KR101103484B1 - Method for fabricating roll stamp - Google Patents

Method for fabricating roll stamp Download PDF

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Publication number
KR101103484B1
KR101103484B1 KR1020100075965A KR20100075965A KR101103484B1 KR 101103484 B1 KR101103484 B1 KR 101103484B1 KR 1020100075965 A KR1020100075965 A KR 1020100075965A KR 20100075965 A KR20100075965 A KR 20100075965A KR 101103484 B1 KR101103484 B1 KR 101103484B1
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KR
South Korea
Prior art keywords
layer
metal layer
roll
pattern
mask
Prior art date
Application number
KR1020100075965A
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Korean (ko)
Inventor
이헌
한강수
Original Assignee
고려대학교 산학협력단
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Priority to KR1020100075965A priority Critical patent/KR101103484B1/en
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Publication of KR101103484B1 publication Critical patent/KR101103484B1/en

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2012—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image using liquid photohardening compositions, e.g. for the production of reliefs such as flexographic plates or stamps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Abstract

A method of producing a roll stamp is disclosed. Method of manufacturing a roll stamp according to an embodiment of the present invention comprises the steps of (a) forming a material layer 200 on the surface of the cylindrical roll (100); (b) forming a metal layer 300 on the material layer 200; (c) anodizing the metal layer 300 to form a mask layer 310; And (d) etching the material layer 200 using the mask layer 310 as a mask.

Description

Manufacturing method of roll stamp {METHOD FOR FABRICATING ROLL STAMP}

The present invention relates to a method for producing a roll stamp. More specifically, the present invention relates to a method of manufacturing a roll stamp, which can prevent the occurrence of a seam portion between patterns at its source.

The nanoimprinting technique was introduced in the United States in the mid-1990s, and has attracted attention as a technology that can compensate for the low productivity of electron beam lithography and the disadvantages of expensive optical lithography equipment. This nanoimprint technique is performed by fabricating a stamp having a nanoscale pattern and imprinting the stamp on a thin film to transfer the nanoscale pattern. Stamps having such a pattern have been generally recognized as flat stamps in which a pattern is formed on a plane.

Nevertheless, efforts have been made to apply nanoimprint technology to roll stamps having patterns as well as flat stamps. Theoretically, since roll stamps having a pattern can be patterned continuously while rotating, it is expected that not only the large area patterning will be easy but also the productivity will be improved.

1 to 4 are views for explaining a general method of manufacturing a roll stamp.

As shown in Figs. 1 and 3, a flat stamp 40 is used to produce a general roll stamp. In other words, in order to manufacture a roll stamp, the method of generally transferring the pattern of the flat plate stamp 40 to a roll stamp as it is is used.

Thus, the method of using the flat stamp 40 can be largely divided into two, one, as shown in Figure 1, to form the intermediate layer 20 and the resin layer 30 in the cylindrical roll 10 in sequence It is a method of applying heat while rolling the cylindrical roll 10 to the flat stamp (40). The shape of the cylindrical roll 10 to which the pattern of the flat stamp 40 has been transferred by this method is shown in FIG. 2. Referring to FIG. 2, it can be seen that the pattern of the flat stamp 40 is transferred to the resin layer 30 to form an intaglio pattern.

Next, in the second method using the flat stamp 40, as shown in FIG. 3, the intermediate layer 20 and the resin layer pattern 31 are sequentially formed on the flat stamp 40, and a cylindrical roll ( It is a method of transferring the intermediate | middle layer 20 and the resin layer pattern 31 to the cylindrical roll 10 surface by applying heat, rolling 10). The shape of the cylindrical roll 10 to which the intermediate | middle layer and the resin layer pattern 31 were transferred by this method is shown by FIG. Referring to FIG. 4, it can be seen that the intermediate layer 40 and the resin layer pattern 31 are transferred to the cylindrical roll 10.

However, according to the two methods described above, a fatal problem occurs that the seam portion J inevitably occurs. In this regard, referring to FIGS. 1 and 2, it can be seen that the patterns of the regions indicated by reference numerals A and B of FIG. 1 are transferred to the regions indicated by reference numerals A and B of FIG. 2. 3 and 4, it can be seen that the pattern of the region indicated by reference numerals C and D of FIG. 3 is transferred to the region indicated by reference numerals C and D of FIG. 4. That is, when the pattern of the flat stamp is transferred to the cylindrical roll 10, a portion where A and B meet C and D necessarily exists, but the seam portion J is inevitably generated. will be.

The seam portion J is easily formed with an unusually large or small pattern (see FIG. 2), and in some cases, a portion where the pattern does not exist may be generated (see FIG. 4). Therefore, the presence of the seam portion J has been a major cause of the inability to accurately form the desired pattern on the substrate, and furthermore, in the roll-to-roll process of continuously forming the pattern on several substrates. It has been a major cause of the colorlessness.

In this situation, a new roll stamp manufacturing method capable of preventing the occurrence of a seam source is required.

Accordingly, the present invention has been made to solve the above problems of the prior art, an object of the present invention is to provide a method of manufacturing a roll stamp that can prevent the occurrence of the seam between the patterns inherently.

In order to achieve the above object, a method of manufacturing a roll stamp according to an embodiment of the present invention comprises the steps of (a) forming a material layer on the surface of the cylindrical roll; (b) forming a metal layer on the material layer; (c) anodizing the metal layer to form a mask layer; And (d) etching the material layer using the mask layer as a mask.

The cylindrical roll may be composed of an insulator.

The metal layer may be made of aluminum.

In step (c), anodization of the metal layer may be repeatedly performed.

In step (c), the shape or size of the pattern of the mask layer may be adjusted by adjusting at least one of the voltage applied to the metal layer or the time for anodizing the metal layer.

In order to achieve the above object, the roll stamp according to an embodiment of the present invention by sequentially forming a material layer and a metal layer on the surface of the cylindrical roll, using the mask layer formed by anodizing the metal layer as a mask And by etching the material layer.

According to the present invention, there is an effect that can be prevented from occurring at the seam between the patterns.

Moreover, according to this invention, there exists an effect which can form the pattern of a roll stamp only by a simple process.

In addition, according to the present invention, there is an effect that can provide a roll stamp that can effectively perform the process of forming a pattern continuously on a plurality of substrates.

1 to 4 are views for explaining a general method of manufacturing a roll stamp.
5 to 8 are views for explaining a roll stamp manufacturing method according to an embodiment of the present invention.
9 is a photograph taken with a scanning electron microscope of the mask layer formed by the manufacturing method of the present invention.

DETAILED DESCRIPTION The following detailed description of the invention refers to the accompanying drawings that show, by way of illustration, specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It should be understood that the various embodiments of the present invention are different but need not be mutually exclusive. For example, certain features, structures, and characteristics described herein may be implemented in other embodiments without departing from the spirit and scope of the invention in connection with an embodiment. It is also to be understood that the position or arrangement of the individual components within each disclosed embodiment may be varied without departing from the spirit and scope of the invention. The following detailed description, therefore, is not to be taken in a limiting sense, and the scope of the present invention, if properly described, is defined only by the appended claims, along with the full range of equivalents to which such claims are entitled. In the drawings, like reference numerals refer to the same or similar functions throughout the several aspects, and length, area, thickness, and the like may be exaggerated for convenience.

DETAILED DESCRIPTION Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily implement the present invention.

5 to 8 are views for explaining a roll stamp manufacturing method according to an embodiment of the present invention.

More specifically, Figure 5 is a view showing the overall appearance of a process for producing a roll stamp of the present invention. 6 is a sectional perspective view of FIG. 5A, FIG. 7 is a sectional perspective view of FIG. 5B, and FIG. 8 is a sectional perspective view of FIG. 5C.

First, referring to FIG. 6, a cylindrical roll 100 having a predetermined width and area may be prepared.

The cylindrical roll 100 may serve as a foundation member for manufacturing a roll stamp. The size of the cylindrical roll 100 may be to substantially determine the size of the roll stamp to be finally produced. Thus, the size of the cylindrical roll 100 can be selected to match the size of the roll stamp to be finally produced.

As described below, an electrode may be connected to the cylindrical roll 100 to perform anodization of the metal layer 300 formed on the surface of the cylindrical roll 100. In this case, in order to smoothly anodize the metal layer 300, the current supplied from the electrode is preferably concentrated in the direction of the metal layer 300 rather than the inside of the cylindrical roll 100. In this sense, the cylindrical roll 100 of the present invention is preferably composed of an insulator having a strong resistance to current. For example, the cylindrical roll 100 of the present invention is preferably composed of a common ceramic material or silicon.

Next, referring further to FIG. 6, a material layer 200 made of a predetermined material may be formed on the surface of the cylindrical roll 100.

The material layer 200 may function as the pattern layer 210 through an etching process to be described later. Therefore, it is preferable to configure the material layer 200 with a material capable of dry or wet etching. Such dry or wet etchable materials may include Si, glass and other metals.

When the material layer 200 is formed on the surface of the cylindrical roll 100, the material layer 200 may be formed on the upper and lower surfaces of the cylindrical roll 100 as well as the circumferential surface of the cylindrical roll 100. In this sense, FIG. 6 shows a state in which the material layer 200 is formed on the circumferential surface, the upper surface, and the lower surface of the cylindrical roll 100.

Next, referring to FIG. 6, a metal layer 300 made of a predetermined metal may be formed on the material layer 200.

The metal layer 300 may function as the mask layer 310 through an anodization process to be described later. Therefore, when selecting the material of the metal layer 300, it is necessary to consider whether the anodic oxidation can be easily progressed, whether or not the material layer 200 has a different etching ratio. In view of such a point, aluminum may be preferably used as a material constituting the metal layer 300 of the present invention.

The metal layer 300 may include physical vapor deposition (PVD), low pressure chemical vapor deposition, and / or the like, such as thermal evaporation, e-beam evaporation, sputtering, and low pressure chemical vapor deposition. Chemical Vapor Deposition (CVD), such as LPCVD, Plasma Enhanced Chemical Vapor Deposition (PECVD), and the like, may be selectively used.

In addition, in order to smoothly anodize the metal layer 300, the metal layer 300 needs to be formed to have a predetermined thickness or more. Of course, there may be a deviation depending on the size of the cylindrical roll 100, preferably the metal layer 300 of the present invention may be formed to a thickness of 1 to 10um.

Next, referring to FIG. 7, the metal layer 300 may be anodized to form a mask layer 310 having a predetermined mask pattern.

Here, the mask layer 310 may mean a layer in which part or all of the metal layer 300 is anodized and converted. Thus, some or all of the mask layer 310 may be composed of an oxide of metal.

As described above, in the present invention, the formation of the mask layer 310 using the anodic oxidation method is an important structural feature. The anodic oxidation method is a method of oxidizing an object with oxygen generated from the anode using an object to be anodized as an anode. When the mask layer 310 is formed using the anodic oxidation method, a pattern of a flat stamp is applied to a roll stamp. By transferring, the seam portion can be prevented from occurring inevitably.

A method of proceeding anodization of the metal layer 300 is briefly described as follows.

First, a predetermined polishing process may be performed before proceeding to anodizing the metal layer 300. Such a polishing process may be performed to make the surface of the metal layer 300 flat.

Next, a voltage may be applied to the metal layer 300 by connecting an electrode to the cylindrical roll 100 on which the metal layer 300 is formed. Here, a general electrode such as platinum or gold may be used as an electrode connected to the cylindrical roll 100. In addition, the voltage applied to the metal layer 300 may be a voltage of 30 to 50V. In addition, the time for which the voltage is applied to the metal layer 300 may be 30 minutes to two hours. Furthermore, a predetermined electrolyte solution having acidity may be further used to smoothly proceed anodization.

As the anodic oxidation of the metal layer 300 proceeds, some or all of the metal layer 300 is oxidized to be converted into a metal oxide layer having a predetermined pattern, that is, the mask layer 310. The mask pattern of the mask layer 310 may be a pore pattern that is irregularly and densely arranged.

In this case, the shape or size of the mask pattern of the mask layer 310 may be appropriately adjusted by appropriately adjusting the voltage applied to the metal layer 300 or the time of anodizing the metal layer 300. For example, by increasing the voltage applied to the metal layer 300 or by anodizing the metal layer 300 for a longer time, the rate of the anodizing of the metal layer 300 may be increased, so that the height of the mask pattern may be adjusted.

In some cases, anodization of the metal layer 300 may be repeatedly performed. More specifically, when the anodic oxidation of the metal layer 300 is performed once, only a part of the surface of the metal layer 300 may be converted into a metal oxide. After selectively removing only the metal oxide converted by the anodic oxidation, the metal layer ( 300) can be anodized. In order to repeatedly perform anodization of the metal layer 300, it is preferable that the thickness of the metal layer 300 is equal to or greater than a predetermined dimension (eg, 1 μm or more).

A photo of a mask layer 310 prepared by the method described above with a scanning electron microscope is shown in FIG. 9. In order to form the mask layer 310 illustrated in FIG. 9, the metal layer 300 was made of aluminum, and a voltage of about 40 V was applied to the metal layer 300 for about one hour.

As shown in FIG. 9, the appearance of the mask layer 310 having an irregular and closely arranged pore-shaped mask pattern was confirmed. Although the overall shape is not shown in FIG. 9, even in the photograph of the mask layer 310 of FIG. 9, the abnormally small or large pattern or the blank portion without the pattern could not be confirmed. From this, it could be confirmed that a simple anodic oxidation process can form a mask pattern in which a seam part does not exist.

Next, referring to FIGS. 7 and 8, the material layer 200 may be etched using the mask layer 310 as a mask.

As such, as the material layer 200 is etched, the mask pattern of the mask layer 310 is transferred to the material layer 200 as it is, so that the material layer 200 may be converted into the pattern layer 210. The etching depth of the material layer 200 is not particularly limited and may be variously set according to the purpose of the present invention.

In the present invention, in order to etch the material layer 200 basically, a known dry or wet etching method may be used without limitation. However, preferably, a method of etching the material layer 200 may be appropriately selected according to the type of material constituting the material layer 200. For example, when the material layer 200 is made of Si, the material layer 200 may be dry etched with a material such as BCl 3 , SF 6 , HBr, CF 4 , Cl 2, or the like. In addition, when the material layer 200 is composed of SiO 2 , the material layer 200 may be dry etched with a material such as CHF 3 or CF 4 .

Finally, referring to FIG. 8, the residual mask layer 310 may be removed.

As such, as the residual mask layer 310 is removed, the roll stamp formed by integrating the cylindrical roll 100 and the pattern layer 210 may be manufactured. The removal method of the residual mask layer 310 is not particularly limited, and the method may be wet etching with an etchant prepared to remove the residual mask layer 310 or dry etching with a device suitable for removing the residual mask layer 310. Methods and the like can be used throughout.

The roll stamp thus produced can be effectively used in a process that requires forming a pattern on a substrate. For example, it can be effectively used in a process for improving the luminous efficiency by forming an uneven pattern on the components of the light emitting diode.

According to the method of manufacturing a roll stamp according to the present invention, it is possible to fundamentally prevent a problem that may occur when the pattern of the flat stamp is transferred to the cylindrical roll 100, that is, a problem that a seam occurs. Accordingly, when performing the pattern forming process using the roll stamp of the present invention, it is possible not only to prevent the desired pattern from being accurately formed, but also to perform a roll-to-roll process of continuously forming patterns on a plurality of substrates. It can be done effectively.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken in conjunction with the present invention. Variations and changes are possible. Such modifications and variations are intended to fall within the scope of the invention and the appended claims.

100: cylindrical roll
200: material layer
210: pattern layer
300: metal layer
310: mask layer

Claims (6)

(a) forming a material layer made of a predetermined material capable of dry or wet etching on the surface of the cylindrical roll;
(b) forming a metal layer on the material layer;
(c) anodizing the metal layer to form a mask layer; And
(d) etching the material layer using the mask layer as a mask
Method of producing a roll stamp comprising a. The method of claim 1,
The cylindrical roll is a manufacturing method of a roll stamp, characterized in that consisting of an insulator. The method of claim 1,
The metal layer is a roll stamp manufacturing method, characterized in that composed of aluminum. The method of claim 1,
The method of claim 1, wherein the step (c) repeats the anodic oxidation of the metal layer. The method of claim 1,
And adjusting the shape or size of the pattern of the mask layer by adjusting at least one of the applied voltage of the metal layer or the time of anodizing the metal layer in the step (c). It is produced by sequentially forming a material layer and a metal layer composed of a predetermined material capable of dry or wet etching on the surface of the cylindrical roll, and etching the material layer using a mask layer formed by anodizing the metal layer as a mask. Roll stamp, characterized in that.
KR1020100075965A 2010-08-06 2010-08-06 Method for fabricating roll stamp KR101103484B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101420093B1 (en) * 2012-11-19 2014-08-13 성균관대학교산학협력단 Manufacturing method of printing roll using anodizing technology and printing roll manufactured by thereof
CN107385390A (en) * 2016-04-22 2017-11-24 普因特工程有限公司 mask and mask assembly

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080143015A1 (en) 2006-12-14 2008-06-19 National Central University Method of fabricating porous AIO2 mold having sub-micro structure
JP2008229869A (en) 2007-03-16 2008-10-02 Kanagawa Acad Of Sci & Technol Roll-shaped mold for continuous imprinting and its manufacturing method
KR20090004180A (en) * 2007-07-06 2009-01-12 삼성전자주식회사 Highly ordered anodic aluminum oxide template and method of manufacturing the same
KR20090108941A (en) * 2008-04-14 2009-10-19 한국기계연구원 Fabricating method of stamp for imprint lithography

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080143015A1 (en) 2006-12-14 2008-06-19 National Central University Method of fabricating porous AIO2 mold having sub-micro structure
JP2008229869A (en) 2007-03-16 2008-10-02 Kanagawa Acad Of Sci & Technol Roll-shaped mold for continuous imprinting and its manufacturing method
KR20090004180A (en) * 2007-07-06 2009-01-12 삼성전자주식회사 Highly ordered anodic aluminum oxide template and method of manufacturing the same
KR20090108941A (en) * 2008-04-14 2009-10-19 한국기계연구원 Fabricating method of stamp for imprint lithography

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101420093B1 (en) * 2012-11-19 2014-08-13 성균관대학교산학협력단 Manufacturing method of printing roll using anodizing technology and printing roll manufactured by thereof
CN107385390A (en) * 2016-04-22 2017-11-24 普因特工程有限公司 mask and mask assembly

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