KR101117023B1 - 폴리이미드계 광경화성 수지 조성물 및 패턴 형성 방법 및 기판 보호용 피막 - Google Patents

폴리이미드계 광경화성 수지 조성물 및 패턴 형성 방법 및 기판 보호용 피막 Download PDF

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Publication number
KR101117023B1
KR101117023B1 KR1020050093913A KR20050093913A KR101117023B1 KR 101117023 B1 KR101117023 B1 KR 101117023B1 KR 1020050093913 A KR1020050093913 A KR 1020050093913A KR 20050093913 A KR20050093913 A KR 20050093913A KR 101117023 B1 KR101117023 B1 KR 101117023B1
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KR
South Korea
Prior art keywords
group
resin composition
formula
photocurable resin
polyimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020050093913A
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English (en)
Korean (ko)
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KR20060052077A (ko
Inventor
히데또 가또
미찌히로 수고
도모유끼 고또
Original Assignee
신에쓰 가가꾸 고교 가부시끼가이샤
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Publication of KR20060052077A publication Critical patent/KR20060052077A/ko
Application granted granted Critical
Publication of KR101117023B1 publication Critical patent/KR101117023B1/ko
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387Polyamides or polyimides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0757Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G03F7/0758Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
KR1020050093913A 2004-10-07 2005-10-06 폴리이미드계 광경화성 수지 조성물 및 패턴 형성 방법 및 기판 보호용 피막 Expired - Fee Related KR101117023B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2004-00294470 2004-10-07
JP2004294470 2004-10-07

Publications (2)

Publication Number Publication Date
KR20060052077A KR20060052077A (ko) 2006-05-19
KR101117023B1 true KR101117023B1 (ko) 2012-03-15

Family

ID=37150117

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050093913A Expired - Fee Related KR101117023B1 (ko) 2004-10-07 2005-10-06 폴리이미드계 광경화성 수지 조성물 및 패턴 형성 방법 및 기판 보호용 피막

Country Status (2)

Country Link
KR (1) KR101117023B1 (https=)
TW (1) TW200621850A (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101606445B (zh) * 2006-09-26 2012-02-22 阿尔普士电气股份有限公司 印制线路板的制造方法
KR100932770B1 (ko) * 2007-12-18 2009-12-21 전북대학교산학협력단 포지형 감광성 폴리이미드 수지 및 이의 조성물
JP5870487B2 (ja) * 2008-12-26 2016-03-01 日産化学工業株式会社 液晶配向剤、液晶配向膜及び液晶表示素子
JP5593075B2 (ja) * 2010-01-13 2014-09-17 富士フイルム株式会社 パターン形成方法、パターン、化学増幅型レジスト組成物及びレジスト膜
WO2016060340A1 (ko) * 2014-10-15 2016-04-21 연세대학교 원주산학협력단 가압 조건 하에서 수행되는 폴리이미드 제조방법
JP6904245B2 (ja) * 2017-12-27 2021-07-14 信越化学工業株式会社 感光性樹脂組成物、パターン形成方法、及び光半導体素子の製造方法
JP7111031B2 (ja) * 2018-03-23 2022-08-02 信越化学工業株式会社 感光性樹脂組成物、感光性樹脂積層体、及びパターン形成方法
JP7276175B2 (ja) * 2020-01-24 2023-05-18 信越化学工業株式会社 感光性樹脂組成物、感光性ドライフィルム及びパターン形成方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1184653A (ja) 1997-09-11 1999-03-26 Hitachi Chem Co Ltd 耐熱性感光性重合体組成物及びパターンの製造法
KR20040058259A (ko) * 2001-10-30 2004-07-03 가네가후치 가가쿠 고교 가부시키가이샤 감광성 수지 조성물, 이것을 이용한 감광성 필름 및 적층체

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1184653A (ja) 1997-09-11 1999-03-26 Hitachi Chem Co Ltd 耐熱性感光性重合体組成物及びパターンの製造法
KR20040058259A (ko) * 2001-10-30 2004-07-03 가네가후치 가가쿠 고교 가부시키가이샤 감광성 수지 조성물, 이것을 이용한 감광성 필름 및 적층체

Also Published As

Publication number Publication date
TWI373482B (https=) 2012-10-01
KR20060052077A (ko) 2006-05-19
TW200621850A (en) 2006-07-01

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