KR101265871B1 - 납땜 중에 불활성화 가스를 제공하는 장치 및 방법 - Google Patents
납땜 중에 불활성화 가스를 제공하는 장치 및 방법 Download PDFInfo
- Publication number
- KR101265871B1 KR101265871B1 KR1020110022594A KR20110022594A KR101265871B1 KR 101265871 B1 KR101265871 B1 KR 101265871B1 KR 1020110022594 A KR1020110022594 A KR 1020110022594A KR 20110022594 A KR20110022594 A KR 20110022594A KR 101265871 B1 KR101265871 B1 KR 101265871B1
- Authority
- KR
- South Korea
- Prior art keywords
- solder
- inert gas
- workpiece
- tube
- porous
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (14)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US31337610P | 2010-03-12 | 2010-03-12 | |
US31337210P | 2010-03-12 | 2010-03-12 | |
US61/313,376 | 2010-03-12 | ||
US61/313,372 | 2010-03-12 | ||
US32093910P | 2010-04-05 | 2010-04-05 | |
US32101110P | 2010-04-05 | 2010-04-05 | |
US61/321,011 | 2010-04-05 | ||
US61/320,939 | 2010-04-05 | ||
US32360710P | 2010-04-13 | 2010-04-13 | |
US61/323,607 | 2010-04-13 | ||
US36560710P | 2010-07-19 | 2010-07-19 | |
US61/365,607 | 2010-07-19 | ||
US13/040,594 | 2011-03-04 | ||
US13/040,594 US8220699B2 (en) | 2010-03-12 | 2011-03-04 | Apparatus and method for providing an inerting gas during soldering |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20110103369A KR20110103369A (ko) | 2011-09-20 |
KR101265871B1 true KR101265871B1 (ko) | 2013-05-20 |
Family
ID=45100927
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020110022594A KR101265871B1 (ko) | 2010-03-12 | 2011-03-14 | 납땜 중에 불활성화 가스를 제공하는 장치 및 방법 |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR101265871B1 (zh) |
CN (1) | CN102275024B (zh) |
SG (1) | SG174695A1 (zh) |
TW (1) | TWI401131B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2835204B1 (en) * | 2012-04-16 | 2017-03-15 | Tanigurogumi Corporation | Soldering device and soldering method |
CN104249208B (zh) * | 2013-06-26 | 2018-03-06 | 联想企业解决方案(新加坡)私人有限公司 | 波峰焊装置及其喷嘴 |
SG10201405819TA (en) * | 2013-09-27 | 2015-04-29 | Air Prod & Chem | Apparatus and method for providing an inerting gas during soldering |
CN105945378B (zh) * | 2016-05-20 | 2019-06-18 | 深圳市劲拓自动化设备股份有限公司 | 波峰焊锡机及其氮气保护装置 |
CN116511642B (zh) * | 2023-07-04 | 2024-02-20 | 西科沃克瑞泰克热处理设备制造(天津)有限公司 | 一种钎焊炉的可调式氮气输送管 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5176307A (en) * | 1991-02-22 | 1993-01-05 | Praxair Technology, Inc. | Wave soldering in a protective atmosphere enclosure over a solder pot |
US5240169A (en) * | 1991-12-06 | 1993-08-31 | Electrovert Ltd. | Gas shrouded wave soldering with gas knife |
US5292055A (en) * | 1991-12-06 | 1994-03-08 | Electrovert Ltd. | Gas shrouded wave improvement |
US5203489A (en) * | 1991-12-06 | 1993-04-20 | Electrovert Ltd. | Gas shrouded wave soldering |
US5568894A (en) * | 1993-06-04 | 1996-10-29 | Electrovert Ltd. | Applying flux to a solder wave for wave soldering an element |
US5409159A (en) * | 1994-02-28 | 1995-04-25 | L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Apparatus and methods for inerting solder during wave soldering operations |
US5509598A (en) * | 1994-05-31 | 1996-04-23 | The Boc Group, Inc. | Wave soldering apparatus and process |
DE19541445B4 (de) * | 1995-11-07 | 2005-02-10 | Linde Ag | Verfahren zum Wellenlöten von Werkstücken unter Schutzgas sowie hierfür vorgesehene Vorrichtung |
ATE501805T1 (de) * | 2006-05-23 | 2011-04-15 | Linde Ag | Vorrichtung und verfahren zum wellenlöten |
DE102007002777A1 (de) * | 2007-01-18 | 2008-07-24 | Linde Ag | Vorrichtung und Verfahren zum Selektivlöten |
-
2011
- 2011-03-11 TW TW100108427A patent/TWI401131B/zh active
- 2011-03-11 SG SG2011017985A patent/SG174695A1/en unknown
- 2011-03-14 KR KR1020110022594A patent/KR101265871B1/ko not_active IP Right Cessation
- 2011-03-14 CN CN2011101132678A patent/CN102275024B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
TW201143957A (en) | 2011-12-16 |
KR20110103369A (ko) | 2011-09-20 |
TWI401131B (zh) | 2013-07-11 |
CN102275024B (zh) | 2013-07-17 |
SG174695A1 (en) | 2011-10-28 |
CN102275024A (zh) | 2011-12-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
LAPS | Lapse due to unpaid annual fee |