KR101099720B1 - Apparatus for processing substrates - Google Patents

Abstract

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus capable of processing a plurality of substrates in one process chamber. One aspect of the substrate processing apparatus of the present invention is a process chamber that provides a space in which a process is performed, a lower chamber module positioned at a lower end of the process chamber and performing a predetermined unit process, and an upper chamber stacked on an upper end of the lower chamber module. A module, a driving unit for elevating or lowering the second susceptor of the upper chamber module by raising or lowering the first susceptor of the lower chamber module, and adjusting the height of the first susceptor to adjust the first susceptor. It includes a height adjuster for adjusting horizontally.

Chamber module, laminated structure, height adjustable

Description

Apparatus for processing substrates

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus capable of adjusting the horizontality of each chamber module in a stacked structure capable of processing a plurality of substrates in one process chamber.

Recently, information processing devices have been rapidly developed to have various types of functions and faster information processing speeds. This information processing apparatus has a display device for displaying the operated information. Until now, a cathode ray tube monitor has been mainly used as a display device, but recently, with the rapid development of semiconductor technology, the use of a flat display device that is light and occupies a small space is rapidly increasing.

In addition, in general, a semiconductor device uses a deposition process that can form a thin film on a semiconductor substrate, a pattern of forming a pattern on the surface of the thin film on the semiconductor substrate by using a pattern of a mask or a reticle. It is prepared by repeatedly performing a lithography process, an etching process for selectively removing the thin film using a reaction gas or a chemical solution along the pattern of the surface of the thin film.

In addition, recently, research on new energy sources to replace fossil energy due to exhaustion of fossil energy and global climate environment has been conducted, and among them, a solar module device manufactured by applying a semiconductor manufacturing process or a flat panel display manufacturing process. The research on is progressing rapidly recently. Therefore, in order to mass produce and arrange a photovoltaic module device that performs photovoltaic power generation in a wide range of areas, an apparatus for dramatically improving the processing speed of a substrate is required.

Therefore, in the above semiconductor manufacturing process, flat panel display manufacturing process, or solar module manufacturing process, it is necessary to improve the processing speed of the substrate in a predetermined process chamber in which various processes are performed. However, no new progress has been made in research or development from a new perspective of attempting to process large-scale substrates.

An object of the present invention is to provide a substrate processing apparatus capable of horizontally adjusting a chamber module in a structure in which a plurality of chamber modules are stacked in a process chamber.

Problems of the present invention are not limited to the above-mentioned objects, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

In order to solve the above problems, an aspect of the substrate processing apparatus of the present invention comprises a process chamber for providing a space in which the process is performed; A lower chamber module positioned at a lower end of the process chamber and performing a predetermined unit process; An upper chamber module stacked on top of the lower chamber module; A driving unit for elevating or lowering the second susceptor of the upper chamber module by raising or lowering the first susceptor of the lower chamber module; And a height adjusting unit adjusting the height of the first susceptor to horizontally adjust the first susceptor.

According to an embodiment of the present invention, in a structure in which a plurality of chamber modules are stacked in the process chamber, the chamber modules may be horizontally adjusted to increase the efficiency of the process in each chamber module.

The effects of the present invention are not limited to the above-mentioned effects, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

Specific details of other embodiments are included in the detailed description and the drawings. Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various different forms, and only the embodiments make the disclosure of the present invention complete, and the general knowledge in the art to which the present invention belongs. It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

When an element is referred to as being "connected to" or "coupled to" with another element, it may be directly connected to or coupled with another element or through another element in between. This includes all cases. On the other hand, when one device is referred to as "directly connected to" or "directly coupled to" with another device indicates that no other device is intervened. Like reference numerals refer to like elements throughout. “And / or” includes each and all combinations of one or more of the items mentioned.

Although the first, second, etc. are used to describe various elements, components and / or sections, these elements, components and / or sections are of course not limited by these terms. These terms are only used to distinguish one element, component or section from another element, component or section. Therefore, the first device, the first component, or the first section mentioned below may be a second device, a second component, or a second section within the technical spirit of the present invention.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. As used herein, “comprises” and / or “comprising” refers to the presence of one or more other components, steps, operations and / or elements. Or does not exclude additions.

Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used in a sense that can be commonly understood by those skilled in the art. In addition, the terms defined in the commonly used dictionaries are not ideally or excessively interpreted unless they are specifically defined clearly.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic cross-sectional view of a general substrate processing apparatus. Referring to FIG. 1, a general substrate processing apparatus includes a process chamber 10 providing a space where a predetermined process is performed, a susceptor 20 on which a substrate is seated, a shower head 30 spraying process gas, and a process. It may include a jet plate 40 for dispersing the gas.

Driving means 50 for raising and lowering the susceptor 20 vertically to adjust the process gap Gap, which is a distance between the jet plate 40 for seating the substrate W and injecting the process gas and the substrate W. ) Is required. However, due to the central axis 25 of the susceptor 20 it is not easy to apply a multi-stage stacking structure for processing a plurality of substrates at the same time.

2 is a schematic cross-sectional view of a substrate processing apparatus according to an embodiment of the present invention. 2, a substrate processing apparatus according to an embodiment of the present invention includes a process chamber 100, a lower chamber module 200, an upper chamber module 300, a driving unit 450, a height adjusting unit 400, and It may include a horizontal sensor 500.

The process chamber 100 provides a space in which a process of the substrate processing apparatus is performed. The process chamber 100 may include a plurality of chamber modules 200 and 300 having a stacked structure. The plurality of chamber modules 200 and 300 may be disposed in the process chamber 100 at predetermined intervals. The process chamber 100 may include various mechanical devices such as transferring or supporting a substrate, an electronic device for controlling, or a controller (not shown) while providing a space for performing a process.

The process chamber 100 may include a lower chamber module 200 to be described later, and a catching part 120 to which the upper chamber module 300 is mounted. The catching part 120 is disposed horizontally on the inner wall of the process chamber 100, and serves to allow the lower chamber module 200 and the upper chamber module 300 to be described later to be seated on the inner wall. The catching part 120 may include a chamber groove or a chamber protrusion 125 to seat and fix the lower chamber module 200 and the upper chamber module 300.

The lower chamber module 200 supports a first upper support plate 210 attached to the process chamber 100 and a first stand supporting the first susceptor 230 disposed at a predetermined distance from the first upper support plate 210. It may include a acceptor support 220 and a plurality of lower connecting shafts (241, 242).

The first upper support plate 210 is fixed to the inner wall of the process chamber 100 or seated on the locking portion 120 of the process chamber 100. The first upper support plate 210 is a fixed portion of the lower chamber module 200, and is between the first upper support plate 210 and the first susceptor 230 by lifting or lowering the first susceptor support 220. The spacing can be widened or narrowed. Meanwhile, the first upper support plate 210 may include a gas path (not shown) for providing a predetermined process gas and a spray plate 215 connected to the gas path to disperse the process gas.

The first susceptor support 220 supports the first susceptor 230 and may be coupled to the lower connection shafts 241 and 242 to be described later. The edges of the first upper support plate 210 and the first susceptor support 220 may include a plurality of holes. For example, the lower connection shafts 241 and 242 penetrate the rectangular corners, and may include a predetermined hole that is a passage. Meanwhile, the first susceptor support part 220 may have a plate shape for supporting the first susceptor 230 or a bar shape for horizontally supporting the first susceptor 230 at a lower end thereof. Alternatively, the first susceptor support 220 may be integrally coupled with the first susceptor 230. For example, when the first susceptor support part 220 has a bar shape, the lower part of the first susceptor 230 is supported at a predetermined interval, and the lower connecting shaft is provided at both ends of the bar. 241 and 242 may include a predetermined hole that is a passage through which the 241 and 242 move.

The first susceptor 230 generally provides a space in which the substrate is seated. The first susceptor 230 may include a heating means (not shown) in which a heating wire, a gas flow path, an induction coil, and the like are disposed to transfer predetermined heat to the back surface of the substrate, and heat the same to a predetermined temperature. In addition, it may include a predetermined adsorption means (not shown) or an electrostatic chuck for adsorbing the substrate. Meanwhile, the first susceptor 230 may be integrally formed with the first susceptor support 220, and in this case, the first susceptor support 220 and the first susceptor 230 may be collectively referred to as “first”. 1 susceptor "or" first susceptor support ".

The lower connection shafts 241 and 242 serve to couple the first upper support plate 210 and the first susceptor support 220. The lower connection shafts 241 and 242 are coupled through a predetermined hole at the edge of the first upper support plate 210 and the first susceptor support 220, and the lower connection shafts 241 and 242 are connected to the first upper support plate ( It is not integrally attached to 210 and can move up and down relatively. Meanwhile, the lower connection shafts 241 and 242 may be integrally attached to the first susceptor support 220 or may not be attached. At the ends of the lower connecting shafts 241 and 242, locking ends 245 and 246 in the form of bolts, rivets, and nuts having a predetermined contact cross-sectional area are formed to form a first upper support plate 210 and a first susceptor support 220. ) Is not separated from the lower connecting shaft (241, 242).

The height adjuster 400 may adjust the height of the first susceptor 230 or the first susceptor support 220 to horizontally adjust the first susceptor 230 or the first susceptor support 220. . For example, the height adjusting unit 400 finely adjusts the height of each corner portion of the first susceptor 230 or the first susceptor support 220 to thereby adjust the first susceptor 230 or the first standing. The acceptor support 220 may be horizontally adjusted.

The height adjusting part 400 includes a height adjusting end 410 contacting the bottom surfaces of the lower connecting shafts 241 and 242 and a fine moving end 420 which is integrally attached to the height adjusting end 410 to move up and down. can do.

The height adjusting end 410 provides a predetermined horizontal cross-sectional area in contact with the bottom surfaces of the lower connecting shafts 241 and 242, and supports the horizontal cross-sectional area of the stress transmitted to the lower connecting shafts 241 and 242 by vertical movement. Play a role.

The fine moving stage 420 finely moves up and down to finely adjust the height of the height adjusting stage 410. For example, the fine moving end 420 may move finely up and down while rotating along a predetermined thread. In this manner, the linear motion is converted to the linear motion by a predetermined thread or the like, and the height can be finely moved up and down at a predetermined point.

The height adjusting unit 400 may be located at four corner portions of the first susceptor 230 or the first susceptor support 220, respectively, and the bottom surfaces of the lower connecting shafts 241 and 242 at each corner portion. The lower connection shafts 241 and 242 can be moved up and down finely by vertically moving while being in contact with each other. As such, the first and second susceptor 230 or the first susceptor support (the first susceptor 230 or the first susceptor support 220 by moving the lower connecting shaft 241, 242 in each corner portion of the first susceptor 230 or 220 can be adjusted horizontally.

Referring to FIG. 2 again, the upper chamber module 300 may include a second upper support plate 310 attached to the process chamber 100 and a second susceptor 330 disposed at a predetermined distance from the second upper support plate 310. ) May include a second susceptor support 320 and a plurality of upper connecting shafts 341 and 342. On the other hand, the upper chamber module 300 in the configuration, it may be made of the same configuration as the lower chamber module 200.

However, the upper chamber module 300 may be disposed in a structure in which the upper chamber module 300 directly contacts the lower chamber module 200 or is stacked with only a predetermined interval therebetween. Accordingly, each of the upper support plates 210 and 310 of the lower chamber module 200 and the upper chamber module 300 is seated and fixed to the inner wall of the process chamber 100, and thus the lower chamber module 200 and the upper chamber module 300 are fixed. ) So that the laminated structure can be arranged. In addition, the lower chamber module 200 and the upper chamber module 300 may be seated on the inner wall of the process chamber 100 in a receivable state to facilitate assembly or expansion of each chamber module 200 and 300. It may be.

Due to the stacking structure as described above, the upper connecting shafts 341 and 342 are also lifted or lowered together with the lowering or lowering of the lower connecting shafts 241 and 242 to raise or lower the second susceptor support 320. Can be lowered. This operation will be described in more detail later.

The driving unit 450 serves to elevate or lower the lower connecting shafts 241 and 242 of the lower chamber module 200 or to elevate or lower the first susceptor support 220 of the lower chamber module 200. . The driving unit 450 lifts or lowers the lower connection shafts 241 and 242 or the first susceptor support 220 to primarily lift or lower the first susceptor 230. In addition, the second connecting rods 341 and 342 which are connected to and contact with the axes perpendicular to the lower connecting shafts 241 and 242 are also lifted or lowered together to form a second second susceptor support 320. The susceptor 330 may be raised or lowered.

The driving unit 450 is connected to the driving motor 401 providing a predetermined driving force, the first driving member 402 and the first driving member 402 transmitting the driving force, and the lower connecting shafts 241 and 242 or the first driving member 402. 1 may include a second driving member 430 in contact with the susceptor support 220 to transfer the driving force. For example, the driving motor 401 may rotate to induce a lifting or lowering motion of the first driving member 402 by screwing to convert a predetermined rotational motion into a linear motion. Alternatively, the cylinder type may be lifted or lowered by directly contacting the lower connecting shafts 241 and 242 or the first susceptor support 220.

The second driving member 430 may include a transmission shaft 427 forming a predetermined bar and a threaded groove 425 formed in the transmission shaft. The thread groove 425 may be coupled to the fine moving end 420 of the height adjusting unit 400. The fine moving end 420 may move the edge of the first susceptor 230 or the first susceptor support 220 by finely moving up and down relative to the thread groove 425 by rotation. Therefore, the first susceptor 230 or the first susceptor support 220 may be horizontally adjusted by moving the corresponding position on each corner up and down.

The horizontal detector 500 detects a horizontal state of the first susceptor 230 or the first susceptor support 220. The horizontal sensing unit 500 may be installed at the lower ends of the chamber modules 200 and 300 to determine whether the susceptor 230 or 330 or the susceptor support units 220 and 320 are horizontal. The horizontal detection unit 500 uses a technique for detecting horizontality by laser irradiation, a level for detecting an inclination of a predetermined horizontal plane, or detects the height of the vertical on each corner to determine the height of four corners, thereby leveling the horizontal. Sensing techniques can be applied. The horizontal sensing unit 500 may determine whether the susceptor 230 or 330 or the susceptor support units 220 and 320 are horizontal to output to a predetermined display or transmit data regarding horizontality to a controller (not shown).

As described above, an embodiment of the present invention has been described by showing a structure in which two chamber modules 200 and 300 of the lower chamber module 200 and the upper chamber module 300 are stacked, but this will correspond to one example. It is also possible to apply a laminated structure of three or more stages. Along with this, one embodiment of the present invention discloses a configuration for horizontally adjusting the first susceptor 230 or the first susceptor support 220 of the lower chamber module 200, which is the upper chamber module 300 The second susceptor 330 or the second susceptor support 320 may be extended to the configuration to adjust horizontally.

Figure 3 shows a perspective view of the lower chamber module in the substrate processing apparatus according to an embodiment of the present invention. Referring to FIG. 3, the lower chamber module 200 includes a first upper support plate 210 attached to the process chamber 100 and a first susceptor 230 disposed at a predetermined distance from the first upper support plate 210. It may include a first susceptor support 220 and a plurality of lower connecting shafts (241, 242, 243, 244) for supporting.

The first upper support plate 210 is fixed to the inner wall of the process chamber 100 and serves as a predetermined upper plate. The first susceptor support 220 supports the susceptor 230 and serves as a predetermined lower plate.

The first upper support plate 210 and the first susceptor support 220 are spaced apart at predetermined intervals through the plurality of lower connection shafts 241, 242, 243, and 244. In principle, the plurality of lower connection shafts 241, 242, 243, and 244 are coupled to the first upper support plate 210 to allow relative movement, and are integrally coupled to the first susceptor support 220 to lift or lower. Can descend.

For example, when the plurality of lower connecting shafts 241, 242, 243, 244 or the first susceptor support 220 are elevated by the driving unit 400, the first upper support plate 210 may be a process chamber 100. In the state fixed to the inner wall of the), the plurality of lower connecting shafts (241, 242, 243, 244) and the first susceptor support 220 is elevated, the first upper support plate 210 and the first susceptor support 220 The distance between 2 h is reduced.

This may be performed until a predetermined interval is reached between the substrate on the susceptor 230 and the jet plate 215 for a predetermined process performed in the lower chamber module 200. In other words, the first susceptor support 220 may be raised or lowered until the gap between the first upper support plate 210 and the first susceptor support 220 becomes a predetermined predetermined distance, thereby adjusting appropriately.

Meanwhile, in the predetermined process chamber 100, the chamber modules 200 and 300 may be stacked in multiple stages. By such multi-stage stacking, the horizontal degree of each chamber module 200 or 300 may vary. Thus, in one embodiment of the present invention, by introducing the height adjustment unit 400 it is possible to adjust the horizontal of each chamber module (200, 300).

4 is a view schematically illustrating an operation of a substrate processing apparatus according to an embodiment of the present invention. Referring to FIG. 4, the susceptors 230 and 330 of the lower chamber module 200 and the upper chamber module 300 are raised by the driving unit 450, respectively.

As shown in FIG. 2, the susceptors 230 and 330 of the lower chamber module 200 and the upper chamber module 300 are lowered to the maximum so that the gap between the upper support plates 210 and 310 and the susceptor supports 220 and 320 is increased. In a state of maximum (2h), the lower connecting shaft 241, 242 of the lower chamber module 200 by the drive unit 450 is lifted. The first susceptor support 220 which is integrally connected to the lower connection shafts 241 and 242 is elevated by the lifting of the lower connection shafts 241 and 242, and the first susceptor 230 supporting the substrate is also lifted together. do.

Therefore, as shown in FIG. 4, the interval between the first upper support plate 210 and the first susceptor support 220 is narrowed as the first susceptor support 220 is elevated. This may be done until a distance h that matches the process conditions of the substrate is reached in a given process.

In addition, as the lower connection shafts 241 and 242 rise, the upper connection shafts 341 and 342 contacted with the lower connection shafts 241 and 242 may be raised and lowered. Accordingly, as the lower connecting shafts 241 and 242 are raised and lowered at the same time, the upper connecting shafts 341 and 342 are raised and lowered, so that the second susceptor support 320 is elevated and the second susceptor 330 supporting the substrate. ) Is also elevated.

As described above, by stacking the chamber modules (200, 300) in multiple stages, each connecting shaft (241, 242, 341, 342) to be in contact with each other, the lower connecting shaft (241, 242) is raised or By lowering, the susceptor support parts 220 and 320 of the respective chamber modules 200 and 300 positioned at the uppermost end are lowered or lowered to lower and lower the substrates and the ejection plates 215 and 315 in the respective chamber modules 200 and 300. The gap between them can be adjusted accordingly.

Meanwhile, when the connecting shafts 241, 242, 341, and 342 are integrally coupled with the susceptor support units 220 and 320, the connecting shafts 241 and 242 of the lower chamber module 200 may be the upper chamber module 300. It may be installed in contact with the susceptor support 320 of the). In this case, when the connecting shafts 241 and 242 of the lower chamber module 200 are raised and lowered, the susceptor support part 320 of the upper chamber module 300 is elevated, thereby connecting the upper chamber module 300. The shafts 341 and 342 can move up and down. By raising and lowering the connecting shafts 341 and 342, the susceptor support of another upper chamber module may be elevated. As such, in a multi-stacked structure, the susceptor support is lifted to appropriately adjust the distance between the substrate and the jet plates 215 and 315 in each chamber module 200 and 300 to improve film uniformity or yield on the substrate. Can improve.

5A and 5B are schematic cross-sectional views of a height adjusting unit in a substrate processing apparatus according to an embodiment of the present invention.

First, referring to FIG. 5A, the height adjusting part 400 may be configured as a mechanism for moving by a predetermined screw coupling vertically on the second driving member 430. The height adjuster 400 is positioned in contact with the lower connecting shaft 241 and is attached to the height adjusting end 410 and the height adjusting end 410 integrally supporting the lower connecting shaft 241 to move up and down. It may be composed of a stage 420. On the other hand, the second drive member 430 for supporting the height adjusting part 400 is a bar portion (425) having a bar-shaped transmission shaft 427 and a screw groove formed in the interior of the transmission shaft 427 It may include. Therefore, the micro-movement end 420 may be provided with a thread corresponding thereto to move up and down while rotating along the screw groove of the groove 425. In other words, the first susceptor may be rotated in a clockwise or counterclockwise direction by the user or a predetermined driving means by using the information on whether the level is detected by the horizontal sensing unit 500. The support 220 may be adjusted horizontally.

On the other hand, when the horizontal adjustment is made by the rotation of the height adjustment stage 410 may further include a rotation prevention unit for preventing the rotation of the height adjustment stage 410 to maintain a horizontal state. For example, the height adjusting end 410 is provided with a predetermined protrusion 412 on the edge, the predetermined anti-rotation pin 415 is fitted into the groove 413 between the protrusion 412, the height adjusting end. Rotation of 410 can be prevented. The anti-rotation pin 415 may be moved by a predetermined hinge coupling on the lower connection shaft 241 or on the locking end 246 of the lower connection shaft 241. Here, the locking end 246 is formed at the end of the lower connecting shaft 241 so that the first susceptor support 220 is not separated.

Referring to FIG. 5B, the height adjusting part 400 may be inserted into and coupled to the groove 575 having the screw groove of the lower connecting shaft 241. Accordingly, the height adjusting end 410 of the height adjusting unit 400 is in contact with the second driving member 430, so that the second driving member 430 supports the lower chamber module 200. The lower connection shaft 241 may be finely lowered and lowered by obtaining a judgment or information about whether the level is horizontal and rotating the height adjusting end 410 clockwise or counterclockwise by a user or a predetermined driving means. By such fine movement, the first susceptor support 220 may be horizontally adjusted.

6A and 6B are schematic cross-sectional views of a height adjusting unit in a substrate processing apparatus according to another exemplary embodiment of the present invention.

Referring to FIG. 6A, the height adjusting unit 510 may be coupled to the thread 423 on the outer circumferential surface of the second driving member 430 to perform a predetermined vertical movement. The height adjusting part 510 forms a height adjusting end having a predetermined screw groove 515 corresponding to the inside thereof, so that the height adjusting part 510 can move up and down while rotating along the screw thread 423.

Referring to FIG. 6B, the height adjusting unit 520 may be coupled to the thread 585 on the outer circumferential surface of the lower connecting shaft 410 to perform a predetermined vertical movement. The height adjusting part 520 is provided with a predetermined screw groove 520 therein, and can make a fine vertical movement by a rotational movement.

As described above, in one embodiment of the present invention, in order to adjust the horizontal in each chamber module (200, 300) of the laminated structure, by introducing a configuration of a predetermined height adjusting unit 400, each chamber module (200, 300) Fine adjustment of the height of the susceptor (230, 330) or susceptor support (220, 320) of the) can easily adjust the horizontal of each chamber module (200, 300).

Although embodiments of the present invention have been described above with reference to the accompanying drawings, those skilled in the art to which the present invention pertains have various permutations, modifications, and modifications without departing from the spirit or essential features of the present invention. It is to be understood that modifications may be made and other embodiments may be embodied. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

1 is a schematic cross-sectional view of a general substrate processing apparatus.

2 is a schematic cross-sectional view of a substrate processing apparatus according to an embodiment of the present invention.

3 is a perspective view of a lower chamber module in the substrate processing apparatus according to the embodiment of the present invention.

4 is a view schematically illustrating an operation of a substrate processing apparatus according to an embodiment of the present invention.

5A and 5B are schematic cross-sectional views of a height adjusting unit in a substrate processing apparatus according to an embodiment of the present invention.

6A and 6B are schematic cross-sectional views of a height adjusting unit in a substrate processing apparatus according to another exemplary embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

100: process chamber 120: engaging portion

125: chamber projection 200: lower chamber module

210: first upper support plate 220: first susceptor support

230: first susceptor

241, 242, 243, 245: lower connecting shaft

245, 246: jammed end

300: upper chamber module 310: second upper support plate

320: second susceptor support 230: second susceptor

341, 342: upper connecting shaft

450: drive unit 401: drive motor

402: first drive member 430: second drive member

400: height adjustment unit 410: height adjustment end

420: fine moving end 415: anti-rotation pin

425: thread groove 427: transmission shaft

Claims (7)

A process chamber providing a space in which the process is performed; A lower chamber module positioned at a lower end of the process chamber and performing a predetermined unit process; An upper chamber module stacked on top of the lower chamber module; A driving unit for elevating or lowering the second susceptor of the upper chamber module by raising or lowering the first susceptor of the lower chamber module; And It includes a height adjusting unit for adjusting the height of the first susceptor to adjust the first susceptor horizontally, The driving unit lifts and lowers the second susceptor by elevating the lower connecting shaft of the lower chamber module, thereby elevating the upper connecting shaft of the upper chamber module in contact with the lower connecting shaft, The height adjustment unit is formed on the upper end of the transmission shaft for supporting the lower connection shaft or the lower connection shaft in contact with the lower connecting shaft, the height adjusting end is moved up and down through a predetermined screw coupling; And a rotation preventing unit configured to fix the height adjusting end by preventing rotation of the height adjusting end. The method of claim 1, And mounting the first upper support plate of the lower chamber module and the second upper support plate of the upper chamber module on inner walls of the process chamber, respectively. delete The method of claim 1, The transmission shaft includes a groove portion formed with a predetermined screw groove inside the upper end of the shaft, And the height adjusting part is formed integrally with the height adjusting end and further includes a fine moving end having a corresponding thread inserted into the screw groove. The method of claim 1, The transmission shaft includes a predetermined thread outside the top of the shaft, The height adjusting end is provided with a screw groove corresponding to the screw thread to move up and down by rotation. delete The method of claim 1, And a horizontal sensing unit configured to sense the horizontality of the first susceptor or the second susceptor.

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