CN212247206U - Jacking device and material processing equipment - Google Patents

Abstract

The utility model provides a jacking device and material processing equipment, wherein, the jacking device includes: a housing, a chamber being provided in the housing; the material conveying assembly is movably arranged on the shell and is used for conveying materials; the support plate is arranged in the cavity and used for bearing materials, and a plurality of through holes are formed in the support plate; the heater is used for heating the support plate, the plurality of jacking stand columns are arranged in a lifting mode, each jacking stand column corresponds to one through hole, the jacking stand columns are used for penetrating through the through holes, materials are taken down from the material conveying assembly and conveyed to the support plate, or the materials are conveyed to the material conveying assembly from the support plate. Through the technical scheme of the utility model, the condition of hot when having avoided the support plate effectively reduces the waste of the energy, has promoted support plate, material temperature's homogeneity, is favorable to promoting the technology treatment effect of material.

Description

Jacking device and material processing equipment

Technical Field

The utility model relates to a silicon chip processing equipment technical field particularly, relates to a jacking device and a material processing equipment.

Background

In a conventional plate-type PECVD (Plasma Enhanced Chemical Vapor Deposition) apparatus, a silicon wafer to be processed is placed on a carrier plate, and the carrier plate is transported to a process chamber by a roller for processing. In order to achieve a better process effect, the silicon wafer needs to be heated before being subjected to process treatment in the process chamber, and the better the temperature uniformity of the surface of the silicon wafer is, the better the process effect is.

Because the silicon chip is put on the support plate, the silicon chip needs to be heated, the support plate flows around through the rollers, and the carrier plate is hot and cold, so that a part of energy can be wasted, the temperature is uneven, and the process effect is influenced.

SUMMERY OF THE UTILITY MODEL

The present invention aims at least solving one of the technical problems existing in the prior art or the related art.

In view of this, an object of the present invention is to provide a jacking device.

Another object of the utility model is to provide a material processing equipment.

In order to achieve the above object, the present invention provides a jacking device, including: a housing, a chamber being provided in the housing; the material conveying assembly is movably arranged on the shell and is used for conveying materials; the support plate is arranged in the cavity and used for bearing materials, and a plurality of through holes are formed in the support plate; the heater is used for heating the support plate, the plurality of jacking stand columns are arranged in a lifting mode, each jacking stand column corresponds to one through hole, the jacking stand columns are used for penetrating through the through holes, materials are taken down from the material conveying assembly and conveyed to the support plate, or the materials are conveyed to the material conveying assembly from the support plate.

In this technical scheme, through setting up the support plate in the cavity, and adopt fortune material subassembly and jacking stand to mutually support and put the material, make the support plate need not take the material to circulate everywhere, but can stay in the cavity always, heated by the heater rather than being connected, thereby can keep certain temperature comparatively steadily, avoid the time-cooling hot state because the circulation leads to, the waste of the energy has been reduced, and because heated by the heater in the cavity for a long time, make the temperature on the support plate stable and even, be favorable to promoting the homogeneity of material temperature, thereby promote the technological effect of material processing.

In the above technical solution, the material transporting assembly includes at least one set of hangers, and the hangers are used for transporting the material into or out of the chamber.

In the technical scheme, the hanging rack comprises a plurality of hooks, each hook is provided with a supporting part extending out of the adjacent hook, the adjacent supporting parts are used for supporting materials, and the adjacent supporting parts are arranged at intervals.

In any one of the above technical solutions, the material transporting assembly further includes: and each group of transmission devices is connected with one group of hanging racks and is used for transmitting the hanging racks.

In any one of the above technical solutions, the jacking device further includes: the through hole is a step hole and is arranged on the step of the step hole, or the through hole is a conical hole and is arranged in the conical hole; the lifting block is used for being lifted by the lifting upright column and bearing materials.

In the above technical scheme, when the lifting block is located in the through hole, the lifting block is flush with the carrier plate.

In any one of the above technical solutions, the jacking device further includes: the jacking bracket is arranged at the bottom of the shell; the two sides of the jacking bracket are respectively provided with a guide rail; the first lifting assembly is arranged on the guide rail in a lifting manner, is also connected with the jacking upright post and drives the jacking upright post to lift; and the second lifting assembly is connected with the heater and used for driving the heater to lift.

In the above technical solution, the first lifting assembly includes: the first sliding block is connected with the guide rail in a sliding manner; the upright post lifting flat plate is connected with the first sliding block; the upright post jacking platform is connected with the upright post lifting flat plate, and the jacking upright post is arranged on the upright post jacking platform; the first screw nut is fixed on the upright post lifting flat plate; the first lead screw is bolted with the first lead screw nut; the first supporting seat is arranged on the jacking bracket; the first lead screw fixing end supporting bearing seat is arranged on the first supporting seat; the first screw rod floating end supporting bearing seat is arranged on the jacking bracket, and the first screw rod is rotatably arranged on the first screw rod fixed end supporting bearing seat and the first screw rod floating end supporting bearing seat; the first motor and the first coupling, first lead screw links to each other with first motor through first coupling, and first motor is used for driving first lead screw rotatory.

In the above technical solution, the second lifting assembly includes: the second sliding block is connected with the guide rail in a sliding manner; the heater lifting flat plate is connected with the second sliding block; the heater jacking platform is connected with the heater lifting flat plate, and the heater is connected with the heater jacking platform; the second screw nut is fixed on the heater lifting flat plate; the second lead screw is bolted with the second lead screw nut; the second supporting seat is arranged on the jacking bracket; the fixed end of the second lead screw supports the bearing seat and is arranged on the second supporting seat; the second screw rod floating end supporting bearing seat is arranged on the jacking bracket, and the second screw rod can be rotatably arranged on the second screw rod fixed end supporting bearing seat and the second screw rod floating end supporting bearing seat; the second motor and the second coupling, the second lead screw passes through the second coupling and links to each other with the second motor, and the second motor is used for driving the second lead screw rotatory.

The utility model discloses technical scheme of second aspect provides a material processing equipment, include: a film coating device; the jacking device in any one of the above technical schemes in the first aspect is connected with the coating device.

In the technical scheme, by adopting the jacking device of any one of the technical schemes, all beneficial effects of the technical scheme are achieved, and further description is omitted; the jacking device is connected with the coating device, so that the materials can be directly sent into the coating device for process treatment after being preheated, and the process treatment effect is improved.

Additional aspects and advantages of the invention will be set forth in part in the description which follows, or may be learned by practice of the invention.

Drawings

Fig. 1 is a schematic cross-sectional structural view of a jacking device according to an embodiment of the present invention;

fig. 2 is a schematic cross-sectional structural view of a jacking device according to another embodiment of the present invention;

fig. 3 is a schematic cross-sectional view of a jacking device according to another embodiment of the present invention;

fig. 4 is a schematic cross-sectional view of a jacking device according to another embodiment of the present invention;

fig. 5 is a schematic cross-sectional view of a jacking device according to another embodiment of the present invention;

fig. 6 is a schematic cross-sectional view of a jacking device according to another embodiment of the present invention;

fig. 7 is a schematic cross-sectional view of a jacking device according to another embodiment of the present invention;

fig. 8 is a schematic cross-sectional view of a jacking device according to another embodiment of the present invention;

FIG. 9 is an enlarged partial view of the portion A of FIG. 1;

fig. 10 is a partially enlarged schematic view of a portion B in fig. 3.

Wherein, the correspondence between the reference numbers and the component names in fig. 1 to 10 is:

1 shell, 2 jacking supports, 3 guide rails, 4 hangers, 40 transmission devices, 5 hooks, 50 supporting parts, 7 lifting blocks, 70 jacking upright columns, 700 upright column jacking platforms, 702 upright column lifting flat plates, 704 first lead screw nuts, 706 first lead screws, 708 first lead screw floating end supporting bearing seats, 710 first lead screw fixed end supporting bearing seats, 712 first supporting seats, 714 first couplings, 716 first motors, 718 first sliding blocks, 8 carrier plates, 80 heaters, 800 heater jacking platforms, 802 heater lifting flat plates, 804 second lead screw nuts, 806 second lead screws, 808 second lead screw floating end supporting bearing seats, 810 second lead screw fixed end supporting bearing seats, 812 second supporting seats, 814 second couplings, 816 second motors, 818 second sliding blocks, 82 through holes, 9 corrugated pipes and 10 silicon wafers.

Detailed Description

In order that the above objects, features and advantages of the present invention can be more clearly understood, a more particular description of the invention will be rendered by reference to the appended drawings, which are illustrated in the appended drawings. It should be noted that the embodiments and features of the embodiments of the present invention may be combined with each other without conflict.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited by the specific embodiments disclosed below.

Some embodiments of the present invention are described below with reference to fig. 1 to 10.

Before the embodiments of the present invention are described with reference to the drawings, it should be noted that the material may be a silicon wafer, or may be other materials that need to maintain a stable temperature and cleanliness, such as various materials or workpieces that need to be electroplated or hot-dipped, specifically, such as screws, mirrors, ornaments, etc.; correspondingly, the material processing equipment is not limited to silicon wafer processing equipment, and can be any other equipment for film coating, electroplating and hot dipping.

In the following examples, silicon wafers and silicon wafer processing equipment are exemplified.

As shown in fig. 1 to 10, the jacking device according to an embodiment of the present invention is used for silicon wafer processing equipment, and includes: the device comprises a shell 1, wherein a cavity is arranged in the shell 1; the material conveying assembly is movably arranged on the shell 1 and is used for conveying the silicon wafers 10; a carrier plate 8 disposed in the chamber, wherein the carrier plate 8 is used for carrying the silicon wafer 10, and as shown in fig. 3 and 10, a plurality of through holes 82 are formed in the carrier plate 8; the heater 80 is connected with the support plate 8, the heater 80 is used for heating the support plate 8, the plurality of jacking columns 70 are arranged in a lifting manner, each jacking column 70 is arranged corresponding to one through hole 82, wherein the jacking columns 70 are used for penetrating through the through holes 82, taking down the silicon wafers 10 from the material conveying assembly and conveying the silicon wafers onto the support plate 8, or conveying the silicon wafers 10 from the support plate 8 to the material conveying assembly.

In this embodiment, through setting up the support plate 8 in the cavity, and adopt fortune material subassembly and jacking stand 70 to mutually support and get and put silicon chip 10, make the support plate 8 need not take silicon chip 10 to circulate everywhere at silicon chip processing equipment, but can stay in the cavity always, heated by the heater 80 who is connected with it, thereby can keep certain temperature comparatively steadily, avoid the hot state of time-cooling time that leads to because the circulation, the waste of the energy has been reduced, and because heated by heater 80 in the cavity for a long time, make the temperature on the support plate 8 stable and even, be favorable to promoting the homogeneity of silicon chip 10 temperature, thereby promote the technological effect of silicon chip 10 processing.

Specifically, the carrier plate 8 is arranged in the chamber instead of being used for carrying the silicon wafers 10 to flow around, so that a relatively closed environment is provided for the carrier plate 8, heat loss on the carrier plate 8 is reduced, and energy is saved; the heater 80 is connected with the carrier plate 8, so that the carrier plate 8 can be heated conveniently, the stability and uniformity of the temperature of the carrier plate 8 can be kept, and the silicon wafer 10 can be heated after the carrier plate 8 carries the silicon wafer 10, so as to improve the process treatment effect of the silicon wafer 10; the silicon wafers 10 are transported by adopting the material transporting assembly, the silicon wafers 10 can be transported between different process sections, and the material transporting assembly is not required to be heated, so that the waste of energy is reduced; through set up the through-hole 82 on support plate 8 to set up the jacking stand 70 that corresponds with through-hole 82, be convenient for through the lift of jacking stand 70, take off silicon chip 10 from fortune material subassembly, put and heat on support plate 8, perhaps will heat the silicon chip 10 of accomplishing and ejecting from support plate 8, send to fortune material subassembly on, can realize like this that silicon chip 10 is got and is put, the automation of carrying, and because jacking stand 70 can go up and down, consequently after placing silicon chip 10 on support plate 8, jacking stand 70 can descend and leave the heating position, avoid unnecessary heating, thereby further saved the energy.

In the above embodiment, the heater 80 is disposed at the bottom of the carrier plate 8 and is attached to the carrier plate 8, which is more beneficial to improve the heating effect; the jacking upright column 70 is arranged below the heater 80 and can pass through the through hole on the carrier plate 8 by lifting, and it can be understood that the heater 80 is correspondingly provided with a through hole to allow the jacking upright column 70 to pass through; the material handling assembly reciprocates above the carrier plate 8.

In the above-mentioned embodiment, the fortune material subassembly includes two sets of stores pylon 4, a set of stores pylon 4 is used for sending into the cavity with silicon chip 10, another group of stores pylon 4 is used for sending out the cavity with silicon chip 10, be convenient for distinguish the different processing technology flows of silicon chip 10 like this, a stores pylon 4 can be used for sending out the cavity after taking out silicon chip 10 from the upper process position promptly, and another stores pylon sends silicon chip 10 to the lower process position, the work of two sets of stores pylons is mutual noninterference, each plays its own role, be favorable to promoting smooth and easy degree and the streamlined machining efficiency of technology.

In some embodiments, the two sets of hangers 4 are arranged in a staggered manner to avoid interference.

As shown in fig. 1 and 9, in the above embodiment, the hanger 4 includes a plurality of hooks 5, each hook 5 is provided with a support portion 50 extending toward an adjacent hook 5, the adjacent support portions 50 are used for supporting the silicon wafer 10, and the adjacent support portions 50 are spaced apart from each other.

In this embodiment, the hanging rack 4 includes a plurality of hooks 5, each hook 5 is provided with a supporting portion 50 extending to an adjacent hook 5 so as to support the silicon wafer 10 in cooperation with the adjacent supporting portion 50, and the adjacent supporting portions 50 are arranged at intervals, as shown in fig. 2, after the hanging rack 4 on the upper layer transfers the silicon wafer 10 to the chamber, as shown in fig. 3 and 4, the lifting column 70 is lifted up to lift the silicon wafer 10 from the interval between the adjacent supporting portions 50, as shown in fig. 5, so that the silicon wafer 10 is separated from the hook 5, and then after the hanging rack 4 is moved away, as shown in fig. 6, the lifting column 70 is lowered to the support plate 8 so that the support plate 8 supports the silicon wafer 10, and at this time, the lifting column 70 is further lowered to be separated from the through hole 82, so that the silicon wafer 10 is completely supported; when the silicon wafer 10 needs to be sent out of the cavity, as shown in fig. 7, the lifting columns 70 can be lifted again to lift the silicon wafer 10 away from the carrier plate 8 and continue to rise, after another hanger 4, that is, the hanger 4 located at the lower layer is in place, the other hanger 4 is moved to the top of the lifting columns 70, and each lifting column 70 is located between the hooks 5, as shown in fig. 8, the lifting columns 70 can be lowered, so that the silicon wafer 10 is supported by the adjacent supporting part 50 on the hanger 4 at the lower layer and is transmitted to the next process by the hanger 4 at the lower layer for process treatment, and at this time, as the lifting columns 70 are already lowered, the interference with the supports of the hanger 4 at the lower layer cannot occur; in the above process, the carrier plate 8 can be continuously heated by the heating plate, so that a uniform and stable temperature can be maintained, thereby facilitating to improve the temperature uniformity and stability of the silicon wafer 10.

In any of the above embodiments, the material handling assembly further comprises: each group of transmission devices 40 is connected with one group of hanging racks 4 and is used for transmitting the hanging racks 4 connected with the transmission devices, so that the two groups of hanging racks 4 are respectively provided with the corresponding transmission devices, and the convenience of silicon wafer 10 transmission and the flow operation efficiency are improved; in addition, the hanging rack 4 can be transported to avoid the carrier plate 8 by the transporting device 40, so as to provide a lifting space for the carrier plate 8.

As shown in fig. 9 and 10, in any one of the above embodiments, the jacking device further includes: the through hole 82 of the lifting block 7 is a step hole, the lifting block 7 is arranged on the step, and the lifting block 7 is used for being lifted by the lifting upright 70 and bearing the silicon wafer 10 or other materials.

In this embodiment, by arranging the lifting block 7 and being capable of being lifted by the lifting upright 70, the top of the lifting upright 70 can be arranged to be smaller, so that it can be freely lifted up and down in the through-hole 82 without interference, and at the same time, by setting the lifting block 7 in a shape with a large top and a small bottom, thereby not only being lifted by the lifting upright post 70, but also having enough bearing area to ensure that the silicon chip 10 is not easy to fall off, and the through hole 82 is a step hole, the lifting block 7 can be placed on the step for a long time to heat together with the carrier plate 8, the temperature is kept approximately the same as that of the carrier plate 8, so that after the silicon wafer 10 is lifted by the lift block 7 onto the carrier plate 8, uniform heating can be obtained as well, the lifting block 7 is small in size and separated from the lifting upright post 70, so that the required heat is less, and the heat is rarely transferred to other places, thereby being beneficial to saving energy; the lifting block 7 is arranged on the step and cannot fall from the through hole 82.

In other embodiments, the through hole 82 is a tapered or truncated cone, i.e., the cross-sectional area of the through hole 82 decreases from top to bottom, so that the lift block 7 does not fall out of the through hole 82.

In other embodiments, the through-hole 82 is a tapered hole and is also a stepped hole.

As shown in fig. 9, in the above embodiment, when the lifting block 7 is located in the through hole 82, it is flush with the carrier plate 8, so that when the silicon wafer 10 is placed on the carrier plate 8, each part is either in contact with the carrier plate 8 or in contact with the lifting block 7, that is, each part of the silicon wafer 10 can be uniformly heated, which is beneficial to improving the uniformity of the temperature on the silicon wafer 10, thereby improving the process treatment effect of the silicon wafer 10.

In any one of the above embodiments, the jacking device further includes: the jacking bracket 2 is arranged at the bottom of the shell 1; two sides of the guide rail 3 and the jacking bracket 2 are respectively provided with one guide rail 3; the first lifting assembly is arranged on the guide rail 3 in a lifting manner, is also connected with the jacking upright post 70 and drives the jacking upright post 70 to lift; and the second lifting assembly is arranged on the liftable ground guide rail 3 and is connected with the heater 80, and the second lifting assembly is used for driving the heater 80 to lift.

In this embodiment, the first lifting assembly is arranged to drive the lifting column 70 to lift, so that the silicon wafer 10 can be conveniently taken and placed on the carrier plate 8, and the automation of processing the silicon wafer 10 is realized; the second lifting assembly is arranged to drive the heater 80 to lift, so that the support plate 8 connected with the heater 80 can be driven to lift, the silicon wafer 10 can be heated in the cavity all the time, the process treatment effect of the support plate 8 in the process can be improved, and the support plate 8 of the jacking upright post 70 is provided with the respective lifting assembly due to the through hole 82 formed in the support plate 8, so that the lifting of the jacking upright post 70 and the lifting of the support plate 8 are not interfered with each other, and the convenience of production and processing can be improved; set up guide rail 3 on jacking support 2, be convenient for restrict first lifting unit and second lifting unit's lift orbit for when jacking stand 70 or support plate 8 go up and down, jacking stand 70 and through-hole 82 can both accurately counterpoint, avoid the dislocation and take place to interfere, arouse equipment trouble.

In the above embodiment, the first elevating assembly includes: the left side and the right side of the jacking bracket 2 are respectively provided with a first sliding block 718 which is respectively connected with the guide rail 3 in a sliding way; the upright lifting plate 702 is connected with the first sliding block 718; the upright post jacking platform 700 is connected with the upright post lifting flat plate 702, and the jacking upright post 70 is arranged on the upright post jacking platform 700; a first lead screw nut 704 fixed to the column lifting plate 702; a first lead screw 706 bolted to the first lead screw nut 704; the first supporting seat 712 is arranged on the jacking bracket 2; a first lead screw fixing end supporting bearing seat 710 arranged on the first supporting seat 712; the first lead screw floating end supporting bearing seat 708 is arranged on the jacking bracket 2, and the first lead screw 706 is rotatably arranged on the first lead screw fixed end supporting bearing seat 710 and the first lead screw floating end supporting bearing seat 708; a first motor 716 and a first coupling 714, the first lead screw 706 is connected with the first motor 716 through the first coupling 714, and the first motor 716 is used for driving the first lead screw 706 to rotate.

In this embodiment, a first lead screw nut 704 is fixed on the upright lifting plate 702, and a first lead screw 706 is rotatably disposed on the first lead screw fixed-end supporting bearing seat 710 and the first lead screw floating-end supporting bearing seat 708, so that when the first lead screw 706 rotates along with the driving of the first motor 716, the first lead screw nut 704 can perform a spiral ascending or descending motion along the first lead screw 706 and drive the upright lifting plate 702 connected thereto to ascend or descend, and the upright lifting platform 700 is connected with the upright lifting plate 702, the lifting upright 70 is disposed on the upright lifting platform 700, so that the lifting upright 70 can ascend or descend along with the rotation of the first motor 716, and the first lead screw nut 704 moves along the first lead screw 706, also moves linearly, and the upright lifting plate 702 is connected with the guide rail 3 through the first sliding blocks 718 on the left and right sides, therefore, under the dual limitation of the first lead screw 706 and the guide rail 3, the stability and reliability of the lifting track of the lifting upright 70 can be further ensured.

In other embodiments, the first lifting assembly comprises a rack and pinion assembly or a sprocket chain assembly or a pulley assembly.

In the above embodiment, the second elevating assembly includes: the second sliding blocks 818 are respectively arranged at the left side and the right side of the jacking bracket 2 and are respectively connected with the guide rail 3 in a sliding way; a heater lifter plate 802 coupled to the second slider 818; a heater lifting platform 800 connected with the heater lifting flat plate 802, and a heater 80 connected with the heater lifting platform 800; a second lead screw nut 804 fixed on the heater lifting plate 802; a second lead screw 806 bolted to the second lead screw nut 804; the second supporting seat 812 is arranged on the jacking bracket 2; the second lead screw fixing end supporting bearing seat 810 is arranged on the second supporting seat 812; the second lead screw floating end supporting bearing seat 808 is arranged on the jacking bracket 2, and the second lead screw 806 can be rotatably arranged on the second lead screw fixed end supporting bearing seat 810 and the second lead screw floating end supporting bearing seat 808; a second motor 816 and a second coupling 814, wherein the second lead screw 806 is connected with the second motor 816 through the second coupling 814, and the second motor 816 is used for driving the second lead screw 806 to rotate.

In this embodiment, the second lead screw nut 804 is fixed on the heater lifting plate 802, and the second lead screw 806 is rotatably disposed on the second lead screw fixed end supporting bearing seat 810 and the second lead screw floating end supporting bearing seat 808, so that when the second lead screw 806 is driven by the second motor 816 to rotate, the second lead screw nut 804 can perform a spiral ascending or descending motion along the second lead screw 806 and drive the heater lifting plate 802 connected thereto to ascend or descend, the heater lifting platform 800 is connected with the heater lifting plate 802, the heater 80 is connected with the heater lifting platform 800, so that the heater 80 can ascend or descend along with the rotation of the second motor 816, and the second lead screw nut 804 moves along the second lead screw 806, which is also a linear motion, and the heater lifting plate 802 is connected with the guide rail 3 through the second sliders 818 on the left side and the right side, this is beneficial to further ensure the stability and reliability of the lifting tracks of the heater 80 and the carrier plate 8 under the dual limitation of the second lead screw 806 and the guide rail 3.

In other embodiments, the second lifting assembly comprises a rack and pinion assembly or a sprocket chain assembly or a pulley assembly.

An embodiment of the second aspect of the present invention provides a silicon wafer processing apparatus, including: a film coating device; the jacking device of any one of the embodiments of the first aspect is connected with the film coating device.

In this embodiment, by using the jacking device of any one of the embodiments, all the beneficial effects of the embodiments are achieved, and are not described herein again; the jacking device is connected with the coating device, so that the silicon wafer 10 can be directly sent into the coating device for technical treatment after being preheated, and the technical treatment effect of the silicon wafer 10 is improved.

As described above, the material processing apparatus is not limited to the silicon wafer processing apparatus, and may be a screw processing apparatus, a decoration processing apparatus, or the like.

According to the utility model provides a jacking device of a specific embodiment, including casing 1, jacking support 2, guide rail 3, stores pylon 4, transmission device 40, lifting block 7, jacking stand 70, stand jacking platform 700, stand lift flat board 702, first lead screw nut 704, first lead screw 706, first lead screw floating end bearing frame 708, first lead screw fixed end bearing frame 710, first supporting seat 712, first shaft coupling 714, first motor 716, first slider 718, support plate 8, heater 80, heater jacking platform 800, heater lift flat board 802, second lead screw nut 804, second lead screw 806, second lead screw floating end bearing frame 808, second lead screw fixed end bearing frame 810, second supporting seat 812, second shaft coupling 814, second motor 816, second slider 818 and bellows 9.

Each transfer device 40 carries a set of hangers 4 in linear motion.

The jacking bracket 2 is arranged at the bottom of the shell 1, the left side and the right side of the jacking bracket 2 are respectively provided with a guide rail 3, the guide rail 3 on the left side is provided with two sliding blocks, namely a first sliding block 718 and a second sliding block 818, the two sliding blocks can slide along the guide rail 3, and the guide rail 3 on the right side is also provided with the first sliding block 718 and the second sliding block 818 and can slide along the guide rail 3. The first support base 712 and the second support base 812 are fixed on the jacking bracket 2. The first lead screw fixing end supporting bearing seat 710 is fixed on the first supporting seat 712, and the second lead screw fixing end supporting bearing seat 810 is fixed on the second supporting seat 812. The first lead screw 706 is supported and rotated up and down by a first lead screw floating end supporting bearing seat 708 and a first lead screw fixed end supporting bearing seat 710 respectively, and the second lead screw 806 is supported and rotated up and down by a second lead screw floating end supporting bearing seat 808 and a second lead screw fixed end supporting bearing seat 810 respectively.

The first lead screw nut 704 on the first lead screw 706 is connected with the upright lifting plate 702, the lower end of the first lead screw 706 is connected with the first coupling 714, the other end of the first coupling 714 is connected with the first motor 716, at this time, the power of the first motor 716 can be transmitted to the first lead screw 706, and the first lead screw nut 704 on the first lead screw 706 drives the upright lifting plate 702 to move up and down along the length direction of the guide rail 3. The column jacking platform 700 is fixed with the column lifting plate 702, and the column jacking platform 700 is provided with the jacking column 70, so that the rotation of the first motor 716 can drive the jacking column 70 to move up and down.

The second lead screw nut 804 on the second lead screw 806 is connected with the heater lifting plate 802, the lower end of the second lead screw 806 is connected with the second coupling 814, the other end of the second coupling 814 is connected with the second motor 816, at this time, the power of the second motor 816 can be transmitted to the second lead screw 806, and the second lead screw nut 804 on the second lead screw 806 drives the heater lifting plate 802 to move up and down along the length direction of the guide rail 3. The heater lifting platform 800 and the heater lifting plate 802 are fixed together, the heater 80 is arranged above the heater lifting platform 800, and the carrier plate 8 is mounted on the heater 80, so that the carrier plate 8 can be driven to move up and down by the rotation of the second motor 816.

If the silicon wafer 10 is to be processed, the following process is performed:

as shown in fig. 2, in a first step, the transfer device 40 transfers the rack 4, which hooks the unprocessed silicon wafer 10, to the process chamber, that is, transfers the upper rack 4 to the process chamber;

as shown in fig. 3 and 10, in the second step, the first motor 716 rotates to drive the column jacking platform 700 to move upwards, the jacking column 70 is also driven to move upwards, and during the upward movement of the jacking column 70, the upper part of the jacking column 70 first contacts with the lower part of the material lifting block 7, so as to separate the material lifting block 7 from the groove of the carrier plate 8, that is, from the through hole 82 of the carrier plate 8;

in the third step, as shown in fig. 4, the first motor 716 continues to rotate, the upper surface of the material lifting block 7 on the upper part of the lifting upright 70 contacts the silicon wafer 10, and the silicon wafer 10 is separated from the hanging rack 4;

as shown in fig. 5, in the fourth step, after the silicon wafer 10 is separated from the upper layer of the racks 4, the conveying device 40 conveys the upper layer of the racks 4 to the outside of the process chamber;

as shown in fig. 6, in the fifth step, after the hanger 4 is transferred to the separation process chamber, the first motor 716 reversely rotates to drive the column jacking platform 700 to move downward, the jacking column 70 is also driven to move downward, during the downward movement of the jacking column 70, the material lifting block 7 falls into the groove of the carrier plate 8, the upper surface of the material lifting block 7 is flush with the upper surface of the carrier plate 8, and the lower portion of the silicon wafer 10 is completely contacted with the upper portions of the carrier plate 8 and the lifting block 7. Since the carrier plate 8 and the lift block 7 are always above the heater 80 and are always in a heated state, the temperature uniformity of the carrier plate and the lift block is good, and the temperature uniformity of the silicon wafer 10 in contact with the carrier plate and the lift block is also good.

After the silicon wafer 10 is unloaded onto the carrier plate 8, the second motor 816 rotates to drive the heater 80 and the carrier plate 8 to rise to a specified height, and the process is performed.

If the cavity outlet operation is to be performed on the processed silicon wafer 10, the following process is performed:

as shown in fig. 7, in a first step, the first motor 716 rotates to drive the column jacking platform 700 to move upwards, the jacking column 70 is also driven to move upwards, and in the process of moving the jacking column 70 upwards, the upper part of the jacking column 70 contacts with the lower part of the lifting block 7 first, so that the lifting block 7 is separated from the groove of the carrier plate 8;

as shown in fig. 8, in the second step, another transfer device 40 transfers the lower rack 4 to the process chamber, that is, the transfer device 40 located below transfers the lower rack to the process chamber;

and thirdly, after the lower-layer hanger 4 is transmitted to the process chamber, the first motor 716 reversely rotates to drive the upright post jacking platform 700 to move downwards, the jacking upright post 70 can also be driven to move downwards, in the process of downward movement of the jacking upright post 70, the silicon wafer 10 can be hooked by the supporting part 50 on the lower-layer hanger 4, and the silicon wafer 10 falls into the clamping groove of the lower-layer hanger 4. The first motor 716 continues to rotate in the reverse direction until the lifting block 7 falls into the recess (through hole 82) of the carrier plate 8.

Above combine the figure to describe in detail the technical scheme of the utility model, through the technical scheme of the utility model, the condition of cold-time heat has been avoided the support plate effectively, has reduced the waste of the energy, has promoted support plate, material temperature's homogeneity, is favorable to promoting the technology treatment effect of material.

In the present application, the terms "first", "second", are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; the term "plurality" means two or more unless expressly limited otherwise. The terms "mounted," "connected," "fixed," and the like are to be construed broadly, and for example, "connected" may be a fixed connection, a removable connection, or an integral connection; "coupled" may be direct or indirect through an intermediary. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the description of the present invention, it should be understood that the terms "upper", "lower", "left", "right", "front", "back", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or unit indicated must have a specific direction, be constructed and operated in a specific orientation, and therefore, should not be construed as limiting the present invention.

In the description of the present specification, the description of the terms "one embodiment," "some embodiments," "specific embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A jacking device, comprising:

a housing having a chamber therein;

the material conveying assembly is movably arranged on the shell and is used for conveying materials;

the support plate is arranged in the cavity and used for bearing materials, and a plurality of through holes are formed in the support plate;

a heater connected with the carrier plate, the heater being used for heating the carrier plate,

the jacking upright columns are arranged in a liftable mode, each jacking upright column corresponds to one through hole, the jacking upright columns are used for penetrating through the through holes, the materials are taken down from the material conveying assembly and conveyed to the carrier plate, or the materials are conveyed to the material conveying assembly from the carrier plate.

2. Jacking device according to claim 1,

the material transporting assembly comprises at least one set of hangers, and the hangers are used for conveying the materials into or out of the chamber.

3. Jacking device according to claim 2,

the stores pylon includes a plurality of couples, every be equipped with on the couple to adjacent the supporting part that the couple stretches out, it is adjacent the supporting part is used for supporting the material, and adjacent the interval sets up between the supporting part.

4. Jacking device according to claim 2 or 3,

the fortune material subassembly still includes: and each group of transmission devices is connected with one group of hanging racks and is used for transmitting the hanging racks.

5. The jacking device of claim 1 or 2, further comprising:

the through hole is a step hole, the lifting block is arranged on the step of the step hole, or the through hole is a conical hole, and the lifting block is arranged in the conical hole;

the lifting block is used for being lifted by the lifting upright column and bearing the material.

6. Jacking device according to claim 5,

and when the lifting block is positioned in the through hole, the lifting block is parallel and level to the carrier plate.

7. The jacking device of claim 1 or 2, further comprising:

the jacking support is arranged at the bottom of the shell;

the two sides of the jacking bracket are respectively provided with one guide rail;

the first lifting assembly is arranged on the guide rail in a lifting manner, is also connected with the jacking upright post and drives the jacking upright post to lift;

the second lifting assembly is arranged on the guide rail in a lifting mode, the second lifting assembly is connected with the heater, and the second lifting assembly is used for driving the heater to lift.

8. Jacking device according to claim 7,

the first lifting assembly comprises: the first sliding block is connected with the guide rail in a sliding manner;

the upright post lifting flat plate is connected with the first sliding block;

the upright post jacking platform is connected with the upright post lifting flat plate, and the jacking upright post is arranged on the upright post jacking platform;

the first screw nut is fixed on the upright post lifting flat plate;

a first lead screw bolted to the first lead screw nut;

the first supporting seat is arranged on the jacking bracket;

the first lead screw fixing end supporting bearing seat is arranged on the first supporting seat;

the first screw rod floating end supporting bearing seat is arranged on the jacking bracket, and the first screw rod is rotatably arranged on the first screw rod fixed end supporting bearing seat and the first screw rod floating end supporting bearing seat;

the first motor and the first coupling, the first lead screw pass through the first coupling with the first motor links to each other, the first motor is used for the drive first lead screw is rotatory.

9. Jacking device according to claim 7,

the second lifting assembly comprises: the second sliding block is connected with the guide rail in a sliding manner;

the heater lifting flat plate is connected with the second sliding block;

the heater jacking platform is connected with the heater lifting flat plate, and the heater is connected with the heater jacking platform;

the second lead screw nut is fixed on the heater lifting flat plate;

a second lead screw bolted to the second lead screw nut;

the second supporting seat is arranged on the jacking bracket;

the second lead screw fixing end supports the bearing seat and is arranged on the second supporting seat;

the second screw rod floating end supporting bearing seat is arranged on the jacking bracket, and the second screw rod can be rotatably arranged on the second screw rod fixed end supporting bearing seat and the second screw rod floating end supporting bearing seat;

the second motor and the second coupling, the second lead screw passes through the second coupling with the second motor links to each other, the second motor is used for driving the second lead screw is rotatory.

10. A material processing apparatus, comprising:

a film coating device;

the jacking device of any one of claims 1 to 9, connected to said coating device.

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