KR101072917B1

KR101072917B1 - Scribing device, substrate cutting apparatus having the same and method of cutting substrate using the same

Info

Publication number: KR101072917B1
Application number: KR1020080111471A
Authority: KR
Inventors: 박준우
Original assignee: 세메스 주식회사
Priority date: 2008-11-11
Filing date: 2008-11-11
Publication date: 2011-10-17
Also published as: KR20100052660A

Abstract

In the scribing apparatus, the substrate cutting apparatus having the same, and the substrate cutting method using the same, the first scribing unit and the second scribing unit are controlled by a common driving unit. The common drive unit includes a cog wheel provided between the first scribing unit and the second scribing unit, and moves the first and second scribing units in a vertical direction in the rotational movement of the cog wheel. That is, when the first scribing unit descends, the second scribing unit is raised, and when the second scribing unit descends, the first scribing unit is raised. Therefore, the configuration of the scribing apparatus can be simplified, and the cost can be reduced by reducing the components, thereby improving productivity.

Mosquito board, scribe line, toothed wheel, toothed rack

Description

Scribing device, substrate cutting device having same, and substrate cutting method using same {SCRIBING DEVICE, SUBSTRATE CUTTING APPARATUS HAVING THE SAME AND METHOD OF CUTTING SUBSTRATE USING THE SAME}

The present invention relates to an apparatus and method for use in the manufacture of a flat panel display panel, and more particularly, to a scribing apparatus for forming a scribe line on a mother substrate formed with a plurality of cells, a substrate cutting apparatus having the same, and such a substrate cutting apparatus It relates to a substrate cutting method using.

Generally, a display panel used for a flat panel display device is provided, and the display panel is completed through the following process.

First, a plurality of cells are formed in a large mother substrate, and the mother substrate is cut into a plurality of cell units. Here, each cell separated from the mother substrate is used as the display panel.

As such, the process of cutting the large mother substrate in cell units includes a method of cutting using a laser beam and a method of using a scribe wheel. In the method of cutting the mother substrate using the scribe wheel, the scribe wheel moves while pressing the mother substrate to form a scribe line on the surface of the mother substrate. Subsequently, when a physical shock is applied to the mother substrate, cracks propagate along the scribe line and are separated into cells.

In the scribing method using the scribe wheel, a scribing apparatus including a head provided with a scribe wheel and a cylinder for pressing the head toward the mother substrate is used.

The scribing apparatus may include two scribing units, and may use different scribing units depending on the direction of forming the scribe line. In this case, the linear movement of the two scribe units in the vertical direction is controlled by separate drive units, respectively. Therefore, not only the configuration of the scribing apparatus is complicated, but also the cost increases, resulting in a problem of lowering productivity.

Accordingly, it is an object of the present invention to provide a scribing apparatus that can simplify the overall configuration.

It is another object of the present invention to provide a substrate cutting device capable of improving productivity by providing the above-described scribing device.

Still another object of the present invention is to provide a method for cutting a substrate using the scribing apparatus described above.

The scribing apparatus according to the present invention includes a first scribing unit, a second scribing unit, and a common driving unit to separate a mother substrate on which a plurality of cells are formed in one cell unit.

The first scribing unit forms a first scribe line on the surface of the mother substrate while moving in the first direction. The second scribing unit forms a second scribe line on the surface of the mother substrate while moving in a second direction opposite to the first direction.

The common driving unit includes a rotating member provided between the first scribing unit and the second scribing unit, and the rotational motion of the rotating member is vertically upwards of the first and second scribing units. Switch to a linear motion to raise the second scribing unit when the first scribing unit descends and raise the first scribing unit when the second scribing unit descends. .

As an example of the present invention, each of the first and second scribing units may be provided on a cutting wheel that rotates in contact with the mother substrate and an upper portion of the cutting wheel, and is vertically moved by the common driving unit. A moving head, and a holder for fixing the cutting wheel to the head.

The common drive unit may include a first tooth leg mounted to the head of the first scribing unit, a second tooth leg mounted to the head of the second scribing unit and facing the first tooth leg, A gear wheel that meshes with the first and second gear teeth to rotate, and a motor that rotates the gear wheel.

Therefore, when the gear wheel rotates in the third direction, the head of the first scribing unit is lowered and the head of the second scribing unit is raised. On the contrary, when the gear wheel rotates in the fourth direction opposite to the third direction, the head of the first scribing unit is raised and the head of the second scribing unit is lowered.

The substrate cutting apparatus according to the present invention includes a loading unit in which a mother substrate on which a plurality of cells are formed is loaded, a scribing unit generating a scribing line in the mother substrate received from the loading unit, and the scribe line generated in the mother substrate. Breaking unit for separating the mother substrate in units of cells, and Unloading unit for unloading the separated cells.

The scribing unit includes a first scribing unit, a second scribing unit, and a common driving unit.

The substrate cutting method according to the present invention comprises the steps of loading a mother substrate formed with a plurality of cells, generating a scribe line on the loaded mother substrate, separating the mother substrate in units of cells along the scribe line generated in the mother substrate And unloading the separated cells.

Here, the forming of the scribe line includes the following process.

First, the first scribing unit and the second scribing unit are coupled using a tooth wheel and first and second tooth legs. The gear wheel is rotated to lower the first scribing unit toward the mother substrate and to raise the second scribing unit. The lowered first scribing unit is moved in a first direction to form a first scribe line on the surface of the mother substrate.

Next, the gear wheel is rotated in the opposite direction to lower the second scribing unit toward the mother substrate, and the first scribing unit is raised. The lowered second scribing unit is moved in a second direction opposite to the first direction to form a second scribe line on the surface of the mother substrate.

According to such a scribing apparatus, a substrate cutting apparatus having the same, and a substrate cutting method using the same, the first and second rotations of the gear wheel provided between the first scribing unit and the second scribing unit are performed. By moving the scribing unit in the vertical direction, the configuration of the scribing apparatus can be simplified, and the cost can be reduced by reducing the components, thereby improving productivity.

Hereinafter, a scribing apparatus, a substrate cutting apparatus and a method having the same according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings. First, in adding reference numerals to components of each drawing, the same components are denoted by the same reference numerals even if they are displayed on different drawings.

1 is a plan view illustrating a mother substrate for a liquid crystal display panel, and FIG. 2 is a perspective view illustrating a liquid crystal display panel.

Referring to FIG. 1, the mother substrate 100 has a structure in which first and second large substrates 110 and 120 are combined, and the plurality of cells 101 arranged in a matrix form on the mother substrate 100. This is provided. The mother substrate 100 is cut in units of the plurality of cells 101, and each of the cut cells is provided as a liquid crystal display panel.

As shown in FIG. 2, the liquid crystal display panel 105 has a structure in which a lower substrate 105a and an upper substrate 105b are combined. In the cutting process, the upper substrate 105b is cut into a smaller size than the lower substrate 105a to expose the source side end and the gate side end of the lower substrate 105a to the outside. A data pad portion for receiving a data signal from a source driver is provided at a source side end of the lower substrate 105a, and a gate pad portion for receiving a gate signal from a gate driver is provided at a gate side end.

Although the liquid crystal display panel 105 shown in FIG. 2 has a structure in which both the gate end and the source end are exposed, the liquid crystal display panel 105 may have a structure in which only the source end is exposed.

3 is a block diagram of a substrate cutting apparatus according to an embodiment of the present invention.

Referring to FIG. 3, the substrate cutting device 400 includes a loading unit 410, a scribing unit 420, a breaking unit 430, and an unloading unit 440. The loading unit 410, the scribing unit 420, the breaking unit 430, and the unloading unit 440 may be sequentially arranged in a line.

The mother substrate 100 (shown in FIG. 1) is introduced into the substrate cutting device 400 through the loading unit 410, and is separated into cells by sequentially passing through the scribing unit 420 and the breaking unit 4303. , And flows out of the substrate cutting device 400 through the unloading part 440.

The scribing unit 420 forms a scribe line on the surface of the mother substrate 100 along the arrangement direction of the cells 101 using the scribing apparatus 300 to be described later. The breaking part 430 separates the cells 101 from the mother substrate 100 by applying a force to a scribe line portion formed in the mother substrate 100 using a break bar (not shown).

4 is a side view of the scribing apparatus provided in the scribing unit of FIG. 3, and FIG. 5 is a plan view of the scribing apparatus and the mother substrate of FIG. 4.

4 and 5, the scribing apparatus 300 includes a support unit 310, a first scribing unit 320, a second scribing unit 330, and a common driving unit. .

The support unit 310 is formed of a support plate on which the mother substrate 100 is seated, and the support plate 310 is provided with a vacuum hole (not shown) for adsorbing the mother substrate 100.

The first and second scribing units 320 and 330 are installed on the support unit 310. The first scribing unit 320 includes a first cutting wheel 321, a first vibrating head 322, and a first holder 323, and the second scribing unit 330 includes a second And a cutting wheel 331, a second vibrating head 332, and a second holder 333.

However, since the first and second scribing units 320 and 330 include the same components, only the first scribing unit 320 will be described in detail here and the second scribing unit will be described. In step 330, a description of the overlapping components will be omitted.

The first cutting wheel 321 is rotatable, has a generally disk shape, and a circular through hole is formed at the center thereof. In one example of the present invention, the first cutting wheel 321 is made of a diamond material. The first cutting wheel 321 rotates while pressing the surface of the mother substrate 100 to generate cracks on the surface of the mother substrate 100 to form a first scribe line SL1.

The first vibration head 322 is installed above the first cutting wheel 321. The first vibrating head 322 moves in the first direction D1 such that the first cutting wheel 321 forms the first scribe line SL1 extending in the first direction D1. .

In addition, the first vibration head 322 generates vibration in the scribing process to apply vibration to the first cutting wheel 321, and the first cutting wheel 321 is the first vibration head 322. The first scribe line SL1 is formed on the surface of the mother substrate 100 by vibrating up and down by the vibration transmitted from the second substrate. The first vibration head 322 may generate vibration using ultrasonic waves, and in this case, a ultrasonic transducer may be embedded in the first vibration head 322.

The first holder 323 fixes the first cutting wheel 321 to the lower portion of the first vibration head 322. The first holder 323 is fixedly coupled to the lower portion of the first vibrating head 322, the groove is formed in the lower surface is inserted a portion of the first cutting wheel 321. The first holder 323 has a shaft pin penetrating the through-hole formed in the central portion of the first cutting wheel 321. The shaft pin has a cylindrical shape and is mounted in the groove to fix the first cutting wheel 321 to the first holder 323. In the scribing process, only the first cutting wheel 321 rotates while the shaft pin is fixed, and vibration of the first vibration head 322 is transmitted through the first holder 323. 321 is passed.

Here, the first cutting wheel 321 may be coupled to the shaft pin so that the origin of the first cutting wheel 321 is combed on the extension line of the shaft pin. For example, if the first cutting wheel 321 is installed in a position that is deflected to the right with respect to the shaft pin, the second cutting wheel 331 may be installed in a position that is deflected to the left with respect to the shaft pin.

Meanwhile, the first and second scribing units 320 further include first and second pressing parts 324 and 334, respectively. The first pressing part 324 is provided on the upper end of the first vibration head 322 to allow the first cutting wheel 321 to press the surface of the mother substrate 100 with an appropriate force during the scribing process. The first vibrating head 322 is pressed toward the support unit 310 so that the first vibration head 322 is pressed. In one example of the present invention, a cylinder may be used as the first pressing part 324, and the cylinder pressurizes the first vibration head 322 using pneumatic pressure.

The common drive unit includes a first gear rack 341, a second gear rack 342, a first gear wheel 343, and a motor 344.

The first tooth rack 341 is mounted on one side of the first vibration head 322, and the second tooth rack 342 is mounted on one side of the second vibration head 332. Specifically, the first and second toothed legs 341 and 342 are mounted on two opposite sides of the first and second vibrating heads, respectively. Here, the tooth rails provided in the first and second tooth racks 341 and 342 extend along the longitudinal direction of each side surface.

The toothed wheel 343 is interposed between the first toothed leg 341 and the second toothed leg 342. The gear wheel 343 meshes with the first and second gear teeth 341 and 342 and rotates in a predetermined direction. Here, the rotation direction and operation of the cogwheel 343 is controlled by the motor 344.

As shown in FIG. 4, when the cogwheel 343 rotates in the third direction D3, the first oscillating head is caused by the first cogwheel 341 moving in engagement with the cogwheel 343. 322 drops. On the other hand, when the cogwheel 343 rotates in the third direction D3, the second vibrating head 332 is raised by the second cogwheel 342 moving in engagement with the cogwheel 343. . Therefore, when the first vibration head 322 is lowered, the first cutting wheel 321 is in contact with the mother substrate 100, but the second vibration head 332 is raised to the second cutting wheel ( 331 is spaced apart from the mother substrate 100 by a predetermined interval.

In this state, when the first scribing unit 320 is horizontally moved in the first direction D1, as illustrated in FIG. 5, the first scribe line is formed on the surface of the mother substrate 100. SL1) is formed.

When the formation of the first scribe line SL1 is completed, a process of rearranging the first and second scribing units 320 and 330 is performed.

FIG. 6 is a side view of the rearranged scribing apparatus, and FIG. 7 is a plan view of the scribing apparatus and the mother substrate of FIG. 6.

6 and 7, in the process of forming the first scribe line SL1, the first and second scribing units 320 and 330 traveling in the first direction D1 are inverted in the moving directions. Proceeds in a second direction D2 opposite to the first direction D1.

At this time, the rotation direction of the gear wheel 343 is also reversed by the motor 344. Specifically, the cogwheel 342 is rotated in the fourth direction D4 opposite to the third direction D3, and the cogwheel 342 is rotated in the fourth direction D4 by the cogwheel 343. The first scribing unit 320 rises and the second scribing unit 330 descends. Therefore, the second cutting wheel 331 of the second scribing unit 330 is in contact with the upper surface of the mother substrate 100, the first cutting wheel 321 of the first scribing unit 320 ) Is spaced apart from the upper surface of the mother substrate 100 by a predetermined interval.

Subsequently, when the first and second scribing units 320 and 330 are horizontally moved in the second direction D2, the first and second scribing units 320 and 330 extend in the second direction D2 on the upper surface of the mother substrate 100. Two scribe lines SL2 are formed.

As such, when all scribe lines are formed in the first and second directions D1 and D2 on the mother substrate 100 by using the first and second scribing units 320 and 330 alternately, the mosquitoes Rotate the plate 100 by 90 ° to repeat the scribing process using the same method. Through this process, a scribe line may be formed in the cells 101 formed on the mother substrate 100.

As described above, when performing a scribing process using two scribing units, since the two scribing units can be controlled by one drive unit, the configuration of the apparatus can be simplified and the cost can be simplified. Can reduce the productivity.

8 is a flowchart illustrating an operation flow of the substrate cutting apparatus illustrated in FIG. 3, and FIG. 9 is a flowchart illustrating a scribe process illustrated in FIG. 8.

3 and 8, the mother substrate 100 having a plurality of cells formed thereon is loaded into the substrate cutting device 400 through the loading unit 410 (S10), and the loaded mother substrate 100 is swapped. The scribe line 420 is moved to form a scribe line on the surface of the mother substrate 100 (S20).

Thereafter, the mother substrate 100 is transferred to the breaking part 430, and the mother substrate 100 is separated in units of cells along the scribe line generated in the mother substrate 100 by the breaking part 430. (S30). Next, the separated cells are unloaded to the outside through the unloading unit 440 (S40).

4, 6 and 9, the scribe process (S20) is made through the following process.

First, the first scribing unit 320 and the second scribing unit 330 facing each other are coupled using the cog wheels 343, the first and the second tooth legs 341 and 342 (S21). ).

Next, the gear wheel 343 is rotated to lower the first scribing unit 320 to the mother substrate 100 and to raise the second scribing unit 330 (S22).

When the lowered first scribing unit 320 contacts the upper surface of the mother substrate 100, the first scribing unit 320 is moved in a first direction D1 to allow the mother substrate 100 to move. The first scribe line SL1 is formed on the surface of the substrate (S23).

When the first scribe line SL1 is completed, the gear wheel 343 is rotated in the opposite direction to lower the second scribing unit 330 toward the mother substrate 100, and the first scribe Raise the ice unit 320 (S24).

When the lowered second scribing unit 330 is in contact with the upper surface of the mother substrate 100, the second scribing unit 330 may be moved in a second direction opposite to the first direction D1 ( D2) to form a second scribe line SL2 on the surface of the mother substrate 100 (S25).

As such, scribe lines may be formed in the first and second directions D1 and D2 in the mother substrate 100 by using the first and second scribing units 320 and 330 alternately.

Although not shown in the drawings, the scribe process may be performed again by rotating the mother substrate 100 by 90 ° using the same method.

The foregoing description is merely illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention.

Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention but to describe the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of the present invention.

1 is a plan view illustrating a mother substrate for a liquid crystal display panel.

2 is a perspective view illustrating a liquid crystal display panel.

4 is a side view illustrating a scribing apparatus provided in the scribing unit of FIG. 3.

FIG. 5 is a plan view illustrating the scribing apparatus and the mother substrate of FIG. 4.

6 is a side view of the relocated scribing apparatus.

FIG. 7 is a plan view of the scribing apparatus and the mother substrate of FIG. 6.

8 is a flowchart illustrating an operation flow of the substrate cutting device illustrated in FIG. 3.

9 is a flowchart illustrating a scribe process shown in FIG. 8.

100: mother substrate 300: scribing device

310: support unit 320: first scribing unit

330: second scribing unit 341, 342: first and second tooth rack

343: toothed wheel 344: motor

400: substrate cutting device 410: loading part

420: scribing part 430: breaking part

440: unloading unit

Claims

In the scribing apparatus for separating the mother substrate formed with a plurality of cells in one cell unit,

A first scribing unit moving in a first direction to form a first scribe line on a surface of the mother substrate;

A second scribing unit which forms a second scribe line on a surface of the mother substrate while moving in a second direction opposite to the first direction; And

And a rotating member provided between the first scribing unit and the second scribing unit, wherein the rotational motion of the rotating member is a linear motion in the vertical direction of the first and second scribing units. And a common driving unit to switch to raise the second scribing unit when the first scribing unit descends and to raise the first scribing unit when the second scribing unit descends. Scribing device, characterized in that.

The method of claim 1, wherein each of the first and second scribing units,

Rotating cutting wheels;

A head installed at an upper portion of the cutting wheel and moving up and down by the common driving unit; And

And a holder for fixing the cutting wheel to the head.

The method of claim 2, wherein the common drive unit,

A first toothed rack mounted to the head of the first scribing unit;

A second tooth leg mounted on the head of the second scribing unit and facing the first tooth leg;

A gear wheel that rotates in engagement with the first and second gear legs; And

And a motor for rotating said cogwheel.

The method of claim 3, wherein when the gear wheel rotates in the third direction, the head of the first scribing unit is lowered, the head of the second scribing unit is raised,

When the gear wheel rotates in a fourth direction opposite to the third direction, the head of the first scribing unit is raised, the head of the second scribing unit is lowered Crying Device.

A loading unit to which a mother substrate on which a plurality of cells are formed is loaded;

A scribing unit generating a scribe line on the mother substrate received from the loading unit;

Breaking unit for separating the mother substrate in units of cells along the scribe line generated in the mother substrate;

An unloading unit for unloading the separated cells,

The scribing unit,

And a rotating member provided between the first scribing unit and the second scribing unit, wherein the rotational motion of the rotating member is a linear motion in the vertical direction of the first and second scribing units. And a common driving unit that switches to raise the second scribing unit when the first scribing unit descends and raises the first scribing unit when the second scribing unit descends. Substrate cutting device comprising a scribing device.

The method of claim 5, wherein each of the first and second scribing unit,

Rotating cutting wheels;

And a holder for fixing the cutting wheel to the head.

The method of claim 6, wherein the common drive unit,

A first toothed rack mounted to the head of the first scribing unit;

And a motor for rotating said cogwheel.

Loading a mother substrate on which a plurality of cells are formed;

Generating a scribe line on the loaded mother substrate;

Separating the mother substrate in units of cells along a scribe line generated in the mother substrate; And

Unloading the separated cells;

Forming the scribe line,

Coupling the first scribing unit and the second scribing unit to the tooth wheel and the first and second tooth legs;

Rotating the gear wheel to lower the first scribing unit toward the mother substrate and raising the second scribing unit;

Moving the first scribing unit in a first direction to form a first scribe line on a surface of the mother substrate;

Rotating the gear wheel in the opposite direction to lower the second scribing unit toward the mother substrate and raising the first scribing unit; And

Moving the second scribing unit in a second direction opposite to the first direction to form a second scribe line on the surface of the mother substrate.