JP2004117215A - Probe unit and manufacturing method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a probe unit, for avoiding lowering of the productivity and lowering of accuracy of probe position, even with increase in the number of probes. <P>SOLUTION: The probe unit A is provided with a projection 211, having conductivity on one surface 210, while a probe 400, having a wiring board 200 of which the other surface 220 a land part 221 electrically connected with the projection 211, is provided; a substrate 100 placed facing the other surface 220 of the wiring board 200, where the land part 110 (wiring pattern) is formed; a connecting means 300 for electrically connecting the land part 110 of the substrate 100 and the land part 110 of the wiring board 200; a base part 410 attached on one surface 210 of the wiring board 200; and a needle part 420, which is needle-shaped body extended from the base part and touches the projection 211, when the base part 410 is attached to the wiring board 200, is provided. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a probe unit used for measuring various electrical characteristics of a semiconductor integrated circuit and the like, and a method for manufacturing the same.
[0002]
[Prior art]
There are two types of conventional probe cards, a horizontal type called a cantilever type (for example, see Patent Documents 1 and 2) and a vertical type called a vertical type (for example, Patent Document 3), depending on the type of probe. In any of the probe cards, a large number of electrode pads on the object to be measured are simultaneously and elastically contacted with a large number of probes arranged corresponding to the electrode pads, thereby simultaneously measuring a large number of points.
[0003]
[Patent Document 1]
Japanese Patent Application Laid-Open No. 2002-022771 [Patent Document 2]
Japanese Patent Application Laid-Open No. 2000-088884 [Patent Document 3]
JP-A-10-221374
[Problems to be solved by the invention]
However, in a semiconductor integrated circuit, an LCD device, and the like, which are objects to be measured by a probe card, high integration and miniaturization are rapidly advancing, and accordingly, the number of probes in the probe card is rapidly increasing. Conventionally, probes in a probe card are manually attached one by one, so that a sudden increase in the number of probes has caused a serious problem of a decrease in productivity and a decrease in probe position accuracy.
[0005]
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a probe unit capable of avoiding a decrease in productivity and a decrease in probe position accuracy even when the number of probes increases, and a method of manufacturing the same.
[0006]
[Means for Solving the Problems]
A probe unit according to the present invention includes a wiring board provided with a plurality of protrusions having conductivity on one surface, and a plurality of lands electrically connected to the protrusions on the other surface. A base attached to one surface of the wiring board and a plurality of needle-like bodies extending from the base, wherein the base abuts on the projection when the base is attached to the wiring board. Having a probe.
[0007]
In another probe unit according to the present invention, a plurality of conductive protrusions are provided on one surface, and a plurality of lands electrically connected to the protrusions are provided on the other surface. A wiring board, a board provided with a plurality of wiring patterns provided so as to face the other surface of the wiring board, and a wiring pattern of the board and a land portion of the wiring board electrically connected to each other. Connecting means for connecting, a base attached to one surface of the wiring board, and a plurality of needles extending from the base, wherein the base is attached to the wiring board when the base is attached to the wiring board. A probe having a needle portion in contact with the probe.
[0008]
More preferably, it is desirable that an inter-board connection device is used for the connection means.
[0009]
More preferably, the probe unit according to claim 1, 2 or 3 for measuring various electric characteristics of the semiconductor integrated circuit, wherein the probe is brought into contact with a projection of the wiring board, and the probe is It is desirable to bend obliquely toward the electrode of the semiconductor integrated circuit.
[0010]
More preferably, in the probe unit for measuring various electrical characteristics of the semiconductor integrated circuit, a contact portion that contacts an electrode of the semiconductor integrated circuit is provided at a tip of a needle portion of the probe. desirable.
[0011]
The method of manufacturing a probe unit according to the present invention may further include a step of manufacturing the probe, a step of forming a conductive protrusion on the wiring board, and a step of attaching a base of the probe to the wiring board. Contacting the needle portion with the protrusion.
[0012]
More preferably, the step of fabricating the probe includes the step of fabricating a metallic film on the substrate having the recess formed thereon, and forming a resist layer having an opening exposing the recess at one end with respect to the substrate. Performing a step of electroforming a metal in the opening to form a metal body having a convex portion at one end, removing the resist layer and exposing the metal body, and the other end of the metal body. Preferably, the method includes a step of bonding a first fixing member to the portion, and a step of removing the substrate and bonding a second fixing member to the first fixing member.
[0013]
More preferably, the step of forming the projecting portion having conductivity on the wiring board includes: a step of electroforming a metal in a recess formed in the wiring board; Preferably, the method includes a step of applying a resist layer having an opening to the opening, a step of electroforming a metal in the opening, and a step of removing the resist layer.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a longitudinal sectional view of a probe unit according to an embodiment of the present invention, FIG. 2 is a plan view of a probe used in the probe unit, and FIG. 3 is a view taken along the line AA in FIG. 4 is a longitudinal sectional view showing a use state of the probe unit, FIG. 5 is an explanatory view of a probe mounting process in the probe unit, FIG. 6 is an explanatory diagram of a probe manufacturing process in the probe unit, and FIG. FIG. 8 is an explanatory view of a process of mounting a probe in the probe unit, FIG. 9 is a longitudinal sectional view showing another example of a connecting means in the probe unit, and FIG. It is a longitudinal section showing another example of the connecting means.
[0015]
As shown in FIG. 1, the probe unit A according to the present embodiment is a probe unit for measuring the electrical characteristics of the semiconductor integrated circuit B, in which one surface 210 is provided with a conductive protrusion 211. A wiring board 200 provided with a land portion 221 electrically connected to the protrusion 211 on the other surface 220, and a land portion 110 provided to face the other surface 220 of the wiring board 200. The substrate 100 on which the (wiring pattern) is formed, the connecting means 300 for electrically connecting the land 110 of the substrate 100 and the land 221 of the wiring substrate 200, and the one surface 210 of the wiring substrate 200. A base portion 410 and a needle-like body extending from the base portion, and when the base portion 410 is attached to the wiring board 200, the needle portion 42 abuts on the projection portion 211. And it includes a probe 400 having and. Hereinafter, each part will be described in detail.
[0016]
The board 100 is made of a printed circuit board (PCB), and a plurality of lands 110 are provided at predetermined intervals on the front side (ie, the surface facing the wiring board 200). The land 110 is connected to a tester (not shown). Although the board 100 is made of a printed board (PCB), a board such as a printed board (PWB) or an interval converter plate (ST) can be used.
[0017]
The wiring substrate 200 is a thin metal plate manufactured using lithography and electroforming techniques, and is disposed below the substrate 100. The wiring substrate 200 has a plurality of conductive protrusions 211 provided on one surface 210 at the same pitch as the electrodes 1 of the semiconductor integrated circuit B, and the same as the land portions 110 of the substrate 100 on the other surface 220. It has lands 221 provided at a pitch interval, and a conductive portion 230 for electrically connecting the protrusion 211 to the land 221. The conductive portion 230 is formed to be bent inside the wiring board 200 because the pitch interval between the protrusion portion 211 and the land portion 221 is different. The protrusion 211 has a height of 10 to 500 μm. Further, as the material of the protrusion 211, it is possible to use a Ni-based alloy such as Ni and NiCo, a noble metal such as Pd, Pt, Rh, Au, and Ag and their alloys, and Cu and a Cu-based alloy.
[0018]
The wiring board 200 is supported by a support member 500 suspended from the board 100. The support member 500 has a pair of hanging parts 510 attached to the substrate 100, and an extending part 520 extending from the hanging part 510 so as to face each other and supporting the wiring board 200. . In this manner, the wiring substrate 200 is supported under the substrate 100.
[0019]
The connection means 300 is interposed between the wiring board 200 and the board 100. As the connecting means 300, an inter-substrate connecting device (so-called interposer) to be described later is used.
[0020]
The connection means 300 is provided on an intermediate substrate 310 interposed between the substrate 100 and the wiring substrate 200, and is provided on a surface of the intermediate plate 310 (opposing surface of the substrate 100). It has a first spring 320 that conducts, and a second spring 330 that is provided on the back surface of the intermediate plate 310 (opposing surface of the wiring board 200) and conducts with the land portion 221 of the wiring board 200. . In this way, the land portion 110 of the substrate 100 and the land portion 221 of the wiring substrate 200 are electrically connected, and at the same time, a fixed distance is set between the land portion 110 of the substrate 100 and the land portion 221 of the wiring substrate 200. A contact pressure can be constantly applied to stabilize the connection state.
[0021]
The probe 400 is attached to one surface 210 of the wiring board 200. The probe 400 is manufactured by using lithography and electroforming techniques to be described later, and as shown in FIGS. 2 and 3, a base 410 having an opening 411 in the center and extending from the base 410 toward the opening 411. And a contact portion 430 that is a downwardly extending quadrangular pyramid extending from the tip of the needle portion 420 and that contacts the electrode 1 of the semiconductor integrated circuit B (see FIG. 4). ing. Providing the contact portion 430 is optional.
[0022]
The length of the needle part 420 is 100 to 3500 μm, and the contact part 430 has a horizontal dimension of 10 to 150 μm, a vertical dimension of 10 to 150 μm, and a thickness of 5 to 100 μm. The needle 420 and the contact 430 are made of a Ni-based alloy such as Ni or NiCo, a precious metal such as Pd, Pt, Rh, Au, or Ag, or an alloy thereof, Cu and a Cu-based alloy, or an Fe- and Fe-based alloy. , SUS, etc. can be used.
[0023]
The base 410 has a first fixing sheet 412 (first fixing member) and a second fixing sheet 413 (second fixing member), and the first and second fixing sheets 412 and 413 are provided. Needle part 420 is interposed between them. As the first and second fixing sheets 412 and 413, a ceramic material, a resin sheet such as Kapton, a silicon resin, or the like is used. Further, the needle portions 420 extended to the openings 411 are alternately arranged so as to be able to abut on the protrusions 211 of the wiring board 200.
[0024]
In such a probe 400, when the base 410 is attached to one surface 210 of the wiring board 200 as shown in FIG. 4 or 5, the needle 420 comes into contact with the projection 211 of the wiring board 200, It is bent downward (toward the electrode 1 of the semiconductor integrated circuit B). This makes it possible to elastically press the contact portion 430 of the probe 400 against the electrode 1 of the semiconductor integrated circuit B with an appropriate stylus pressure.
[0025]
Further, when the needle 420 of the probe 400 is attached to the one surface 210 of the wiring board 200, the needle 420 comes into contact with the protrusion 211, so that conduction between the two can be ensured without wiring. . For this reason, the assembling work is facilitated, the handling of high frequencies is facilitated, and the degree of freedom in design is increased.
[0026]
Hereinafter, a method for manufacturing the probe unit A will be described. First, the probe 400 is manufactured based on FIG. As the substrate 10 used for manufacturing the probe 400, a silicon substrate such as a wafer is used.
[0027]
As shown in FIG. 6A, a plurality of recesses 11 are formed on one surface of the substrate 10 by anisotropic etching or the like. The concave portion 11 is a portion where the contact portion 430 of the probe 400 is formed, and is formed in a downward quadrangular pyramid shape. The concave portion 11 is formed at a position corresponding to the arrangement pattern of the protruding portions 211 of the wiring board 200, and has a horizontal dimension of 10 to 150 μm, a vertical dimension of 10 to 150 μm, and a depth of 5 to 100 μm. I have.
[0028]
Then, a seed layer (conductive metal film) 20 made of Cu or the like, which becomes an electrode when a metal body 50 described later is formed on one surface, is formed on the substrate 10 by sputtering, vapor deposition, or the like. On one surface of the substrate 10, a photoresist 30 is applied on the seed layer 20 by an appropriate method such as spin coating.
[0029]
Thereafter, a mask (not shown) provided with an opening (not shown) for the photoresist 30 corresponding to the arrangement pattern of the recesses 11 of the substrate 10, that is, at a position where the recess 11 is exposed at one end. Exposure is performed. Then, as shown in FIG. 6B, the photoresist 30 after exposure is developed, and a resist layer having an opening 41 from which the photoresist 30 is removed so that the concave portion 11 is exposed at one end. 40 are formed.
[0030]
As shown in FIG. 6C, the substrate 10 is electroplated by electroplating, electroless plating, sputtering, CVD or the like, and Ni or the like is electroformed over the concave portion 11 and the opening 41 to form one end portion. The metal body 50 having the convex portion 51 is manufactured (see FIG. 6D). The metal body 50 and the protrusion 51 serve as a needle 420 and a contact 430 of the probe 400.
[0031]
Thereafter, as shown in FIG. 6D, the resist layer 40 is removed, and the metal body 50 is exposed. A resin 60 such as acrylic is applied to the other end of the metal body 50, and the first fixing sheet 412 is bonded.
[0032]
Then, the substrate 10 is removed. After that, the resin 60 is applied to the first fixing sheet 412 and the second fixing sheet 413 is adhered to produce the probe 400 (see FIG. 6E).
[0033]
Next, a method of forming the protrusion 211 on the wiring board 200 will be described with reference to FIG. A space transformer is used for the wiring board 200. On one surface 210 of the wiring board 200, a land portion 12 'to be a projection 211 is formed.
[0034]
Then, on one surface 210 of the wiring substrate 200, a photoresist 30 'is applied by an appropriate method such as spin coating.
[0035]
Thereafter, a mask (not shown) provided with an opening (not shown) at the position corresponding to the arrangement pattern of the land portion 12 'of the wiring board 200, that is, at the position exposing only the land portion 12', for the photoresist 30 '. Exposure is performed using (). Then, as shown in FIG. 7B, the exposed photoresist 30 'is developed, and the opening 41' from which the photoresist 30 'is removed so that the land 12' is exposed at one end. Is formed.
[0036]
Electroplating, electroless plating, sputtering, CVD, or the like is performed on the wiring substrate 200, Ni or the like is electroformed in the opening 41 ', and the land portion 12' is grown. After that, the resist layer 40 'is removed to expose the land 12'. This land portion 12 'becomes the projection portion 211.
[0037]
Finally, a method of attaching the probe 400 to the wiring board 200 on which the protrusion 211 has been manufactured will be described with reference to FIG.
[0038]
When the resin 60 ′ is applied to the wiring board 200 and the base 410 of the probe 400 is adhered, the needle 420 of the probe 400 comes into contact with the projection 211 of the wiring board 200 and is bent. Thus, the probe unit A is completed.
[0039]
In the case of such a probe unit A, a plurality of needle portions 420 of the probe 400 can be easily attached simply by attaching the base 410 of the probe 400 to the wiring board 200, and as a result, the manufacturing cost can be reduced. In addition, the number of manufacturing steps can be reduced. In addition, since the probe 400 and the projection 211 of the wiring board 200 are manufactured by using lithography and electroforming techniques, the position accuracy of the needle 420 is high. Can be. The design of the probe unit A can be changed as follows.
[0040]
Here, the probe unit A includes the board 100 and the connection unit 300, but it is sufficient that the probe unit A includes at least the wiring board 200 and the probe 400. As shown in FIG. 9, the connecting means 300 for electrically connecting the land portion 221 of the wiring substrate 200 and the land portion 110 of the substrate 100 has a single tip end 341 bent in a V shape. An inter-board connection device using a spring 340 can be used, or an inter-board connection device using a spring pin 350 as shown in FIG. Note that the connection means 300 is not limited to the board-to-board connection device, and may simply connect the land portion 221 of the wiring board 200 and the land portion 110 of the board 100 with a conductive wire.
[0041]
Here, it is assumed that the needle portion 420 is sandwiched between the first and second fixing sheets 412 and 413 in the base portion 410 of the probe 400. However, the plurality of needle portions 420 are connected to one first fixing sheet. 412 or the second fixing sheet 413 can be attached.
[0042]
【The invention's effect】
As described above, the probe unit according to claim 1 of the present invention has a plurality of conductive portions provided on one surface, and a plurality of conductive portions connected to the other surface on the other surface. A wiring board provided with a land portion, a base attached to one surface of the wiring board and a plurality of needles extending from the base, wherein the base is attached to the wiring board, A probe having a needle portion abutting on the protrusion.
[0043]
The probe unit according to claim 2 of the present invention includes a plurality of conductive protrusions provided on one surface, and a plurality of lands electrically connected to the protrusions on the other surface. A wiring board, a board provided with a plurality of wiring patterns provided so as to face the other surface of the wiring board, and a wiring pattern of the board and a land portion of the wiring board electrically connected to each other. Connecting means for connecting, a base attached to one surface of the wiring board, and a plurality of needles extending from the base, wherein the base is attached to the wiring board when the base is attached to the wiring board. And a probe having a needle portion in contact therewith.
[0044]
In the case of the probe unit according to claims 1 and 2 of the present invention, the needle portions of a plurality of probes can be easily attached only by attaching the base of the probe to the wiring board. As a result, the manufacturing cost can be reduced and the number of manufacturing steps can be reduced. In addition, since the needle portion of the probe is positioned in advance, the position accuracy is high, and it is possible to manufacture a probe having a narrow pitch which has not been achieved before.
[0045]
In a probe unit according to a third aspect of the present invention, in the probe unit according to the second aspect, an inter-board connection device is used as the connection means. According to such a configuration, the contact pressure between the land of the substrate and the land of the wiring substrate can be kept constant, so that the connection state is very stable.
[0046]
The probe unit according to claim 4 of the present invention measures the electrical characteristics of the semiconductor integrated circuit. The probe unit according to claim 1, 2 or 3, wherein the probe is brought into contact with a protrusion of the wiring board. Thus, the needle part is bent obliquely toward the electrode of the semiconductor integrated circuit. According to such a configuration, it is possible to elastically press the needle portion of the probe against the electrode of the semiconductor integrated circuit with an appropriate needle pressure.
[0047]
The probe unit according to claim 5 of the present invention is a probe unit according to claim 1, 2, 3 or 4 for measuring various electric characteristics of a semiconductor integrated circuit. A contact portion for contacting an electrode of the integrated circuit is provided. According to such a configuration, since the contact portion comes into contact with the electrode of the semiconductor integrated circuit, stable contact can be obtained.
[0048]
According to a sixth aspect of the present invention, there is provided a method of manufacturing a probe unit, the method comprising: fabricating the probe according to any one of the first to third aspects; Attaching the base of the probe to the wiring board, and bringing the needle portion of the probe into contact with the protrusion. According to such a manufacturing method, a plurality of needle portions can be easily attached simply by attaching the base of the probe to the wiring board. As a result, the manufacturing cost can be reduced and the number of manufacturing steps can be reduced.
[0049]
According to a seventh aspect of the present invention, there is provided a probe unit manufacturing method according to the sixth aspect, wherein the step of manufacturing the probe according to the fourth aspect further comprises: A step of forming a resist layer having an opening exposing the concave portion at one end with respect to the substrate, and electroforming a metal into the opening to form a metal body having a convex portion at one end. Forming, removing the resist layer, exposing the metal body, bonding a first fixing member to the other end of the metal body, removing the substrate, and removing the first substrate. A method for manufacturing a probe unit, comprising: attaching a second fixing member to a fixing member. In the case of such a manufacturing method, since the probe is manufactured by using lithography and electroforming techniques, it is possible to obtain a simple and high-precision one. Those having a narrow pitch can also be manufactured.
[0050]
According to a method of manufacturing a probe unit according to claim 8 of the present invention, in the method of manufacturing a probe unit according to claim 6 or 7, the step of forming the conductive protrusion on the wiring board is performed on the wiring board. Electroforming a metal in the recessed portion, applying a resist layer having an opening on the recessed portion of the wiring substrate to the wiring board, electroforming a metal in the opening, Removing the layer. In the case of such a manufacturing method, since the protruding portion of the wiring board is manufactured using lithography and electroforming techniques, a simple and highly accurate one can be obtained, and as a result, the positional accuracy of the protruding portion is high, Narrow pitches that could not be made before can also be manufactured.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional view of a probe unit according to an embodiment of the present invention. It is a longitudinal cross-sectional view which shows another example of the connection means in the same probe unit.
FIG. 2 is a plan view of a probe used in the probe unit.
FIG. 3 is a diagram showing an arrow AA in FIG. 2;
FIG. 4 is a longitudinal sectional view showing a use state of the probe unit.
FIG. 5 is an explanatory view of a probe attaching process in the probe unit.
FIG. 6 is an explanatory diagram of a process of manufacturing a probe in the probe unit.
FIG. 7 is a longitudinal sectional view showing another example of the connection structure.
FIG. 8 is an explanatory diagram of a manufacturing process of a protruding portion of the wiring board of the probe unit.
FIG. 9 is an explanatory diagram of a probe attaching process in the probe unit.
FIG. 10 is a longitudinal sectional view showing another example of the connecting means.
[Explanation of symbols]
A Probe unit 100 Substrate 110 Land portion 200 Wiring substrate 210 One surface 211 of the wiring substrate Projection 220 The other surface 221 of the wiring substrate Land portion 300 Connecting means 400 Probe 410 Base 420 Needle B Semiconductor integrated circuit 1 electrode

Claims (8)

A wiring board provided with a plurality of conductive protrusions on one surface, and a plurality of lands electrically connected to the protrusions on the other surface; and one surface of the wiring substrate. A probe having a base attached to the base and a plurality of needles extending from the base, the needle having a needle contacting the protrusion when the base is attached to the wiring board. A characteristic probe unit. A wiring board provided with a plurality of conductive protrusions on one surface, a plurality of lands electrically connected to the protrusions on the other surface, and the other surface of the wiring substrate A substrate provided with a plurality of wiring patterns, and connecting means for electrically connecting the wiring patterns of the substrate and the lands of the wiring substrate; and one of the wiring substrates A probe having a base attached to a surface and a plurality of needles extending from the base, the needle having a needle contacting the protrusion when the base is attached to the wiring board; A probe unit characterized by the above-mentioned. 3. The probe unit according to claim 2, wherein an inter-board connection device is used as the connection means. The probe unit according to claim 1, wherein the probe is brought into contact with a protruding portion of the wiring board, so that the needle portion contacts an electrode of the semiconductor integrated circuit. A probe unit that bends obliquely toward the probe unit. 5. The probe unit according to claim 1, wherein the electrical characteristics of the semiconductor integrated circuit are measured, wherein a tip portion of a needle portion of the probe is provided with a contact portion that contacts an electrode of the semiconductor integrated circuit. A probe unit characterized in that: 5. The step of producing the probe according to claim 1, 2, 3, or 4, the step of forming a conductive protrusion on the wiring board, the step of attaching a base of the probe to the wiring board, and the step of Contacting the protrusion. 7. The method for manufacturing a probe unit according to claim 6, wherein the step of manufacturing the probe according to claim 4 includes the steps of: forming a metallic film on the substrate having the recess formed therein; Forming a resist layer having an opening exposing the concave portion, electroforming a metal in the opening to form a metal body having a convex portion at one end, removing the resist layer, and removing the metal body; , Exposing a first fixing member to the other end of the metal body, and removing the substrate and adhering a second fixing member to the first fixing member. A method for manufacturing a probe unit, comprising: 8. The method of manufacturing a probe unit according to claim 6, wherein the step of forming the conductive protrusion on the wiring board includes the steps of: electroforming a metal in a recess formed in the wiring board; A probe unit comprising: a step of applying a resist layer having an opening above the concave portion of the wiring board; a step of electroforming a metal in the opening; and a step of removing the resist layer. Manufacturing method.

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