KR101185622B1 - A ffc structure using conductive paste - Google Patents
A ffc structure using conductive paste Download PDFInfo
- Publication number
- KR101185622B1 KR101185622B1 KR20100112311A KR20100112311A KR101185622B1 KR 101185622 B1 KR101185622 B1 KR 101185622B1 KR 20100112311 A KR20100112311 A KR 20100112311A KR 20100112311 A KR20100112311 A KR 20100112311A KR 101185622 B1 KR101185622 B1 KR 101185622B1
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- KR
- South Korea
- Prior art keywords
- conductive
- ffc
- conductive paste
- base film
- electrode
- Prior art date
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Conductive Materials (AREA)
Abstract
The present invention relates to a double-sided FFC using a conductive paste, the conductive electrode is formed on both sides around the base film so that the distance between the electrodes can be reduced, and by using the conductive paste to form a conductive electrode This is to improve the accuracy of the electrode pattern.
In the FFC of the present invention for realizing this, a plurality of conductive electrodes 20 and 20 'formed by printing a conductive paste on the upper and lower surfaces of the base film 10 are provided at regular intervals; Both sides of the base film 10 is characterized in that the cover film 30 for preventing the external exposure of the conductive electrode (20, 20 ') is configured, respectively.
Description
The present invention relates to an FFC (Flexibe Flat Cable), and more particularly, the electrode of the FFC can be formed on both sides by a conductive paste printing method to improve the reliability of the product while reducing the width of the cable. It is to make it possible.
In general, almost all electronic products such as monitors, PCs, telephones, and the like are thinner for printed circuit boards (PCBs) having various circuit patterns and electrical signals between the PCBs or electrical signals between the PCBs and components. An FFC in the form of a plate is used to electrically connect between the PCB and the PCB or between the PCB and peripheral components.
1 and 2 show the structure of such a conventional FFC, the copper wire (3) forming the electrode portion between the
However, in the conventional manufacturing process of the FFC, the lower film (1), the upper film (2) and the copper wire (3) is gradually released in the state of being wound on one side, respectively, the supply is made, the copper wire (3) If the case is finely thin, there was a problem that is easily broken during the release process.
In addition, due to supply of the winding method of the
Conventional FFC has a problem in that a plurality of adjacent conductive electrodes to maintain a certain distance from each other to prevent electrical contact between each other, there is a limit in reducing the width of the FFC.
The present invention has been proposed to improve the above problems in the prior art, by forming the electrode by a printing method rather than the conventional copper winding method by preventing the occurrence of defects due to the pattern is broken during the manufacturing process The aim is to reduce manufacturing costs through simplification and to increase the flexibility of reducing thickness.
In addition, the purpose is to reduce the width of the FFC by forming the electrode in a double-sided form.
Double-sided FFC of the present invention for achieving the above object is provided with a plurality of conductive electrodes formed by printing a conductive paste on the upper and lower surfaces of the base film at regular intervals; Both sides of the base film is characterized in that each cover film is configured to prevent the external exposure of the conductive electrode.
In the FFC of the present invention, since the conductive electrodes are formed on both sides of the base film, the inter-electrode spacing can be reduced, thereby reducing the overall width of the FFC.
In particular, by forming a conductive electrode using a conductive paste without using a conventional copper wire, the manufacturing process is shortened and defects caused by disconnection of the electrode in the manufacturing process can be prevented.
In addition, since the pitch of the electrode can be formed more precisely, the production quality and cost are reduced.
Figure 1 shows a side cross-sectional view of the FFC structure in the prior art,
1a is an isolated state diagram.
1b is a laminating state diagram.
Figure 2 is a front cross-sectional view of the FFC in the prior art,
2a is an isolated state diagram.
2b is a laminating state.
Figure 3 is a front view of the FFC isolation state in the present invention.
Figure 4 is a front view of the FFC coupled state in the present invention.
5 is an enlarged view of an electrode arrangement state of the present invention FFC.
Figure 6 is a side view of the FFC separation state in the present invention.
Figure 7 is a side view of the FFC binding state in the present invention.
8 is a cross-sectional view of the cut unit of the length unit of the present invention FFC.
Hereinafter, specific embodiments of the present invention will be described in detail with reference to the accompanying drawings.
First, looking at the structure of the bi-directional FFC according to an embodiment of the present invention, a plurality of conductive electrodes (20, 20 ') on the upper surface and the lower surface with respect to the
That is, the lower conductive electrode 20 'is formed on the lower surface of the
In particular, the
Meanwhile, the conductive paste may be a copper filler or a silver-coated filler or a conductive material, such as copper, nickel, and cobalt, in addition to the silver filler.
In addition, in order to improve the printing quality of the paste composition and prevent cracking of the printed
That is, in this case, it is preferable that the mixing is performed at a ratio of 55% by weight of silver filler, 35% by weight of binder, 7% by weight of MMA, and 3% by weight of emulsifier.
In addition, as a printing technique, a conventional gravure printing, inkjet printing, offset printing, silkscreen printing, rotary screen printing, and flexographic printing may be selected and performed.
On the other hand, the
Accordingly, the film is cut along the through-
Therefore, by forming a double-sided electrode forming structure as in the present invention, it is possible to reduce the overall width of the FFC and to achieve the precision of the electrode pattern using the conductive paste, thereby improving the quality of the product.
10:
30: cover film 31: through hole
Claims (5)
The conductive electrodes 20 and 20 'provided at both sides are provided at positions crossing each other;
The cover film 30 is formed with a through hole 31 is punched at a predetermined interval, the cutting is made at regular intervals along the portion of the through hole 31;
The conductive paste for forming the conductive electrodes 20 and 20 'has a conductive filler content of 50 to 70 wt% and a binder content of 30 to 50 wt%;
MFC (Methyl MethacrylAte), which is a water-dispersible acrylic emulsion, and a phosphate ester type emulsifier, which is a reactive surfactant, are further added to the conductive paste.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20100112311A KR101185622B1 (en) | 2010-11-11 | 2010-11-11 | A ffc structure using conductive paste |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20100112311A KR101185622B1 (en) | 2010-11-11 | 2010-11-11 | A ffc structure using conductive paste |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20120050852A KR20120050852A (en) | 2012-05-21 |
KR101185622B1 true KR101185622B1 (en) | 2012-09-24 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR20100112311A KR101185622B1 (en) | 2010-11-11 | 2010-11-11 | A ffc structure using conductive paste |
Country Status (1)
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KR (1) | KR101185622B1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014084618A1 (en) * | 2012-11-29 | 2014-06-05 | (주)삼원에스티 | Method for manufacturing touch panel sensor, and touch panel sensor |
KR101447592B1 (en) * | 2012-12-26 | 2014-10-07 | (주)삼원에스티 | Method of manufacturing stacked structure for touch panel sensor and the stacked structure |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003036732A (en) | 2001-07-25 | 2003-02-07 | Hitachi Cable Ltd | Flexible flat cable |
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2010
- 2010-11-11 KR KR20100112311A patent/KR101185622B1/en active IP Right Grant
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003036732A (en) | 2001-07-25 | 2003-02-07 | Hitachi Cable Ltd | Flexible flat cable |
Also Published As
Publication number | Publication date |
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KR20120050852A (en) | 2012-05-21 |
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