CN218631942U - Heating device for be used for wafer charging tray - Google Patents
Heating device for be used for wafer charging tray Download PDFInfo
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- CN218631942U CN218631942U CN202222819486.4U CN202222819486U CN218631942U CN 218631942 U CN218631942 U CN 218631942U CN 202222819486 U CN202222819486 U CN 202222819486U CN 218631942 U CN218631942 U CN 218631942U
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- heating plate
- plate
- slide rail
- charging tray
- heating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model discloses a heating device for be used for wafer charging tray, including the mounting panel, fixed mounting has horizontal slide rail on the mounting panel, installs the heating plate through the slider on the horizontal slide rail, and the center of heating plate is provided with the positioning mechanism that the distance equals at the circumferencial direction, and one side of heating plate is provided with vertical slide rail, and positioning mechanism and the equal fixed mounting of vertical slide rail install material handling mechanism through the slider on the vertical slide rail on the mounting panel, and the bottom of heating plate is provided with the climbing mechanism who is used for the gentle charging tray that falls of jacking. The beneficial effects of the utility model are that, the top that the through-hole on the last support material pole of climbing mechanism rises to the heating plate from the heating plate is with charging tray jack-up, and materials handling mechanism shifts out directly over the heating plate, and climbing mechanism control holds in the palm the material pole and slowly drops the charging tray to the charging tray and place completely on the heating plate, and the heating plate of controlling again is transferred on transverse sliding rail for the charging tray can also heat when being transported on the heating plate, has promoted the efficiency of wafer processing greatly.
Description
Technical Field
The utility model relates to a semiconductor production and processing technology field, especially a heating device for be used for wafer charging tray.
Background
Semiconductor technology has developed according to the moore's theorem, with integrated circuits having higher and lower densities and smaller dimensions. All integrated circuits can be processed at high temperature in the processing process, wafers are heated in a standing mode at present, and the next processing procedure can be carried out only after the wafers are heated, so that the working efficiency is reduced, the product processing time is greatly prolonged, and a mechanism capable of carrying out heating treatment in the carrying process is needed.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the problem, a heating device for wafer charging tray has been designed.
The technical scheme of the utility model be, a heating device for be used for wafer charging tray, including the mounting panel, fixed mounting has horizontal slide rail on the mounting panel, install the heating plate through the slider on the horizontal slide rail, the center of heating plate is provided with the positioning mechanism that the distance equals at the circumferencial direction, one side of heating plate is provided with vertical slide rail, positioning mechanism with the equal fixed mounting of vertical slide rail is in on the mounting panel, install material handling mechanism through the slider on the vertical slide rail, the bottom of heating plate is provided with the climbing mechanism who is used for the gentle charging tray that falls of jacking.
As to the utility model discloses a further explanation, heating plate inside is provided with the pore that is used for placing the water-cooled tube, the central point of heating plate puts and is provided with the through-hole that climbing mechanism is used for passing.
As right the utility model discloses a further explanation, climbing mechanism is including the connecting piece that is the character cut in bas-relief shape, bottom fixed mounting in the middle of the connecting piece has jacking motor, the eminence at connecting piece both ends is passed through the connecting rod and is connected on the bottom plate of heating plate, jacking motor passes the one end of connecting piece and is connected with the driving plate through the telescopic link, bottom fixed mounting in the middle of the connecting piece has the axle sleeve, be provided with in the axle sleeve directional axle with the lower panel fixed connection of driving plate, fixed mounting has the support material pole on the top panel of driving plate, the support material pole passes the through-hole of heating plate.
As right the utility model discloses a further explanation, positioning mechanism includes fixed mounting and is in T shape setting element on the mounting panel, fixed mounting has the propulsion subassembly on the T shape setting element, fixed mounting has the push pedal on the propulsion subassembly.
As right the utility model discloses a further explanation, material handling mechanism includes and installs through the slider locating plate on the vertical slide rail, run through connection has the material pole on the locating plate, the one end sliding connection of material pole has outer flitch of lifting, the other end of material pole lifts the flitch in one side sliding connection who is close to the locating plate.
As right the utility model discloses a further explanation, interior material lifting plate with lift the distance between the material lifting plate outward and adjust according to the diameter size of charging tray.
Its beneficial effects lie in, the utility model discloses in be provided with transverse sliding rail in the below of heating plate, carry the heating plate directly over through material handling mechanism, the last support material pole of climbing mechanism from the through-hole jacking on the heating plate to the top of heating plate, with the slight jack-up of charging tray, material handling mechanism shifts out directly over the heating plate, climbing mechanism control holds in the palm the material pole and slowly descends the charging tray, place on the heating plate completely until the charging tray, positioning mechanism carries out the center clamp to the charging tray and fixes a position, the heating plate of controlling again is transferred on transverse sliding rail, make the charging tray can also heat when being transported on the heating plate, the efficiency of wafer processing has been promoted greatly.
Drawings
Fig. 1 is a schematic structural diagram of the present invention;
FIG. 2 is a schematic view of the present invention with the mounting plate and material handling mechanism removed;
fig. 3 is a schematic structural view of another viewing angle of the present invention;
in the figure, 1, mounting plate; 2. a transverse slide rail; 3. heating the plate; 4. a positioning mechanism; 5. a vertical slide rail; 6. a material handling mechanism; 7. a jacking mechanism; 8. a duct; 9. a through hole; 10. a connecting member; 11. a jacking motor; 12. a telescopic rod; 13. a drive plate; 14. a shaft sleeve; 15. an orientation axis; 16. a material supporting rod; 17. a T-shaped positioning member; 18. a propulsion assembly; 19. pushing the plate; 20. positioning a plate; 21. a material rod; 22. lifting the material plate; 23. an inner material lifting plate.
Detailed Description
The utility model discloses it is next described specifically to combine the attached drawing to be right the utility model discloses, as shown in fig. 1-3, a heating device for wafer charging tray, including mounting panel 1, fixed mounting has horizontal slide rail 2 on the mounting panel 1, installs heating plate 3 through the slider on the horizontal slide rail 2, and heating plate 3's center is provided with the positioning mechanism 4 that the distance equals in the circumferencial direction, and one side of heating plate is provided with vertical slide rail 5, and positioning mechanism 4 and the equal fixed mounting of vertical slide rail 5 are on mounting panel 1, install material handling mechanism 6 through the slider on the vertical slide rail 5, and heating plate 3's bottom is provided with climbing mechanism 7 that is used for the gentle charging tray that falls of jacking. Carry the charging tray to heating plate 3 through material handling mechanism 6 directly over, the top of heating plate 3 is jacked from through-hole 9 on the heating plate 3 to the material pole 16 of holding in the palm on the climbing mechanism 7, slightly jack-up the charging tray, material handling mechanism 6 shifts out directly over heating plate 3, climbing mechanism 7 control holds in the palm material pole 16 with the charging tray slow decline, until the charging tray is placed on heating plate 3 completely, positioning mechanism 4 carries out the center clamping location to the charging tray, the heating plate 3 of controlling again is transferred on horizontal slide rail 2, make the charging tray can also cool down when being transported on heating plate 3, the efficiency of wafer processing has been promoted greatly.
The inside pore 8 that is used for placing the water-cooled tube that is provided with of heating plate 3, wherein, the water-cooled tube is used for the feeding tray to cool down, the central point of heating plate 3 puts and is provided with the through-hole 9 that climbing mechanism 7 is used for passing, climbing mechanism 7 is including being the connecting piece 10 of character cut in bas-relief shape, bottom fixed mounting in the middle of the connecting piece 10 has jacking motor 11, the eminence at connecting piece 10 both ends is connected on the bottom plate of heating plate 3 through the connecting rod, jacking motor 11 passes the one end of connecting piece 10 and is connected with driving plate 13 through telescopic link 12, bottom fixed mounting in the middle of the connecting piece 10 has axle sleeve 14, be provided with the lower panel fixed connection of directional axle 15 and driving plate 13 in the axle sleeve 14, fixed mounting has support material pole 16 on the upper panel of driving plate 13, support material pole 16 passes the through-hole 9 of heating plate 3. The jacking motor 11 drives the telescopic shaft to drive the transmission plate 13 to move up and down, the directional shaft 15 ensures that the transmission plate 13 moves directionally in the shaft sleeve 14, and the connecting piece 10 is fixedly connected to the bottom of the heating plate 3, so that the lifting of the transmission plate 13 can drive the material supporting rod 2116 fixedly connected to the upper end of the transmission plate to pass through the through hole 9 to synchronously move up and down, and further, the purpose of driving the material tray to synchronously lift is achieved.
The positioning mechanism 4 comprises a T-shaped positioning part 17 fixedly arranged on the mounting plate 1, a pushing component 18 is fixedly arranged on the T-shaped positioning part 17, a pushing plate 19 is fixedly arranged on the pushing component 18, and the pushing plate 19 is driven by the pushing component 18 to push and position a material tray carried to the upper end of the heating plate 3.
The material handling mechanism 6 comprises a positioning plate 20 fixedly mounted on the vertical sliding rail 5 through a sliding block, a material rod 21 is connected to the positioning plate 20 in a penetrating mode, one end of the material rod 21 is connected with an outer lifting plate 22 in a sliding mode, the other end of the material rod 21 is connected with an inner lifting plate 23 in a sliding mode, the other end of the material rod 21 is close to one side of the positioning plate 20, the distance between the inner lifting plate 23 and the outer lifting plate 22 is adjusted according to the diameter of a material disc, the material handling mechanism 6 carries a wafer processed at a high temperature to the position right above the heating disc 3 through the material disc, the jacking mechanism 7 jacks up the material disc through the material supporting rod 16, and the material handling mechanism 6 is moved away in an idle load mode.
The working principle is as follows: the material carrying mechanism 6 carries the wafer processed at high temperature to the position right above the heating plate 3 through the material tray, the jacking motor 11 drives the telescopic shaft to drive the transmission plate 13 to move up and down, the directional shaft 15 ensures that the transmission plate 13 moves directionally in the shaft sleeve 14, and the connecting piece 10 is fixedly connected to the bottom of the heating plate 3, so that the transmission plate 13 can drive the material supporting rod 16 fixedly connected to the upper end of the transmission plate to pass through the through hole 9 to synchronously move up and down, and further the purpose of driving the material tray to synchronously move up and down is achieved, the jacking mechanism 7 jacks up the material tray through the material supporting rod 16, the material carrying mechanism 6 moves away in no-load, the jacking mechanism 7 slowly descends the material tray through the material supporting rod 16 and places the material tray on the heating plate 3, the positioning mechanism 4 drives the push plate 19 through the pushing assembly 18 to push and position the material tray carried to the upper end of the heating plate 3, the heating plate 3 is installed on the transverse sliding rail 2 and can be carried, the pore channels 8 for placing the heating pipe are arranged inside the heating plate 3, and the wafer on the material tray can be heated in the carrying process.
Above-mentioned technical scheme has only embodied the utility model discloses technical scheme's preferred technical scheme, some changes that this technical field's technical personnel probably made to some parts wherein have all embodied the utility model discloses a principle belongs to within the protection scope of the utility model.
Claims (5)
1. The utility model provides a heating device for be used for wafer charging tray, a serial communication port, including mounting panel (1), fixed mounting has horizontal slide rail (2) on mounting panel (1), install heating plate (3) through the slider on horizontal slide rail (2), the center of heating plate (3) is provided with positioning mechanism (4) that the distance equals at the circumferencial direction, one side of heating plate (3) is provided with vertical slide rail (5), positioning mechanism (4) with vertical slide rail (5) equal fixed mounting be in on mounting panel (1), install material handling mechanism (6) through the slider on vertical slide rail (5), the bottom of heating plate (3) is provided with climbing mechanism (7) that are used for the gentle charging tray that falls of jacking.
2. A heating device for wafer trays according to claim 1, characterized in that the heating plate (3) is internally provided with a hole (8) for placing a water cooling pipe, and the heating plate (3) is provided with a through hole (9) for passing through by a jacking mechanism (7) at a central position.
3. The heating device for wafer charging tray of claim 2, characterized in that, climbing mechanism (7) is including connecting piece (10) that is the character cut in bas-relief, bottom fixed mounting in the middle of connecting piece (10) has jacking motor (11), the eminence at connecting piece (10) both ends is passed through the connecting rod and is connected on the bottom plate of heating plate (3), the one end that jacking motor (11) passed connecting piece (10) is connected with driving plate (13) through telescopic link (12), bottom fixed mounting in the middle of connecting piece (10) has axle sleeve (14), be provided with in axle sleeve (14) directional axle (15) with the lower panel fixed connection of driving plate (13), fixed mounting has material support pole (16) on the top panel of driving plate (13), material support pole (16) pass through-hole (9) of heating plate (3).
4. The heating device for the wafer tray as claimed in claim 1, wherein the positioning mechanism (4) comprises a T-shaped positioning member (17) fixedly mounted on the mounting plate (1), a pushing assembly (18) is fixedly mounted on the T-shaped positioning member (17), and a pushing plate (19) is fixedly mounted on the pushing assembly (18).
5. A heating device for wafer trays according to claim 1, wherein the material handling mechanism (6) comprises a positioning plate (20) mounted on the vertical slide rail (5) through a slide block, a material rod (21) is connected to the positioning plate (20) in a penetrating manner, one end of the material rod (21) is connected with an outer material lifting plate (22) in a sliding manner, and the other end of the material rod (21) is connected with an inner material lifting plate (23) in a sliding manner at a side close to the positioning plate (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222819486.4U CN218631942U (en) | 2022-10-24 | 2022-10-24 | Heating device for be used for wafer charging tray |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222819486.4U CN218631942U (en) | 2022-10-24 | 2022-10-24 | Heating device for be used for wafer charging tray |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218631942U true CN218631942U (en) | 2023-03-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222819486.4U Active CN218631942U (en) | 2022-10-24 | 2022-10-24 | Heating device for be used for wafer charging tray |
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| Country | Link |
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| CN (1) | CN218631942U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116504686A (en) * | 2023-06-28 | 2023-07-28 | 北京中科科美科技股份有限公司 | Semiconductor heating plate based on liquid uniform temperature control |
-
2022
- 2022-10-24 CN CN202222819486.4U patent/CN218631942U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116504686A (en) * | 2023-06-28 | 2023-07-28 | 北京中科科美科技股份有限公司 | Semiconductor heating plate based on liquid uniform temperature control |
| CN116504686B (en) * | 2023-06-28 | 2023-10-20 | 北京中科科美科技股份有限公司 | Semiconductor heating plate based on liquid uniform temperature control |
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