KR101145530B1 - Squeegee and squeegee assembly - Google Patents
Squeegee and squeegee assembly Download PDFInfo
- Publication number
- KR101145530B1 KR101145530B1 KR1020100086228A KR20100086228A KR101145530B1 KR 101145530 B1 KR101145530 B1 KR 101145530B1 KR 1020100086228 A KR1020100086228 A KR 1020100086228A KR 20100086228 A KR20100086228 A KR 20100086228A KR 101145530 B1 KR101145530 B1 KR 101145530B1
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- South Korea
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- squeegee
- needle
- mask
- fine particles
- protrusion
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Mechanical Engineering (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Screen Printers (AREA)
Abstract
In the squeegee, an object of the present invention is to suppress generation of static electricity and generation of cutting chips by friction with a mask and to cope with conductive fine particles.
Produced by electroforming, the plurality of needle-like protrusions 12 are arranged with a predetermined gap along the end edge of the base. When the squeegee 10 is made of metal, the mask 50 is disposed on the substrate 44, the conductive fine particles 40 such as solder balls are placed on the mask 50, and the needle protrusions of the squeegee 10 are placed. When the conductive fine particles 40 are moved to (12) to arrange the conductive fine particles 40 in the opening pattern 52 formed in the mask 50, between the needle protrusion 12 and the mask 50. Even if friction occurs, generation of static electricity and cutting chips can be suppressed.
Description
The present invention relates to a squeegee and a squeegee assembly.
A microparticle aligning device is disclosed in which conductive fine particles on a mask are moved by a squeegee and suction-inserted into the openings of a ceramic porous plate (see Patent Document 1). In this squeegee, soft conductive fibers are planted.
Conventionally, a mask in which an opening pattern corresponding to a position of an electrode pad such as a semiconductor substrate or a printed wiring board is formed is superimposed on the semiconductor substrate or the like to load conductive fine particles (solder balls) on the mask, and screen-printed. By moving the said electroconductive fine particles etc. with a squeegee by the method, arrange | positioning electroconductive fine particles etc. in the opening pattern of a mask is performed.
Although some squeegee used for this is manufactured by rubber | gum and a polyurethane material (polymer), since squeegee is produced with such a material, since static electricity and a cutting chip generate | occur | produce by friction with a mask etc., it is not preferable. . In addition, in the squeegee in which the soft conductive fibers are planted, as in the above-described conventional example, even if the generation of static electricity can be suppressed, the generation of cutting chips cannot be suppressed, and the current tends to become smaller and smaller. There is a limit to planting at pitch and becomes problem.
In view of the above fact, an object of the present invention is to make it possible to cope with conductive fine particles while suppressing generation of static electricity and cutting chips due to friction with a mask.
The first aspect (squeegee) is produced by electroforming, and a plurality of needle-like protrusions are arranged with a predetermined gap along the end edge of the base.
2nd aspect is a squeegee which concerns on a 1st aspect WHEREIN: One surface of the said needle-shaped protrusion in the thickness direction is formed in the curved surface of cross-sectional convex shape.
According to a third aspect, in the squeegee according to the first aspect, the width of the needle protrusion and the width of the gap are 5 to 400 μm.
In a 4th aspect, in the squeegee according to the first aspect, the length of the needle protrusion is 0.05 to 4 mm.
5th aspect is 1-100 micrometers in thickness in the squeegee which concerns on a 1st aspect.
In the squeegee according to the first aspect, the sixth aspect uses nickel, copper, palladium, platinum, gold, silver, or an alloy thereof as the electroforming material.
A 7th form (squeegee assembly) uses at least one squeegee which concerns on the form in any one of the 1st form-6th form, and is made to clamp and fix the said base from both sides of the thickness direction by the fitting support member. .
Since the squeegee which concerns on a 1st aspect is produced by the electroforming which can form a minute shape, it can respond to electroconductive fine particles. In addition, since the squeegee is made of metal, a mask is placed on the substrate, and conductive fine particles such as solder balls are placed on the mask, the conductive fine particles are moved by the needle protrusion of the squeegee, and the conductive fine particles are formed in the opening pattern formed in the mask. When arranging, even if friction occurs between the needle protrusion and the mask, generation of static electricity and cutting chips can be suppressed.
In the squeegee according to the second aspect, when the electroconductive fine particles are pushed and moved by the needle protrusion, the occurrence of scratches on the surface of the electroconductive fine particles can be suppressed by using the curved surface side of the needle protrusion.
In the squeegee according to the third aspect, the width of the needle-like protrusion in the squeegee and the width of the gap can be made to be suitable for the particle diameter of the conductive fine particles. In addition, it is also possible to partially change the density of the needle protrusions by changing the width of the gap.
In the squeegee according to the fourth aspect, the squeegee can be miniaturized by appropriately setting the length of the needle-like protrusion.
In the squeegee according to the fifth aspect, the strength of the needle-shaped protrusion can be controlled by setting the thickness appropriately.
In the squeegee according to the sixth aspect, by appropriately selecting an electroforming material, necessary mechanical properties and durability such as hardness, deformation strength, flexibility, and wear resistance can be ensured.
In the squeegee assembly according to the seventh aspect, since the squeegee is fitted to the fitting support member, handling of the squeegee is easy, and the attachment and detachment of the conductive fine particles into the device for disposing the conductive fine particles in the opening pattern of the mask is also easy. By foaming a plurality of squeegee, the strength of the entire squeegee can be controlled.
As described above, according to the squeegee according to the first aspect, an excellent effect that the squeegee can suppress the generation of static electricity and the generation of cutting chips due to friction with the mask, and can cope with the conductive fine particles.
According to the squeegee according to the second aspect, an excellent effect of being able to suppress the occurrence of scratches on the surface of the conductive fine particles is obtained.
According to the squeegee which concerns on 3rd aspect, the outstanding effect which can be adapted to the particle diameter of electroconductive fine particles is acquired.
According to the squeegee according to the fourth aspect, an excellent effect of miniaturizing the squeegee can be obtained.
According to the squeegee according to the fifth aspect, an excellent effect of being able to control the strength of the needle protrusion is obtained.
According to the squeegee according to the sixth aspect, an excellent effect that the required mechanical properties and durability such as hardness, deformation strength, flexibility, and wear resistance can be ensured can be obtained.
According to the squeegee assembly which concerns on 7th aspect, the outstanding effect that handling of a squeegee becomes easy and attachment / detachment to the apparatus which arrange | positions electroconductive fine particles in the opening pattern of a mask also becomes easy is acquired.
1 is a plan view showing a squeegee.
2 is a perspective view showing a squeegee in which the tip side of the needle-shaped protrusion is thinner than the base side;
3 is an exploded perspective view illustrating the squeegee assembly.
4 is a perspective view showing a squeegee assembly.
Fig. 5 is a side view showing a squeegee assembly sandwiched between one squeegee fitting member.
Fig. 6 is a side view showing a squeegee assembly in which three squeegees are sandwiched between the fitting support members through spacers.
7 is a partial cross-sectional side view showing a state in which conductive fine particles on a mask are moved and disposed in an opening pattern by a squeegee assembly having one squeegee.
8 is a partial cross-sectional side view showing a state in which conductive fine particles on a mask are moved and disposed in an opening pattern by a squeegee assembly having three squeegees.
9 is a state in which one surface in the thickness direction of the needle-like protrusion in the squeegee is formed on a curved surface having a convex cross section, and the conductive fine particles on the mask are moved and disposed in the opening pattern using the curved surface side. Some cross-sectional perspective view showing the.
Fig. 10 is a side view showing a state in which photoresist is applied on a conductive substrate, a mask is disposed on the photoresist, and ultraviolet rays are irradiated from the mask side in this state.
FIG. 11 is a partial cross-sectional side view showing a state in which a region to which ultraviolet light is not irradiated remains on the substrate as a convex portion by developing a photoresist. FIG.
It is a schematic diagram which shows the principle of an electroforming process.
13 is a partial cross-sectional side view showing a state in which electroforming material is electrodeposited on a substrate by electroforming.
FIG. 14 is a partial cross-sectional side view showing a state in which the photoresist is removed in FIG. 13. FIG.
15 is a partial cross-sectional side view showing a state in which the electroforming material is peeled off from the substrate.
EMBODIMENT OF THE INVENTION Hereinafter, the form for implementing this invention is demonstrated based on drawing.
(Squeegee)
In FIG. 1, the
The
The width of the
In the example shown in FIG. 1, the needle-shaped
The needle-shaped
The thickness of one
In FIGS. 2 and 3, the needle-
The conductive
(Squeegee assembly)
3 to 6, the
Specifically, in one of the fitting supporting
When assembling the
In addition, the
In addition, as shown in FIG. 5, one
In the case where a plurality of
(Action)
This embodiment is comprised as mentioned above, and the action is demonstrated below. In FIG. 7, the
At this time, since the
When using one
As illustrated in FIG. 2, the
5 and 6, in the
In addition, as illustrated in FIG. 8, in the
In addition, as shown in FIG. 9, one surface in the thickness direction of the
(Method for producing squeegee)
Here, the manufacturing method of a squeegee is demonstrated. First, the electroforming die 62 corresponding to the shape of the
In this state, ultraviolet rays are irradiated from the
In the portion where the
Next, as shown in FIG. 12, the
This
On the other hand, if the application of voltage is continued until the
Next, as shown in FIG. 14, when the
In the
By using photolithography or X-ray lithography and electroforming, the
12 is a schematic diagram showing the principle in the electroforming step, and the scale of each member, the electrodeposition position of the
10: squeegee
12: couch projection
14: Donate
16: gap curved surface
24: fitting support member
26: fitting support member
28: squeegee
30: assembly
Claims (7)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2009-205247 | 2009-09-04 | ||
JP2009205247A JP2011056666A (en) | 2009-09-04 | 2009-09-04 | Squeegee and squeegee assembling object |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20110025620A KR20110025620A (en) | 2011-03-10 |
KR101145530B1 true KR101145530B1 (en) | 2012-05-14 |
Family
ID=43933113
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020100086228A KR101145530B1 (en) | 2009-09-04 | 2010-09-03 | Squeegee and squeegee assembly |
Country Status (2)
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JP (1) | JP2011056666A (en) |
KR (1) | KR101145530B1 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5435816B2 (en) | 2011-03-15 | 2014-03-05 | パナソニック株式会社 | Mobile device |
KR102149792B1 (en) * | 2014-01-24 | 2020-08-31 | 삼성전기주식회사 | Squeegee for printing of printed circuit board |
CN105034590A (en) * | 2015-09-01 | 2015-11-11 | 苏州恩欧西精密机械制造有限公司 | Printing machine scarper |
CN105082738A (en) * | 2015-09-01 | 2015-11-25 | 苏州恩欧西精密机械制造有限公司 | Scraper installation frame |
KR101768502B1 (en) * | 2016-03-21 | 2017-08-18 | 우리이앤엘 주식회사 | Semiconductor light emitting device manufacturing apparatus |
WO2017164527A2 (en) * | 2016-03-21 | 2017-09-28 | 우리이앤엘 주식회사 | Semiconductor light-emitting device manufacturing method |
KR101768505B1 (en) * | 2016-03-21 | 2017-08-18 | 우리이앤엘 주식회사 | Method of manufacturing semiconductor light emitting device |
KR101768503B1 (en) * | 2016-03-21 | 2017-08-18 | 우리이앤엘 주식회사 | Method of manufacturing semiconductor light emitting device |
KR101768504B1 (en) * | 2016-03-21 | 2017-08-18 | 우리이앤엘 주식회사 | Method of manufacturing semiconductor light emitting device |
JP7043740B2 (en) * | 2017-05-09 | 2022-03-30 | 株式会社村田製作所 | Screen printing device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11138749A (en) | 1997-11-12 | 1999-05-25 | Nippon Reinz Co Ltd | Squeegee for screen coating |
JP2003182027A (en) | 2001-12-19 | 2003-07-03 | Sony Corp | Squeegee structure for printing and printing apparatus |
JP2006247990A (en) | 2005-03-10 | 2006-09-21 | Shin Etsu Handotai Co Ltd | Screen printing method, squeegee, and screen printer |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09107045A (en) * | 1995-10-13 | 1997-04-22 | Japan Aviation Electron Ind Ltd | Ball mounting method for bga package |
JPH09164655A (en) * | 1995-12-18 | 1997-06-24 | Kyushu Hitachi Maxell Ltd | Squeegee for screen printing |
JPH09174809A (en) * | 1995-12-25 | 1997-07-08 | Kyushu Hitachi Maxell Ltd | Screen printing squeegee |
JP2003211862A (en) * | 2002-01-25 | 2003-07-30 | Nec Tohoku Ltd | Method for solder printing, metal screen, and squeegee |
-
2009
- 2009-09-04 JP JP2009205247A patent/JP2011056666A/en active Pending
-
2010
- 2010-09-03 KR KR1020100086228A patent/KR101145530B1/en active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11138749A (en) | 1997-11-12 | 1999-05-25 | Nippon Reinz Co Ltd | Squeegee for screen coating |
JP2003182027A (en) | 2001-12-19 | 2003-07-03 | Sony Corp | Squeegee structure for printing and printing apparatus |
JP2006247990A (en) | 2005-03-10 | 2006-09-21 | Shin Etsu Handotai Co Ltd | Screen printing method, squeegee, and screen printer |
Also Published As
Publication number | Publication date |
---|---|
KR20110025620A (en) | 2011-03-10 |
JP2011056666A (en) | 2011-03-24 |
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