KR101109095B1 - 멤스 마이크로폰 및 그 제조방법 - Google Patents

멤스 마이크로폰 및 그 제조방법 Download PDF

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Publication number
KR101109095B1
KR101109095B1 KR1020090132682A KR20090132682A KR101109095B1 KR 101109095 B1 KR101109095 B1 KR 101109095B1 KR 1020090132682 A KR1020090132682 A KR 1020090132682A KR 20090132682 A KR20090132682 A KR 20090132682A KR 101109095 B1 KR101109095 B1 KR 101109095B1
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KR
South Korea
Prior art keywords
membrane
silicon substrate
back plate
air gap
depositing
Prior art date
Application number
KR1020090132682A
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English (en)
Korean (ko)
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KR20110076074A (ko
Inventor
김용국
Original Assignee
주식회사 비에스이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 주식회사 비에스이 filed Critical 주식회사 비에스이
Priority to KR1020090132682A priority Critical patent/KR101109095B1/ko
Priority to PCT/KR2010/007535 priority patent/WO2011081288A2/ko
Priority to CN2010206481591U priority patent/CN201937821U/zh
Priority to TW099142137A priority patent/TWI505723B/zh
Priority to CN201010579578.9A priority patent/CN102111705B/zh
Publication of KR20110076074A publication Critical patent/KR20110076074A/ko
Application granted granted Critical
Publication of KR101109095B1 publication Critical patent/KR101109095B1/ko

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Pressure Sensors (AREA)
  • Multimedia (AREA)
  • Micromachines (AREA)
KR1020090132682A 2009-12-29 2009-12-29 멤스 마이크로폰 및 그 제조방법 KR101109095B1 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020090132682A KR101109095B1 (ko) 2009-12-29 2009-12-29 멤스 마이크로폰 및 그 제조방법
PCT/KR2010/007535 WO2011081288A2 (ko) 2009-12-29 2010-10-29 멤스 마이크로폰 및 그 제조방법
CN2010206481591U CN201937821U (zh) 2009-12-29 2010-12-03 微电子机械系统传声器
TW099142137A TWI505723B (zh) 2009-12-29 2010-12-03 微電子機械系統傳聲器及其製造方法
CN201010579578.9A CN102111705B (zh) 2009-12-29 2010-12-03 微电子机械系统传声器及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090132682A KR101109095B1 (ko) 2009-12-29 2009-12-29 멤스 마이크로폰 및 그 제조방법

Publications (2)

Publication Number Publication Date
KR20110076074A KR20110076074A (ko) 2011-07-06
KR101109095B1 true KR101109095B1 (ko) 2012-01-31

Family

ID=44175704

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090132682A KR101109095B1 (ko) 2009-12-29 2009-12-29 멤스 마이크로폰 및 그 제조방법

Country Status (4)

Country Link
KR (1) KR101109095B1 (zh)
CN (2) CN201937821U (zh)
TW (1) TWI505723B (zh)
WO (1) WO2011081288A2 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024034931A1 (ko) * 2022-08-08 2024-02-15 삼성전자주식회사 음향 입력 장치를 포함하는 전자 장치

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101355434B1 (ko) * 2012-06-12 2014-01-28 한국생산기술연구원 미세 홀이 배열된 폴리머 멤브레인을 포함하는 플라스틱 챔버 플레이트의 제작 방법
KR20140040997A (ko) 2012-09-27 2014-04-04 한국전자통신연구원 멤스 마이크로폰 및 그 제조방법
CN106604195A (zh) * 2015-10-14 2017-04-26 天津修瑕科技有限公司 一种基于电子信息系统钥匙的安全方法
CN107465983B (zh) * 2016-06-03 2021-06-04 无锡华润上华科技有限公司 Mems麦克风及其制备方法
CN108609573A (zh) * 2016-12-12 2018-10-02 中芯国际集成电路制造(上海)有限公司 一种mems器件及其制备方法、电子装置
KR102091849B1 (ko) * 2018-11-30 2020-03-20 (주)다빛센스 콘덴서 마이크로폰 및 그 제조방법
CN111131986A (zh) * 2019-12-31 2020-05-08 歌尔股份有限公司 防尘结构、麦克风封装结构以及电子设备

Citations (4)

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JP2006068843A (ja) 2004-08-31 2006-03-16 Sony Corp 微小電気機械素子、光学微小電気機械素子、光変調素子、並びにレーザディスプレイ
KR20060099627A (ko) * 2005-03-14 2006-09-20 주식회사 케이이씨 Ｍｅｍｓ 공정을 이용한 마이크로폰 및 그 제조 방법
KR100893558B1 (ko) 2005-08-10 2009-04-17 세이코 엡슨 가부시키가이샤 반도체 장치, 반도체 장치의 제조 방법 및 전자 부품
JP2009148880A (ja) 2007-12-14 2009-07-09 Ind Technol Res Inst センシング膜及びそれを用いるマイクロエレクトロメカニカルシステムデバイス

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US6566251B2 (en) * 2001-03-29 2003-05-20 Georgia Tech Research Corporation Method for selective deposition of materials in micromachined molds
EP1246502A1 (en) * 2001-03-30 2002-10-02 Phone-Or Ltd Microphone
US7045868B2 (en) * 2003-07-31 2006-05-16 Motorola, Inc. Wafer-level sealed microdevice having trench isolation and methods for making the same
US20060291674A1 (en) * 2005-06-14 2006-12-28 Merry Electronics Co. Ltd. Method of making silicon-based miniaturized microphones
TWI285509B (en) * 2006-02-10 2007-08-11 Univ Nat Chunghsing Sawing-free process for manufacturing wafer of capacitor-type silicon microphone
WO2007112743A1 (en) * 2006-03-30 2007-10-11 Sonion Mems A/S Single die mems acoustic transducer and manufacturing method
JP2008092561A (ja) * 2006-09-04 2008-04-17 Yamaha Corp 半導体マイクユニット、その製造方法、及び、半導体マイクユニットの搭載方法
EP1931173B1 (en) * 2006-12-06 2011-07-20 Electronics and Telecommunications Research Institute Condenser microphone having flexure hinge diaphragm and method of manufacturing the same
US8258591B2 (en) * 2008-01-16 2012-09-04 Solid State System Co., Ltd. Micro-electro-mechanical systems (MEMS) device
WO2009146494A1 (en) * 2008-06-04 2009-12-10 Cochlear Limited Implantable microphone diaphragm stress decoupling system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006068843A (ja) 2004-08-31 2006-03-16 Sony Corp 微小電気機械素子、光学微小電気機械素子、光変調素子、並びにレーザディスプレイ
KR20060099627A (ko) * 2005-03-14 2006-09-20 주식회사 케이이씨 Ｍｅｍｓ 공정을 이용한 마이크로폰 및 그 제조 방법
KR100893558B1 (ko) 2005-08-10 2009-04-17 세이코 엡슨 가부시키가이샤 반도체 장치, 반도체 장치의 제조 방법 및 전자 부품
JP2009148880A (ja) 2007-12-14 2009-07-09 Ind Technol Res Inst センシング膜及びそれを用いるマイクロエレクトロメカニカルシステムデバイス

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024034931A1 (ko) * 2022-08-08 2024-02-15 삼성전자주식회사 음향 입력 장치를 포함하는 전자 장치

Also Published As

Publication number Publication date
CN102111705B (zh) 2015-12-09
CN201937821U (zh) 2011-08-17
KR20110076074A (ko) 2011-07-06
WO2011081288A3 (ko) 2011-11-03
WO2011081288A2 (ko) 2011-07-07
TW201127088A (en) 2011-08-01
CN102111705A (zh) 2011-06-29
TWI505723B (zh) 2015-10-21

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