KR101069385B1 - Apparatus for processing substrates - Google Patents

Abstract

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus capable of processing a plurality of substrates in one process chamber. One aspect of the substrate processing apparatus of the present invention is a process chamber providing a space in which a process is performed, a first chamber module positioned at a lower end of the process chamber and performing a predetermined unit process, and a first stacked on an upper portion of the first chamber module. And a driving unit for elevating or lowering the second susceptor of the second chamber module by raising or lowering the second chamber module and the first susceptor of the first chamber module.

Chamber Module, Stacked Structure, Drawer Type

Description

Apparatus for processing substrates

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus capable of processing a plurality of substrates in one process chamber.

Recently, information processing devices have been rapidly developed to have various types of functions and faster information processing speeds. This information processing apparatus has a display device for displaying the operated information. Until now, a cathode ray tube monitor has been mainly used as a display device, but recently, with the rapid development of semiconductor technology, the use of a flat display device that is light and occupies a small space is rapidly increasing.

In addition, in general, a semiconductor device uses a deposition process that can form a thin film on a semiconductor substrate, a pattern of forming a pattern on the surface of the thin film on the semiconductor substrate by using a pattern of a mask or a reticle. It is prepared by repeatedly performing a lithography process, an etching process for selectively removing the thin film using a reaction gas or a chemical solution along the pattern of the surface of the thin film.

In addition, recently, research on new energy sources to replace fossil energy due to depletion of fossil energy and global climate environment has been conducted, and among these, solar modules manufactured by applying a semiconductor manufacturing process or a flat panel display manufacturing process. The study of the device is progressing rapidly in recent years. Therefore, in order to mass produce and arrange a photovoltaic module device that performs photovoltaic power generation in a wide range of areas, an apparatus for dramatically improving the processing speed of a substrate is required.

Therefore, in the above semiconductor manufacturing process, flat panel display manufacturing process, or solar module manufacturing process, it is necessary to improve the processing speed of the substrate in a predetermined process chamber in which various processes are performed. However, no new progress has been made in research or development from a new perspective of attempting to process large-scale substrates.

An object of the present invention is to provide a substrate processing apparatus having a plurality of modules in a process chamber to play a plurality of chambers.

Another object of the present invention is to provide a substrate processing apparatus in which a plurality of modules are formed in a prefabricated laminated structure in a predetermined process chamber, thereby enabling efficient operation of the process chamber.

Problems of the present invention are not limited to the above-mentioned objects, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

In order to solve the above problems, an aspect of the substrate processing apparatus of the present invention comprises a process chamber for providing a space in which the process is performed; A first chamber module positioned at a lower end of the process chamber to perform a predetermined unit process; A second chamber module stacked on top of the first chamber module; And a driving unit that lifts or lowers the second susceptor of the second chamber module as the first susceptor of the first chamber module is lifted or lowered.

According to one embodiment of the present invention, a plurality of modules may be provided in a process chamber to process a plurality of substrates at once.

In addition, by stacking and expanding a plurality of modules in a predetermined process chamber, the process chamber can be efficiently operated.

The effects of the present invention are not limited to the above-mentioned effects, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

Specific details of other embodiments are included in the detailed description and the drawings. Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various different forms, and only the embodiments make the disclosure of the present invention complete, and the general knowledge in the art to which the present invention belongs. It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

When an element is referred to as being "connected to" or "coupled to" with another element, it may be directly connected to or coupled with another element or through another element in between. This includes all cases. On the other hand, when one device is referred to as "directly connected to" or "directly coupled to" with another device indicates that no other device is intervened. Like reference numerals refer to like elements throughout. “And / or” includes each and all combinations of one or more of the items mentioned.

Although the first, second, etc. are used to describe various elements, components and / or sections, these elements, components and / or sections are of course not limited by these terms. These terms are only used to distinguish one element, component or section from another element, component or section. Therefore, the first device, the first component, or the first section mentioned below may be a second device, a second component, or a second section within the technical spirit of the present invention.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. As used herein, “comprises” and / or “comprising” refers to the presence of one or more other components, steps, operations and / or elements. Or does not exclude additions.

Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used in a sense that can be commonly understood by those skilled in the art. In addition, the terms defined in the commonly used dictionaries are not ideally or excessively interpreted unless they are specifically defined clearly.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic cross-sectional view of a general substrate processing apparatus. Referring to FIG. 1, a general substrate processing apparatus includes a process chamber 10 providing a space where a predetermined process is performed, a susceptor 20 on which a substrate is seated, a shower head 30 spraying process gas, and a process gas. It may include a spray plate 40 for dispersing.

In order to fit the process gap, which is a distance between the injection plate 40 for seating the substrate W and spraying the process gas and the substrate W, a driving means 50 for vertically raising and lowering the susceptor 20 is required. Due to the central axis 25 of the susceptor 20, it is not easy to apply a multi-stage stacking structure that simultaneously processes a plurality of substrates.

2 is a schematic cross-sectional view of a substrate processing apparatus according to an embodiment of the present invention. 2, a substrate processing apparatus according to an embodiment of the present invention may include a process chamber 100, a first chamber module 200, a second chamber module 300, and a driver 400.

The process chamber 100 provides a space in which a process of the substrate processing apparatus is performed. The process chamber 100 may include a plurality of chamber modules 200 and 300 having a stacked structure. The plurality of chamber modules 200 and 300 may be disposed in the process chamber 100 at predetermined intervals. The process chamber 100 may include various mechanical devices and electronic devices for controlling, such as transferring or supporting a substrate while providing a space for performing a process.

The process chamber 100 may include a locking part 120 to which the first chamber module 200 and the second chamber module 300 to be described later are mounted. The catching part 120 is disposed horizontally on the inner wall of the process chamber 100, and serves to allow the first chamber module 200 and the second chamber module 300 to be described later to be seated on the inner wall. The locking part 120 may include a groove or a protrusion 125 so that the first chamber module 200 and the second chamber module 300 are seated and fixed.

The first chamber module 200 supports a first upper support plate 210 attached to the process chamber 100 and a first susceptor 230 disposed at a predetermined distance from the first upper support plate 210. The susceptor support part 220 and a plurality of first connecting shafts 241 and 242 may be included.

The first upper support plate 210 is fixed to the inner wall of the process chamber 100 or seated on the locking portion 120 of the process chamber 100. The first upper support plate 210 is a part fixed in the first chamber module 200, and the first upper support plate 210 and the first susceptor 230 are raised or lowered by the first susceptor support 220. The spacing between them can be widened or narrowed. Meanwhile, the first upper support plate 210 may include a gas path (not shown) for providing a predetermined process gas and a spray plate 215 connected to the gas path to disperse the process gas.

The first susceptor support 220 supports the first susceptor 230 and may be coupled to the first connection shafts 241 and 242 to be described later. The edges of the first upper support plate 210 and the first susceptor support 220 may include a plurality of holes. For example, the first connecting shafts 241 and 242 penetrate the rectangular corner portions, and may include a predetermined hole that is a passage that is moved. Meanwhile, the first susceptor support 220 may have a plate shape for supporting the first susceptor 230 or a bar shape for supporting the first susceptor 230. Alternatively, the first susceptor support 220 may be integrally coupled with the first susceptor 230. For example, when the first susceptor support 220 has a bar shape, the lower end of the first susceptor 230 is supported at regular intervals, and both ends of the first connecting shaft 241 are supported. , 242 may include a predetermined hole that is a passage through which the 242 moves.

The first susceptor 230 generally provides a space in which the substrate is seated. The first susceptor 230 may include a heating means (not shown) in which a heating wire, a gas flow path, an induction coil, and the like are disposed to transfer predetermined heat to the back surface of the substrate, and heat the same to a predetermined temperature. In addition, it may include a predetermined adsorption means (not shown) or an electrostatic chuck for adsorbing the substrate. Meanwhile, the first susceptor 230 may be integrally formed with the first susceptor support 220, and in this case, the first susceptor support 220 and the first susceptor 230 may be collectively referred to as “first”. 1 susceptor "or" first susceptor support ".

The first connecting shafts 241 and 242 serve to couple the first upper support plate 210 and the first susceptor support 220. The first connecting shafts 241 and 242 are coupled through a predetermined hole in the edge of the first upper support plate 210 and the first susceptor support 220, and the first connecting shafts 241 and 242 are connected to the first upper end. The support plate 210 may not be integrally attached and may move up and down relatively. Meanwhile, the first connecting shafts 241 and 242 may be integrally attached to the first susceptor support 220 or may not be attached thereto. At the ends of the first connecting shafts 241 and 242, locking ends 245 and 246 in the form of bolts, rivets and nuts having a predetermined contact cross-sectional area are formed to form a first upper support plate 210 and a first susceptor supporter ( 220 may not be separated from the shaft of the first connecting shaft (241, 242).

The second chamber module 300 supports a second upper support plate 310 attached to the process chamber 100 and a second susceptor 330 disposed at a predetermined distance from the second upper support plate 310. It may include a susceptor support 320 and a plurality of second connecting shafts (341, 342). On the other hand, the second chamber module 300 in the configuration, it may be made of the same configuration as the first chamber module 200.

However, the second chamber module 300 may be disposed in a structure in which the second chamber module 300 directly contacts the first chamber module 200 or is stacked with a predetermined interval therebetween. Therefore, each of the upper support plates 210 and 310 of the first chamber module 200 and the second chamber module 300 is seated and fixed to the inner wall of the process chamber 100, so that the first chamber module 200 and the second chamber module 200 are fixed. The chamber module 300 may be arranged in a stacked structure. In addition, the first chamber module 200 and the second chamber module 300 may be seated on the inner wall of the process chamber 100 in a receivable state, thereby easily assembling or expanding each chamber module 200 and 300. You can also

Due to the stacking structure as described above, the second connecting shafts 341 and 342 are also raised or lowered together with the lifting or lowering of the first connecting shafts 241 and 242 to thereby raise the second susceptor support 320. It can raise or lower. This operation will be described in more detail later.

The driving unit 400 lifts or lowers the first connecting shafts 241 and 242 of the first chamber module 200 or lifts or lowers the first susceptor support 220 of the first chamber module 200. Play a role. The driving unit 400 raises or lowers the first connecting shafts 241 and 242 or the first susceptor support 220 to primarily raise or lower the first susceptor 230. Along with this, the second connecting shafts 341 and 342, which are connected to and contact with the axes perpendicular to the first connecting shafts 241 and 242, are also raised or lowered together, so that the second susceptor support 320 The second susceptor 330 may be raised or lowered.

The driving unit 400 is connected to the driving motor 410 for providing a predetermined driving force, the first driving member 420 and the first driving member 420 for transmitting the driving force, and the first connection shafts 241 and 242. It may include a second driving member 430 in contact with the first susceptor support 220 to transfer the driving force. For example, the driving motor 410 may rotate to induce a lifting or lowering movement of the first driving member 420 by screwing to convert a predetermined rotational movement into a linear movement. Alternatively, the cylinder type may be lifted or lowered by directly contacting the first connecting shafts 241 and 242 or the first susceptor support 220. However, the driving unit 400 is only one embodiment, and the first connecting shaft by the other driving means (not shown) that can be applied by those skilled in the art of the present invention. 241 and 242 or the first susceptor support 220 may be raised and lowered.

According to an embodiment of the present invention as described above, by stacking the first chamber module 200 and the second chamber module 300, the first connecting shaft 241, 242 or the first driving module 200 As the first susceptor support 220 is lifted or lowered, the second connecting shafts 341 and 342 or the first susceptor support 320 of the second driving module 200 may be lifted or lowered. As such, the susceptors 230 and 330 of the respective chamber modules 200 and 300 stacked in multiple stages by one driving unit 400 are moved to be spaced from the injection plates 215 and 315 to which the process gas is injected. Can be adjusted. Meanwhile, in an embodiment of the present invention, a structure in which two chamber modules of the first chamber module 200 and the second chamber module 300 are stacked is illustrated and described. However, this is only an example. It is also possible to apply the above laminated structure.

3 is a perspective view of a first chamber module in a substrate processing apparatus according to an embodiment of the present invention. Referring to FIG. 3, the first chamber module 200 may include a first susceptor disposed at a predetermined distance from the first upper support plate 210 and the first upper support plate 210 attached to the process chamber 100. The first susceptor support 220 supporting the 230 and the plurality of first connecting shafts 241, 242, 243, and 244 may be included.

The first upper support plate 210 is fixed to the inner wall of the process chamber 100 and serves as a predetermined upper plate. The first susceptor support 220 supports the susceptor 230 and serves as a predetermined lower plate.

The first upper support plate 210 and the first susceptor support 220 are spaced apart at predetermined intervals through the plurality of first connecting shafts 241, 242, 243, and 244. In principle, the plurality of first connecting shafts 241, 242, 243, and 244 are coupled to the first upper support plate 210 so as to allow relative movement, and are integrally coupled to the first susceptor support 220 to lift or lower. Can descend.

For example, when the plurality of first connecting shafts 241, 242, 243, and 244 or the first susceptor support 220 are elevated by the driving unit 400, the first upper support plate 210 may be a process chamber ( The first upper support plate 210 and the first susceptor support while the plurality of first connecting shafts 241, 242, 243, 244 and the first susceptor support 220 are elevated while being fixed to the inner wall of the 100. The interval 2h between the 220 is reduced.

This may be performed until a predetermined interval is reached between the substrate on the susceptor 230 and the jet plate 215 for a predetermined process performed in the first chamber module 200. In other words, the first susceptor support 220 may be raised or lowered until the gap between the first upper support plate 210 and the first susceptor support 220 becomes a predetermined predetermined distance, thereby adjusting appropriately.

Meanwhile, in the predetermined process chamber 100, the chamber modules 200 and 300 may be stacked in multiple stages. As already described above with respect to the second chamber module 300 stacked on top of the first chamber module 200 in Figure 2, a detailed description thereof will be omitted.

4 is a view schematically illustrating an operation of a substrate processing apparatus according to an embodiment of the present invention. Referring to FIG. 4, the susceptors 230 and 330 of the first chamber module 200 and the second chamber module 300 are raised by the driving unit 400, respectively.

As shown in FIG. 2, the susceptors 230 and 330 of the first chamber module 200 and the second chamber module 300 are lowered to the maximum so that between the upper support plates 210 and 310 and the susceptor supports 220 and 320. In the state where the interval is maximum (2h), the first connecting shaft 241, 242 of the first chamber module 200 is lifted by the drive unit 400. The first susceptor support 220 which is integrally connected to the first connection shafts 241 and 242 by the lifting and lowering of the first connection shafts 241 and 242 is lifted, and the first susceptor 230 that supports the substrate is also lifted. Are elevated together.

Therefore, as shown in FIG. 4, the interval between the first upper support plate 210 and the first susceptor support 220 is narrowed as the first susceptor support 220 is elevated. This may be done until a distance h that matches the process conditions of the substrate is reached in a given process.

In addition, as the first connection shafts 241 and 242 rise, the second connection shafts 341 and 342 contacting the first connection shafts 241 and 242 may be raised or lowered. Accordingly, as the first connecting shafts 241 and 242 are raised and lowered at the same time, the second connecting shafts 341 and 342 are raised and lowered, so that the second susceptor support 320 is lifted and the second susceptor supporting the substrate. 330 is also elevated together.

As described above, by stacking the chamber modules (200, 300) in multiple stages, each connecting shaft (241, 242, 341, 342) to be in contact with each other, the lower connecting shaft (241, 242) is raised or By lowering, the susceptor support portions 220 and 320 of the respective chamber modules 200 and 300 positioned at the uppermost end are lowered or lowered, so that the gap between the substrate and the jet plate in each chamber module 200 and 300 is appropriately adjusted. I can regulate it.

Meanwhile, when the connecting shafts 241, 242, 341, and 342 are integrally coupled with the susceptor support units 220 and 320, the connecting shafts 241 and 242 of the lower chamber module 200 may be the upper chamber module 300. It may be installed in contact with the susceptor support 320 of the). In this case, when the connecting shafts 241 and 242 of the lower chamber module 200 are raised and lowered, the susceptor support part 320 of the upper chamber module 300 is elevated, thereby connecting the upper chamber module 300. The shafts 341 and 342 can move up and down. By raising and lowering the connecting shafts 341 and 342, the susceptor support of another upper chamber module may be elevated. As described above, in the multi-stacked structure, the susceptor support is lifted and the gap between the substrate and the jet plate in each chamber module 200 and 300 is appropriately adjusted to improve film uniformity or yield on the substrate. .

5 is a schematic diagram of disposing each chamber module 200 in a substrate processing apparatus according to an embodiment of the present invention. Referring to FIG. 5, while moving each chamber module 200 horizontally from the side of the process chamber 100, the upper support plate 210 of the chamber module 200 stops 120 on the inner wall of the process chamber 100. By placing it on the), the chamber module 200 may be seated in the process chamber 100.

In order to facilitate coupling of the upper support plate 210 of the chamber module 200 and the locking portion 120 of the process chamber 100, a coupling technique of grooves and protrusions may be applied. For example, the locking portion 120 may have a predetermined protrusion shape 125, and the upper support plate 210 may have a groove shape 215 to be coupled to each other by fitting. In addition, by applying a predetermined bearing (not shown) in order to facilitate the coupling can be easily coupled to the engaging portion 120 of the chamber module 200 in the process chamber (100).

As described above, according to an embodiment of the present invention, by placing each chamber module 200 in the process chamber 100 in a multi-layered stacked structure, a chamber structure of a stacked structure capable of processing a plurality of substrates in the process chamber 100. It is possible to provide a substrate processing apparatus having a. In addition, by stacking and extending a plurality of modules in the process chamber, the substrate processing apparatus capable of processing a plurality of substrates can be easily expanded, and the substrate throughput can be significantly increased by processing a plurality of substrates at once.

Although embodiments of the present invention have been described above with reference to the accompanying drawings, those skilled in the art to which the present invention pertains have various permutations, modifications, and modifications without departing from the spirit or essential features of the present invention. It is to be understood that modifications may be made and other embodiments may be embodied. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

1 is a schematic cross-sectional view of a general substrate processing apparatus.

2 is a schematic cross-sectional view of a substrate processing apparatus according to an embodiment of the present invention.

3 is a perspective view of a first chamber module in a substrate processing apparatus according to an embodiment of the present invention.

4 is a view schematically illustrating an operation of a substrate processing apparatus according to an embodiment of the present invention.

5 is a schematic view of disposing each chamber module in a substrate processing apparatus according to an embodiment of the present invention;

<Explanation of symbols for the main parts of the drawings>

100: process chamber 120: engaging portion

125: turning

200: first chamber module 210: first upper support plate

220: first susceptor support 230: first susceptor

241, 242, 243, 245: first connecting shaft

245, 246: jammed end

300: second chamber module 310: second upper support plate

320: second susceptor support 230: second susceptor

341, 342: second connecting shaft

400: driving unit 410: driving motor

420: first drive member 420: second drive member

Claims (8)

A process chamber providing a space in which the process is performed; A first chamber module positioned at a lower end of the process chamber and including a first susceptor for performing a predetermined unit process and seating a first substrate; A second chamber module stacked on top of the first chamber module and including a second susceptor for seating a second substrate; And Including the driving unit for raising or lowering the second susceptor at the same time in accordance with the lifting or lowering the first susceptor, When lifting or lowering by the driving unit, the entirety of one surface of the first substrate is in close contact with the first susceptor, and the entirety of one surface of the second substrate is in close contact with the second susceptor. Processing unit. The method of claim 1, Fixing the first upper support plate of the first chamber module and the second upper support plate of the second chamber module to the inner wall of the process chamber, respectively, The driving unit lifts and lowers the second susceptor by elevating the first connecting shaft of the first chamber module and elevating the second connecting shaft of the second chamber module in contact with the first connecting shaft. Device. The method of claim 1, Fixing the first upper support plate of the first chamber module and the second upper support plate of the second chamber module to the inner wall of the process chamber, respectively, The driving unit raises and lowers the first susceptor support of the first chamber module, and lifts the first connection shaft of the first chamber module integrally coupled with the first susceptor support. And elevating the second susceptor by elevating the second connecting shaft of the second chamber module which is in contact with the shaft. The method of claim 1, The upper support plate of the first chamber module and the second chamber module is fixed to the inner wall of the process chamber, And the first chamber module and the second chamber module are stacked and arranged in a state capable of being accommodated in the process chamber. The method of claim 1, The process chamber includes a locking portion for allowing the first upper support plate of the first chamber module and the second upper support plate of the second chamber module to be seated on an inner wall of the process chamber, respectively. The locking portion includes a groove or a protrusion for fixing the first upper support plate and the second upper support plate. The method of claim 1, wherein the first chamber module A first upper support plate attached to the process chamber; A first susceptor supporter supporting the first susceptor disposed at a predetermined distance from the first upper support plate; And And a plurality of first connecting shafts fixedly attached to the first susceptor support and connecting the first upper support plate and the first susceptor support. The method of claim 6, wherein the second chamber module A second upper support plate attached to the process chamber; A second susceptor supporter supporting the second susceptor disposed at a predetermined distance from the second upper support plate; And And a plurality of second connecting shafts fixedly attached to the second susceptor support and connecting the second upper support plate and the second susceptor support. The method of claim 7, wherein And the first connecting shaft and the second connecting shaft are vertically standing in contact with each other, and a contact end having a predetermined cross-sectional area is formed at the contacting end.

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