JP2007121198A - Contact probe, manufacturing method therefor, probe unit, and probe card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a contact probe capable of assembling easily a large number of micro probes, and capable of coping with a request of forming a narrow pitch in an electronic component. <P>SOLUTION: This contact probe of the present invention is a cantilever type contact probe provided with a tip part contacting with a measured face, a spring part connected to the tip part, a support part for supporting the tip part and the spring part, and a flexible printed circuit board for fixing the support part. The tip part, the spring part and the support part are constituted to be elastically deformed by the spring part under the condition where the tip part abuts to the measured face, when the tip part is pressed onto the measured face while fixing the support part, the tip part is a plate-like structure having a plane along an elastically deformed direction, and a relation t<SB>1</SB><t<SB>2</SB>is satisfied where t<SB>1</SB>is a width of the tip part and where t<SB>2</SB>is a width of a portion connected to the support part out of the spring part. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a contact probe for making an electrical inspection by contacting an electrode of an electronic component such as a semiconductor IC chip or a liquid crystal device, and a method for manufacturing the contact probe. Moreover, it is related with the probe unit and probe card provided with a contact probe.

  In order to electrically inspect electronic components on which ICs and LSIs are mounted at high density, a probe card having a large number of contact probes is used. FIG. 6 shows a basic structure of a conventional cantilever type contact probe. FIG. 6A is a front view, and FIG. 6B is a plan view. As shown in FIG. 6, the contact probe has a distal end portion 61, a spring portion 62, and a support portion 63, and is held by the probe card by the support portion 63. In addition, the example shown in FIG. At the time of inspection, the tip 61 of the contact probe is pressed against the electrode of the electronic component to collect various data of the electronic component. The contact probe has a spring structure in order to obtain reliable contact with the electrode of the electronic component to be inspected and not to damage the electrode to be measured.

  A probe card for attaching the contact probe is illustrated in FIG. FIG. 7A is a perspective view, and FIG. 7B is a cross-sectional view taken along VIIB-VIIB. As shown in FIG. 7A, a large number of wirings and the like are arranged in the radial direction on the upper surface of the probe card (FIG. 7A shows a part thereof). Further, as shown in FIG. 7B, the probe card 70 is supported in a cantilevered manner by the disc-shaped substrate 72, the needle pressing portion 74 incorporated in the substrate 72, and the needle pressing portion 74. The contact probe 76 is arranged in the radius direction of the substrate 72.

  Today, with the progress of high integration of ICs and LSIs and the increase in the arrangement density of electrodes as inspection objects, integration of contact probes is required. For this reason, a probe has been proposed in which the cantilever is shortened and the wiring portion, which has conventionally been a cantilever extension member, has an insulating structure (see Non-Patent Document 1).

  Further, the tip of the pattern wiring formed on the film is bent and protruded to form a contact pin. The contact pin is composed of a first metal layer made of nickel-manganese alloy and a second metal layer having high toughness and conductivity. A configured contact probe is disclosed (see Patent Document 1). Since this contact probe is bent with the second metal layer having high toughness and electrical conductivity on the outside, it can be used repeatedly and is excellent in high frequency characteristics. However, the shape corresponds to a narrow pitch, but in practice, if the pitch is narrowed, the width of the contact pin becomes narrow and it is difficult to obtain a sufficient spring force.

On the other hand, in order to increase the arrangement density of contact probes and avoid contact between adjacent probes, a probe unit having a multistage structure in which the probe mounting height in the needle holding portion is changed between adjacent probes is known. (See Patent Document 2). As shown in FIG. 8 (a), the length from the tip portion 86a of the contact probe 86 to the needle presser 84 and L _1, the height of the tip portion 86a as shown in FIG. 8 (b) and L ₂ In this case, L ₁ and L ₂ are configured to be larger as the attachment position of the contact probe 86 in the needle presser 84 is closer to the substrate 82. For this reason, the tip portions are arranged in a row, the arrangement density of the tip portions can be increased, and the difference between the needle pressure and the slip amount between adjacent probes can be reduced.
JP-A-11-44708 JP-A-10-123175 Dave Oh et al., “Application of Larger Probing area by cantilevered probes” South West Test Workshop 2005, 07/06.

  However, since the conventional cantilever-type contact probe is difficult to assemble a large number of fine probes, it is difficult to meet the demand for further miniaturization.

  An object of the present invention is to provide a contact probe that can easily assemble a large number of fine probes and can sufficiently meet the demand for a narrow pitch of electronic components, and a method of manufacturing the contact probe. Moreover, it is providing the probe unit and probe card provided with this contact probe.

The contact probe of the present invention includes a tip portion that contacts the surface to be measured, a spring portion connected to the tip portion, a support portion that supports the tip portion and the spring portion, and a flexible printed wiring board that fixes the support portion. It is a cantilever type contact probe, and the tip, spring, and support are fixed by the spring when the support is fixed and the tip is pressed against the surface to be measured. The tip portion is a plate-like structure that is configured to be elastically deformed, and has a flat surface along the elastically deforming direction, and the width t _{1 of the} tip portion and the width t of the portion connected to the support portion of the spring portion. ₂ and t ₁ <t ₂ .

The width t ₃ of the portion connected to the tip of the spring portion is preferably t ₃ <t ₂ . Moreover, the aspect which a tip part, a spring part, and a support part consist of nickel or a nickel-type alloy is preferable. On the other hand, it is preferable that the tip portion has at least a surface layer made of rhodium or a palladium alloy. In particular, a contact probe having a protrusion at a portion where the tip portion contacts the surface to be measured is preferable.

  The contact probe manufacturing method of the present invention includes a step of forming a resin mold by lithography or a mold, and a step of forming a layer made of a metal material on the resin mold by electroforming on a conductive substrate having a flexible printed wiring board. After forming the spring portion and the support portion by the step, the tip portion is formed by a step of forming a resin mold by lithography or a mold, and a step of forming a layer made of a metal material on the resin die by electroforming on a conductive substrate. It is characterized by forming.

  After the tip portion is formed, the protrusion can be formed by a step of forming a resin mold by lithography or a mold and a step of forming a layer made of a metal material on the resin mold by electroforming on the conductive substrate. Moreover, the aspect which removes the unnecessary part of a flexible printed wiring board is preferable.

The probe unit of the present invention has a multistage structure in which a plurality of such contact probes are arranged side by side. The height L of the tip can be different between adjacent contact probes. Further, a probe unit including a contact probe in which the width t _{1 of the} tip portion and the width t _{2 of} the portion connected to the support portion of the spring portion is t ₁ = t ₂ is preferable. The probe card of the present invention includes such a probe unit.

  It is possible to provide a contact probe that is easy to assemble a large number of fine probes and can sufficiently meet the demand for a narrow pitch of electronic components.

(Contact probe)
The cantilever type contact probe of the present invention is illustrated in FIG. 1 (a) is a front view, FIG. 1 (b) is a plan view, FIG. 1 (c) is a bottom view, and FIG. 1 (d) is a left side view. As shown in FIG. 1A, this contact probe includes a tip portion 1 that contacts the surface to be measured, a spring portion 2 that is connected to the tip portion 1, and a support portion 3 that supports the tip portion 1 and the spring portion 2. And a flexible printed circuit (hereinafter also referred to as “FPC”) 4 for fixing the support 3. The tip portion 1, the spring portion 2, and the support portion 3 are elastically deformed by the spring portion 2 while the tip portion 1 is in contact with the surface to be measured when the support portion 3 is fixed and the tip portion 1 is pressed against the surface to be measured. To do.

As shown in FIG. 1, the tip portion 1 is a plate-like structure having a plane along the elastically deforming direction (the direction of the arrow shown in FIG. 1A), the width t ₁ of the tip portion 1, The width t _{2 of} the part connected to the support part 3 in the spring part 2 is characterized by t ₁ <t ₂ . By narrowing the width t ₁ of the end portion 1, it is possible to cope with narrowing of the pitch of the measurement target electrode. Further, by increasing the width t ₂ of the spring portion 2, it is possible to secure sufficient spring force and stroke.

In FIG. 2, three contact probes shown in FIG. 1 are arranged side by side, and the tip portion 21 having a plate-like structure is aligned in the direction in which it is elastically deformed by the spring portion 22 (the direction of the arrow shown in FIG. 2B). An example of a probe unit arranged and having a multistage structure is shown. 2 (b) is a front view, FIG. 2 (a) is a bottom view, and FIG. 2 (c) is a left side view. As shown in FIG. 2, the contact probe is attached to a substrate 25 of a probe card, and includes a tip portion 21, a spring portion 22, a support portion 23, and a flexible printed wiring board 24. According to the configuration of the present invention, the width t ₂ of width t ₁ and the spring portion 22 of the tip 21, because it is t ₁ <t _2, as shown in FIG. 2, near the distal end in a row Can be arranged. Therefore, it is possible to cope with a narrow pitch of the measurement electrodes in the measurement regions A and B, and even if arranged in this way, adjacent probes do not contact each other. Moreover, since t ₁ <t ₂ , the pitch can be further reduced as compared with the measurement region C of the conventional contact probe shown in FIG. Furthermore, since a plurality of contact probes can be laminated by the flexible printed wiring board 24 and connected to the probe card 25, assembly is significantly easier than in the prior art. For this reason, the request | requirement of narrow pitch can fully be met.

  In FIG. 3, six contact probes shown in FIG. 1 are arranged side by side, and the tip portion 31 having a plate-like structure is aligned in the direction in which the spring portion 32 elastically deforms (the direction of the arrow shown in FIG. 3B). An example of a probe unit arranged and having a multistage structure is shown. 3 (b) is a front view, FIG. 3 (a) is a bottom view, and FIG. 3 (c) is a left side view. As shown in FIG. 3, the contact probe is attached to a substrate 35 of a probe card, and includes a tip portion 31, a spring portion 32, a support portion 33, and a flexible printed wiring board 34.

According to the configuration of the present invention, the width t ₂ of width t ₁ and the spring portion 32 of the tip 31, because it is t ₁ <t _2, as shown in FIG. 3, proximate the distal end portion in a row Can be arranged. Further, as in the example of FIG. 2, since the assembly of the contact probe is easy, it is possible to cope with the narrowing of the electrode pitch in the measurement region D. Further, as shown in FIG. 1, in the spring portion 2, the width t _{3 at} the portion connected to the tip portion 1 and the width t _{2 at} the portion connected to the support portion 3 are t ₃ <t _2. Is preferred. For example, even when three contact probes are arranged as shown in FIG. 2 and these are set as one set, and two sets are arranged as shown in FIG. 3, t ₃ <t ₂ The adjacent probes can be configured not to contact each other.

FIG. 11 is a view of the contact probe of the present invention as viewed from the tip direction with a multi-stage configuration. As shown in FIG. 11, the pitch p, the number of steps n (n = 3 in the case of FIG. 11), the width t _{1 of} the tip 11, the gap g ₁ of the tip 11, the width t ₂ of the spring 12, The gap g ₂ of the spring portion is p = t ₁ + g ₁ and needs to be designed so as to satisfy t ₂ + g ₂ = p × n. From the viewpoint of assembly, g ₁ is preferably 2 μm to 15 μm, more preferably 5 μm to 10 μm. By arranging a plurality of such contact probes in a multi-stage structure, it is possible to cope with a narrow pitch of the measurement electrodes. Further, since the probe card of the present invention is composed of such contact probes, it is useful for high-density inspection. In the case of a multi-stage structure, an embodiment in which an insulating coating layer or the like is formed on the surface of the contact probe such as a spring portion and a support portion is preferable.

  FIG. 4 shows another example of a probe unit in which three contact probes shown in FIG. 4 (b) is a front view, FIG. 4 (a) is a bottom view, and FIG. 4 (c) is a left side view. As shown in FIG. 4, this contact probe is attached to a substrate 45 of a probe card, and includes a tip portion 41, a spring portion 42, a support portion 43, and a flexible printed wiring board 44. In the example shown in FIG. 4, the tip portion 41 has a protrusion 46 at a portion that contacts the surface to be measured. By forming the protrusion at the contact portion, scrubbing can be facilitated and the connection reliability can be improved.

  The material of the contact probe is excellent in spring characteristics such as toughness, high hardness, and nickel or a nickel-based alloy is preferable because it is suitable for manufacturing by the LIGA (Lithographie Galvanoformung Abformung) method described later. Preferably contains 40 mass% or more of nickel. Furthermore, since the contact probe is also used for a wafer burn-in test and requires heat resistance, a nickel manganese alloy having excellent heat resistance is suitable as a material for the contact probe. The nickel manganese alloy preferably has a manganese content of 3% by mass or less. Further, the crystal grain size of nickel or the like is preferably 50 nm or less from the viewpoint of increasing the spring strength and elastic limit of the contact probe.

  Normally, a contact probe is used by being pressed against an electrode that is a surface to be measured several tens of millions to a million times, so that oxide film shavings from the electrode surface generated during scrubbing adhere to the tip of the contact probe. Cheap. However, if the tip that comes into contact with the electrode to be measured, or at least the surface layer of the tip, is made of a palladium-based alloy such as rhodium or palladium cobalt, adhesion of shavings to the tip is reduced and the number of cleanings is reduced. be able to. In addition, it is easy to maintain the shape of the tip, prevent local load concentration during contact with the surface to be measured, and avoid breakage of the electrode. Moreover, electrical contact and corrosion resistance can be improved. From such a viewpoint, the thickness of the surface layer portion made of rhodium or palladium alloy is preferably 0.05 μm to 1 μm, and the palladium alloy preferably contains 50% by mass or more of palladium. Such a surface layer portion can be formed by electrolytic plating or the like. In addition, as shown in FIG. 4, when the tip 41 has a protrusion 46, it is also effective to use only the protrusion portion as the above material.

  According to the manufacturing method to be described later, the tip portion, the protrusion, the spring portion, and the support portion of the contact probe are formed through a separate electroforming process, so that different materials can be used. Therefore, rhodium or palladium-based alloy is used for the tip or protrusion where the oxide film shavings are likely to adhere from the electrode to be measured, and for the spring part that requires spring characteristics and hardness, nickel or It is possible to select a material such as a nickel-based alloy.

(Contact probe manufacturing method)
The contact probe manufacturing method of the present invention includes a step of forming a resin mold by lithography and a step of forming a layer made of a metal material on the resin mold by electroforming on a conductive substrate having a flexible printed wiring board. After forming the support portion, the tip portion is formed by a step of forming a resin mold by lithography and a step of forming a layer made of a metal material on the resin mold by electroforming on the conductive substrate. . Since the contact probe is formed on the flexible printed wiring board, the flexible printed wiring board can be attached to a probe card or the like. Therefore, assembly is easy and it is possible to cope with a narrow pitch of the object to be measured.

  Conventional contact probes were manufactured by bending a tungsten wire, so it was not possible to form a probe with a complicated shape. However, in the present invention, since a lithography is adopted, a probe with a complicated shape is easily formed. can do. In machining, only accuracy of about ± 10 μm can be obtained. However, according to the method of the present invention, a highly accurate contact probe of ± 1 μm can be manufactured with good reproducibility and the material composition is uniform. The spring characteristics can be kept uniform. In addition, since variation in the overall length can be reduced and variation in the shape of the contact portion in contact with the surface to be measured can be reduced, generation of excessive stress can be suppressed even for the brittle electrode. Furthermore, since the fine structure can be integrally formed, the number of parts can be reduced, and the part cost and the assembly cost can be reduced.

  Such a contact probe manufacturing method is illustrated in FIG. As shown in FIG. 5A, first, a conductive layer is formed on a flexible printed wiring board 50 made of polyimide resin or the like, etched into a predetermined pattern to form a conductive layer 51, and then a resist 52 is formed. . The conductive layer 51 is made of copper, nickel, stainless steel or the like, and for example, a copper foil can be suitably used. For the resist, a resin material mainly composed of polymethacrylate such as polymethyl methacrylate (PMMA), or a chemically amplified resin material sensitive to ultraviolet rays (UV) or X-rays is used. The thickness of the resist can be arbitrarily set according to the thickness of the spring part and the support part of the contact probe to be formed, and can be set to 10 μm to 200 μm, for example.

  Next, a mask 53 is disposed on the resist 52, and UV or X-ray 54 is irradiated through the mask 53. When a structure having a thickness exceeding 100 μm and having a high aspect ratio is required, or when a highly accurate structure of about ± 2 μm is required, X-rays having a wavelength shorter than UV (wavelength: 200 nm) (wavelength: 0 .4 nm) is preferred. Further, it is more preferable to use synchrotron radiation X-ray (hereinafter referred to as “SR”) having high directivity among X-rays. The LIGA method using SR enables deep lithography, and can produce a large number of contact probes having a thickness of several hundreds of micrometers with high accuracy on the order of microns. On the other hand, when UV is used, a merit can be pursued in terms of cost.

  The mask 53 includes an absorbing layer 53a such as UV or X-ray 54 formed according to the contact probe pattern, and a translucent substrate 53b. As the translucent substrate 53b, silicon nitride, silicon, diamond, titanium, or the like is used for the X-ray mask, and quartz glass is used for the UV mask. In the case of an X-ray mask, the absorbing layer 53a is made of heavy metal such as gold, tungsten, or tantalum or a compound thereof, and in the case of a UV mask, chromium or the like is used. Of the resist 52, the resist 52a of the resist 52 is exposed and deteriorated by the X-ray 54 or UV irradiation, but the resist 52b is not exposed by the absorption layer 53a. For this reason, in the case of a positive resist, only the part 52a that has been altered (molecular chain is cut) is removed by development, and a resin mold 52b as shown in FIG. 5B is obtained. On the other hand, when a negative resist is used, the exposed portion remains and the non-exposed portion is removed. Therefore, a mask pattern opposite to that of the positive resist is used. The resin mold 52b can be formed using a mold by a method described later.

  Next, electroforming is performed, and a metal material layer 55a is deposited on the resin mold 52b as shown in FIG. 5 (c). Electroforming refers to forming a layer made of a metal material on the conductive layer 51 using a metal ion solution. By performing electroforming using the conductive layer 51 as a plating electrode, the metal material layer 55a can be deposited on the resin mold 52b. The metal material layer 55a becomes a spring part and a support part of the contact probe.

  After electroforming, if necessary, the resist 57 is formed to have a predetermined thickness by polishing or grinding, and a resist 57 is formed to a thickness of about 30 μm to 200 μm, for example, as shown in FIG. Next, as shown in FIG. 5 (e), a mask 56 is placed on the resist 57, irradiated with X-rays 54, etc., and developed to form a resin mold 57b as shown in FIG. 5 (f). To do. The resin mold 57b can be formed by a mold.

  Thereafter, similarly to FIG. 5C, the metal material layer 55b is formed by electroforming, and the tip portion of the contact probe is formed. As the material of the tip portion, nickel or a nickel alloy can be used as in the spring portion, but rhodium or a palladium-based alloy can also be selected in order to reduce contact resistance. Thereafter, polishing or grinding is performed as necessary, and the resin molds 52b and 57b are removed by wet etching or plasma etching, as shown in FIG. Next, as shown in FIG. 5 (h), unnecessary portions of the flexible printed wiring board 50 can be removed as required to enhance the spring function of the contact probe. The removal of FPC can be performed by laser ablation after masking.

  In this manner, a contact probe including the metal material layer 55b corresponding to the tip portion, the metal material layer 55a corresponding to the spring portion and the support portion, and the FPC 50a can be manufactured. Thereafter, a coating layer such as rhodium having a thickness of 0.05 μm to 1 μm can be applied to the contact probe as necessary.

  When forming the protrusion at the tip of the contact probe, first, electroforming is performed on the resin mold 57b shown in FIG. 5 (f) to form the metal material layer 55b as the tip, and polishing or polishing is performed as necessary. Grind. The subsequent steps are shown in FIG. As shown in FIG. 9A, when a resist 97 is formed, a mask 96 is arranged, irradiated with X-rays 94, and developed, a resin mold 97a as shown in FIG. 9B is obtained. The resin mold 97a can also be formed by a mold.

  Thereafter, as shown in FIG. 9C, a metal material layer 95a is formed by electroforming. The metal material layer 95a becomes a protrusion on the tip. Thereafter, polishing or grinding is performed as necessary, and the resin molds 92b, 97a, 97b are removed by wet etching or plasma etching, whereby a contact probe with protrusions as shown in FIG. 9D is obtained. Thereafter, if necessary, unnecessary portions of the flexible printed wiring board can be removed, and a coating layer made of rhodium or the like can be applied.

  For example, FIG. 10 shows a method of forming a resin mold such as the resin mold 52b shown in FIG. This method is basically the same as the manufacturing method of the contact probe shown in FIG. First, as shown in FIG. 10A, a resist 14 is formed on a conductive substrate 15. Next, when the mask 13 is arranged, irradiated with X-rays 16 and developed, a resin mold 14b as shown in FIG. 10B can be formed. Subsequently, as shown in FIG. 10C, electroforming is performed to deposit a metal material layer 17. After electroforming, if necessary, the metal mold 18 is obtained by aligning to a predetermined thickness by polishing or grinding, and removing the resin mold 14b by wet etching or plasma etching as shown in FIG. 10 (d). Next, as shown in FIG. 10E, a concave resin mold 12a is formed by a mold such as emboss molding, reactive molding or injection molding using a mold 18. As the resin, a thermoplastic resin such as an acrylic resin such as polymethyl methacrylate, a polyurethane resin, or a polyacetal resin such as polyoxymethylene is used.

  Next, the resin mold 12a is polished to form a penetrating resin mold 12b as shown in FIG. Thereafter, as shown in FIG. 10G, when a resist 12b is attached to the substrate, a resin mold is obtained. In addition, when forming a metal mold | die, it is preferable to improve the adhesiveness of a board | substrate and an electroformed structure.

  In the method using a mold, like the method using lithography, a contact probe having a small shape variation, a uniform material composition, and uniform characteristics can be manufactured, and a contact probe suitable for high-density inspection can be provided. it can. Further, since the fine structure can be integrally formed, the number of parts can be reduced, and the part cost and the assembly cost can be reduced. Furthermore, mass production of contact probes is possible using the same mold.

(Probe unit)
The probe unit of the present invention is characterized in that a plurality of the contact probes described above are arranged side by side to form a multistage structure. For example, as shown in FIG. 2, the tip portion 21 having a plate-like structure is arranged with the direction in which the spring portion 22 elastically deforms (the direction of the arrow in FIG. 2 (b)) being aligned, thereby providing a multistage structure. Since the tip portion 21 can be arranged close to one row, it is possible to cope with a narrow pitch in the measurement regions A and B.

When the contact probe has a multistage structure, as shown in FIG. 2 (c), the height L of the tip 21 is different between adjacent contact probes, and the tip of the contact probe arranged on the substrate 25 side of the probe card increases. The height L of 21 becomes long and buckling is likely to occur at the tip. Therefore, the aspect in which the contact probe having the tip width t ₁ and the spring width t ₂ of t ₁ = t ₂ is arranged on the substrate side of the probe card increases the mechanical strength of the tip and reduces buckling. This is preferable in that it can be suppressed.

(Probe card)
The probe card of the present invention includes a probe unit having a multistage structure in which a plurality of contact probes are arranged side by side. The probe card of this aspect can cope with the narrow pitch of the electrode that is the object to be measured. In a probe card having a multi-stage structure, the height of the tip portion of the contact probe differs between adjacent contact probes, and the width t _{1 of the} tip portion and the width t _{2 of the} spring portion are present on the substrate side of the probe card. An embodiment in which a contact probe in which t ₁ = t ₂ is arranged is preferable.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  A probe card useful for high-density inspection can be provided.

It is a figure which shows the structure of the cantilever type | mold contact probe of this invention. It is a figure which shows the example of a probe unit which arranged the contact probe of this invention side by side, and was set as the multistage structure. It is a figure which shows the example of a probe unit which arranged the contact probe of this invention side by side, and was set as the multistage structure. It is a figure which shows the example of a probe unit which arranged the contact probe of this invention side by side, and was set as the multistage structure. It is process drawing which shows the manufacturing method of the contact probe of this invention. It is a figure which shows the structure of the conventional cantilever type | mold contact probe. It is a figure which shows the basic structure of the conventional probe card. It is a figure which shows the structure of the conventional probe unit which used the contact probe as the multistage structure. It is process drawing which shows the manufacturing method of the contact probe of this invention. It is process drawing which shows the manufacturing method of the contact probe of this invention. It is the figure which made the contact probe of this invention the multistage structure and was seen from the front-end | tip part direction.

Explanation of symbols

  1, 21, 31, 41 Tip, 2, 22, 32, 42 Spring, 3, 23, 33, 43 Support, 4, 24, 34, 44 Flexible printed circuit board, 46 Protrusion.

Claims (12)

A cantilever-type contact comprising a tip portion that contacts the surface to be measured, a spring portion connected to the tip portion, a support portion that supports the tip portion and the spring portion, and a flexible printed wiring board that fixes the support portion. In the probe, the tip, the spring, and the support are elastically deformed by the spring while the tip is in contact with the surface to be measured when the support is fixed and the tip is pressed against the surface to be measured. The tip is a plate-like structure having a flat surface along the direction of elastic deformation, and the width t _{1 of the} tip and the width t _{2 of} the portion of the spring connected to the support. Wherein t ₁ <t ₂ . The contact probe according to claim 1, wherein a width t _{3 of} a portion connected to the tip portion of the spring portion is t ₃ <t ₂ .   The contact probe according to claim 1, wherein the tip portion, the spring portion, and the support portion are made of nickel or a nickel-based alloy.   The contact probe according to claim 1, wherein at least the surface layer of the tip portion is made of rhodium or a palladium alloy.   The contact probe according to claim 1, wherein the tip has a protrusion at a portion that contacts the surface to be measured. It is a manufacturing method of the contact probe according to claim 1,
Forming a resin mold by lithography or metal mold;
On the conductive substrate having a flexible printed wiring board, after forming the spring portion and the support portion by the step of forming a layer made of a metal material on the resin mold by electroforming,
Forming a resin mold by lithography or metal mold;
A method of manufacturing a contact probe, comprising: forming a tip portion on a conductive substrate by electroforming a layer made of a metal material on the resin mold. After forming the tip,
Forming a resin mold by lithography or metal mold;
The contact probe manufacturing method according to claim 6, wherein the protrusion is formed by a step of forming a layer made of a metal material on the resin mold by electroforming on the conductive substrate.   The manufacturing method of the contact probe of Claim 6 provided with the process of removing the unnecessary part of the said flexible printed wiring board.   A probe unit having a multistage structure in which a plurality of contact probes according to claim 1 are arranged side by side.   The probe unit according to claim 9, wherein a height L of the tip portion is different between adjacent contact probes. The width t ₁ of the end portion, the width t ₂ of the portion connected to the support portion of the spring portion, the probe unit according to claim 9 comprising a contact probe is t ₁ = t _2.   A probe card comprising the probe unit according to claim 9.

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