CN210897241U - Horizontal adjustable mechanism suitable for multi-position jacking thimble - Google Patents
Horizontal adjustable mechanism suitable for multi-position jacking thimble Download PDFInfo
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- CN210897241U CN210897241U CN201922464820.7U CN201922464820U CN210897241U CN 210897241 U CN210897241 U CN 210897241U CN 201922464820 U CN201922464820 U CN 201922464820U CN 210897241 U CN210897241 U CN 210897241U
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Abstract
The utility model relates to a level adjustable mechanism suitable for multiposition jacking thimble belongs to the semiconductor device field. The utility model is suitable for a horizontal adjustable mechanism of a multi-position jacking thimble, a heating platform is arranged in the cavity, a thimble hole is arranged in the heating platform, and a top plate is arranged below the heating platform; the lower end of the hot table is connected with the jacking mechanism through a hot table corrugated pipe, and the bottom end of the hot table corrugated pipe is connected with the jacking mechanism through a flange; the jacking mechanism is used for controlling the heat bench to move up and down; a thimble is arranged in the thimble hole, the bottom end of the thimble is arranged on the top plate, a thimble corrugated pipe is arranged at the bottom end of the top plate, and the bottom end of the thimble corrugated pipe is connected with the air cylinder; and a horizontal adjusting mechanism is arranged between the bottom end of the ejector pin corrugated pipe and the driving end of the air cylinder. The utility model provides a through the relative levelness between thimble and the hot platform, can accurately keep same levelness, this structure provides convenience for the assembly, and is not high to the assembly requirement, can lightly loosely adorn and reach the service level requirement.
Description
Technical Field
The utility model relates to a level adjustable mechanism suitable for multiposition jacking thimble belongs to the semiconductor device field.
Background
The rapid development of science and technology, the importance of semiconductor industry is prominent today, the automation and requirements of semiconductors are higher and higher, a vacuum manipulator is used for conveying wafers in many devices in the semiconductor industry, and a mechanism matched with the manipulator conveying piece in vacuum is a thimble mechanism. The importance of which is self evident. Because the ejector pin mechanism is generally designed for a specific cavity structure and a specific equipment layout of a specific machine. The structure of the device is also diversified, and more or less various problems exist in application. The device is not changed greatly, and the trouble is not caused to the client.
For many old-fashioned thimble mechanisms, the general design structure is not simple, but the small problem is not few, for example, the assembly step is more complicated, still need the experience of assembly to adjust, the reassembling, the experience and the hands-on ability of comparison experimenter. For another example, the thimble mechanism is difficult to readjust after assembly, and the ideal use state of the thimble is difficult to achieve.
A old-fashioned thimble structure commonly used mainly includes that the actuating cylinder that drives of hot platform, roof, thimble, bellows, connecting plate, cylinder, thimble is independent with hot platform, and the cylinder can drive the thimble and rise or fall, and hot platform can rise or fall alone, and the thimble has the mushroom head, consequently rises when hot platform, and the thimble mushroom head can follow the hot platform and rise together to break away from the roof. After the hot platform falls down, when being in the accessible scope apart from the roof, the cylinder starts, and the roof rises during, just can push up the thimble by certain distance this moment. So that several thimbles are all higher than the heating table. The theoretical value is that three or four thimbles are all the same height. However, this is not ideal. Certain errors are inevitable in the assembly process or production process, and the structure is difficult to adjust the thimble. When the air cylinder is assembled, special attention is paid to certain things, the horizontal degree is guaranteed as far as possible, and meanwhile the air cylinder can smoothly ascend and descend.
SUMMERY OF THE UTILITY MODEL
The utility model provides a horizontal adjustable mechanism suitable for multiposition jacking thimble to above-mentioned problem.
The utility model adopts the following technical scheme:
the utility model discloses a horizontal adjustable mechanism suitable for multiposition jacking thimble, including cavity, hot platform, thimble, roof, thimble bellows, cylinder, bottom plate seat, hot platform bellows, climbing mechanism; a heating table is arranged in the cavity, a thimble hole is arranged in the heating table, and a top plate is arranged below the heating table; the lower end of the hot table is connected with the jacking mechanism through a hot table corrugated pipe, and the bottom end of the hot table corrugated pipe is connected with the jacking mechanism through a flange; the jacking mechanism is used for controlling the heat bench to move up and down; a thimble is arranged in the thimble hole, the bottom end of the thimble is arranged on the top plate, a thimble corrugated pipe is arranged at the bottom end of the top plate, and the bottom end of the thimble corrugated pipe is connected with the air cylinder; and a horizontal adjusting mechanism is arranged between the bottom end of the ejector pin corrugated pipe and the driving end of the air cylinder.
The horizontal adjusting mechanism suitable for the multi-position jacking thimble of the utility model comprises a flange plate, a fixing bolt, a jackscrew, a cylinder and a piston plate arranged at the driving end of the cylinder; the bottom end of the thimble corrugated pipe is provided with a flange plate, the flange plate is connected with the piston plate, and the flange plate and the piston plate are provided with matched screw holes and are fixed with each other through fixing bolts; the piston plate is also provided with a jackscrew hole and a jackscrew; the jackscrew is contradicted the piston board, and the levelness of the conflict altitude mixture control piston board of jackscrew.
The utility model discloses a horizontal adjustable mechanism suitable for multiposition jacking thimble, flange board and piston plate be platelike structure, the center department of flange board links to each other with the thimble bellows; and jackscrews are respectively arranged on two sides of the ejector pin corrugated pipe, and the inclination between the flange plate and the piston plate is adjusted until the flange plate is kept horizontal through the lifting of the jackscrews along jackscrew holes.
Level adjustable mechanism suitable for multiposition jacking thimble, the levelness of its roof and thimble is adjusted to the levelness through the flange board.
Advantageous effects
The utility model provides a level adjustable mechanism suitable for multiposition jacking thimble through the relative levelness between thimble and the hot platform, can accurately keep same levelness, and this structure provides convenience for the assembly, and is not high to the assembly requirement, can lightly loosely adorn and reach the service level requirement. And even if the workpiece is not leveled due to errors of assembling workpieces and the like, the level can be adjusted in time according to the jackscrew.
The utility model provides a level adjustable mechanism suitable for multiposition jacking thimble, thimble structure are fixed at the root of hot platform, and this thimble structure can follow hot platform and go up and down together, therefore no matter which position is gone up to hot platform, the relative position of thimble and hot platform is unchangeable, as long as thimble cylinder restarts to go up and down this moment, the thimble all will be ejecting.
The utility model provides a horizontal adjustable mechanism suitable for multiposition jacking thimble is applied to the CVD board, and the inside temperature of cavity is higher, and it can be very difficult directly to get manually to put the wafer, and burns easily. At the moment, the hot table is required to be lifted to a high position, and the ejector pins are used for ejecting the wafer, so that a convenient structure is provided for manually taking and placing the wafer.
Drawings
Fig. 1 is a schematic structural diagram of the present invention;
fig. 2 is a schematic sectional structure of the present invention;
FIG. 3 is a schematic structural view of the horizontal adjustment mechanism of the present invention;
fig. 4 is a schematic diagram illustrating the non-jacking state of the present invention;
fig. 5 is a schematic diagram of the jacking state of the present invention.
In the figure, 1 is a chamber, 2 is a hot table, 3 is an ejector pin, 4 is a top plate, 5 is an ejector pin bellows, 6 is a cylinder, 7 is a bottom plate seat, 8 is a hot table bellows, 9 is a jacking module, 51 is a bottom flange plate, 52 is a fixing bolt, 53 is a jackscrew, and 61 is a piston plate.
Detailed Description
In order to make the purpose and technical solution of the embodiments of the present invention clearer, the following description will clearly and completely describe the technical solution of the embodiments of the present invention by combining the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only some of the embodiments of the present invention, and not all of them. All other embodiments, which can be obtained by a person skilled in the art without any inventive work based on the described embodiments of the present invention, belong to the protection scope of the present invention.
As shown in fig. 1: a horizontal adjustable mechanism suitable for multi-position jacking thimbles comprises a cavity 1, a hot table 2, a thimble 3, a top plate 4, a thimble corrugated pipe 5, a cylinder 6, a bottom plate seat 7, a hot table corrugated pipe 8 and a jacking mechanism 9; the root of the hot platform 2 is fixed at the bottom end of the hot platform corrugated pipe 8, the upper end of the hot platform corrugated pipe 8 is fixed at the bottom of the cavity, and the hot platform corrugated pipe 8 has the telescopic performance. And has the function of isolating vacuum and atmosphere. Under the action of the lifting drive of the external jacking mechanism 9, the thermal platform 2 can be lifted up and down in the vacuum environment in the chamber 1. The bottom plate seat 7 is installed on the lower end flange of the hot table corrugated pipe 8, the air cylinder 6 is installed on the bottom plate seat 7, the ejector pin corrugated pipe 5 is installed on the piston expansion plate of the air cylinder 6, the top plate 4 is installed on the ejector pin corrugated pipe 5, and the ejector pins 3 are generally three or four and are directly placed in the ejector pin holes of the hot table 2. Since the cylinder 6 has two states as the driving source, it can be extended and contracted, and when the cylinder 6 is in the contracted state, the ejector pin 3 is in the falling state, that is, the ejector pin 3 is entirely fallen below the upper surface of the heat block 4. When the cylinder 6 is in an extended state, the piston plate of the cylinder 6 will lift the top plate to a certain height. The ejector pin 3 is lifted above the surface of the heat stage 1.
As shown in fig. 2: because the cylinder 6 of the driving top plate 4 is arranged at the bottom end of the heat table corrugated pipe 8, and the heat table 2 is also arranged at the bottom end of the heat table corrugated pipe, namely the heat table 2 and the top plate 4 are positioned on the same reference surface, and in addition, each part is designed to be precisely machined and accurately positioned, the levelness of the heat table 2 and the levelness of the top plate 4 are easy to keep consistent, and a good levelness can be met basically without adjustment.
As shown in fig. 3: when the mechanism is leveled, the cavity 1 is installed well, and the levelness is adjusted well. Then, the hot plate 2 is installed, and the level of the hot plate 2 is adjusted to be parallel to the level of the chamber 1 with reference to the level of the chamber 1. The mechanism can be adjusted more conveniently because the top plate 4 and the heat platform 2 are in the same level, after the adjustment is completed, the adjustment is basically not needed, even if the cavity is moved later or the levels of the cavity 1 and the heat platform 2 are adjusted slightly, only the cavity or the level of the heat platform 2 needs to be adjusted independently, and the relative level between the cavity and the heat platform cannot be changed. This brings about a lot of convenience in the maintenance of the equipment.
As shown in fig. 4: the thimble mechanism has a great advantage that the thimble 3 can be lifted at any position, that is, when the mechanism is applied to a low-end robot-free device, the convenience advantage is more prominent. Low end robot-less devices require opening the chamber and manually taking and placing the wafers, especially after the process is completed, the hot plate 2 is at a high temperature and the chamber 1 is deep enough to be difficult and dangerous to manually grasp to remove the wafers. Then, after the cavity is opened, the hot table 2 is lifted to the highest position allowed by the stroke, then the air cylinder 6 is lifted, at the moment, the ejector pin 3 is lifted by the top plate 4, the wafer is lifted by the ejector pin 3, so that the wafer is completely positioned outside the cavity 1, and the wafer lifted by the ejector pin 3 is easier to take down from the tweezers. The tablet taking is more convenient.
As shown in fig. 5: for the conventional equipment with a transmission cavity, the jacking of the thimble only needs to set the position where the transmission sheet is appointed to the height position, namely the position where the surface depth of the hot bench is c. At this time, the thimble 3 is lifted out to receive the wafer, the distance of the thimble from the hot stage is a, and the cylinder stroke is b. Obviously, the design should satisfy a < b. When the cavity needs to be opened and the tablet is manually taken. As shown, the thermal stage is based on the position where the depth of the surface of the chamber is c'. At this time, the thimble 3 is lifted out, the distance from the thimble to the heating table is a, that is, the height of the wafer from the heating table is a, and then the wafer is taken, so that the wafer is easy and safe.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered by the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (4)
1. The utility model provides a level adjustable mechanism suitable for multiposition jacking thimble which characterized in that: the device comprises a cavity, a hot table, an ejector pin, a top plate, an ejector pin corrugated pipe, an air cylinder, a bottom plate seat, a hot table corrugated pipe and a jacking mechanism; a heating table is arranged in the cavity, a thimble hole is arranged in the heating table, and a top plate is arranged below the heating table; the lower end of the hot table is connected with the jacking mechanism through a hot table corrugated pipe, and the bottom end of the hot table corrugated pipe is connected with the jacking mechanism through a flange; the jacking mechanism is used for controlling the heat bench to move up and down; a thimble is arranged in the thimble hole, the bottom end of the thimble is arranged on the top plate, a thimble corrugated pipe is arranged at the bottom end of the top plate, and the bottom end of the thimble corrugated pipe is connected with the air cylinder; and a horizontal adjusting mechanism is arranged between the bottom end of the ejector pin corrugated pipe and the driving end of the air cylinder.
2. The horizontally adjustable mechanism for multi-position lift pins of claim 1 wherein: the horizontal adjusting mechanism comprises a flange plate, a fixing bolt, a jackscrew, an air cylinder and a piston plate arranged at the driving end of the air cylinder; the bottom end of the thimble corrugated pipe is provided with a flange plate, the flange plate is connected with the piston plate, and the flange plate and the piston plate are provided with matched screw holes and are fixed with each other through fixing bolts; the piston plate is also provided with a jackscrew hole and a jackscrew; the jackscrew is contradicted the piston board, and the levelness of the conflict altitude mixture control piston board of jackscrew.
3. The horizontally adjustable mechanism for multi-position lift pins of claim 2, further comprising: the flange plate and the piston plate are both of plate-shaped structures, and the center of the flange plate is connected with the ejector pin corrugated pipe; and jackscrews are respectively arranged on two sides of the ejector pin corrugated pipe, and the inclination between the flange plate and the piston plate is adjusted until the flange plate is kept horizontal through the lifting of the jackscrews along jackscrew holes.
4. The horizontally adjustable mechanism for multi-position lift pins of claim 2, further comprising: the levelness of the top plate and the ejector pin of the flange plate is adjusted through the levelness of the flange plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922464820.7U CN210897241U (en) | 2019-12-31 | 2019-12-31 | Horizontal adjustable mechanism suitable for multi-position jacking thimble |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922464820.7U CN210897241U (en) | 2019-12-31 | 2019-12-31 | Horizontal adjustable mechanism suitable for multi-position jacking thimble |
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| Publication Number | Publication Date |
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| CN210897241U true CN210897241U (en) | 2020-06-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201922464820.7U Active CN210897241U (en) | 2019-12-31 | 2019-12-31 | Horizontal adjustable mechanism suitable for multi-position jacking thimble |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112951689A (en) * | 2021-02-09 | 2021-06-11 | 北京北方华创微电子装备有限公司 | Semiconductor process equipment and cover opening mechanism thereof |
| CN113321154A (en) * | 2021-01-25 | 2021-08-31 | 北京北方华创微电子装备有限公司 | Lifting driving mechanism and semiconductor processing equipment |
| CN113903703A (en) * | 2021-12-10 | 2022-01-07 | 上海陛通半导体能源科技股份有限公司 | Horizontal adjusting device of thimble mechanism |
| CN115547918A (en) * | 2022-11-30 | 2022-12-30 | 深圳市新凯来技术有限公司 | Supporting mechanism and pre-cleaning equipment |
-
2019
- 2019-12-31 CN CN201922464820.7U patent/CN210897241U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113321154A (en) * | 2021-01-25 | 2021-08-31 | 北京北方华创微电子装备有限公司 | Lifting driving mechanism and semiconductor processing equipment |
| CN112951689A (en) * | 2021-02-09 | 2021-06-11 | 北京北方华创微电子装备有限公司 | Semiconductor process equipment and cover opening mechanism thereof |
| CN112951689B (en) * | 2021-02-09 | 2024-03-26 | 北京北方华创微电子装备有限公司 | Semiconductor process equipment and cover opening mechanism thereof |
| CN113903703A (en) * | 2021-12-10 | 2022-01-07 | 上海陛通半导体能源科技股份有限公司 | Horizontal adjusting device of thimble mechanism |
| CN115547918A (en) * | 2022-11-30 | 2022-12-30 | 深圳市新凯来技术有限公司 | Supporting mechanism and pre-cleaning equipment |
| CN115547918B (en) * | 2022-11-30 | 2023-03-10 | 深圳市新凯来技术有限公司 | Supporting mechanism and pre-cleaning equipment |
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Address after: 221300 No.8, Liaohe West Road, Pizhou Economic Development Zone, Xuzhou City, Jiangsu Province Patentee after: Jiangsu Luwen Instrument Co.,Ltd. Address before: 221300 No.8, Liaohe West Road, Pizhou Economic Development Zone, Xuzhou City, Jiangsu Province Patentee before: JIANGSU LEUVEN INSTRUMMENTS Co.,Ltd. |