KR101094233B1

KR101094233B1 - A ffc manufacture method using conductive paste

Info

Publication number: KR101094233B1
Application number: KR1020100086331A
Authority: KR
Inventors: 최용석
Original assignee: 최용석
Priority date: 2010-09-03
Filing date: 2010-09-03
Publication date: 2011-12-14

Abstract

The present invention relates to an FFC manufacturing method using a conductive paste, which reduces the manufacturing process and prevents defects caused by disconnection of the electrode in the manufacturing process by forming the electrode using the conductive paste without using the existing copper wire. It is to make it possible.
The manufacturing process of the present invention for realizing this, the preparing step of the lower film 10 of the synthetic resin material; (ST 1) the electrode printing step of forming the electrode 11 by printing a conductive paste on the upper surface of the lower film 10 And (ST 2) an upper film laminating step of laminating the upper film 20 of PET material on the upper surface of the lower film 10 on which the electrode 11 is printed; and (ST 3) the upper and lower parts of the laminating process. Cutting step of cutting the film (10,20) at regular intervals; (ST 4) characterized in that it comprises a.

Description

FFC manufacturing method using conductive paste {A FFC MANUFACTURE METHOD USING CONDUCTIVE PASTE}

The present invention relates to FFC (Flexibe Flat Cable), and more particularly to improve the reliability of the product by allowing the electrode of the FFC to be formed by a conductive paste printing method.

In general, almost all electronic products such as monitors, PCs, telephones, and the like are thinner for printed circuit boards (PCBs) having various circuit patterns and electrical signals between the PCBs or electrical signals between the PCBs and components. An FFC in the form of a plate is used to electrically connect between the PCB and the PCB or between the PCB and peripheral components.

1 and 2 show the structure of such a conventional FFC, the copper wire (3) forming the electrode portion between the lower film 1 and the upper film 2, the adhesive layer (1a, 2a) is applied on one surface, respectively And a flat cable type FFC was produced by pressing on both sides.

However, in the conventional manufacturing process of the FFC, the lower film (1), the upper film (2) and the copper wire (3) is gradually released in the state of being wound on one side, respectively, the supply is made, the copper wire (3) If the case is finely thin, there was a problem that is easily broken during the release process.

In addition, due to supply of the winding method of the copper wire 3, manufacturing costs are increased, the process is complicated, and there is a problem that adversely affects flexibility due to the increase in the thickness of the FFC.

The present invention has been proposed to improve the above problems in the conventional FFC manufacturing process, by forming the electrode portion by a printing method rather than the copper winding method by preventing the occurrence of defects due to the pattern is broken during the manufacturing process The aim is to reduce manufacturing costs through simplification and to increase the flexibility of reducing thickness.

The present invention for achieving the above object, and the lower film preparation step of the synthetic resin material, such as PET; An electrode printing step of printing a conductive paste on an upper surface of the lower film; An upper film laminating step of laminating an upper film of PET material on an upper surface of the lower film on which the electrode is printed; It characterized in that it comprises a; cutting step of cutting the upper and lower film, the lamination is made at a predetermined interval.

The present invention can shorten the manufacturing process and prevent defects caused by disconnection of the electrode in the manufacturing process by forming the electrode using a conductive paste without using a conventional copper wire.

In addition, since the pitch of the electrode can be formed more precisely, the production quality and cost are reduced.

Figure 1 shows a side cross-sectional view of the FFC structure in the prior art,
1a is an isolated state diagram.
1b is a laminating state diagram.
Figure 2 is a front cross-sectional view of the FFC in the prior art,
2a is an isolated state diagram.
2b is a laminating state.
Figure 3 is a side cross-sectional view showing the FFC structure in the present invention,
3a is a film separation state.
3b is a film laminating state.
4 is a front sectional view showing an FFC structure in the present invention.
4a is a film separation state.
4b is a film laminating state.
5 is a flow chart of manufacturing FFC process according to an embodiment of the present invention.
6 is a manufacturing process chart of the FFC according to an embodiment of the present invention.
7 is a flow chart of FFC manufacturing process according to another embodiment of the present invention.

Hereinafter, specific embodiments of the present invention will be described in detail with reference to FIGS. 3 to 7.

First, the FFC manufacturing process according to an embodiment of the present invention will be described with reference to the flowchart of FIG. 5 and the process diagram of FIG. 6.

<Subfilm Preparation Step> (ST 1)

First, the lower film 10 of a thin film made of a synthetic resin material such as PET (Poly Ethylene Terephthalate) is prepared by molding into a thin film having a thickness of 0.012 to 0.100 mm.

The lower film 10 at this time can be used not only PET, but also various materials such as PEN, PI, PP.

Electrode Printing Step (ST 2)

Then, the conductive paste is printed on the upper surface of the prepared lower film 10 to form an electrode 11.

In this case, the conductive paste used is a composition of a silver filler content of 50 to 70% by weight and a binder content in a range of 30 to 50% by weight. In this embodiment, a resin solid content based on 100% by weight of the binder is used. A mixture of 40 wt%, 45 wt% diluent and 15 wt% additives was used.

Meanwhile, the conductive paste may be a copper filler or a silver-coated filler or a conductive material, such as copper, nickel, and cobalt, in addition to the silver filler.

In addition, in order to improve the printing quality of the paste composition and prevent cracking of the printed electrode 11, it is preferable to add MMA (Methyl MethacrylAte), which is a water dispersible acrylic emulsion, and an emulsifier of phosphate ester type, which is a reactive surfactant.

That is, in this case, it is preferable that the mixing is performed at a ratio of 55% by weight of silver filler, 35% by weight of binder, 7% by weight of MMA, and 3% by weight of emulsifier.

In addition, as a printing technique, a conventional gravure printing, inkjet printing, offset printing, silkscreen printing, rotary screen printing, and flexographic printing may be selected and performed.

<Top Film Laminating> (ST 3)

Then, the upper film 20 of the PET material is laminated on the upper surface of the lower film 10 on which the electrode 11 is printed. At this time, the upper film 20 supplied is laminated with the lower film 10 on the bottom surface. As the adhesive layer 22 is formed into a thin film having a thickness of 0.012 to 0.1 mm by using the adhesive for the punching operation (ST 3-1) for forming the through holes 23 at a predetermined interval in the supply process is performed together. .

The reason for forming the through hole 23 through the punching operation as described above is to allow a separate process for exposing the electrode 11 at both ends of the completed FFC to be omitted.

<Cutting> (ST 4)

Thereafter, the manufacturing of the FFC is completed by performing a cutting operation of cutting the laminating film at a predetermined interval based on the through hole 23 forming portion.

Since the finished FFC is manufactured through a simplified process as compared to the prior art, mass production is possible, and since the electrode 11 is formed by a printing technique, the flexibility and flexibility are greatly improved. do.

On the other hand, Figure 7 is a flow chart showing the manufacturing process of the FFC according to another embodiment of the present invention, after the electrode printing step (ST 2) UV irradiation step of irradiating ultraviolet rays to dry the printed paste quickly (ST 2) -1) is performed.

That is, since the ultraviolet light, which is the UV light, has a property of doubling the drying speed through activation of the conductive paste composition, the ultraviolet ray irradiation process is added in this manner, thereby further reducing the manufacturing time.

10: lower film 11: the electrode
20: upper film 22: adhesive layer
23: through hole

Claims

And preparing the lower film 10 of the synthetic resin material; (ST 1)
An electrode printing step of forming an electrode 11 by printing a conductive paste on an upper surface of the lower film 10; (ST 2)
An upper film laminating step of laminating the upper film 20 of PET material on the upper surface of the lower film 10 on which the electrode 11 is printed; (ST 3)
Cutting step of cutting the upper and lower film (10, 20) is made at a predetermined interval the laminating; (ST 4)
FFC manufacturing method using a conductive paste comprising a

The method according to claim 1,
After the electrode printing step (ST 2) FFC manufacturing method using a conductive paste, characterized in that the ultraviolet irradiation step (ST 2-1) is irradiated with ultraviolet rays to dry the printed paste quickly

The method according to claim 1,
FFC manufacturing method using a conductive paste, characterized in that the adhesive layer 22 is formed in a thin film of 0.012 ~ 0.1mm thickness on the bottom of the upper film (20).

The method according to claim 1,
In the upper film laminating step (ST 3), a punching step (ST 3-1) to form a through hole 23 in the upper film 20 to be supplied so that the electrode 11 is partially exposed after lamination (ST 3-1) FFC manufacturing method using a conductive paste, characterized in that the addition.

The method according to claim 1,
The conductive paste for forming the electrode 11 is a FFC manufacturing method using a conductive paste, characterized in that the conductive filler content is 50 to 70% by weight, the binder content is 30 to 50% by weight.

The method according to claim 5,
MMA (Methyl MethacrylAte), which is a water-dispersible acrylic emulsion, and a phosphate ester type emulsifier, which is a reactive surfactant, are further added to the conductive paste.