딩

Country Status (7)

Country Link
US (1) US20100091475A1 (enExample)
EP (1) EP2347441A1 (enExample)
JP (2) JP2012506154A (enExample)
KR (1) KR101266079B1 (enExample)
CN (1) CN102171824A (enExample)
TW (1) TW201030934A (enExample)
WO (1) WO2010045413A1 (enExample)

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US20100091475A1 (en) 2010-04-15
CN102171824A (zh) 2011-08-31
TW201030934A (en) 2010-08-16
KR20110069883A (ko) 2011-06-23
EP2347441A1 (en) 2011-07-27
JP2015065437A (ja) 2015-04-09
JP5917639B2 (ja) 2016-05-18
JP2012506154A (ja) 2012-03-08
WO2010045413A1 (en) 2010-04-22

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