KR101148745B1 - 반도체 패키지 기판의 제조방법 - Google Patents

반도체 패키지 기판의 제조방법 Download PDF

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Publication number
KR101148745B1
KR101148745B1 KR1020100068115A KR20100068115A KR101148745B1 KR 101148745 B1 KR101148745 B1 KR 101148745B1 KR 1020100068115 A KR1020100068115 A KR 1020100068115A KR 20100068115 A KR20100068115 A KR 20100068115A KR 101148745 B1 KR101148745 B1 KR 101148745B1
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KR
South Korea
Prior art keywords
forming
layer
foamed resin
semiconductor package
resin layer
Prior art date
Application number
KR1020100068115A
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English (en)
Korean (ko)
Other versions
KR20120007379A (ko
Inventor
김승완
최진원
박준형
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020100068115A priority Critical patent/KR101148745B1/ko
Priority to JP2011139214A priority patent/JP2012023364A/ja
Publication of KR20120007379A publication Critical patent/KR20120007379A/ko
Application granted granted Critical
Publication of KR101148745B1 publication Critical patent/KR101148745B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1020100068115A 2010-07-14 2010-07-14 반도체 패키지 기판의 제조방법 KR101148745B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020100068115A KR101148745B1 (ko) 2010-07-14 2010-07-14 반도체 패키지 기판의 제조방법
JP2011139214A JP2012023364A (ja) 2010-07-14 2011-06-23 半導体パッケージ基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100068115A KR101148745B1 (ko) 2010-07-14 2010-07-14 반도체 패키지 기판의 제조방법

Publications (2)

Publication Number Publication Date
KR20120007379A KR20120007379A (ko) 2012-01-20
KR101148745B1 true KR101148745B1 (ko) 2012-05-23

Family

ID=45612744

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100068115A KR101148745B1 (ko) 2010-07-14 2010-07-14 반도체 패키지 기판의 제조방법

Country Status (2)

Country Link
JP (1) JP2012023364A (ja)
KR (1) KR101148745B1 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050009035A (ko) * 2003-07-15 2005-01-24 삼성전자주식회사 일회용 마스크를 이용한 솔더 볼 형성 방법
KR20100049844A (ko) * 2008-11-04 2010-05-13 삼성전기주식회사 발포 테이프를 이용한 솔더 범프 형성 방법
KR20100060968A (ko) * 2008-11-28 2010-06-07 삼성전기주식회사 메탈 포스트를 구비한 기판 및 그 제조방법

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006216777A (ja) * 2005-02-03 2006-08-17 Alps Electric Co Ltd 回路基板の製造方法
JP5144141B2 (ja) * 2007-06-28 2013-02-13 新光電気工業株式会社 配線パターン形成方法及び電子部品搭載用パッケージ
KR100951449B1 (ko) * 2008-01-03 2010-04-07 삼성전기주식회사 인쇄회로기판 및 그 제조방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050009035A (ko) * 2003-07-15 2005-01-24 삼성전자주식회사 일회용 마스크를 이용한 솔더 볼 형성 방법
KR20100049844A (ko) * 2008-11-04 2010-05-13 삼성전기주식회사 발포 테이프를 이용한 솔더 범프 형성 방법
KR20100060968A (ko) * 2008-11-28 2010-06-07 삼성전기주식회사 메탈 포스트를 구비한 기판 및 그 제조방법

Also Published As

Publication number Publication date
JP2012023364A (ja) 2012-02-02
KR20120007379A (ko) 2012-01-20

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